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Intel Announces iGPU-accelerated Threat Detection Technology

Today, Intel is taking another step forward, with two new technology announcements: Intel Threat Detection Technology (Intel TDT), a set of silicon-level capabilities that will help the ecosystem detect new classes of threats, and Intel Security Essentials, a framework that standardizes the built-in security features across Intel processors. We are also announcing a strengthened academic partnership with Purdue University, to help accelerate the development and availability of cybersecurity talent.

Intel Threat Detection Technology leverages silicon-level telemetry and functionality to help our industry partners improve the detection of advanced cyberthreats and exploits. Today we are announcing the first two Intel Threat Detection Technology capabilities, including implementation plans by Microsoft and Cisco.

The first new capability is Accelerated Memory Scanning. Current scanning technologies can detect system memory-based cyberattacks, but at the cost of CPU performance. With Accelerated Memory Scanning, the scanning is handled by Intel's integrated graphics processor, enabling more scanning, while reducing the impact on performance and power consumption. Early benchmarking on Intel test systems show CPU utilization dropped from 20 percent to as little as 2 percent.

Purdue University Develops Next-Gen, 3D Intrachip Cooling Technology

Researchers based on Purdue University have designed an intrachip cooling technology, which will likely pave the way for future generations of high performance 3D microprocessors. The research was part of a DARPA-funded commission for Purdue University's Birck Nanotechnology Center; a fundamental requirement stipulated by DARPA was the ability for this cooling system to handle chips generating 1 kW of heat per cm², more than 10x the amount current high-performance computers generate.

The new cooling system circulates an electrically insulated liquid coolant directly into electronic chips through an intricate series of tiny microchannels. This means that no longer will cooling systems be limited to the nowadays-employed conventional chip-cooling methods, which make use of finned metal plates called heat sinks. These are attached to computer chips to dissipate heat, but have a fundamental flaw: they do not remove heat efficiently enough for an emerging class of high-performance, 3D electronics, where too much heat hinders the performance of electronic chips or damages the tiny circuitry, especially in small "hot spots" that are located below the topmost layer of the chip.
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