Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced a strategic collaboration with Siemens Digital Industries Software for semiconductor design and manufacturing processes for the 2 nm generation. Rapidus will collaborate with Siemens to jointly develop a process design kit based on the Calibre platform, the industry-standard verification solution that enables highly accurate and efficient physical verification, manufacturing optimization and reliability assessment from semiconductor design through to fabrication, while continuing to further its design and verification ecosystem.

This collaboration supports the manufacturing for design (MFD) concept advocated by Rapidus to achieve high yield and short turnaround time from the early stages of manufacturing. Further, Rapidus and Siemens EDA will build a reference flow that holistically supports design, verification and manufacturing from front-end to back-end. This reference flow provides a smooth development environment for Rapidus' Rapid and Unified Manufacturing Service (RUMS).

Today marks a new milestone in the growth of Intel Foundry's design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. This comes on the heels of recent announcements where those same partners declared readiness for Intel 18A designs. "Today's news shows how Intel Foundry continues to combine the best of Intel with the best of our ecosystem to help our customers realize their AI systems ambitions," said Suk Lee, vice president for Ecosystem Development, Intel Foundry.

The success of Intel Foundry is rooted in collaboration with a vibrant design ecosystem. This ensures customers can access our leading process and packaging technologies. Now, in collaboration with our ecosystem partners, we are making it as easy and as fast as possible for companies to optimize, fabricate and assemble their system-on-chip designs through our foundries, while enabling their designers with validated EDA tools, design flows and IP portfolios for silicon-through-package design. This systems foundry approach allows our customers to innovate at every layer of the stack so they can meet the complex computing demands of the AI era, where chip architectures increasingly rely on multiple CPUs, GPUs and NPUs in a package to achieve performance requirements.

A manufacturing plant near Hsinchu, Taiwan's Silicon Valley, is among facilities worldwide boosting energy efficiency with AI-enabled digital twins. A virtual model can help streamline operations, maximizing throughput for its physical counterpart, say engineers at Wistron, a global designer and manufacturer of computers and electronics systems. In the first of several use cases, the company built a digital copy of a room where NVIDIA DGX systems undergo thermal stress tests (pictured above). Early results were impressive.

Making Smart Simulations
Using NVIDIA Modulus, a framework for building AI models that understand the laws of physics, Wistron created digital twins that let them accurately predict the airflow and temperature in test facilities that must remain between 27 and 32 degrees C. A simulation that would've taken nearly 15 hours with traditional methods on a CPU took just 3.3 seconds on an NVIDIA GPU running inference with an AI model developed using Modulus, a whopping 15,000x speedup. The results were fed into tools and applications built by Wistron developers with NVIDIA Omniverse, a platform for creating 3D workflows and applications based on OpenUSD.

Intel Corp. today launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners - including Synopsys, Cadence, Siemens and Ansys - who outlined their readiness to accelerate Intel Foundry customers' chip designs with tools, design flows and IP portfolios validated for Intel's advanced packaging and Intel 18A process technologies.

The announcements were made at Intel's first foundry event, Intel Foundry Direct Connect, where the company gathered customers, ecosystem companies and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others.

Siemens AG, a leading technology company, and Intel Corporation, one of the world's largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

"Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we're proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration," said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. "Our joint efforts will contribute to achieving global sustainability goals."