Details of ASUS' upcoming Prime N100I-D D4 Mini-ITX motherboard has made an appearance in official pictures posted over at Fanlesstech, although the board was apparently shown at Computex. The interesting part here is that it's under ASUS' Prime branding, which suggests that this will be a retail product, rather than something that would only be available to OEM partners. The Intel Processor N100 is a quad core 3.4 GHz chip based on Intel's Alder Lake-N and it has a 6 W TDP, which means it can be passively cooled.

Although the SoC supports DDR4 and DDR5 memory, at least for this specific SKU, ASUS went with DDR4 support in the shape of a single SO-DIMM slot which accepts up to 3200 MHz memory. The board also sports a single PCIe 3.0 x2 M.2 slot, an M.2 slot for an optional WiFi module, a PCIe 3.0 x1 slot and a single SATA connector and a USB 3.0 header. The odd thing here is that the SoC supports a total of nine PCIe lanes, but ASUS only appears to have made use of four of them. Around the back is a pair of 10 Gbps USB Type-A ports, a pair of 5 Gbps USB Type-A ports and two USB 2.0 ports, a PS/2 port, a serial port, a D-Sub VGA connector, a DisplayPort and an HDMI port of unknown version—although the SoC supports DP 1.4 and HDMI 2.1—a Gigabit Ethernet jack and three audio jacks.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced support for the latest 4th Gen AMD EPYC processors. The new processors, based on "Zen 4c" architecture and featuring AMD 3D V-Cache technology, enhance Giga Computing's enterprise solutions, enabling superior performance and scalability for cloud native computing and technical computing applications in GIGABYTE enterprise solutions. To date, more than thirty unique GIGABYTE systems and platforms support the latest generation of AMD EPYC 9004 processors. As time goes on Giga Computing will roll out more new GIGABYTE models for this platform, including more SKUs for immersion-ready servers and direct liquid cooling systems.

"For every new generation of AMD EPYC processors, GIGABYTE has been there, offering diverse platform options for all workloads and users," said Vincent Wang, Sales VP at Giga Computing. "And with the recent announcement of new AMD EPYC 9004 processors for technical computing and cloud native computing, we are also ready to support them at this time on our current AMD EPYC 9004 Series platforms."

A few weeks ago, we spotted an Intel Core Ultra 7 1003H Meteor Lake-P processor in the wild, running a PugetBench set of benchmarks. Today, we are in luck as there is another Meteor Lake-P processor running in the wild, spotted by @InstLatX64 on Twitter. Called Intel Core Ultra 7 1002H, the CPU represents a similar SKU to the previously discovered 1003. Also, having 16 cores in total, they are split into two categories: 6 Performance cores, and ten Efficient cores, two of which are on the SoC die, divided from the remaining eight on the compute die. Interestingly, only P-cores feature 2-way hyperthreaded, so 12 threads from P-cores and ten threads from E-cores combine into 22 threads.

What we don't know is the frequency of this chip and the position it plays in the Meteor Lake-P family of processors. The screenshot states a potential base clock of 3000 MHz; however, it could be an early engineering sample chip, so we have to wait for the final design. With 1003H having exactly the same core/thread number, we expect that the newly discovered 1002H has potentially lower clocks and TDP to match.

Ampere Computing today announced a new AmpereOne Family of processors with up to 192 single threaded Ampere cores - the highest core count in the industry. This is the first product from Ampere based on the company's new custom core, built from the ground up and leveraging the company's internal IP. CEO Renée James, who founded Ampere Computing to offer a modern alternative to the industry with processors designed specifically for both efficiency and performance in the Cloud, said there was a fundamental shift happening that required a new approach.

"Every few decades of compute there has emerged a driving application or use of performance that sets a new bar of what is required of performance," James said. "The current driving uses are AI and connected everything combined with our continued use and desire for streaming media. We cannot continue to use power as a proxy for performance in the data center. At Ampere, we design our products to maximize performance at a sustainable power, so we can continue to drive the future of the industry."

With more countries creating initiatives to develop homegrown processors capable of powering powerful supercomputing facilities, India has just presented its development milestone with Aum HPC. Thanks to information from the report by The Next Platform, we learn that India has developed a processor for powering its exascale high-performance computing (HPC) system. Called Aum HPC, the CPU was developed by the National Supercomputing Mission of the Indian government, which funded the Indian Institute of Science, the Department of Science and Technology, the Ministry of Electronics and Information Technology, and C-DAC to design and manufacture the Aum HPC processors and create strong, strong technology independence.

