Formula V Line today launches the Crystal Z3 series of panoramic ATX mid-tower PC cases, combining a 90° rotatable rear PCIe bracket with bottom air intake integrated into the case design. The initial shipment consists of Crystal Z3 Plus models in Black and White, each with three PA2 120 mm ARGB PWM fans.

First previewed at COMPUTEX 2026, the Crystal Z3 series supports graphics cards up to 425 mm long, a 360 mm top radiator and up to eight 120 mm fans. Its removable bottom fan bracket and tool-free panels make it easier to assemble, upgrade and clean a display-focused PC.

Compact design meets workstation performance: With the new XB860G2, Shuttle is expanding its portfolio with a high-performance solution that bridges the gap between ultra-compact mini-PCs and bulky tower systems. Thanks to the Intel B860 chipset, support for 'Arrow Lake-S' and a PCIe 5.0 slot for dual-slot graphics cards, the system offers maximum flexibility for demanding professional applications.

Hardware requirements in professional environments are diverse: whilst ultra-compact 1-liter systems are the ideal choice for efficient office applications and space-critical installations, computationally intensive projects often require additional hardware resources. The new Shuttle XPC Barebone XB860G2 fills precisely this market niche. With a chassis volume of around 4.7 liters, it offers space for dedicated components and optimized cooling performance that was previously reserved for significantly larger systems, without sacrificing the advantages of a compact form factor.

Over a decade ago, the BC1 Open Benchtable launched with one clear goal: the ultimate portable platform for traveling overclocking enthusiasts. Its minimalist, toolless, flat pack design proved so effective that it quickly became the benchmark for open air builds, evolving from road warrior to permanent showcase platform for hobbyists and professionals alike.

Portability demanded compromises: slim profile, simple brackets, no native support for complete vertical builds. Today we close those gaps with precision engineered accessories that extend the BC1's legendary versatility without changing its core DNA.

If you were in or around the PC building space in 2020, you'd have at least heard about the fire risk related to the PCIe riser cable on the original NZXT H1 mini ITX case, which eventually resulted in a recall and replacement PCIe riser kits being sent out. Since NZXT has launched the newest iteration of the SFF case, the H2 Flow—which TechPowerUp has reviewed—the PC case maker has seen fit to publish a blog post explaining the engineering changes it has made to the new H2 Flow's riser cable to avoid the same issues from popping up again. NZXT starts things off by reminding us that the problem with the original H1's PCIe riser cable was that the mounting screw made contact with an internal power plane in the riser cable's PCB, resulting in a short circuit that could lead to a fire.

The brand goes on to explain that the issue has been avoided in the new PCIe riser cable with two safety measures. First, there is a physical boss, or "shoulder" that extends into the PCB through-hole to protect the PCB from the screw threads and to ensure that there is a consistent and guaranteed gap between the screw and the PCB. Secondly, NZXT has changed the design of the PCB such that there are no power planes or traces surrounding the screw hole—every trace around the screw is grounded, and that ground plane extends externally to a copper screw pad on the top and bottom of the PCB, adding another layer of protection. NZXT notes that the screw pad may be missing in some early review samples, which is something you can observe in our review of the H2 Flow, but it is included in the final mass production versions of the case. NZXT claims that these measures have eliminated the failure mode that caused issues with the original H1 chassis.

NZXT, a leading brand in PC gaming components and prebuilt systems, today introduced the H2 Flow Mini-ITX Case and the C850 SFX Power Supply, two compact solutions designed to bring high-performance PC builds into smaller spaces without compromise. With a focus on airflow, compatibility, and ease of installation, these products make small form factor (SFF) systems more powerful and accessible than ever.

For players who want the performance and design of the H2 Flow without building it themselves, NZXT is also launching the H2 Mini PC, available for a limited time, exclusively in the United States. This prebuilt option delivers the same compact footprint and performance-focused design in a fully assembled, ready-to-play system, making small form factor PC gaming more accessible to a wider audience.

