Akasa, a leading provider of thermal solutions, have announced the Euler TX3, an aluminium fanless case designed for Thin Mini-ITX motherboards. Utilizing passive cooling, the Euler TX3 supports Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP. With a compact volume of only 3.9L, the case is well-suited for industrial automation, point-of-sale (POS), kiosk, digital signage or other commercial systems that require long operational life and minimal maintenance.

The enclosure's fully fanless design utilizes an aluminium thermal module to transfer heat efficiently from the CPU to the external aluminium fins, while eliminating noise and mechanical failure points, ensuring stable and long-term performance. The design incorporates Akasa's patented spring mounting system to ensure reliable thermal contact and compatibility across a diverse range of Thin Mini-ITX form factor boards.

Last month, ASUS started a teaser campaign that alluded to a brand-new ROG Mini motherboard design. Promo material provided a very pixellated preview of a pale Mini-ITX form factor product. Earlier this week, a single render leaked out—image quality was good enough to identify the unreleased SKU as a white spin-off of the already launched Strix B850-I Gaming WiFi7 board design. At some point within the past couple of days, the main ASUS web presence was updated with a dedicated "W" model product page. We suspect that their next move will be the publication of press material, unless staffers deem this SKU's slight redecoration unworthy of such attention. Annoyingly, the White Edition's detailed web portal does not provide a clear view of the board's back section.

Unsurprisingly, the Taiwanese manufacturer has rolled out the standard black variant's exact same description and specs: "(our latest model) integrates cutting-edge technology into a sleek Mini-ITX form factor. It features PCIe 5.0 slots for graphics and storage, dual-channel DDR5 slots and robust power delivery for top-tier gaming and heavy workloads. Meanwhile, advanced cooling solutions maintain peak performance, and Wi-Fi 7 ensures ultra-fast connectivity. This platform delivers the power and connectivity that advanced AI PC applications demand." One major difference, at least on digital paper, is the White Edition's deployment of a "64 MB BIOS." The larger ASUS BIOS chip is advertised as offering a "more powerful interface" and "support for future AM5 processors."

Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to introduce the S380 TG ARGB Mid-Tower Chassis, available in Black and Snow. Designed for users who value both performance and simplicity, the S380 TG ARGB combines an elegant minimalist mesh front panel with high airflow design, delivering a chassis that's as efficient as it is refined. Behind its clean exterior lies a layout optimized for cooling and component compatibility. The S380 TG ARGB supports Mini-ITX, microATX, and ATX motherboards, including the latest hidden-connector motherboard designs such as ASUS BTF, MSI Project Zero, and GIGABYTE Project Stealth. Dedicated cutouts along the motherboard tray ensure tidy cable routing and a clean interior.

To achieve high thermal performance, the chassis comes pre-installed with a SF360 ARGB PWM Reverse Fan on the PSU cover and a SF120 ARGB PWM fan at the rear, providing immediate and balanced airflow. The reverse fan directs cool air toward the GPU area, maximizing graphics card cooling efficiency. Builders can further expand cooling with support for up to ten 120 mm fans or dual 360 mm radiators installed on the top and front simultaneously.

SilverStone has introduced the FLP03, the latest entry in its retro-inspired case lineup. The new model follows the FLP01 HTPC case, released late in 2024, and the FLP02, released earlier this year, continuing the same 1980s office-tower aesthetic, beige plastics, and flat front panel. The FLP03 shown at EXPO 2025 in Japan measures 220 × 456 × 477 mm and supports microATX and Mini-ITX motherboards. It includes three external 5.25-inch bays that can be adapted for 2.5-inch drives, plus internal mounts for 3.5-inch and 2.5-inch storage. Cooling is handled by a 180 mm front fan, room for three 120 mm or two 140 mm fans up top, and a 120 mm fan at the rear. The top panel can also accommodate a 360 mm radiator, though installing it occupies one of the 5.25-inch bays.