The Aum HPC is based on Armv8.4 CPU ISA and represents a chiplet processor. Each compute chiplet features 48 Arm Zeus Cores based on Neoverse V1 IP, so with two chiplets, the processor has 96 cores in total. Each core gets 1 MB of level two cache and 1 MB of system cache, for 96 MB L2 cache and 96 MB system cache in total. For memory, the processor uses 16-channel 32-bit DDR5-5200 with a bandwidth of 332.8 GB/s. To expand on that, HBM memory is present, and there is 64 GB of HBM3 with four controllers capable of achieving a bandwidth of 2.87 TB/s. As far as connectivity, the Aum HPC processor has 64 PCIe Gen 5 Lanes with CXL enabled. It is manufactured on a 5 nm node from TSMC. With a 3.0 GHz typical and 3.5+ GHz turbo frequency, the Aum HPC processor is rated for a TDP of 300 Watts. It is capable of producing 4.6+ TeraFLOPS per socket. Below are illustrations and tables comparing Aum HPC to Fujitsy A64FX, another Arm HPC-focused design.

At VLSI Symposium 2023, scheduled to take place between June 11-16, Intel is set to demonstrate its PowerVia technology working efficiently on an E-Core chip built using the Intel 4 node. Conventional chips have power and signal interconnects distributed across multiple metal layers. PowerVia, on the other hand, dedicates specific layers for power delivery, effectively separating them from the signal routing layers. This approach allows for vertical power delivery through a set of power-specific Through-Silicon Vias (TSVs) or PowerVias, which are essentially vertical connections between the top and bottom surfaces of the chip. By delivering power directly from the backside of the chip, PowerVia reduces power supply noise and resistive losses, optimizing power distribution and improving overall energy efficiency. PowerVia is set to make a debut in 2024 with Intel 20A node.

For VLSI Symposium 2023 talk, the company has prepared a paper that highlights a design made using Intel 4 technology and implements E-Cores only in a test chip. The document states: "PowerVia Technology is a novel innovation to extend Process Scaling by having Power Delivery on the backside. This paper presents the pre and post silicon findings from implementing an Intel E-Core in PowerVia Technology. PowerVia enabled standard cell utilization of greater than 90 percent in large areas of the core while showing greater than 5 percent frequency benefit in silicon due reduced IR drop. Successful Post silicon debug is demonstrated with slightly higher but acceptable throughput times. The thermal characteristics of the PowerVia testchip is inline with higher power densities expected from logic scaling."

MINISFORUM is proud to unveil its latest series of office solutions, the Venus Series UN100 and UN305 Mini-PCs. These devices are designed to offer a superior office experience in a compact form factor, powered by advanced Intel N series processors (Intel N100 & Intel Core i3-N305) that provide significant performance improvements over entry-level products.

With up to 16 GB of LPDDR5-4800 on-board memory, M.2-2280 SATA SSD storage, and an expansion slot for a 2.5-inch hard drive and a TF card, UN100 and UN305 deliver quiet, energy-efficient, and reliable operation. The all-metal unibody design, manufactured using advanced CNC machining technology with a 0.6 L volume (136 mm long x 121 mm width x 39 mm height), offers a sleek and elegant appearance while maintaining exceptional portability without compromising on performance.

Researchers at the Technical University of Berlin have published a paper called "faulTPM: Exposing AMD fTPMs' Deepest Secrets," highlighting AMD's firmware-based Trusted Platform Module (TPM) is susceptible to the new exploit targeting Zen 2 and Zen 3 processors. The faulTPM attack against AMD fTPMs involves utilizing the AMD secure processor's (SP) vulnerability to voltage fault injection attacks. This allows the attacker to extract a chip-unique secret from the targeted CPU, which is then used to derive the storage and integrity keys protecting the fTPM's non-volatile data stored on the BIOS flash chip. The attack consists of a manual parameter determination phase and a brute-force search for a final delay parameter. The first step requires around 30 minutes of manual attention, but it can potentially be automated. The second phase consists of repeated attack attempts to search for the last-to-be-determined parameter and execute the attack's payload.

Once these steps are completed, the attacker can extract any cryptographic material stored or sealed by the fTPM regardless of authentication mechanisms, such as Platform Configuration Register (PCR) validation or passphrases with anti-hammering protection. Interestingly, BitLocker uses TPM as a security measure, and faulTPM compromises the system. Researchers suggested that Zen 2 and Zen 3 CPUs are vulnerable, while Zen 4 wasn't mentioned. The attack requires several hours of physical access, so remote vulnerabilities are not a problem. Below, you can see the $200 system used for this attack and an illustration of the physical connections necessary.

Today, AMD introduced the new Ryzen Z1 Series processors, the ultimate high-performance processor for handheld PC gaming consoles. The Ryzen Z1 Series features two high performance processors, the Ryzen Z1 and Ryzen Z1 Extreme, both offering industry-leading gaming experiences, uncompromising battery life, and featuring AMD RDNA 3 architecture-based graphics. AMD is partnering with Asus to launch the first Ryzen Z1 Series device with the Asus ROG Ally, a premium handheld PC console, featuring up to a Ryzen Z1 Extreme processor.

