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TrendForce: Demand for Consumer Electronics Sluggish, NAND Flash Wafer Pricing Leads Downturn in May

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

AAEON Announces BOXER-8260AI and BOXER-8261 Powered by NVIDIA Jetson AGX Orin

With the announcement of the NVIDIA Jetson AGX Orin developer kit, AAEON is excited to utilize the many benefits that such a powerful system-on-module (SOM) can bring to its own product lines. With the same form factor and pin compatibility as the NVIDIA Jetson AGX Xavier, but with an improvement from 32 TOPS to 275 TOPS, the NVIDIA Jetson AGX Orin is set to make it easier than ever to develop faster, more sophisticated AI applications.

AAEON is therefore pleased to announce two upcoming products available in Q4 which will feature the Jetson AGX Orin 32 GB and Jetson AGX Orin 64 GB as their respective processor modules: the BOXER-8260AI and BOXER-8261 AI@Edge Embedded BOX PCs. Both products will feature the NVIDIA JetPack 5.0 SDK to support the full Jetson software stack to help in the development of AI applications in areas such as high-end autonomous machinery. With two NVIDIA deep learning accelerators (NVDLA), along with a 32 GB 256-bit system memory, the BOXER-8260AI will provide the perfect device for vision-based AI applications. Moreover, its expansive I/O options include 12 RJ-45 slots for PoE, along with DB-9 slots for CANbus and six DIO.

OnLogic Raspberry Pi-Powered Industrial Computer Now Available

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

ATP Announces High-Endurance 3D TLC-based eMMC Devices

ATP Electronics, the global leader in specialized storage and memory solutions, has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND. Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration options. ATP's new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.

The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.

Total NAND Flash Revenue Drops 2.1% QoQ in 4Q21 Due to Slowing Demand and Falling Prices, Says TrendForce

In 4Q21, NAND Flash bit shipments grew by only 3.3% QoQ, a significant decrease from the nearly 10% in 3Q21, according to TrendForce's investigations. ASP fell by nearly 5% and the overall industry posted revenue of US$18.5 billion, a QoQ decrease of 2.1%. This was primarily due to a decline in the purchase demand of various products and a market shift to oversupply causing a drop in contract prices. In 4Q21, with the exception of enterprise SSD, the supply of which was limited by insufficient upstream components, the prices of other NAND Flash products such as eMMC, UFS, and client SSD, all fell.

TrendForce's summary of NAND Flash market sales performance in 2021 is as follows: although there have been signs of weakening since 2H21, thanks to remote services and cloud demand driven by the pandemic, revenue performance still grew significantly compared to 2020. Revenue reached US$68.6 billion, up 21.1% YoY, the second-biggest increase since 2018.

NAND Flash Pricing Set to Spike 5-10% in Q2 Due to Material Contamination at WDC and Kioxia, Says TrendForce

WDC recently stated that certain materials were contaminated in late January at NAND Flash production lines in Yokkaichi and Kitakami, Japan which are joint ventures with Kioxia, according to TrendForce's investigations. Before this incident, TrendForce had forecast that the NAND Flash market will see a slight oversupply the entire year and average price from Q1 to Q2 will face downward pressure. However, the impact of WDC's material contamination issue is significant and Samsung's experience during the previous lockdown of Xi'an due to the pandemic has also retarded the magnitude of the NAND Flash price slump. Therefore, the Q1 price drop will diminish to 5~10%. In addition, according to TrendForce, the combined WDC/Kioxia NAND Flash market share in the 3Q21 was as high as 32.5%. The consequences of this latest incident may push the price of NAND Flash in Q2 to spike 5~10%.

The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 6.5exabytes (approximately 6,500M GB) affected. According to TrendForce, damaged bits account for 13% of the group's output in 1Q22 and approximately 3% of the total output for the year. The normal production schedule for the entire line has yet to be confirmed. It is worth noting that the damages announced by WDC likely do not account for total losses stemming for this event and the number of damaged Kioxia parts has not been aggregated, so the total number of affected bits may increase further.

Price Drop of NAND Flash Products for 1Q22 Expected to Taper to 8-13% QoQ Decline, Says TrendForce

NAND Flash prices for 1Q22 are expected to decline by 8-13% QoQ, compared to TrendForce's previous forecast of 10-15% QoQ, primarily due to PC OEMs' increased orders for PCIe 3.0 products and the impact of the lockdown in Xi'an on PC OEMs' price negotiation approaches. To mitigate potential risks in logistics, NAND Flash buyers are now more willing to accept a narrower decline in contract prices in order to obtain their products sooner. However, as the Xi'an lockdown has not noticeably affected the local fabs' manufacturing operations, the movement of NAND Flash contract prices going forward will likely remain relatively unaffected by the lockdown.

