The semicondustor market in 3Q21 is red hot with total revenue of the global top 10 IC design (fabless) companies reaching US$33.7 billion or 45% growth YoY, according to TrendForce's latest investigations. In addition to the Taiwanese companies MediaTek, Novatek, and Realtek already on the list, Himax comes in at number ten, bringing the total number of Taiwanese companies on the top 10 list to 4.

Qualcomm has been buoyed by continuing robust demand for 5G mobile phones form major mobile phone manufacturers with further revenue growth from its processor and radio frequency front end (RFFE) departments. Qualcomm's IoT department benefited from strong demand in the consumer electronics, edge networking, and industrial sectors, posting revenue growth of 66% YoY, highest among Qualcomm departments. In turn, this drove Qualcomm's total 3Q21 revenue to US$7.7 billion, 56% growth YoY, and ranking first in the world.

According to reports out of Taiwan, Intel's meeting with TSMC might not have ended up in favour of Intel, as TSMC has apparently asked Intel to pay up a deposit in advance to get access to its upcoming 3 nanometer node. This is unlikely to be what Intel had hoped for, but at the same time, the 3 nanometer node is likely to be popular among many of TSMC's customers, unless the cost becomes prohibitive.

Intel was apparently hoping to be able to get a dedicated production line, much in the way of what Apple has at TSMC, but it seems like this is going to cost and the question is if Intel is willing to pay or not. The reason for a dedicated production line could also come down to Intel wanting to make chips at TSMC using Intel specific tricks of the trade, that Intel doesn't want TSMC or its competitors to get too much insight into. Time will tell what will come out of this meeting between the two semiconductor giants, but it seems like Gelsinger has changed his mind about Taiwan, as he said that "Intel would continue to invest in Taiwan".

Historically, AMD was working with two semiconductor manufacturing companies: TSMC and GlobalFoundries. According to the latest report coming from Gokul Hariharan, an analyst at J.P. Morgan, AMD could soon tap another semiconductor manufacturer to produce the company's growing list of processors. As the report indicates, AMD could start working with the South Korean giant Samsung and utilize the firm's 4LPP process that represents a second generation of the low-power 4 nm silicon node. This specific node is allegedly the choice for AMD APUs designed to fit inside Google's Chromebook devices, which require low-power designs to achieve excellent battery life.

AMD could realize this move in late 2022, as Samsung's 4LPP node goes into mass production at that point. It means that we could see the first Samsung-made AMD APUs in late 2022 or the beginning of 2023. And apparently, the two company's collaboration could be much more significant as AMD is evaluating Samsung's 3 nm nodes for other products spanning more segments in 2023/2024. There are no official, definitive agreements between the two, so we have to wait for more information and official responses from these parties. Anyways, if AMD decides to produce a part of its lineup at Samsung, the remaining TSMC capacity would ensure that the supply of every incoming chip remains sufficient.

Factors such as the rising popularity of topics related to the metaverse and UGC (user-generated content), as well as the rapid increase in AR/VR device shipment, will likely result in the creation of a growing body of virtual reality content in the market, according to TrendForce's latest investigations. TrendForce expects annual global virtual reality content revenue to grow at a 40% CAGR from US$2.16 billion in 2021 to US$8.31 billion in 2025.

TrendForce further indicates that gaming/entertainment, videos, and social interactions comprise the primary categories of virtual reality content. Incidentally, as the construction of the virtual world and the development of virtual reality content are unlikely to be accomplished by only a handful of companies alone, companies in this space will therefore place an increasing emphasis on UGC instead. Leading companies will likely leverage the build-out of virtual reality platforms/environments and the provisioning of developmental tools/interfaces in order to not only lower the barrier to entry for content creation, but also raise user participation, thereby driving up the content market for virtual reality applications.

Unlike Intel and Qualcomm, Samsung seems to be far more pessimistic about the current chip supply issues, as the company isn't expecting the chip shortage to be resolved next year. Admittedly this information comes via a meeting of its mobile divisions top brass, but considering that the mobile division is using a significant amount of various chips for its products, it would seem that the information is reliable.

The two biggest shortages for Samsung's mobile division will continue to be application processors (also known as SoCs) and radio frequency (RF) components. Considering that these are key components of any modern smartphone, it's not hard to see why Samsung would be concerned. What we don't know is how much of an advantage Samsung's various business units have when they work with Samsung's foundries and we might have reached a point where the highest bidder wins the allocation.

Due to material shortages caused by insufficient semiconductor supply, to date, power management IC (PMIC) prices remain on an upward trend, according to TrendForce's latest investigations. Average selling price (ASP) for 1H22 is forecast to increase by nearly 10%, reaching a record six year high.

