Western Digital Corp. today reported fiscal third quarter 2024 financial results.

"As evidenced by our excellent third quarter results, Western Digital continues improving through-cycle profitability and dampening business cycles by leveraging our strategy of developing a diversified portfolio of industry-leading products across a broad range of end markets," said David Goeckeler, Western Digital CEO. "We are in the early innings of unlocking the full potential of this company, and as industry supply and demand dynamics continue to improve, we will remain disciplined around our capital spending and focused on driving innovation and efficiency across our businesses. We are confident in our strategy and the actions we have taken to-date, which successfully position us to capitalize on the promising growth prospects that lie ahead."

Samsung debuted its Mach-1 generation of AI processors during a recent shareholder meeting—the South Korean megacorp anticipates an early 2025 launch window. Their application-specific integrated circuit (ASIC) design is expected to "excel in edge computing applications," with a focus on low power and efficiency-oriented operating environments. Naver Corporation was a key NVIDIA high-end AI customer in South Korea (and Japan), but the leading search platform firm and creator of HyperCLOVA X LLM (reportedly) deliberated on an adoption alternative hardware last October. The Korea Economic Daily believes that Naver's relationship with Samsung is set to grow, courtesy of a proposed $752 million investment: "the world's top memory chipmaker, will supply its next-generation Mach-1 artificial intelligence chips to Naver Corp. by the end of this year."

Reports from last December indicated that the two companies were deep into the process of co-designing power-efficient AI accelerators—Naver's main goal is to finalize a product that will offer eight times more energy efficiency than NVIDIA's H100 AI accelerator. Naver's alleged bulk order—of roughly 150,000 to 200,000 Samsung Mach-1 AI chips—appears to be a stopgap. Industry insiders reckon that Samsung's first-gen AI accelerator is much cheaper when compared to NVIDIA H100 GPU price points—a per-unit figure of $3756 is mentioned in the KED Global article. Samsung is speculated to be shopping its fledgling AI tech to Microsoft and Meta.

Canalys anticipates that China's PC (excluding tablets) market will rebound to 3% growth in 2024 and 10% growth in 2025, primarily fueled by refresh demand from the commercial sector. The tablet market is expected to grow by 4% in both 2024 and 2025, benefiting from increasing penetration as digitalization deepens.

"2024 is expected to bring modest relief to a struggling PC market in China, but a challenging environment will remain," said Canalys Analyst Emma Xu. "Ongoing economic structural adjustments are a key priority as the government seeks new avenues for economic growth, with a core focus on technology-driven innovation. AI emerged as a central theme during the latest 'Two Sessions' in China, with enthusiasm for AI spanning commercial entities and government initiatives aimed at establishing a domestic AI ecosystem across industries. Significant opportunities for the PC industry are set to arise from this commercial push, especially as it coincides with the upcoming device refresh and the emergence of AI-capable PCs."

Micron Technology, Inc. today announced results for its second quarter of fiscal 2024, which ended February 29, 2024.

Fiscal Q2 2024 highlights

• Revenue of $5.82 billion versus $4.73 billion for the prior quarter and $3.69 billion for the same period last year
• GAAP net income of $793 million, or $0.71 per diluted share
• Non-GAAP net income of $476 million, or $0.42 per diluted share
• Operating cash flow of $1.22 billion versus $1.40 billion for the prior quarter and $343 million for the same period last year

"Micron delivered fiscal Q2 results with revenue, gross margin and EPS well above the high-end of our guidance range - a testament to our team's excellent execution on pricing, products and operations," said Sanjay Mehrotra, President and CEO of Micron Technology. "Our preeminent product portfolio positions us well to deliver a strong fiscal second half of 2024. We believe Micron is one of the biggest beneficiaries in the semiconductor industry of the multi-year opportunity enabled by AI."

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Global tensions have caused big semiconductor manufacturers to consider a diversification of production facilities outside of China—most news headlines have concentrated on new operations or advancement/upgrades in the USA, India and Japan. As reported by the Financial Times, Malaysia has quietly established itself as a haven for big chip firms—a "free-trade zone" on the island of Penang is home to fancy Intel and Micron production operations. Team Blue's emerging next-gen Battlemage GPU was spotted during a summer 2023 press event—at the time, HardwareLuxx reported the existence of a "BMG G10" die in Intel Malaysia's Failure Lab. Micron celebrated its 45th anniversary last October, with the opening of a new cutting-edge assembly and test facility in Batu Kawan, Penang. The two firms—and a few others—established roots in Malaysia decades ago, but future investments are set to boost the nation's semiconductor industry.