In addition, TrendForce finds that the daily number of new COVID-19 cases in Xi'an has recently undergone a noticeable drop, and the local government has also announced that that the emergency level has been downgraded. As such, Samsung's and Micron's local production facilities are returning to normal with respect to workforce and operational capacity. Samsung's local production base manufactures NAND Flash products, whereas Micron's local production base is responsible for the testing and packaging of DRAM chips as well as the assembly of DRAM modules. The impacts of the lockdown mainly relate to delays in the deliveries of memory products to customers. On the other hand, the event has not caused a tangible loss in memory production.

Axiomtek Partners with Leading AI Chipmaker Hailo to Launch Edge AI Computer for Smart City Applications

Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is pleased to announce its partnership with leading AI chipmaker Hailo to launch the RSC100, a state-of-the-art ARM-based edge AI computer (also named Plato). The ARM-based RSC100 (Plato) supports the Hailo-8 edge AI processor, the latter of which features up to 26 TOPS for running deep learning applications at full scale efficiently, intelligently, and sustainably. The partnership with Hailo offers customers a new level of AI solutions across a wide range of market segments such as smart city, smart retail, industry 4.0, and smart transportation.

"Hailo has gained a lot of experience in developing high-performance AI processors suitable for edge devices. The powerful yet affordable RSC100 (Plato) is our first fanless edge AI computing system that adopts the Hailo-8. The RSC100 (Plato) provides system developers with highly efficient implementation of innovative AI solutions at reduced time-to-market and engineering costs. With the advanced AI performance, the RSC100 (Plato) is well suited for use in smart city applications, including smart surveillance, smart factory, smart agriculture, and smart transportation," said Ken Pan, the product manager at Axiomtek.

Samsung Begins Mass Production of Comprehensive Automotive Memory Solutions for Next-Generation Autonomous Electric Vehicles

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2 GB GDDR6 DRAM and 2 GB DDR4 DRAM for high-performance infotainment systems, as well as 2 GB GDDR6 DRAM and 128 GB Universal Flash Storage (UFS) for autonomous driving systems.

"With the recent proliferation of electric vehicles and the rapid advancement of infotainment and autonomous driving systems, the semiconductor automotive platform is facing a paradigm shift. What used to be a seven to eight-year replacement cycle is now being compressed into a three to four-year cycle, and at the same time, performance and capacity requirements are advancing to levels commonly found in servers," said Jinman Han, executive vice president and head of Memory Global Sales & Marketing at Samsung Electronics. "Samsung's reinforced lineup of memory solutions will act as a major catalyst in further accelerating the shift toward the 'Server on Wheels' era."

NAND Flash ASP Expected to Undergo 10-15% QoQ Decline in 1Q22 as Market Shifts Towards Oversupply, Says TrendForce

Demand for NAND Flash products will undergo a noticeable and cyclical downward correction in 1Q22 as major smartphone brands wind down their procurement activities for the peak season and ODMs prepare for the New Year holidays, according to TrendForce's latest investigations. As such, the NAND Flash market will remain in an oversupply situation, with prices continuing to undergo downward corrections accordingly. However, PC OEMs have been reinstating certain orders for client SSDs since early November in response to improvements in the supply of upstream semiconductor materials. By fulfilling these orders, suppliers are able to keep their inventory level relatively low, meaning they are not under as much pressure as previously expected to reduce inventory by lowering prices. Taking these factors into account, TrendForce expects NAND Flash ASP to undergo a 10-15% QoQ decline in 1Q22, during which NAND Flash prices will experience the most noticeable declines compared to the other quarters in 2022.

Regarding the price trend of NAND Flash products across the whole 2021, TrendForce further indicates that suppliers have actively transitioned their output to higher-layer technologies, resulting in a bit supply growth that noticeably outpaces demand, though the tight supply of components such as controller ICs and PMICs has constrained the production of NAND Flash end-products. Hence, the decline in contract prices of NAND Flash products has not been as severe as previously expected. Moving ahead to 2022, however, the supply of relevant components is expected to gradually improve, so the market for various NAND Flash products will also likely shift towards a noticeable oversupply. As a result, prices of NAND Flash products will steadily decline before the arrival of the peak season in 3Q22.