In terms of the global supply chain, in addition to the production capacity of major IDM manufacturers including TI, Infineon, ADI, STMicroelectronics, NXP, ON Semiconductor, Renesas, Microchip, ROHM (Maxim has been acquired by ADI and Dialog by Renesas), IC design houses such as Qualcomm and MediaTek (MTK) have obtained a certain level of production capacity from foundries. Of these, TI is in a leadership position and the aforementioned companies possess a combined market share of over 80%.

The chip shortage discussion has been very focused on TSMC for some reason and although the company is without a doubt the world's leading foundry, the company is making its living from being a cutting edge foundry, whereas much of the components that there's a shortage of are made on far older nodes at many different foundries. Taiwanese UMC is one of the foundries that makes many of the automotive semiconductors, as well as key components when it comes to power regulation and is considered the world's third largest foundry.

Until 2018, UMC was competing head on with TSMC, although the company was always about a node behind TSMC, which led to a management team decision to slow down its node transition and instead to focus on speciality technologies. The company has done well in this niche, with a revenue of about US$6.2 billion in 2020. However, UMC is starting to feel the pressure from its competitors in China, as the PRC government is making a push for local production of local IC designs.

The Federal Trade Commission today sued to block U.S. chip supplier Nvidia Corp.'s $40 billion acquisition of U.K. chip design provider Arm Ltd. Semiconductor chips power the computers and technologies that are essential to our modern economy and society. The proposed vertical deal would give one of the largest chip companies control over the computing technology and designs that rival firms rely on to develop their own competing chips. The FTC's complaint alleges that the combined firm would have the means and incentive to stifle innovative next-generation technologies, including those used to run datacenters and driver-assistance systems in cars.

"The FTC is suing to block the largest semiconductor chip merger in history to prevent a chip conglomerate from stifling the innovation pipeline for next-generation technologies," said FTC Bureau of Competition Director Holly Vedova. "Tomorrow's technologies depend on preserving today's competitive, cutting-edge chip markets. This proposed deal would distort Arm's incentives in chip markets and allow the combined firm to unfairly undermine Nvidia's rivals. The FTC's lawsuit should send a strong signal that we will act aggressively to protect our critical infrastructure markets from illegal vertical mergers that have far-reaching and damaging effects on future innovations."

The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce's latest investigations. More specifically, NAND Flash suppliers' hyperscaler and enterprise clients kept up their procurement activities that began in 2Q21 in order to deploy products based on new processor platforms. Major smartphone brands, on the other hand, likewise expanded their NAND Flash procurement activities during the quarter as they prepared to release their new flagship models. As such, clients in both server and smartphone industries made significant contributions to the revenue growth of the NAND Flash industry for 3Q21. At the same time, however, suppliers also warned that orders from PC OEMs began showing signs of decline. On the whole, the industry's quarterly total NAND Flash bit shipment increased by nearly 11% QoQ for 3Q21, and the overall NAND Flash ASP rose by nearly 4% QoQ for the same quarter. Thanks to rising prices and expanding shipments, the quarterly total NAND Flash revenue increased by 15% QoQ to a new record high of US$18.8 billion in 3Q21.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

Apple today announced Self Service Repair, which will allow customers who are comfortable with completing their own repairs access to Apple genuine parts and tools. Available first for the iPhone 12 and iPhone 13 lineups, and soon to be followed by Mac computers featuring M1 chips, Self Service Repair will be available early next year in the US and expand to additional countries throughout 2022. Customers join more than 5,000 Apple Authorized Service Providers (AASPs) and 2,800 Independent Repair Providers who have access to these parts, tools, and manuals.

The initial phase of the program will focus on the most commonly serviced modules, such as the iPhone display, battery, and camera. The ability for additional repairs will be available later next year.

Qualcomm has been in the game of creating SoCs for the PC market with the company's Snapdragon lineup. These processors mainly were beefed-up versions of their mobile designs and were based on the Arm instruction set architecture (ISA). Microsoft has backed this effort by creation Windows-on-Arm (WoA) project that enables the Windows OS to operate on Arm processors. However, up until now, Qualcomm's designs were not very powerful as they represented a relatively moderate approach to the problem and almost made no sense of purchase compared to the standard laptops equipped with x86 processors from AMD and Intel. This is about to change.

According to the news from Investor Day yesterday, Qualcomm is preparing high-performance Arm SoCs for the PC market. The company has recently acquired Nuvia Inc., a startup focused on creating novel IPs based on Arm ISA. And this is what Qualcomm will use in building its next-generation PC processors. As the company plans, in August of 2022, it should start sampling OEM partners with these new chips, and we will be seeing them in consumers' hands in early 2023. If everything goes as planned, this should represent direct competition to AMD, Intel, and now Apple in the high-end SoC market. After PCs, the company plans to tackle datacenter, mobile, and automotive market.

