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VIA Unveils the World's Smallest x86 Quad Core System, ARTiGO A1250

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the world's smallest x86 quad core system, the VIA ARTiGO A1250 slim system, featuring a 1.0 GHz VIA QuadCore processor and the latest VIA VX11H media system processor (MSP), in chassis the size of a paperback novel. The ultra-compact VIA ARTiGO A1250, is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance as well as medical and healthcare applications.

The VIA ARTiGO A1250 leverages the VIA VX11H MSP to deliver an immersive multimedia experience complete with 3D stereoscopic and HD display support in a low power envelope, which a typical power consumption of a mere 32W TDP. The VIA ARTiGO A1200 can fit easily into any environment, whether it is behind a monitor or on the wall with a 10 x 10 cm VESA mount or placed alongside other home media devices. For system developers, VIA provides third party software security through a unique hardware/software design.

VIA Announces First ETX Module, VIA ETX-8X90

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ETX-8X90 module which features a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900 media system processor (MSP), providing industry leading performance in a power efficient design. The VIA ETX-8X90 module provides a highly integrated and compact platform for embedded applications in medical, test and measurement, industrial automation and transportation.

The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles enabling customers to rapidly develop new and innovative devices. Customers can take advantage of a proprietary start-up kit including a multi-I/O baseboard reference, or can utilize extensive technical support from VIA in developing a custom baseboard. In addition to support for the embedded industry leading VxWorks RTOS, the VIA ETX-8X90 runs a wide range of Windows and Linux based operating systems.

VIA Announces Latest VIA EPIA-M920 Mini-ITX Embedded Board

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA EPIA-M920 Mini-ITX board, the first VIA Mini-ITX board to feature the latest VIA VX11H media system processor (MSP) enabling DirectX 11 and 3D stereoscopic display capabilities for immersive environments. Providing superior performance with the latest in connectivity technology in a low power envelope, the VIA EPIA-M920 Mini-ITX provides the ideal platform for a wide array of next-generation compact devices for applications in healthcare, gaming, digital signage, and other vertical market segments.

With the choice of a 1.2GHz VIA QuadCore-E processor for high-end performance or a 1.0GHz VIA Eden X2 dual core processor for fanless system design, the VIA EPIA-M920 is a highly flexible platform for compact, low power systems with today's latest connectivity options including HDMI and USB 3.0. In combination with the VIA VX11H MSP, the VIA EPIA-M920 Mini-ITX provides the latest in graphic capabilities, for richer textures and more life-like images in even the most demanding multi-display environments.

VIA Magic Box Announced

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced VIA Magic Box, a complete hardware and software solution for dynamic digital signage. VIA Magic Box integrates the user friendly VIA Magic View content management software optimized for a range of VIA x86 hardware platforms to provide a high performance, scalable digital signage solution ideal for a wide range of user scenarios.

Currently available with the choice of a VIA ARTiGO A1150 or fanless VIA ARTiGO A1200, VIA Magic Box provides full HD support and playback of the most popular video codecs through video decoding hardware acceleration including DivX, WMV9, VC1 and H.264, in ultra compact, low power designs. The VIA Magic View content management software has been optimized to provide a user friendly interface to manage digital signage content, layout and scheduling.

VIA Announces First QuadCore Pico-ITX Board with 3D Display Capabilities

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA EPIA-P910 Pico-ITX board, the first VIA board to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-Series processor. Providing superior performance and outstanding display capabilities, the VIA EPIA-P910 Pico-ITX provides the ideal platform for a wide array of next-generation ultra compact devices for applications in health-care, logistics, fleet management and other vertical market segments.

The VIA EPIA-P910 Pico-ITX is the first VIA board to include the VIA VX11H MSP which provides the latest in graphic capabilities, including DirectX 11 support, for richer textures as well as 3D stereoscopic display. In combination with a 1.0GHz VIA QuadCore E-Series processor, the VIA EPIA-P910 offers high performance computing in an ultra compact, low power design with today's latest connectivity options including HDMI and USB 3.0.