"At AMD, we're continually advancing the next generation of gaming experiences, from consoles to desktops to on-the-go handheld devices," said Jason Banta, corporate vice president and general manager, Client OEM at AMD. "Ryzen Z1 processors deliver gamers an elite gaming experience and extreme portability in exciting gaming form factors."

Not entirely unexpected, Intel has started to discontinue its 11th Gen Core processors, also known as Tiger Lake. In a product change notification (PCN) the company has listed no less than five mobile and four desktop parts that the company will stop letting its customers order from the end of June this year, with the last shipment taking place at the end of January 2024.

The discontinued range covers everything from Core i3 to Core i9 models and the full range of discontinued models can be found in the screenshot below. It should be noted that the desktop parts are the B SKU parts that were for example found in Intel's NUC 11 Extreme and are 65 W TDP parts. Most of the mobile parts are still available in products being sold, albeit, most of those products being older SKUs that have been replaced by 12th and 13th Gen Core processors by now. None of the products in the PCN were available directly to end consumers to purchase as far as TPU is aware.

Klas, a global leader in edge intelligence solutions, launched a new rugged compute module, the VoyagerVM 4.0, powered by the new Intel Xeon D embedded processor (formerly known as Ice Lake D). The innovative design integrates the newest edge compute technology and exposes an expansion interface to support more agile, and open edge deployments.

The rugged design of the VoyagerVM 4.0 allows it to operate continuously in power constrained and austere environments with wide-ranging ambient temperatures with no impact to performance. Its compact size makes it the ideal edge computing platform for heavy-industry, autonomous vehicles, smart transportation, and military applications.

Following its successful demonstration of a MIPI camera solution using the UP Squared Pro 7000 at Embedded World, AAEON have announced a MIPI Expansion Kit for the newly released third generation board. Equipped with the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor and Intel Processor N Series (formerly Alder Lake-N) and an FPC port supporting MIPI-CSI interface, the UP Squared Pro 7000 emphasizes AAEON's continued dedication to bringing the latest Intel technologies to a wider variety of platforms. One such platform is the LI-ADL-ADP-IMX415-MIPI-081H, a 4K MIPI Camera Module from leading intelligent embedded camera creator, Leopard Imaging Inc.

The company recently announced that the camera has been designed with full-function drivers to support the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor, and Intel Processor N Series (formerly Alder Lake-N), allowing users to take advantage of the peripheral Intel technologies that come with the processor platform, such as Intel UHD Graphics on a Windows 10 IoT Enterprise OS.

Intel today expanded its 13th Gen Core "Raptor Lake" client processor family into the commercial segment. Devices in this segment are bought in bulk by large businesses and enterprises; the processors powering them have certain in-built device security and remote management features that enforce company policy regardless of where the employees take the devices. Intel has been pioneering hardware-level remote-management and device security features for close to two decades now, with its vPro feature-set (originally launched as Centrino vPro in the 2000s. The new 13th Gen Core vPro lineup covers popular processor models across various device form-factor classes, spanning ultraportables (15 W or below), thin-and-light commercial notebooks (28 W to 35 W segment); mainstream commercial notebooks (45 W to 55 W); and commercial desktops (65 W).

The 13th Gen vPro series have a lot in common with the 12th Gen Core vPro series, At a hardware-level, these are processors based on the same "Raptor Lake" silicon as the mainstream-client 13th Gen Core processors, but with the enhanced vPro Management Engine that interacts with a compatible operating system to offer endpoint remote manageability for administrators. The desktop versions of these chips have identical SKU differentiation to 65 W 13th Gen Core processors already launched, but with either vPro or vPro Essentials feature-sets. Something similar applies to the 15 W U-segment, 28 W P-segment, and 35-45 W H-segment Core vPro processors. Along with these processors, Intel is debuting Q700-series chipsets specific to the form-factor. For U- and P-segment mobile processor SKUs, the core-logic is part of the processor package; while the H-segment and S-segment (desktop) processors come with discrete chipsets. With the 13th Gen, Intel is also standardizing a new WiFi 6E (Gig+) WLAN chipset with vPro features.

AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

AIC today announced its EB202-CP is ready to support newly launched 4th Gen AMD EPYC Embedded 9004 processors. By leveraging the five-year product longevity supported by AMD EPYC Embedded processors, EB202-CP provides customers with stable and long-term support. AIC and AMD will join forces to showcase EB202-CP at Embedded World in AMD stand No. 2-411 from 14th to 16th March, 2023 in Nuremberg, Germany.