Despite the vintage look, component support is generous. The case fits GPUs up to 412 mm long and 156 mm wide, and CPU coolers up to 171 mm tall with the expansion-card retainer installed (167 mm without it). It offers five expansion slots, ATX PSU support up to 180 mm, and a front I/O panel with USB-C, dual USB 3.0, audio, and mic ports. SilverStone maintained that classic-retro front panel with a Turbo button, which pushes all PWM fans to their max speed, a built-in numeric display that shows CPU frequency, power and reset buttons, plus a special key lock. Pricing and availability have not yet been announced; however, IT Home reports that the case is scheduled to be available in Japan around February or March 2026. Regarding pricing, since the bigger SilverStone FLP02 chassis has an MSRP of $239.99, it can be safe to assume that the FLP03 will be a bit cheaper, likely around $199.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the MasterFrame 400 Mesh, a compact PC case that brings the signature MasterFrame design language to a more accessible, desk-friendly format. The MasterFrame 400 Mesh delivers FreeForm 2.0 modularity in a simplified build experience. It offers dual orientation for vertical or horizontal setups, repositionable brackets, and mesh-optimized airflow so builders can tailor layout and thermals with confidence. The result is a compact footprint that still supports serious hardware.

The case is engineered for microATX and Mini-ITX systems and supports high-performance components without compromise. Builders can install GPUs up to 390 mm and air coolers up to 190 mm. Cooling headroom is extensive, with support for up to nine fans and multiple radiators, including top-mounted 360 mm options. A full front mesh panel maximizes intake, while a tempered glass side panel creates a clean, refined showcase.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the QUBE 540, a compact case for today. The QUBE 540 offers orientation flexibility, so you can build a vertical or horizontal system that fits your desk or shelf. Inside, a modular interior lets you tailor the layout to your components and airflow preferences.

The QUBE 540 keeps the clean, geometric design language of the QUBE series while raising the bar on practical adaptability. It fits comfortably in limited spaces such as small apartments and dorm rooms, and it looks at home in creator studios and living areas. The case ships in two colors, Moonstone and Stardust Iron, giving users options that blend with modern setups and room aesthetics. Builders can set airflow paths, adjust GPU clearance, and position core components for a tidy, quiet system that reflects their style.

After the success of the highly acclaimed and award-winning Arx 500 and Arx 700 cases, ENDORFY presents their younger, equally ambitious sibling. The new Arx 500 White ARGB, finished in an elegant white color scheme, is a natural evolution of the series and another step toward a complete product portfolio that allows to build a reliable, visually consistent ENDORFY ecosystem. Designed with attention to detail, the white Arx 500 impresses with perfectly matched shades of white, ensuring that it looks great both right out of the box and after long-term use. It's a blend of performance and design that creators, gamers and professionals alike will appreciate.

Technology In Its Purest Form
Behind its beautiful form lies thoughtful engineering. The spacious interior can accommodate up to seven fans and radiators up to 360 mm, and it's compatible with ATX, microATX, and Mini-ITX motherboards. Straight out of the box, the case comes equipped with four pre-installed Stratus 140 White PWM ARGB fans, developed in collaboration with Synergy Cooling. Each operates between 200 and 1400 RPM, delivering not only excellent airflow but also silence.

Maxsun today introduced the MS-Terminator B850 BKB WiFi motherboard. Built in the Mini-ITX form-factor, this Socket AM5 motherboard is powered by the AMD B850 chipset. An interesting design choice by Maxsun is to wire out the PCI-Express 5.0 x16 PEG interface from the SoC as an open-ended PCI-Express 5.0 x8 slot for graphics card, and putting out its remaining 8 lanes as M.2 Gen 5 x4 slots on the backside of the PCB to supplement the Gen 5 x4 slot from the SoC with dedicated wiring. The Socket AM5 is wired to two DDR5 DIMM slots, and the board takes in power from a combination of 24-pin ATX and 8-pin EPS power connectors. The board also comes with Wi-Fi 6E, 2.5 GbE wired LAN, HDMI+DP display outputs, and USB connectivity that includes 20 Gbps USB 3.2 Gen 2 type-C.