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

While the global electronics supply chain experienced a chip shortage, the corresponding shortage of foundry capacities also led various foundries to raise their quotes, resulting in an over 20% YoY increase in the total annual revenues of the top 10 foundries for both 2020 and 2021, according to TrendForce's latest investigations. The top 10 foundries' annual revenue for 2021 is now expected to surpass US$100 billion. As TSMC leads yet another round of price hikes across the industry, annual foundry revenue for 2022 will likely reach US$117.69 billion, a 13.3% YoY increase.

TrendForce indicates that the combined CAPEX of the top 10 foundries surpassed US$50 billion in 2021, a 43% YoY increase. As new fab constructions and equipment move-ins gradually conclude next year, their combined CAPEX for 2022 is expected to undergo a 15% YoY increase and fall within the US$50-60 billion range. In addition, now that TSMC has officially announced the establishment of a new fab in Japan, total foundry CAPEX will likely increase further next year. TrendForce expects the foundry industry's total 8-inch and 12-inch wafer capacities to increase by 6% YoY and 14% YoY next year, respectively.

With the x86 architecture, large hyperscale cloud providers have been experiencing all sorts of troubles, from high power consumption to the high pricing structure of these processors. Companies like Amazon Web Services (AWS) build their processors based on 3rd party instruction set architecture designs. Today, Alibaba, the Chinese giant, has announced the launch of two processors made in-house to serve everything from edge to central server processing. First in line is the RISC-V-based Xuantie series of processors, which can run anything from AliOS, FreeRTOS, RT-Thread, Linux, Android, etc., to other operating systems as well. These processors are open-source, capable of modest processing capabilities, and designed as IPs that anyone can use. You can check them out on T-Head GitHub repositories here.

The other thing that Alibaba announced is the development of a 128-core custom processor based on the Arm architecture. Called Yitian 710 server SoC, TSMC manufactures it on the company on 5 nm semiconductor node. So far, Alibaba didn't reveal any details about the SoC and what Arm cores are used. However, this signifies that the company seeks technology independence from outside sources and wants to take it all in-house. With custom RISC-V processors for lower-power tasks and custom Arm server CPUs, the whole infrastructure is covered. It is just a matter of time before Alibaba starts to replace x86 makers in full. However, given the significant number of chips that the company needs, it may not happen at any sooner date.

SkyHigh Memory Limited., a global leader in embedded storage solutions, is introducing 3.0 V 1 Gb - 4 Gb densities 4 KB page and 2 KB page ML-3 products to its family of NAND Flash memories. The new 1 Gb - 4 Gb ML-3 SLC NAND Flash product family devices are designed on 1xnm, the industry's most advanced technology node for SLC NAND products. Available with different interfaces, SkyHigh Memory first-generation Serial (SPI) SLC NAND and third-generation Parallel SLC NAND complete the third generation ML-3 4 Gb - 16 Gb parallel SLC NAND product family already in production.

The new 1 Gb - 4 Gb devices will be offered to support high-reliability systems that store critical data and operate at extended temperatures, up to +105°C. Thanks to its internal ECC engine, the ML-3 product family can support chipsets with as low as a 1-bit ECC engine to accommodate legacy chipsets and modern chipsets with higher ECC engines.

There doesn't seem to be a single month where rumours about new TSMC plants around the world are popping up and this time around it looks like there might be a joint venture with Sony in Japan. According to the Nikkei, the Japanese government is likely to be involved and might foot as much as half of the US$7 billion bill.

Another much more unknown player, Japanese auto parts maker Denso is also said to be a potential participant in the new fab. Denso is said to supply Toyota among others and with a shift towards more EVs, this might not be such a strange move. The new fab is expected to be located in Kumamoto Prefecture on land owned by Sony. It should be noted that Sony already manufactures image sensors here and the factory was hit badly by a large earthquake back in 2016, which led to a global shortage of certain image sensors.

It appears that some of the current chip shortages might be artificially induced by one or multiple companies in the chip supply chain, according to an article by TIME Magazine. The article is taking a look at the role TSMC is playing in the global chip production industry and TIME has interviewed TSMC chairman Mark Liu among others in the industry.

Mark Liu is quoted as saying "But I told them, "You are my customer's customer's customer. How could I [prioritize others] and not give you chips?"" when asked about the complaints by car makers, since they were among the first to suggest TSMC was one of the issues. Due to the various allegations against TSMC, Liu had a team collect data points to try and figure out what was going on and to see which customers were truly running low on stock and which customers that might be stockpiling for a rainy day.