AIC EB202-CP, a 2U rackmount server designed for AI and edge appliances, is powered by the newly released 4th Gen AMD EPYC Embedded processors. Featuring the world's highest-performing x86 processor and PCIe 5.0 ready, the 4th Gen AMD EPYC Embedded processors enable low TCO and delivers leadership energy efficiency as well as state-of-the-art security, optimized for workloads across enterprise and edge. EB202-CP, with 22 inch in depth, supports eight front-serviceable and hot-swappable E1.S/ E3.S and four U.2 SSDs. By leveraging the features of the 4th Gen AMD Embedded EPYC processors, EB202-CP is well suited for broadcasting, edge and AI applications, which require greater processing performance and within the most efficient, space-saving format.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, will be showcasing its latest generation of systems that accelerate workloads for the entire Telco industry, specifically at the edge of the network. These systems are part of the newly introduced Supermicro Intel-based product line; the better, faster, and greener systems based on the brand new 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids) that deliver up to 60% better workload-optimized performance. From a performance standpoint these new systems that demonstrate up to 30X faster AI inference speedups on large models for AI and edge workloads with the NVIDIA H100 GPUs. In addition, Supermicro systems support the new Intel Data Center GPU Max Series (formerly codenamed Ponte Vecchio) across a wide range of servers. The Intel Data Center GPU Max Series contains up to 128 Xe-HPC cores and will accelerate a range of AI, HPC, and visualization workloads. Supermicro X13 AI systems will support next-generation built-in accelerators and GPUs up to 700 W from Intel, NVIDIA, and others.

Supermicro's wide range of product families is deployed in a broad range of industries to speed up workloads and allow faster and more accurate decisions. With the addition of purpose-built servers tuned for networking workloads, such as Open RAN deployments and private 5G, the 4th Gen Intel Xeon Scalable processor vRAN Boost technology reduces power consumption while improving performance. Supermicro continues to offer a wide range of environmentally friendly servers for workloads from the edge to the data center.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.

AAEON, a leading manufacturer of industrial-grade server solutions, has announced the release of the ZEUS-WHI0 4U Rackmount Whitely Platform Server System. The ZEUS-WHI0 is AAEON's first system-level solution to utilize a 3rd Generation Intel Xeon Scalable Processor (formerly Ice Lake-SP). With up to 40 cores and 80 threads, this platform provides server-grade power while also benefitting from peripheral technologies such as Intel Crypto Acceleration, Intel VT-x, and Intel AES-NI.

Equipped with seven PCIe slots with up to Gen 4 speed capability, the ZEUS-WHI0 is exceptionally expandable, making it capable of supporting up to four GPU cards for AI acceleration and enhanced graphics realization. Further to this, the ZEUS-WHI0 also supports eight 2.5" or 3.5" HDD via two 4-bay inputs for storage, alongside an additional M.2 2280 M-Key for PCIe [x4].

HP Inc. announced its new Z by HP high-performance workstation desktop lineup, engineered to change what is possible within complex, data rich workflows. HP is advancing hybrid workforce management with the HP Anyware Remote System Controller, a device that gives IT departments the management capabilities to support high performance devices from anywhere.

The complex workflows in industries spanning media and entertainment, data science, and engineering mean increased time pressure and the need for more compute power to deliver faster results. They also highlight a need to iterate with remote teams and push creative boundaries to deliver more accurate results. The new Z by HP Z4, Z6, Z8, and Z8 Fury desktops, powered by Intel, deliver the scalable balance of CPU and GPU compute needed to fuel new levels of speed, accuracy, and creativity.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock W790 WS motherboard for workstations for Intel Xeon W-3400/W-2400 series processors (LGA4677). The ASRock W790 WS features up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Supports New 4th Generation Xeon Processor
The W790 WS chipset is optimized for new Intel Xeon W-2400 series (LGA4677) processors and is compatible with W-3400 series processors with up to 56 cores also. The ASRock W790 WS provides a quad-channel DDR5 design with 2DPC over 8 DIMM slots, maximizing memory performance, potential memory pool capacity and supports ECC RDIMMs to ensure data reliability.

Back in January, Intel officially increased the price of its 12th Gen Core processors by 10 percent, a move that was thought to help push the 13th Gen Core processors in retail. Here we are, barely a month later and Intel is now said to be cutting the price on said 12th Gen Core processors by as much as 20 percent. The report comes from DigiTimes in Taiwan and should as such be taken with a pinch of salt, but apparently the higher-end SKUs are expected to see the biggest price cuts.

Twitter user @harukaze5719 has put together a cheat sheet that gives us an easy overview on what we might be able to expect, if the 20 percent price cut is done across the board. This should make Intel's 12th Gen Core processors quite attractive price wise, as all models would end up selling for much less than they did before the 10 percent price increase. This would give Intel some extra leverage over AMD, which might be forced to lower its prices in turn, to be able to stay competitive.