ECS Releases New-Generation LIVA Z3 and Z3E Mini PCs

Elitegroup Computer Systems (ECS), the global leading motherboard, Mini-PCs, Notebooks, mobile device and smart city solutions provider, is proud to present the high performance, power efficient and multi-tasking mini PC - LIVA Z3 & Z3E. They build in powerful and multi-functional Intel Jasper Lake Pentium & Celeron processors with up to 16 GB DDR4 dual-channel memory technology, and is expandable through the M.2 socket to meet various needs. LIVA Z3 & Z3E also equip with the latest 802.11ax technology to effortlessly support your wireless connection. They support dual-screen output via HDMI 2.0 and mini DisplayPort both up to 4K high-quality resolution. It is not only suitable for commercial office, remote office, online learning and home entertainment, but also an alternative option for smart digital signage, smart education and self-service kiosk and so forth to broaden your business!

The LIVA Z3 & Z3E feature Intel Pentium & Celeron processors, up to 35% higher processing power than the previous generation. They adopt eMMC 5.1 128 GB as the storage capacity and DDR4 dual-channel 16 GB memory, which accelerate system performance and improve response speed as well. Furthermore, the M.2 PCIE 2280 interface for SSD and 2.5" SATA interface for HDD/ SSD assist users to easily tackle the daily tasks by experiencing a compact PC.

Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices.

"Wearables like smartwatches are no longer just a cool gadget to have. They're now a growing part of our lifestyles to keep you fit, safe and alert," said Harry Cho, vice president of System LSI marketing at Samsung Electronics. "With the Exynos W920, future wearables will be able to run applications with visually appealing user interfaces and more responsive user experiences while keeping you connected on the go with fast LTE."

AAEON Introduces BOXER-8230AI Edge Computer Powered by NVIDIA Jetson TX2 NX

AAEON, a leader in AI edge solutions, announces the release of the BOXER-8230AI AI Edge box PC powered by the NVIDIA Jetson TX2 NX System on Module (SOM). The BOXER-8230AI delivers powerful computing performance without breaking budgets, along with rugged design and diverse I/O layout including five Gigabit Ethernet ports. The BOXER-8230AI offers a solution that's perfect for intelligent applications including surveillance, smart factory, and smart retail.
The BOXER-8230AI platform brings flexibility to meet the needs of customers, with industrial design and storage capacity. With two available configurations, the BOXER-8230AI-A3 and BOXER-8230AI-A4 systems offer flexible I/O loadout with five Gigabit Ethernet LAN ports to connect with IP cameras and other devices, as well as four USB 3.2 Gen 1 ports and two COM ports. Storage flexibility is provided with 16 GB onboard eMMC storage, microSD slot and a 2.5" SATA III bay (A4 model).

The BOXER-8230AI platform is powered by the NVIDIA Jetson TX2 NX SOM, delivering powerful AI edge computing without compromising costs. The Jetson TX2 NX delivers more than twice the performance of the NVIDIA Jetson Nano thanks to its six-core ARM processor and NVIDIA Pascal GPU with 256 CUDA cores. This allows the Jetson TX2 NX to achieve speeds up to 1.33 TFLOPS, and enables the system to power a wide range of AI Edge applications.

Valve Steam Deck SoC Detailed: AMD Brings Zen2 and RDNA2 to the Table

Valve today announced its first big splash into the console market with Steam Deck, a device out to eat the Nintendo Switch's lunch. The announcement comes as yet another feather in AMD's cap for its semi-custom SoC business, benefiting from being the only company with an x86-64 CPU license and having a cutting-edge graphics hardware IP. Built on the 7 nm node at TSMC, the semi-custom chip at the heart of the Steam Deck is designed for extended gameplay on battery, and is a monolithic silicon that combines CPU, GPU, and core-logic.

The yet-unnamed semi-custom chip features a 4-core/8-thread CPU based on the "Zen 2" microarchitecture, with a nominal clock speed of 2.40 GHz, and up to 3.50 GHz boost. The CPU component offers an FP32 throughput of 448 GFLOP/s. The GPU is based on AMD's latest RDNA2 graphics architecture—the same one powering the Xbox Series X, PlayStation 5, and Radeon RX 6900 XT—and is comprised of 8 RDNA2 compute units (512 stream processors). The GPU operates at an engine clock speed of 1.10 GHz to 1.60 GHz, with peak compute power of 1.6 TFLOP/s. The silicon uses a unified memory interface, and a cutting-edge LPDDR5 memory controller.