ASMedia Offices Raided over USB 3.0 Controller Design Infringement Allegations

Offices of semiconductor company ASMedia were raided by law enforcement agencies in Taiwan, late last month, over allegations of intellectual property (IP) theft of physical-layer component (PHY) design of USB 3.0 host controllers. While the agencies did not disclose who is behind the allegations, it is rumored to be VIA, which sells USB 3.0 host, hub, and device controllers under the VIA Labs Inc (VLI) brand. Many of ASMedia's engineers are former employees of VIA, who are believed to have trafficked its IP over to their new employers.

Following the raid, ASMedia president Lin Che-wei held a press-conference in Taipei, announcing full cooperation with the authorities over the investigation. It remains to be seen how the investigation affects supplies of ASMedia's USB 3.0 controllers. A PC motherboard maker we spoke with expressed concern over the developments.

APC ROM, Kernel and Bootloader Available for Public Download

We are pleased to announce that the APC ROM, kernel and bootloader are now available for download here. Our efforts are focused on creating the most stable and user friendly Android experience for APC and with this release we are aiming to provide developers with the tools you need to begin creating new and exciting apps for our Android environment. At the same time we understand the desire and passion that exists from the hacker and developer communities and we want to allow you the freedom to experiment with installing other distributions to match your needs.

In addition to the availability of the APC ROM, kernel and bootloader we have created a forum within the APC website, at www.forum.apc.io, to encourage discussion and innovations for APC. We are always interested to see what the actual users envision for APC and aim to provide a fertile feeding ground for new ideas and applications to develop. We have created a separate section for those who choose to go with a different distribution and wish to develop strong community support for these efforts. Also available at this time are technical drawings of the board, including the 3D stacking layout for those who want to create customized cases for their APC, as well as a quick guide and other reference material.

VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications.

Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VIA VAB-800 Pico-ITX board combines a rich I/O set with superb multimedia performance, supporting playback of the most demanding video formats in resolutions up to 1080p. Leveraging VIA's hardware design expertise, the VIA VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.

VIA Announces ARM Digital Signage System with Android Support

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARM DS (Digital Signage) system.

Developed for the Android operating system, the VIA ARM DS is an all-in-one system-ready solution for managing dynamic displays for cost sensitive high volume segments where high performance video and connectivity are paramount for enhanced customer engagement. Applications range from kiosks, POS systems, video walls, and menu boards to TVOIP, cloud streaming, and Out of Home Advertising across a broad spectrum of retail, hospitality, education, and entertainment environments.

HTC to Complete Acquisition of S3 Graphics

S3 Graphics' future hung in the balance since June 2011, when its parent company VIA Technologies announced sale of its stake in it. Since then, it's been a word on the wires, that smartphone maker HTC has been in the fray to buy it out, since it is facing IP turbulence with Apple. HTC and Apple used S3 Graphics (September 2011) and AMD (November 2011), respectively, as proxies in their patent infringement battles. It emerged out of the patent spat, that S3 Graphics holds a handy bouquet of graphics IP, and HTC announced that it is now back on track to acquire it.

Smartphone giant HTC backed S3 Graphics' claims to certain graphics-related patents in the patent infringement case against Apple. "We think S3's patent portfolio is valid and strong, and we have decided to complete the purchase of S3 after cautious assessment," HTC's general counsel Grace Lei said, at an annual shareholders' general meeting. S3 Graphics currently owns about 270 patents, some of which are licensed to Sony Corp., Nintendo Co. and Microsoft Corp., Lei added.

VIA's $49 APC Listed for Pre-Order, Sells Out

VIA listed the US $49 Android mini-PC (APC) system board for pre-order. The product sold out in a few hours following staggering demand. VIA announced that all pre-orders will be shipped starting early-July, and the company is working hard to make the product available through local distributors around the world, to eliminate shipping costs to the end-users. Announced the APC back in May, the APC is a neo-ITX system board that can fit into most ITX and ATX chassis, and can be powered both by external 2-pin DC input, and internal 4-pin ATX input. The board seats an ARM-based SoC, which drives Google's Android 2.3 operating system, modified for conventional PC interfaces.