According to Tom's Hardware: "Intel will spend a whopping $7 billion on new, Malaysian chip assembly and testing facilities. The overall total of foreign Malaysian investment in 2023 was $12.8 billion, and that exceeded its seven-year combined total from 2013 to 2020." Anwar Ibrahim, the country's Prime Minister, is keen to see manufacturing advance to a higher-value tier—a February FT.com interview reveals that this is a "critical goal" for his administration. The establishment of a front-end semiconductor manufacturing plant would be welcomed the most—Zafrul Aziz, Trade Minister of Malaysia, stated (to FT): "I am optimistic we will attract more than one. All it takes is one to kick-start a wave." Historically, Malaysian facilities have been created to deal with the back end of semiconductor supply chains—e.g. packing, assembling and testing components. Company leaderships consider these activities to be of lower value, due to their less complex nature. Certain foreign investments, into Malaysian plants, have come from Chinese firms—a growing presence of PRC-owned plants could complicate matters. The Financial Times article presents a possible future scenario, with the US Government stepping in...if alarmed to a certain degree.

A 2019-signed export license has allowed Intel to supply laptop processors to Huawei, under an exclusive deal—this US Government approved arrangement was not viewed favorably by AMD. The rival chipmaker apparently missed out on the securing of a similar trade license back in 2021. According to a new Reuters report, Team Red and a handful of supporters have attempted to revoke Intel's license—worth hundreds of millions of dollars. Two anonymous sources allege that: "Intel has survived an effort to halt chip sales to Huawei...giving one of the world's largest chipmakers more time to sell to the heavily sanctioned Chinese telecoms company." Intel and Huawei's symbiosis is set to end later this year—folks on the inside reckon that the current US administration will not approve a renewal. Reports suggest that Qualcomm is not anticipating a renewal either—Huawei is an approved buyer of Snapdragon chips, but industry whispers indicate an eventual shift to in-house fare.

Intel, Huawei, US Commerce Department and the White House have declined to comment on the aforementioned scenario. Reuters also sent a query to AMD, but the publication did not receive a response. Earlier last year, a government official revealed that "Huawei's licensing policy" was under review, alongside a general push to scrap a number of trade deals. According to insiders, the same government official allegedly told companies—in private—that the US Commerce Department would fix "the licensing discrepancy." Another anonymous source believes that the agency shelved these plans late last year, for reasons unknown—they stressed that there is potential for a revival. Given the upcoming expiry of Intel and Huawei's arrangement—within the year—it makes little sense to implement a drastic change.

JEDEC is expected to announce a next-gen low-power RAM memory (LPDDR) standard specification by the third quarter of this year. Earlier today, smartphone technology watcher—Revegnus—highlighted insider information disclosed within an ETnews article. The International Semiconductor Standards Organization (JEDEC) has recently concluded negotiations regarding "next-generation mobile RAM standards"—the report posits that: "more than 60 people from memory, system semiconductor, and design asset (IP) companies participated" in a Lisbon, Portugal-situated meeting. A quoted participant stated (to ETnews): "We have held various discussions to confirm the LPDDR6 standard specification...(Details) will be released in the third quarter of this year."

The current generation LPDDR5 standard was secured back in February 2019—noted improvements included 50% performance and 30% power efficiency jumps over LPDDR4. Samsung Electronics and SK Hynix are in the process of mass-producing incremental improvements—in the form of LPDDR5X and LPDDR5T. A second source stated: "Technology development and standard discussions are taking place in a way to minimize power consumption, which increases along with the increase in data processing." A full-fledged successor is tasked with further enhancing data processing performance. Industry figures anticipate that LPDDR6 will greatly assist in an industry-wide push for "on-device AI" processing. They reckon that "large-scale AI calculations" will become the norm on smartphones, laptops, and tablet PCs. Revegnus has heard (fanciful) whispers about a potential 2024 rollout: "support may be available starting with Qualcomm's Snapdragon 8 Gen 4, expected to be released as early as the second half of this year." Sensible predictions point to possible commercialization in late 2025, or early 2026.