ADLINK Technology Inc., a global leader in edge computing, proudly announces the launch of a comprehensive portfolio of industrial computing solutions built on Intel Core 200S series processors. These new platforms deliver major gains in AI performance, energy efficiency, and I/O flexibility—empowering next-generation applications in industrial automation, infotainment, edge AI systems, and immersive computing.

The new upgrade spans form factors Mini-ITX, ATX, PICMG 1.3 boards, edge AI systems, and COM-HPC modules, engineered to leverage the hybrid-core architecture and AI-enhanced compute of the Intel Core 200S series processors.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-MTLD1, the most advanced Mini-ITX board it has ever produced. The first AAEON Mini-ITX solution to support Intel Core Ultra processors (formerly Meteor Lake H/U), the MIX-MTLD1 harnesses the multi-pillar die architecture of the platform, combining a 14 core, 18 thread CPU, Intel Arc graphics with support for multiple AI software frameworks, and on-chip Intel AI Boost NPU.

A particularly notable distinction for the MIX-MTLD1 is the presence of an NCSI header linked to the board's Intel Ethernet Controller I210-AT, which provides support for a MOD-RMB Out-of-Band (OOB) module, bridging communication between the system's Baseboard Management Controller (BMC) and network controller. Consequently, AAEON believe the MIX-MTLD1 will become the gold-standard for integrators seeking a solution to bring real-time remote management of edge inferencing applications across vertical markets.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, announces the latest Thin Mini-ITX motherboard, H810TM-ITX, designed for commercial environments that require exceptional stability and performance. The H810TM-ITX supports Intel Core Ultra Series 2 processors with AI acceleration, dual DDR5 memory configurations, four storage options, and up to five display outputs (supporting three independent displays). It further offers highly customizable I/O configurations, including optional HDMI + DisplayPort, USB4 or Intel Thunderbolt 4, and TPM 2.0—making it an ideal choice for AIO solutions, mini PCs, and specialized deployments.

For more advanced requirements, the B860TM-ITX and Q870TM-ITX also feature five display outputs - driving up to four independent displays, come standard with Intel Thunderbolt 4 and TPM 2.0 security modules, and provide richer I/O options—meeting the diverse needs of smart retail, interactive kiosks, AI-powered education, and digital-first workplaces.

Cooler Master, a global leader in innovative thermal solutions and PC hardware, today announced North American availability of the MasterFrame 500 Mesh, a premium open-frame ATX chassis built for extreme cooling and straightforward customization. Developed under Cooler Master's FreeForm 2.0 design philosophy, it gives builders the structure, airflow, and files they need to tailor the frame to their vision.

The chassis features an exposed exo-structure, mesh panels for stronger airflow, support for Mini-ITX to E-ATX motherboards, and GPU clearance up to 390 mm. ARGB and non-ARGB versions both ship with dual SickleFlow 200 mm front fans and a 120 mm rear fan. With room for up to eight fans and two 360 mm radiators, the platform is ready for high thermal loads, silent tuning, or both.

LIAN LI Industrial Co., Ltd., a leading manufacturer of chassis and PC accessories, announces the O11D MINI V2, a compact ATX tower that provides expanded hardware compatibility and better airflow with only a 2-liter increase in size compared to the original O11D MINI design. Now supporting full ATX motherboards, standard ATX PSUs, and radiators up to 360 mm, the O11D MINI V2 is also fully compatible with ATX Back-Connect motherboards. It features a 10° slanted bottom for enhanced GPU cooling, support for both standard and vertical GPU mounting with included adjustable anti-sag brackets, and a repositionable I/O module for flexible front panel ports and button access. The Flow variant of the O11D MINI V2 comes pre-installed with 5 x 120 mm reverse-blade fans, offering optimized airflow straight out of the box.