Finally some potentially good news, as AMD's CEO Lisa Su is bringing hope that the current chip shortage situation might improve over the next 18 to 24 months according to a new piece on CNBC. She's expecting new chip fabs to have come online by then, although no details were mentioned, one would presume it involves TSMC in AMD's case.

Lisa Su is quoted saying "We've always gone through cycles of ups and downs, where demand has exceeded supply, or vice versa, this time, it's different." "The pandemic has just taken demand to a new level". This isn't exactly breaking news by now, but it also seems like the demand for computers has reached its peak and is now plateauing ahead of what will likely be a drop in sales come next year, but that doesn't mean the demand for chips will go down. Lisa Su is also expecting further consolidation in the industry, which has its upsides and downsides, but her take on it is that "if you want to do something very large for the industry, you know, scale is important." AMD should know this better than most companies, since they've scaled their business from the brink of bankruptcy to where they are today.

There's no secret that Taiwan has been looking at expanding its chip production to other nations, with TSMC having agreed to build a plant in Arizona, while also discussing the subject with the EU. Now it looks like a deal is being worked out with India to build further chip plants there, although it's not clear who the intended manufacturer will be, as TSMC isn't mentioned in the report by Bloomberg.

However, the piece mentions 5G devices and components for electric cars, which suggests that it might not be a cutting edge node we're looking at here, but rather something a bit more conservative like 28 or 14 nm. India would make sense in many ways, but the obvious concern once again is water supply, although so far no exact location has been mentioned for the placement of the fab.

Following the peak period of production in 3Q21, the supply of DRAM will likely begin to outpace demand in 4Q21, according to TrendForce's latest investigations (the surplus of DRAM supply is henceforth referred to as "sufficiency ratio", expressed as a percentage). In addition, while DRAM suppliers are generally carrying a healthy level of inventory, most of their clients in the end-product markets are carrying a higher level of DRAM inventory than what is considered healthy, meaning these clients will be less willing to procure additional DRAM going forward. TrendForce therefore forecasts a downward trajectory for DRAM ASP in 4Q21. More specifically, DRAM products that are currently in oversupply may experience price drops of more than 5% QoQ, and the overall DRAM ASP will likely decline by about 3-8% QoQ in 4Q21.

Although WFH and distance learning applications previously generated high demand for notebook computers, increasingly widespread vaccinations in Europe and North America have now weakened this demand, particularly for Chromebooks. As a result, global production of notebooks is expected to decline in 4Q21, in turn propelling the sufficiency ratio of PC DRAM to 1.38%, which indicates that PC DRAM will no longer be in short supply in 4Q21. However, PC DRAM accounts for a relatively low share of DRAM manufacturers' DRAM supply bits, since these suppliers have allocated more production capacities to server DRAM, which is in relatively high demand. Hence, there will unlikely be a severe surplus of PC DRAM in 4Q21. It should also be pointed out that, on average, the current spot prices of PC DRAM modules are far lower than their contract prices for 3Q21. TrendForce therefore expects an imminent 5-10% QoQ decline in PC DRAM contract prices for 4Q21, with potential for declines that are even greater than 10% for certain transactions, as PC OEMs anticipate further price drops in PC DRAM prices in the future.

Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce's latest investigations. Global sales of large-sized TVs were brisk thanks to major sporting events such as the Tokyo Olympics and UEFA Euro 2020. Likewise, the proliferation of WFH and distance learning applications propelled the demand for IT products, while the automotive semiconductor and data center markets also showed upward trajectories. Taking into account the above factors, OSAT companies raised their quotes in response, resulting in a 26.4% YoY increase in the top 10 OSAT companies' revenue to US$7.88 billion for 2Q21.

TrendForce indicates that, in light of the ongoing global chip shortage and the growing production capacities of foundries/IDMs in the upstream semiconductor supply chain, OSAT companies gradually increased their CAPEX and expanded their fabs and equipment in order to meet the persistently growing client demand. However, the OSAT industry still faces an uncertain future in 2H21 due to the Delta variant's global surge and the health crisis taking place in Southeast Asia, home to a significant number of OSAT facilities.

At the annual Hot Chips conference, IBM (NYSE: IBM) today unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time. Telum is IBM's first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place. Three years in development, the breakthrough of this new on-chip hardware acceleration is designed to help customers achieve business insights at scale across banking, finance, trading, insurance applications and customer interactions. A Telum-based system is planned for the first half of 2022.

Today, businesses typically apply detection techniques to catch fraud after it occurs, a process that can be time consuming and compute-intensive due to the limitations of today's technology, particularly when fraud analysis and detection is conducted far away from mission critical transactions and data. Due to latency requirements, complex fraud detection often cannot be completed in real-time - meaning a bad actor could have already successfully purchased goods with a stolen credit card before the retailer is aware fraud has taken place.

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.