VIA Announces Fanless VIA ARTiGO A1200

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARTiGO A1200 slim PC kit, featuring a VIA Eden X2 dual core processor. The fanless, ultra-compact VIA ARTiGO A1200 is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance applications.

The latest in the VIA ARTiGO series, the VIA ARTiGO A1200 delivers an ultra-low profile design a mere 3 cm high, and utilizes the innovative industrial buckled-blade thermal fin design to dispatch system heat and provide reliable, stable performance in temperatures ranging from 0ºC ~ 45ºC. The VIA ARTiGO A1200 can fit easily into any environment, whether it is behind a monitor or on the wall with a 10 x 10 cm VESA mount or placed alongside other home media devices.

Habey Readies Fanless IPC with Core i3 Processor

Known more for its VIA Nano and Intel Atom-powered fanless IPCs (industrial PCs), Habey is readying BIS-6763, a new IPC model that is driven by a robust Core i3 "Sandy Bridge" dual-core processor. Measuring 190 x 190 x 67 mm, the IPC is made of a metal chassis, a portion of which is ridged, to double up as a heatsink. Beneath it is a pair of cylindrical heat pipes that transport heat to the top panel (heatsink), which cool the Core i3-2367M processor (dual-core, 1.40 GHz, 3 MB L3, 17W TDP), and Intel HM65 Express PCH.

Sadly, the IPC does not take advantage of the processor's dual-channel DDR3 IMC, there's just the one DDR3 SO-DIMM slot, supporting up to 8 GB of DDR3-1333 MHz memory. For expansion, there are two mini-PCIe slots. The sole storage option is a 2.5-inch SATA 6 Gb/s SSD/HDD bay. Connectivity includes one serial RS232 interface, six USB 2.0, gigabit Ethernet, and Intel HD 3000 graphics that gives out an HDMI, and a D-Sub display output. With 2 GB of DDR3 memory included, the BIS-6763 is expected to be priced at US $499. A variant that's powered by Intel Celeron 857 (dual-core, 1.20 GHz, 2 MB L3, 17W TDP), is also expected to be available, at US $299.

VIA Initiates APC: The $49 Android PC

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today unveiled the $49 APC Android PC system.

Powered by a WonderMedia ARM processor, APC integrates memory, storage, and a full set of consumer I/O features in a small footprint Neo-ITX motherboard that can be connected to a TV or monitor. The system also features a custom build of Android that has been optimized for keyboard and mouse input, and comes with a browser and a selection of preinstalled apps.

Q1 Graphics Shipments Decline 0.8% Over Last Quarter and Slip 3.38% Over Last Year

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q1'12. The news was not good. AMD was able to grow shipments over last quarter by 0.3%, in a down quarter. Intel slipped 1.3% and Nvidia declined 4.5% from the last quarter.

Although this did not shape up to be a great quarter for the suppliers, it actually wasn't as bad as it could have been. We found that shipments during the first quarter of 2012 behaved according to past years with regard to seasonality, declining from the previous quarter; however, this quarter's decline (of 0.8%) was less than the ten-year average of 3.1%. If we use graphics as an indicator, the industry seems to be recovering from the floods in Thailand.

VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.

Leveraging the digital prowess of the combined 1.0GHz VIA Eden X2 dual core processor and the VIA VX900H media system processor (MSP) on the VIA EPIA-P900 board, the VIA AMOS-3002 offers a powerful, rugged and HD-ready industrial-class PC that combines all the benefits of high performance 64-bit computing in an ultra compact system. The highly integrated, all-in-one VIA VX900H boasts ruthless hardware acceleration of the most demanding codecs, including MPEG-2, WMV9 and H.264, in resolutions up to 1080p across the latest display connectivity standards, including native HDMI support, for next generation multimedia-intensive applications.

VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.

VLI Launches Third Generation USB Hub Controller

VIA Labs, Inc., a leading supplier of USB 3.0 integrated circuit controllers, today announced its 3rd generation USB 3.0 hub controller, the VIA Labs VL812. The VL812 USB 3.0 Hub Controller utilizes a new low-power design and features an industry-first integrated 5V DC-DC switching regulator, offering a single-chip solution that achieves both high power efficiency and greater system integration for further reduced BOM.

