Thermalright has taken yet another low-key approach to announcing new products—the Taiwan hardware cooling specialist has updated its website with Heilos thermal pads. The model name looks to be a typo—should they have used "Helios" instead? A prominent sun graphic is placed on the bottom left of Thermalright's packaging for both of the Intel and AMD variants. It is unfortunate that something got lost in translation, or a spellcheck did not pick up on the small error before going to print/publication. Anyway...Thermalright is offering two sizes, with an identical 0.2 mm thickness—40x40 mm for AMD's AM4/AM5 CPU platforms, and a smaller pad (40x30 mm) for Intel LGA115X/1200/1700 CPUs. Pricing and availability is TBD.

These easy-peel away applicators provide an alternative route for users who fret about the best way to deal with traditional tubes of thermal paste. Tom's Hardware has pored over the Heilos specs—these pads offer thermal conductivity performance (8.5 W/mK) and resistance (0.04°C cm²/W), comparable (in their opinion) to "inexpensive" tubes of Arctic MX-4 and MX-5. The latter ranks at number four on the publication's "list of the best thermal pastes." Older thermal pads from other manufacturers have been criticized for falling short in terms of cooling performance, when cross-referenced against market leading thermal pastes—it is encouraging to see Thermalright addressing these concerns (specs-wise). We hope that evaluation samples have been sent out to review outlets.

Excellent thermal conductivity thanks to the new Apex thermal pads Soft! Alphacool's high-performance thermal pads offer a variety of advantages compared to a standard pad. Given the high compressibility and natural stickiness, they nestle perfectly to surfaces, compensate for unevenness between electronic components and thus provide a significant improvement in heat transfer. As a result, the enormous waste heat not only from voltage converters and VRAMs of graphics cards, but also from PlayStation and Xbox game consoles can be effectively dissipated, significantly increasing performance and durability. The heat conduction pads can also be used to cool a wide variety of electronic components far away from PC water cooling due to their considerable electrical insulation as well as the large number of variants in terms of thickness and dimensions.

More thermal conductivity with the new Core Soft thermal pads! The performance thermal pads from Alphacool offer a variety of advantages compared to a standard pad. They perfectly cling to surfaces, compensate for unevenness between electronic components and thus provide a significant improvement in heat transfer. This means that the enormous waste heat not only from voltage converters and VRAMs of graphics cards, but also from Playstation and Xbox game consoles, can be effectively dissipated and performance and durability significantly increased. Due to their excellent electrical insulation as well as the large number of variants in terms of thickness and dimensions, the Core thermal pads can also be used to cool a wide variety of electronic components apart from PC water cooling.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, expands its wide array of thermal interfaces with today's launch of the TP-3 Premium Performance thermal pads.

The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances.Thanks to their good compression properties, they adapt to the surface profile without putting too much stress on the components. This ensures optimum heat transfer even on rough surfaces. The ARCTIC TP-3 Pads are heat-conducting, vibration-damping, deformable, electrically insulating and therefore safe and easy to use. They are versatile and are therefore ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.

Thermalright today introduced the Valor Odin series of thermal pads that you can use to improve the cooling performance of your motherboard's VRM heatsinks, M.2 SSD heatsinks, or your graphics card's coolers (to better pull heat from the memory chips or VRM). The company claims that the pad offers thermal conductivity of 15 W/mK, which is in the league of thermal pastes. The pad uses aluminium nitride as a key ingredient, while maintaining electrical non-conductivity up to 9.8 kV, and has a density of 3.1 g/cc. There are three variants of the Thermalright Valor Odin based on pad thickness—1.0 mm, 1.5 mm, and 2.0 mm, all with the same density and thermal characteristics. Each pack includes a sheet measuring 95 mm x 50 mm, which you cut to size. The company didn't reveal pricing.

A user discovered a manufacturing defect with their PowerColor Radeon RX 6700 XT graphics card. Apparently a card still has the protective covers of its thermal pads still in place on a finished graphics card. "angry_kitten" on Reddit posted pictures of a disassembled PowerColor RX 6700 XT graphics card showing protective covers over the thermal pads that pull heat from secondary components such as memory chips and VRM. The user spotted the blue protective film before installing the card, and decided to take the card apart. With modern memory chips and MOSFETs capable of heating up beyond 100 °C, this card would have raised quite a stink. This is likely a defect at the plant that assembles the card, installing the cooler onto the PCB, rather than at the OEM that makes these coolers. These protective covers are meant to be removed at the final assembly line. There's no evidence at this point to suggest that the issue is widespread.

Today, Alphacool presents a new generation of thermal pads. The Alphacool Apex Soft and Rise Ultra Soft thermal pads can be compared thermal paste due to their outstanding properties and efficiency.

The Apex Soft and Rise Ultra Soft thermal pads fill up the unevenness of components significantly better than standard pads. As they can nestle between components better, heat transfer between the cooler and component is significantly increased. The softer consistency of the thermal pads also prevents taller components such as voltage converters or VRAM from being subjected to increased contact pressure from the cooler. The special material does not dry out as easily as standard thermal pads, allowing them to be used for a much longer period without any significant loss of performance.

Tech innovator GELID Solutions unveils the ultimate performance GP-Ultimate 120x20 thermal pad. The GP-Ultimate 120x20 is a product of GELID Solutions GAMER product line. The GP-Ultimate 120x20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.

Thanks to its enhanced multilayer matrix, advanced material composition, and the ultimate 15 W/mK thermal conductivity, the GP-Ultimate 120x20 offers the best performance in class. It is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60° to 220°C. The GP-Ultimate 120x20 features seamless application and has the thermal pad dimensions of 120x20mm with 0.5 mm, 1 mm, 1.5 mm and 2 mm thickness to best fit enlarged PCB surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.