Minimal Size, Maximum Support
With only a 2-liter increase in volume, the O11D MINI V2 delivers significantly expanded compatibility. Thanks to a subtle side panel protrusion and an offset mounting bracket, the case now supports full-sized ATX power supplies without increasing its overall width. Internally, it accommodates ATX, microATX, and Mini-ITX motherboards, including ATX Back-Connect motherboards, while offering clearance for radiators up to 360 mm at the top and 240 mm on the side. The case supports up to three 120 mm fans at the bottom, two 120 mm fans on the side, one 120 mm at the rear, and up to three 120 mm or two 140 mm fans at the top, giving builders greater flexibility for high-performance configurations.[Editor's note: Our in-depth review of the U11D Mini v2 is now live]

Chinese ODM Sixunited has introduced its STHT1 Thin Mini-ITX board, bringing AMD's Strix Halo "Ryzen AI MAX" APUs to the PC enthusiast market for the first time. Previously available only in high-end laptops and compact PCs, these Zen 5-based SoCs feature up to 16 CPU cores, an enhanced RDNA 3.5 Radeon 8060S GPU with up to 40 CU, and an integrated AI engine. Sixunited's non-socketed design allows builders to select any Ryzen AI MAX model: from the six-core, 16-thread 380 to the top-tier 16-core, 32-thread 395+ SKU, each supporting a configurable TDP range between 45 and 120 watts. To fully leverage this performance, the STHT1 ships with 128 GB of LPDDR5X-8000 memory soldered directly onto the board. This unified memory pool feeds the CPU, GPU, and AI engine, ensuring sufficient bandwidth for tasks such as LLM inference and real-time rendering in a compact footprint.

The STHT1 MoDT (Mobile on Desktop) platform offers plenty of connectivity and storage options. Dual M.2 2280 PCIe 4.0 x4 slots accommodate high-speed NVMe drives, while an M.2 2230 socket supports Wi-Fi modules. The rear panel features HDMI 2.1, a user-selectable DisplayPort, VGA, or COM output, two USB 3.2 Gen 2 Type-A ports, additional USB 3.2 Gen 1 and USB 2.0 ports, Gigabit Ethernet, and audio jacks. Internally, a robust 16-phase voltage regulator module powers the SoC, alongside a 4+1-phase arrangement for auxiliary components. Supporting the board are two fan headers, a standard four-pin ATX power connector, and a 19-volt DC-in plug, all housed on a 170×170 mm PCB.

Gainward, a trusted leader in high-performance graphics cards, proudly announces the launch of its NVIDIA GeForce RTX 5050 lineup. This release features the Ghost and Pegasus series with advanced cooling and exceptional durability. Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio.

GeForce RTX 5050 Ghost
The Gainward GeForce RTX 5050 Ghost is built for efficiency and reliability, featuring a sleek black design with a 2-slot form factor, ensuring compatibility with small form factor builds. Its twin 95 mm fans provide effective cooling while maintaining low noise levels for optimal thermal performance. A protective backplate enhances durability and adds a premium touch, while a subtle RGB glow on the side shroud brings a refined aesthetic without being distracting. The Ghost strikes a balance between style, functionality, and value.

As a leading innovator in graphics card technology, Palit Microsystems Ltd. is excited to unveil its latest GeForce RTX 5050 series. Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio.

GeForce RTX 5050 Dual
The Palit GeForce RTX 5050 Dual offers classic cooling efficiency in a sleek, modern black design with durable build quality. The large twin fans provide competitive cooling and quiet operation, while a compact 2-slot design suits small form factor builds.

Cooler Master has introduced the new NR200P case now in its V3 iteration. The NR200P V3 is a Mini-ITX case designed for compact builds requiring high-performance cooling solutions. The case measures 378.2 x 185 x 292 mm with protrusions (18.62-liter volume) while supporting full-size components. The exterior combines aluminium, SGCC steel, mesh panels, and ABS plastic components. The CNC-machined aluminium side panels feature magnetic latching mechanisms for tool-free access. Large mesh side panels facilitate airflow while maintaining component visibility. The NR200P V3 accommodates 240 mm and 280 mm AIO liquid coolers through top-mounted radiator support. Additional cooling options include dual 120 mm or 140 mm fans at the top. Bottom ventilation supports up to two 120 mm slim fans (maximum 15 mm thickness) when no 3.5-inch drive is installed, or one 120 mm slim fan with a drive present.