The US government is reported to be preparing a very healthy $3.5 billion investment in Intel Corporation—a mid-week published Bloomberg article proposes that the White House has authored a new "fast-moving spending bill." Congressional aides believe that Team Blue—upon official approval/signing off of funds—will be tasked with the production of advanced semiconductors for military and intelligence programs. Bloomberg posits that the resources will be sourced from a "Secure Enclave" project, seemingly linking to a wider tranche of funds within the US government's CHIPS and Science Act. The agreement/contract is expected to run over a period of three years. According to Bloomberg: "the Senate is expected to pass the legislation by a Saturday (March 9) deadline."

Reports from last November suggested that Intel leadership and US government representatives had engaged in negotiations regarding funds for military and intelligence chip applications—the construction costs for new manufacturing facilities were estimated to be in the $3 billion to $4 billion range. A Commerce Department statement was submitted to Bloomberg, but they only commented on an overall $10 billion budget: "We are still reviewing the effect of the appropriations text on the program...(we look) forward to continuing to work with Congress on implementing the Chips and Science Act in a manner the promotes our economic and national security." TSMC, Micron and Samsung are expected to receive "multi-billion-dollar awards" in the near future—these multinational corporations will assist in a bolstering of North American chip manufacturing capabilities.

According to renowned Apple analyst Ming-Chi Kuo, Apple is actively working on a foldable 20.3-inch MacBook, with mass production expected to begin in 2027. In a recent post on X/Twitter, Kuo stated that this foldable MacBook is currently Apple's only foldable product with a clear development schedule. Kuo's revelation comes amidst frequent inquiries about whether Apple plans to mass-produce a foldable iPhone or iPad in 2025 or 2026. His latest survey indicates that while Apple may explore these options, the foldable MacBook is the only device with a definitive timeline. This is not the first time rumors have circulated about a potential foldable MacBook from Apple. In 2022, display industry analyst Ross Young and Bloomberg's Mark Gurman both reported that Apple was interested in launching a foldable device with a screen size of around 20 inches.

Details about the foldable MacBook's design remain scarce, but it is expected to feature a single foldable OLED display that can be used in various configurations, such as a laptop mode with a virtual keyboard on the lower half of the screen or as a large tablet when fully unfolded. While competitors like Samsung, Motorola, and Huawei have already released foldable smartphones, Apple appears to be more cautious, focusing on perfecting the technology before bringing a product to market. As the foldable device market evolves, it will be interesting to see how Apple's unique take on the form factor fares. As Apple's first foldable product, it will be interesting to see what design choices are made and what hardware configuration will be present. But we are still relatively far away from the actual release of 2027.

Electronic Arts revealed a workforce reduction program last week—reportedly impacting around 670 employees—alongside announcements regarding a number of major development project cancellations and reassignments. Laura Miele, President of EA Entertainment and Technology, disclosed that Respawn Entertainment's mysterious "Star Wars FPS Action game" had been axed, with staffers moving onto "new projects based on our owned brands" instead of licensed material. Industry insider reports suggested that an internal Respawn team—not assigned to a "Star Wars: Jedi" sequel—had started work on a Mandalorian/bounty hunter-themed first-person shooter IP. The official announcement of a renewed focus on Respawn's "rich library of owned brands" has generated plenty of internet speculation—Titanfall franchise fans have long demanded a proper third entry in the series. Studio boss, Vince Zampella, has teased revisits in the past—an Axios interview revealed that veteran Titanfall game director, Steve Fukuda, was incubating "something new" with a very small skunkworks-type team.