NAND Flash Contract Prices Likely to Increase by 5-10% QoQ in 3Q21 as Quotes Continue to Rise, Says TrendForce

The recent wave of COVID-19 outbreaks in India has weakened sales of retail storage products such as memory cards and USB drives, according to TrendForce's latest investigations. However, demand remains fairly strong in the main application segments due to the arrival of the traditional peak season and the growth in the procurement related to data centers. Hence, the sufficiency ratio of the entire market has declined further. NAND Flash suppliers have kept their inventories at a healthy level thanks to clients' stock-up activities during the past several quarters. Moreover, the ongoing shortage of NAND Flash controller ICs continues to affect the production of finished storage products. Taking account of these demand-side and supply-side factors, TrendForce forecasts that contract prices of NAND Flash products will rise marginally for 3Q21, with QoQ increases in the range of 5-10%.

Silicon Motion Announces Results for the Period Ended March 31, 2021

Silicon Motion Technology Corporation today announced its financial results for the quarter ended March 31, 2021. For the first quarter, net sales (GAAP) increased sequentially to $182.4 million from $143.9 million in fourth quarter 2020. Net income (GAAP) increased to $34.4 million or $0.98 per diluted ADS (GAAP) from net income (GAAP) of $1.4 million or $0.04 per diluted ADS (GAAP) in fourth quarter 2020. For the first quarter, net income (non-GAAP) increased to $38.7 million or $1.11 per diluted ADS (non-GAAP) from a net income (non-GAAP) of $29.9 million or $0.86 per diluted ADS (non-GAAP) in fourth quarter 2020.

"As we had previously communicated, we are seeing very strong demand for our SSD and eMMC+UFS controllers," said Wallace Kou, President and CEO of Silicon Motion. "Customer demand was well in excess of our ability to supply as both our foundry supply and inventory on hand are limited."

AAEON Announces Official Support for NVIDIA Ubuntu, Jetpack 4.5 and Secureboot on BOXER-8200 Systems

AAEON, an industry leader in embedded AI Edge systems, announces new software support for the BOXER-8200 series of embedded PCs featuring NVIDIA Jetson System on Modules (SOM). AAEON has officially signed an agreement with Canonical to provide customers with the NVIDIA Ubuntu operating system pre-installed on new BOXER-8200 systems. Systems with the NVIDIA Ubuntu OS will also ship with the Jetpack 4.5 drivers and toolkit package preinstalled. Additionally, AAEON announces a new customization services to provide Secureboot to clients in addition to other customization options.

AAEON is dedicated to delivering the most comprehensive platform solutions powered by NVIDIA Jetson SOMs. To meet the needs of their clients, AAEON has signed an agreement with Canonical to provide the official NVIDIA Ubuntu OS image on the entire range of BOXER-8200 series systems. Developers and customers who purchase new BOXER-8200 series systems can receive the system with the OS preinstalled, with no need to flash the image before starting the system up for the first time. The BOXER-8200 series includes the BOXER-822x platforms with Jetson Nano, BOXER-8240AI with Jetson AGX Xavier, BOXER-825x platforms with Jetson Xavier NX, and BOXER-823x platforms with Jetson TX2 NX (currently under development).

Kingston Digital Partners With NXP Semiconductors on i.MX 8M Plus Processors

Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it is partnering with NXP Semiconductors on their new i.MX 8M Plus applications processors. NXP is a leading applications processor developer for creating infrastructure solutions involving smart technology, and Kingston is proud that its eMMC embedded memory solution is part of the reference board for its latest application processor.

Smart device makers requesting NXP's engineering verification kits featuring the i.MX 8M Plus chipset will see Kingston's eMMC onboard. This creates a terrific opportunity to expand the relationship with NXP and also further showcase Kingston embedded memory solutions to other IoT manufacturers. Kingston's discrete memory and storage solutions were also embedded on NXP's previous-generation i.MX 6 and i.MX 7 series processor boards.

NAND Flash Contract Prices Projected to Increase by 3-8% QoQ in 2Q21 Due to Easing of Oversupply, Says TrendForce

With Samsung, YMTC, SK Hynix, and Intel leading the charge, NAND Flash suppliers will maintain an aggressive effort to expand their production capacities throughout 2Q21, during which NAND Flash bit output will likely increase by nearly 10% QoQ, according to TrendForce's latest investigations. On the other hand, orders from PC OEMs and Chinese smartphone brands since 1Q21, as well as recovering procurement activities from clients in the data center segment during 2Q21, will generate upward momentum propelling NAND Flash bit demand. Furthermore, buyers are actively stocking up on finished products, such as SSDs and eMMC, due to persistently limited NAND Flash controller supply. TrendForce therefore expects NAND Flash contract prices to increase by an average of 3-8% QoQ in 2Q21 after experiencing a 5-10% decline QoQ in 1Q21. In particular, as Samsung's Line S2 fab in Austin has yet to resume full operation after the Texas winter storm, the supply of NAND Flash controllers going forward may be at risk, and Samsung's ability to manufacture client SSDs will be further constrained as a result. In light of these factors, TrendForce is not ruling out the possibility that NAND Flash contract prices may increase by even more than current forecasts.