It can accommodate CPU coolers up to 70 mm in height and supports graphics cards up to 361.5 mm in length, 160 mm in height, and 78.5 mm in width (3.8 slots). A PCIe 5.0 x16 riser cable enables vertical GPU mounting, with an included GPU support bracket for stability. Power supply compatibility covers SFX and SFX-L form factors. Storage capacity includes one 3.5-inch HDD bay (expandable to two) and one 2.5-inch SSD bay (expandable to two). Front I/O provides two USB 3.2 Gen 1 ports, one USB 3.2 Gen 2x2 Type-C port, and a 3.5 mm headset jack. The Cooler Master NR200P V3 ships in black finish with a two-year warranty (retail pricing was not yet disclosed) targeting users requiring maximum performance in minimal desktop space.

ADLINK Technology Inc., a global leader in edge computing solutions, has unveiled brand-new series of expandable DLAP Edge AI platforms, including 3 products—DLAP-5200, DLAP-4100, and DLAP-8100—each engineered to meet the evolving demands of edge computing, AI inference, and industrial automation. These platforms feature latest Intel Core processors for powerful computing performance, and support dedicated GPU acceleration through MXM or PEG (PCIe Graphics) slots to unlock advanced AI capabilities.

The expandable DLAP Edge AI platforms feature comprehensive I/O including USB 3.2 Gen 2, 2.5GbE Ethernet, HDMI, DisplayPort, serial and digital I/O, along with PCIe Gen 4/Gen 5 slots, M.2 expansions, and SATA SSD trays for versatile integration and expansion. Certified GPU support delivers up to 91.1 TFLOPS AI performance using NVIDIA RTX 6000 ADA GPUs. The platforms' rugged, fanless design ensures reliable operation from -20°C to +60°C, with anti-shock, vibration resistance, and corrosion-resistant stainless steel, ideal for harsh environments like oil & gas, industrial automation, and healthcare.

INNO3D, a leading manufacturer of high-end multimedia components and innovations is proud to unveil its latest additions to the GeForce RTX 50 Series lineup: the INNO3D GeForce RTX 5050 GPUs. Powered by NVIDIA's highly efficient Blackwell architecture, these state-of-the-art graphics cards deliver exceptional performance and a suite of industry-leading features.

INNO3D has enhanced both the design and performance of its standout cooler series, featuring the sleek TWIN X2 and TWIN X2 OC models. Meanwhile, the RTX 5050 receives a small form factor upgrade with the single-fan COMPACT edition. These strategic enhancements underscore INNO3D's dedication to delivering extraordinary visual experiences, continuing to push the limits of graphics innovation for gamers and creators alike.

ASRock Industrial proudly announces its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192 GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, microATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

Intel Core 200S Processor Motherboards with DDR5 Support
ASRock industrial's Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, microATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

MSI listed the MPG B850I EDGE TI WIFI, a Mini-ITX form-format AMD AM5 socket motherboard built around AMD's B850 chipset with support for the latest Ryzen CPU series. The board features an 8+2+1 phase digital VRM with 90 A SPS DrMOS power stages, powered through a single 8-pin EPS connector. It uses a 10-layer PCB with 2oz copper for enhanced conductivity and thermal performance. The motherboard supports DDR5 memory up to 8200 MT/s in a dual-slot, single DIMM per channel configuration. Storage connectivity includes a front-mounted PCIe 5.0×4 M.2 slot with active cooling fan connected directly to the CPU, plus a rear PCIe 4.0×4 M.2 slot through the chipset and two SATA III ports. A single PCIe 5.0×16 slot provides GPU connectivity via CPU lanes.