Earlier this week, Giant Bomb's Jeff Grubb addressed rumored goings-on at Respawn. His "Game Mess Mornings 03/04/24" videocast—co-hosted by Emma Fyffe—included a segment dedicated to EA's adjusted development strategies. Grubb reiterated insider information about "Titanfall Legends" getting canned early on last year—allegedly a single-player Apex/Titanfall crossover experience. Giant Bomb's News Editor has reached out to his network of moles—he shared this inside info during Monday's broadcast: "They're not making Titanfall 3. They just straight up aren't. They do have another team that has been kicking around a project that is very early. There's been a very small team in the prototyping phase and now they're going to go to wider. This is a real project now, but still in the prototyping phase. This game, as it stands today, as far as I understand, is a Titanfall game. It's in the Titanfall universe. But everyone I talk to keeps saying, don't get in your mind that it's Titanfall 3, a game with online multiplayer and a single player campaign."

HP Inc. and its subsidiaries ("HP") announced fiscal 2024 first quarter net revenue of $13.2 billion, down 4.4% (down 4.9% in constant currency) from the prior-year period. First quarter GAAP diluted net EPS was $0.62, up from $0.47 in the prior-year period and within the previously provided outlook of $0.60 to $0.70. First quarter non-GAAP diluted net EPS was $0.81, up from $0.73 in the prior-year period and within the previously provided outlook of $0.76 to $0.86. First quarter non-GAAP net earnings and non-GAAP diluted net EPS excludes after-tax adjustments of $186 million, or $0.19 per diluted share, related to restructuring and other charges, acquisition and divestiture charges, amortization of intangible assets, non-operating retirement-related credits and tax adjustments.

"Our Q1 results reflect continued progress against our Future Ready plan," said Enrique Lores, HP President and CEO. "We are bringing terrific innovation to our customers while driving disciplined execution across every facet of the business. As a result, we delivered solid earnings growth this quarter and we are well positioned to accelerate as the market recovers."

Lenovo Group Limited, together with its subsidiaries ("the Group"), today announced third quarter results reporting Group revenue increasing 3% year-on-year to US$15.7 billion, and Group profitability improving quarter-to-quarter for the second time in a row. Net income was US$357 million on a non-Hong Kong Financial Reporting Standards basis, with net income margin up 0.4% quarter-to-quarter to 2.3%. The Group's diversified growth engines continued to deliver strong performance, with revenue from non-PC businesses accounting for 42% of Group revenue, up 1.3 points year-on-year.

The consistent quarter-to-quarter improvements over past quarters have been driven by the resilience of the Group's core businesses and the wider effectiveness of its ongoing transformation. The SSG business hit an important milestone of passing the US$2 billion revenue threshold, achieved a record high operating profit with operating margin of over 20% and grew revenue from managed services and project and solution services year-on-year for 11 straight quarters. The ISG business delivered quarter-to-quarter revenue growth and reached a record high US$1 billion revenue for its storage, software, and services businesses. Overall, the IDG business resumed revenue growth, outperformed the market and achieved year-on-year shipment growth for PCs, and maintained its industry-leading profitability.

Dylan Patel, of SemiAnalysis, has highlighted worrying industry trends from an October 2021 published report—the Center for Security and Emerging Technology (CSET) document explored and "(outlined) infrastructure investments and regulatory reforms that could make the United States a more attractive place to build new chipmaking capacity and ensure continued U.S. access to key inputs for semiconductor manufacturing." Citing CSET/World Fab Forecast findings, Patel expressed his dissatisfaction with the apparent lack of progress in the region: "The United States is the slowest relevant country in the world to build a fab thanks to NIMBY assholes and the garbage regulatory/permitting system." The SemiAnalysis staffer likely believes that unsuitable conditions remain in place, and continue to hinder any forward momentum—for greenfield fabrications projects, at least.

The CSET 2021 report posited that the proposed $52 billion CHIPS Act fund would not solve all USA chip industry problems—throwing a large sum of money into the pot is not always a surefire solution: "The United States' ability to expeditiously construct fabs has declined at the same time as the total number of fab projects in the United States has declined. Some of this is due to changes in the global semiconductor value chain, which has concentrated resources in Asia as foundries have risen in prominence, and countries like Taiwan, South Korea, and China have established significant market share in the industry from 1990 to 2020. However, during this same 30-year period, the time required to build a new fab in the United States increased 38 percent, rising from an average of 665 days (1.8 years) during the 1990 to 2000 time period to 918 days (2.5 years) during the 2010-2020 time period (Figure 2). At the same time, the total number of new fab projects in the United States was halved, decreasing from 55 greenfield fab projects in the 1990-2000 time period to 22 greenfield fab projects between 2010 and 2020." Intel's work-in-progress Ohio fabrication site has suffered numerous setbacks (including delayed CHIPS Act payments)—the latest news articles suggest that an opening ceremony could occur in late 2026 or early 2027. Reportedly, TSMC's Arizona facility is a frequently runs into bureaucratic and logistical headaches—putting pressure on company leadership at their Hsinchu (Taiwan) headquarters.