ADATA Unveils Industrial-grade IEM5141A eMMC

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions, today announces the ADATA IEM5141A embedded multi media cards. Ideally suited for industrial and IoT applications, the ADATA IEM5141A meets JEDEC eMMC 5.1 HS400 standard that delivers high read/write speeds of up to 300/170 MB/s,and low-power consumption of optimized performance.

The IEM5141A is a fully integrated device with built-in controllerand NAND Flash for higher capacities, durability, and perfectly suited for space-constrained IPCs and server boot-up applications. Furthermore, the IEM5141A offers Auto sleep on/off mode for low power consumption, Partitioning Management, and Thermal Throttling. It also features wide-temperature operability (-40°C - +85°C) and a 3,000 P/E cycle for excellent stability and reliability.

ASUS Launches Pilot the Future Program for the ASUS BR1100C Laptop

ASUS North America today announced the launch of the Pilot the Future program for the K-12 education-focused ASUS BR1100C laptop, which was recently announced at CES 2021. ASUS North America will be kicking off the Pilot the Future Campaign today to provide select K-12 schools in North America with the opportunity to receive a set of 30 ASUS BR1100C clamshell laptops, enough to equip a full class of students for learning remotely and in the classroom. To be considered for the ASUS BR1100 Pilot the Future program, school faculty can submit videos to share with ASUS how their school is preparing students for better collaboration in-person and remotely, as well as how the ASUS BR1100 laptops can help promote learning in their classroom.

From the batch of submissions, ASUS will select a number of schools to move onto the community voting round from March 5 through March 22, where schools with the most votes will be selected as a participant in the program. The Pilot the Future program starts today with initial school nominations through February 26 and concludes when the selected K-12 schools are announced on March 29.

Foresee Announces High-Stability eMMC Solutions

Embedded storage has gradually matured over its years of development. However, as technology has developed, market demands towards the stability of embedded storage products has also increased. Only by improving their products and technologies and pushing the boundaries of technology can storage enterprises weather the storm of the rapidly changing market.

In 2020, FORESEE, Longsys' embedded storage brand, launched a compact eMMC packaged in BGA 153, with dimensions of only 9.0 x 7.5 x 0.8 mm. This is in stark contrast to the standard dimensions of 11.5x13x1.2 mm. The operating temperature ranges from -25°C to 85°C, reaching the standards seen in industrial-grade products, and the maximum capacity can reach up to 64 GB. It meets all market requirements for high performance, low power consumption, slimness, and multiple capacities, and satisfies the needs of terminal equipment such as tablets, smart phones, smart speakers, dash cams, and smart watches.

Prices of NAND Flash Controller ICs Poised to Rise by 15-20% due to Tightening Production Capacity for Foundry Services, Says TrendForce

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

Oversupply to Continue Affecting NAND Flash Prices, with 10-15% QoQ Decline Expected in 1Q21, Says TrendForce

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

Greenliant Ultra High Endurance Storage Solutions Enable High Reliability Systems

Greenliant has secured major design wins with its EnduroSLC solid state drives (SSDs) in a wide range of demanding, extreme environment applications for customers that need best-in-class reliability and product longevity. Greenliant's proprietary EnduroSLC Technology substantially enhances data retention and extends the write endurance of 1-bit-per-cell SSDs with advanced hardware ECC capabilities and NAND flash management algorithms. EnduroSLC SSDs not only offer superior data retention capabilities under complex temperature conditions, but also support 50K, 100K and industry-leading, ultra high 250K+ program-erase (P/E) cycles, which are at least a 5x improvement over pseudo-SLC (pSLC) SSDs and a 50x improvement over MLC NAND-based products.

For systems that are in remote locations and costly to maintain-from satellite to subsea communications-customers recognize the value of EnduroSLC SSDs; they can reliably operate and retain data for long periods of time in harsh conditions. Long-life, write-intensive products, such as transportation black box recorders and industrial data loggers, have also benefitted from the enhanced features of EnduroSLC SSDs. EnduroSLC storage products are designed with Greenliant's advanced SATA, NVMe PCIe and eMMC controllers, operate at industrial temperatures (-40 to +85 degrees Celsius) and are backed by the company's Long-Term Availability program (http://bit.ly/SSD-LTA-program), providing an extra level of support.
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