Networking capabilities include 5 GbE wired connectivity through a Realtek RTK8126 controller and Wi-Fi 7 with 320 MHz channels supporting up to 5.8 Gbps, alongside Bluetooth 5.4. Audio processing uses the Realtek ALC4080 codec. The I/O configuration provides USB-C connectivity at 20 Gbps on the rear panel and 10 Gbps via internal header, multiple USB-A ports ranging from 480 Mbps to 10 Gbps speeds, HDMI 2.1 FRL video output, S/PDIF digital audio, and dual antenna connectors for wireless connectivity. The active cooling fan on the primary M.2 slot addresses thermal management for high-performance PCIe 5.0 SSDs while maintaining the compact Mini-ITX form factor.

Chinese tech news sites have alluded to the launch of Colorful's brand-new SMART 900 Mini PC in the region. Oddly, the company's various web presences and social media accounts do not mention this diminutive 4-liter (volume) product. At last month's Computex trade show, the TechPowerUp crew happened upon a preview unit—dubbed generically as a "Mini AI PC." The latest press material confirms Colorful's selection of AMD's top-flight 16-core Ryzen AI Max+ 395 APU. The Team Red "Strix Halo" mobile series leverages "Zen 5" processor cores and RDNA 3.5 integrated graphics solutions. Colorful has joined a small club of Mini PC providers that deal in Ryzen AI Max-equipped hardware. GMKtec seems to be leading this pack; with last month's global release of configurable EVO-X2 Mini PC pre-builds (starting at $1499).

Zotac is readying a competing Magnus EA (2025) range; the TPU team encountered a 12-core Ryzen AI Max 390-equipped example at Computex 2025. In North America, Framework is still working on getting its "4.5L Mini-ITX" Desktop out of the door—hopefully by the third quarter of this year. Colorful's SMART 900 Mini PC design sports a high quality anodized aluminium chassis. An "excellent" heat dissipation solution is advertised as taking: "advantage of the metal body—ensuring that the system can maintain a low operating temperature and a relatively reasonable noise level under high load." Rival manufacturers have outlined memory configurations of 64 GB or 128 GB LPDDR5X, but Colorful has opted for an unusual in-between 96 GB setup. At the time of writing, no SMART 900 Mini PC pricing information was included in local media reports.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

GEEEK, a Taiwanese SFF chassis brand, announced the Rhino open-air frame cases series designed for compact PC builds, featuring a tilted design with acrylic panels and aluminium block construction. The GEEEK Rhino M microATX measures 305 × 250 × 275 mm (excluding protrusions) and supports microATX and Mini-ITX motherboards. This model offers unrestricted compatibility with all standard air and liquid CPU coolers and graphics cards of any length. The open design provides complete freedom for cooling solutions, supporting radiator sizes ranging from 120 mm to 360 mm. Power supply compatibility includes ATX, SFX, and SFX-L formats with no length limitations.

The smaller Rhino S case is designed exclusively for Mini-ITX motherboards, featuring a more compact footprint of 300 × 200 × 250 mm (excluding protrusions) and weighs 1.1 kg. Despite its smaller size, it maintains the same unrestricted compatibility for CPU coolers and graphics cards as Rhino M. The case supports radiators up to 360 mm and accommodates ATX, SFX, and SFX-L power supplies, however, with a maximum length of 140 mm (maximum 150 mm). The white version features slightly thicker acrylic panels, which may make it a bit more difficult to secure the graphics card, according to the product page.

SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, has announced the launch of the HoneyComb Ryzen V3000 development platform. This innovative Mini-ITX board, built around SolidRun's Ryzen Embedded V3000 COM Express 7 (CX7) module, provides outstanding performance, reliability, and flexibility for prototyping and expediting time to market for industrial, networking, and edge computing solutions.

Combining SolidRun's AMD Ryzen V3000 CX7 Module, equipped with the AMD Ryzen Embedded 8-core V3C18I processor running at 1.9 GHz (base) and up to 3.8 GHz (boost) and 64 GB DDR5 memory, the HoneyComb Ryzen V3000 Mini-ITX development platform, equipped with fast and reliable PCIe Gen 4 NVMe storage, delivers exceptional computing power and performance in an ultra-compact form factor. Designed to withstand extreme conditions this system includes a powered CPU cooler, to support operating in environments ranging from -40°C to 85°C and can be configured to run at 15 to 45 Watts.