China's National Supercomputer Center (NUDT) introduced their Tianhe-3 system as a prototype back in early 2019—at the time it had been tested by thirty local organizations. Notable assessors included the Chinese Academy of Sciences and the China Aerodynamics Research and Development Center. The (previous generation) Tianhe-2 system currently sits in a number seven position of world-ranked Supercomputers—offering a measured performance of 33.86 petaFLOPS/s. The internal makeup of its fully formed successor has remained a mystery...until now. The Next Platform believes that the "Xingyi" monikered third generation supercomputer houses the Guangzhou-based lab's MT-3000 processor design. Author, Timothy Prickett Morgan, boasted about acquiring exclusive inside knowledge ahead of international intelligence agencies—many will be keeping an eye on the NUDT, since it is administered by the National University of Defence Technology (itself owned by the Chinese government).

The Next Platform has a track record of outing intimate details relating to Chinese-developed scientific breakthroughs—the semi-related "Oceanlight" system installed at their National Supercomputer Center (Wuxi) was "figured out" two years ago. Tianhe-3 and Oceanlight face significant competition in the form of "El Capitan"—this is the USA's prime: "supercomputer being built right now at Lawrence Livermore National Laboratory by Hewlett Packard Enterprise in conjunction with compute engine supplier AMD. We need to know because we want to understand the very different—and yet, in some ways similar—architectural path that China seems to have taken with the Xingyi architecture to break through the exascale barrier."

Various news outlets have been keeping tabs on OpenAI's CEO—Sam Altman—the AI technology evangelist was reported to be pursuing an ambitious proprietary AI chip project in early 2024. Inside sources pointed to late-January negotiations with important investment personnel in the Middle East—many believe that OpenAI leadership is exploring the idea of establishing its own network of semiconductor production plants. Late last week, The Wall Street Journal followed up on last month's AI industry rumors: "(Altman) has another great ambition: raising trillions of dollars to reshape the global semiconductor industry. The OpenAI chief executive officer is in talks with investors including the United Arab Emirates government to raise funds for a wildly ambitious tech initiative that would boost the world's chip-building capacity, expand its ability to power AI." One anonymous insider reckons that "the project could require raising as much as $5 trillion to $7 trillion."

TSMC is reportedly in the equation—Altman allegedly conducted talks with top brass last month—their expertise in cutting edge fabrication techniques would be of great value, although it is somewhat futile to reveal too many industry secrets given the sheer scale of OpenAI's (reported) aggressive expansion plans. The Wall Street Journal (WSJ) suggests that the embryonic venture is far more "open" than previously reported—a collaborative venture could be established once funding is secured, although Altman & Co. face "significant obstacles" en route. WSJ proposes that the somewhat OpenAI-centric fabrication network is best founded by a joint partnership—involving multiple investors, contract chip manufacturers (perhaps TSMC), and energy/power providers. OpenAI appears to be the "primary buyer" of resultant fabricated AI chips, with manufacturing services also offered to other clients. The scale of such an endeavor is put into perspective by WSJ's analysis (via inside sources): "Such a sum of investment would dwarf the current size of the global semiconductor industry. Global sales of chips were $527 billion last year and are expected to rise to $1 trillion annually by 2030. Global sales of semiconductor manufacturing equipment—the costly machinery needed to run chip factories—last year were $100 billion, according to an estimate by the industry group SEMI."

Last week SK Hynix revealed ambitious plans for its next wave of High Bandwidth Memory (HBM) products—their SEMICON Korea 2024 presentation included an announcement about cutting-edge HBM3E entering mass production within the first quarter of this year. True next-gen HBM development has already kicked off—TPU's previous report outlines an HBM4 sampling phase in 2025, followed by full production in 2026. South Korea's Pulse News believes that TSMC has been roped into a joint venture (with SK Hynix). An alleged "One Team" strategic alliance has been formed according to reports emerging from Asia—this joint effort could focus on the development of HBM4 solutions for AI fields.