In typical configurations, the VIA Labs VL812 USB 3.0 Hub Controller consumes less than 0.5w under load, making it one of the market's low-power leaders. The low operational power consumption of the new VIA Labs VL812 USB 3.0 Hub allows users to attach an external 2.5" USB 3.0 hard drive, USB 2.0 Flash drive, and a USB Mouse simultaneously without the need for an AC adapter, when connected to a regular USB 3.0 port.

VIA Announces Newer Artigo A1200 Compact Barebones System

VIA is out with its latest addition to the Artigo family of compact barebones PCs, the Artigo A1200, the company's latest addition after Artigo A1150. The A1200 is powered by VIA Nano X2 E dual-core processor clocked at 1.20 GHz, and VIA VX900 chipset that packs integrated graphics with enough compute power for smooth 1080p video playback, with hardware-accelerated decoding of MPEG-2, WMV9 and H.264 HD video formats. The system packs one DDR3 DIMM slot, supporting up to 4 GB of memory. There is room for one SATA HDD. Display outputs include D-Sub and HDMI. Other connectivity includes two gigabit Ethernet interfaces, one USB 3.0 and four USB 2.0 ports, optional 802.11 b/g/n, Bluetooth, and one CFAST interface. The system is fan-less, and passively cooled by heatsinks. Pricing and availability information is not known.

VIA Announces New System-on-Module Solutions

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Worldwide PC Microprocessor Revenues in 2011 Rise 13.2% Compared to 2010

Worldwide PC microprocessor revenues in the fourth calendar quarter of 2011 (4Q11) rose to $10.9 billion, up 1.8% compared to 3Q11 and up 14.2% compared to 4Q10, according to the latest PC microprocessor market share study from International Data Corporation (IDC). For the year 2011 compared to 2010, PC microprocessor revenues rose 13.2% to more than $41 billion.

"The average selling price (ASP) that OEMs pay for PC microprocessors rose more than 9% in 2011, making 2011 the second consecutive year of notable ASP increases," said Shane Rau, director of Semiconductors: Personal Computing research at IDC.

Looking at processor unit shipments in 2011 compared to 2010, overall shipments grew 3.6%. By form factor, mobile PC processor unit shipments grew 3.9% in 2011, while x86 server processor unit shipments grew 9.0%, and desktop processor unit shipments grew 2.7%.

Enermax Officially Launches DreamBass Genie

ENERMAX is proud to announce the launch of its first portable USB audio & amplifier, DreamBass Genie. With the latest audio-remix technology, it turns your music into solid bass enhancement, full surround sound as if you are in live concert, and lets you redefine the real-stereo experience.

The perfect bass with wide-scale high definition audio output is always a dream for the audiophiles. Yet the conventional PC or NB is usually depressed by its dull, vague, compressed, and noisy sound output due to low cost audio-chip, entry-level audio remix software or limited PCB layout. ENERMAX DreamBass USB audio & amplifier is the remedy for music fanatics. With the latest VIA VT1620A chips, plus ENERMAX audio expert's unique bass algorithm and delicated low-interference PCB layout technique, DreamBassTM Genie provides solid bass, crystal clear sound and perfect audio separation. It simply makes your PC audio output equivalent to high-end Hi-Fi stereo amplifier, and lets you touch every musical note and tone.

VIA Announces February Sales Results

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today announced net sales for February 2012 of NT$ 307.27 million (US$ 10.46 million approximately). This sales revenue represents a 1.44 % month-on-month increase over revenues of NT$ 302.94 million (US$ 10.31 million) in January 2012.

VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

VIA Announces World's First Quad Core Mini-ITX Boards

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first quad core Mini-ITX boards featuring the latest VIA QuadCore E-Series processor. The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2 GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products.

The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. To meet the low power demands of the embedded market, the VIA QuadCore E-Series processor offers industry-leading energy efficiency, with the VIA QuadCore E-Series 1.2+ GHz processor delivering a thermal design power (TDP) of only 27.5 W. The distributed power of the VIA QuadCore E-Series processor makes it ideal for handling the most demanding HD video formats for immersive multi-display applications and environments.
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