Reports from last November pointed to a possible SK Hynix and NVIDIA HBM4 partnership, with TSMC involved as the designated fabricator. We are not sure if the emerging "One Team" progressive partnership will have any impact on previously agreed upon deals, but South Korean news outlets reckon that the TSMC + SK Hynix alliance will attempt to outdo Samsung's development of "new-generation AI semiconductor packaging." Team Green's upcoming roster of—"Hopper" H200 and "Blackwell" B100—AI GPUs are linked to a massive pre-paid shipment of SK Hynix HMB3E parts. HBM4 products could be fitted on a second iteration of NVIDIA's Blackwell GPU, and the mysterious "Vera Rubin" family. Notorious silicon industry tipster, kopite7kimi, believes that "R100 and GR200" GPUs are next up in Team Green's AI-cruncher queue.

A Taiwan Economic Daily news article proposes that a couple of high profile clients are considering TSMC's 2 nanometer process—Apple is widely believed to be the first customer to join the foundry's queue for cutting edge services. The report posits that Intel is also signed up on the Taiwanese firm's 2 nm reservation list—TSMC is expected to start production in 2025—insiders reckon that Team Blue's "Nova Lake" CPU family is the prime candidate here. Its CPU tile is alleged to utilize TSMC 2 nm node. Intel's recent "Core" processor roadmaps do not display any technologies beyond 2025—many believe that "Nova Lake" is pencilled in for a loose 2026 launch window, perhaps within the second half of the year.

The existence of "Nova Lake" was revealed late last year by HWiNFO patch notes—a short entry mentioned preliminary support for the family's integrated GPU. Intel is engaged in hyping up of its own foundry's 20A and 18A processes, but remain reliant on TSMC plants for various bits of silicon. Industry tipsters reckon that aspects of "Lunar Lake" CPUs are based on the Taiwanese foundry's N3B node. Team Blue Corporation and United Microelectronics Corporation (UMC) announced a new development partnership last week, but initial offerings will arrive on a relatively passé "12-nanometer semiconductor process platform." TSMC's very advanced foundry services seem to be unmatched at this juncture.

Western Digital Corp. today reported fiscal second quarter 2024 financial results. "Western Digital's second quarter results demonstrate that the structural changes we have put in place over the last few years and the strategy we have been executing are producing significant outperformance across our flash and HDD businesses," said David Goeckeler, Western Digital CEO. "We are seeing our efforts come to fruition as our financial performance met, or exceeded, the non-GAAP guidance ranges we provided in October, and I am confident that our strategy of managing inventory proactively, offering a broad range of products, closely controlling our product cost through focused R&D and manufacturing, and bolstering the agility of our business will allow us to improve through-cycle profitability and dampen business cycles into the future."

• Second quarter revenue was $3.03 billion, up 10% sequentially (QoQ). Cloud revenue increased 23% (QoQ), Client revenue decreased 2% (QoQ) and Consumer revenue increased 15% (QoQ).
• Second quarter GAAP earnings per share (EPS) was $(0.87) and Non-GAAP EPS was $(0.69), which includes $156 million of underutilization-related charges in Flash and HDD.
• Expect fiscal third quarter 2024 revenue to be in the range of $3.20 billion to $3.40 billion.
• Expect Non-GAAP EPS in the range of $(0.10) to $0.20, which includes $30 to $40 million of underutilization-related charges in HDD.

OpenAI CEO, Sam Altman, had a turbulent winter 2023 career moment, but appears to be going all in with his company's future interests. A Bloomberg report suggests that the tech visionary has initiated a major fundraising initiative for the construction of OpenAI-specific semiconductor production plants. The AI evangelist reckons that his industry will become prevalent enough to demand a dedicated network of manufacturing facilities—the U.S. based artificial intelligence (AI) research organization is (reportedly) exploring custom artificial intelligence chip designs. Proprietary AI-focused GPUs and accelerators are not novelties at this stage in time—many top tech companies rely on NVIDIA solutions, but are keen to deploy custom-built hardware in the near future.

OpenAI's popular ChatGPT system is reliant on NVIDIA H100 and A100 GPUs, but tailor-made alternatives seem to be the desired route for Altman & Co. The "on their own terms" pathway seemingly skips an expected/traditional chip manufacturing process—the big foundries could struggle to keep up with demand for AI-oriented silicon. G42 (an Abu Dhabi-based AI development holding company) and SoftBank Group are mentioned as prime investment partners in OpenAI's fledgling scheme—Bloomberg proposes that Altman's team is negotiating a $8 to 10 billion deal with top brass at G42. OpenAI's planned creation of its own foundry network is certainly a lofty and costly goal—the report does not specify whether existing facilities will be purchased and overhauled, or new plants being constructed entirely from scratch.

TSMC (TWSE: 2330, NYSE: TSM) today announced consolidated revenue of NT$625.53 billion, net income of NT$238.71 billion, and diluted earnings per share of NT$9.21 (US$1.44 per ADR unit) for the fourth quarter ended December 31, 2023.

Year-over-year, fourth quarter revenue was essentially flat while net income and diluted EPS both decreased 19.3%. Compared to third quarter 2023, fourth quarter results represented a 14.4% increase in revenue and a 13.1% increase in net income. All figures were prepared in accordance with TIFRS on a consolidated basis. In US dollars, fourth quarter revenue was $19.62 billion, which decreased 1.5% year-over-year but increased 13.6% from the previous quarter.

Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

Micron Technology, Inc. (Nasdaq: MU) today announced results for its first quarter of fiscal 2024, which ended November 30, 2023.

Fiscal Q1 2024 highlights

• Revenue of $4.73 billion versus $4.01 billion for the prior quarter and $4.09 billion for the same period last year
• GAAP net loss of $1.23 billion, or $1.12 per diluted share
• Non-GAAP net loss of $1.05 billion, or $0.95 per diluted share
• Operating cash flow of $1.40 billion versus $249 million for the prior quarter and $943 million for the same period last year

"Micron's strong execution and pricing drove better-than-anticipated first quarter financial results," said Micron Technology President and CEO Sanjay Mehrotra. "We expect our business fundamentals to improve throughout 2024, with record industry TAM projected for calendar 2025. Our industry-leading High Bandwidth Memory for data center AI applications illustrates the strength of our technology and product roadmaps, and we are well positioned to capitalize on the immense opportunities artificial intelligence is fueling across end markets."

TSMC today announced consolidated revenue of NT$546.73 billion, net income of NT$211.00 billion, and diluted earnings per share of NT$8.14 (US$1.29 per ADR unit) for the third quarter ended September 30, 2023. Year-over-year, third quarter revenue decreased 10.8% while net income and diluted EPS both decreased 24.9%. Compared to second quarter 2023, third quarter results represented a 13.7% increase in revenue and a 16.1% increase in net income. All figures were prepared in accordance with TIFRS on a consolidated basis.

In US dollars, third quarter revenue was $17.28 billion, which decreased 14.6% year-over-year and increased 10.2% from the previous quarter. Gross margin for the quarter was 54.3%, operating margin was 41.7%, and net profit margin was 38.6%. In the third quarter, shipments of 3-nanometer accounted for 6% of total wafer revenue; 5-nanometer accounted for 37%; 7-nanometer accounted for 16%. Advanced technologies, defined as 7-nanometer and more advanced technologies, accounted for 59% of total wafer revenue.

The downward spiral for PC shipments continued during the third quarter of 2023 (3Q23) as global volumes declined 7.6% year over year with 68.2 million PCs shipped, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Though demand and the global economy remain subdued, PC shipments have increased in each of the last two quarters, slowing the rate of annual decline and indicating that the market has moved past the bottom of the trough.

PC inventory has also become leaner in the past few months and is near healthy levels in most channels. However, downward pressure on pricing persists and will likely remain an issue within the consumer and business sectors. While most of the top 5 vendors experienced double-digit declines during the quarter, Apple's outsized decline was the result of unfavorable year-over-year comparisons as the company recovered from a COVID-related halt in production during 3Q22. Meanwhile, HP's growth was largely due to the normalizing of inventory.