[Editor's note: You can read ourin-depth review of the NZXT H2 Flow Mini-ITX case here]

LIAN LI Industrial Co., Ltd., a leading manufacturer of chassis and PC accessories, announces the launch of the Multi-Directional Vertical GPU Mounting Bracket, a versatile solution for vertically mounting graphics cards with enhanced adjustability and support. Featuring three adjustable height positions with 10.2 mm spacing and forward/backward tilt options at each level, the bracket offers improved compatibility and display flexibility. It includes a 155 mm PCIe 5.0 riser cable for full Gen 5 bandwidth, integrated addressable RGB lighting compatible with all major motherboard software, and a support arm to prevent GPU sag with adjustable mounting points. Compatible with GPUs up to 4 slots thick and available in black or white, the bracket is a clean and functional upgrade for showcase PC builds.

Adjustable Height, Tilt, and Lighting for Optimized GPU Positioning
The Multi-Directional Vertical GPU Mounting Bracket allows precise GPU placement with three height levels spaced 10.2 mm apart, making it easier to clear bottom intake fans or large CPU air coolers. Each height setting supports both forward and backward tilt, providing flexibility to improve airflow or adjust the GPU orientation for better visibility through the side panel. To enhance visual appeal, the bracket also features integrated addressable RGB lighting that remains fully functional across all height and tilt settings, letting users sync lighting effects with the rest of their system.

An unlucky owner of a GIGABYTE AORUS GeForce RTX 5080 MASTER ICE 16 GB graphics card has reported a baffling instance of thermal gel leakage. A forum post—titled: "5080 oh my god thermal problem"—on the Quasar Zone BBS alerted the wider world to this bizarre fault. The South Korean MMORPG enthusiast described circumstances up until the point of critical liquefaction: "it's been exactly a month since I bought it. I use it for (Blizzard's) World of Warcraft. Two hours of use per day. I set up the card with a riser kit. Thermal (material) is crawling out?!" Early 2025 press coverage has largely focused on other types of unwanted high temperature events involving GeForce RTX 50-series cards, but the seeping out of "server-grade thermal conductive gel" compound is something new. As reported by several PC hardware news outlets, GIGABYTE has utilized fancy thermal conductive gel within flagship SKUs—instead of traditional/conventional thermal pads. This gel was placed over the card's VRAM and MOSFET sections; following fairly light usage (as described above) some of this material started to head down—getting ever closer to the unit's PCIe interface.

Assisted by the AORUS RTX 5080 MASTER ICE's vertical orientation, the (apparently) highly deformable, but non-fluid thermal gel was susceptible to the effects of gravity. JC Hyun System Co., Ltd.—GIGABYTE's official domestic importer (for South Korea)—weighed in with a separate bulletin: "we are aware of the thermal gel issue with the GIGABYTE GeForce RTX 50 series, which was first posted on Quasar Zone—(we) are currently discussing the thermal gel issue with GIGABYTE HQ and future customer service regulations. In addition, we sincerely apologize for the confusion caused to many customers who love and use GIGABYTE products due to inaccurate guidance provided to customers who received the products due to unclear customer service regulations regarding the issue that occurred this time. Lastly, when the manufacturer's customer service policy regarding this thermal gel issue is finalized, we will also forward the service policy to CS Innovation so that it can be processed smoothly in accordance with the service policy. We will also provide information through a separate post so that more customers can be aware of the information." As mentioned by Notebookcheck, GIGABYTE uses this special thermal gel solution on other highly expensive custom: "RTX 50-series cards like the GeForce RTX 5090 XTREME WATERFORCE 32G, RTX 5090 MASTER ICE, RTX 5070 Ti MASTER, and others."

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, has today announced the NR200P V2 - a redesigned new take on the classic high performance NR200P case. The V2 keeps things compact and frees up desk space without sacrificing any of the performance benefits users expect from an NR200P case, such as versatile cooling support and maximized airflow.

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.

In Win launches its Foldable POC Mini-ITX Tower - the latest iBuildiShare series case you can shape yourself! In Win Development Inc. (In Win), a leading innovator in PC enthusiast gaming hardware, has introduced its POC Mini-ITX tower PC chassis. POC is the latest addition to In Win's iBuildiShare series. Encouraging the development of dexterity skills both inside and out of a PC.

DIY PC builders of all ages can assemble a Mini-ITX enclosure from this vibrant modular kit by actually bending and shaping each panel. Similar to the art of origami, but using 0.8 mm foldable SECC steel panels instead of paper. This durable, lightweight material can withstand multiple bends. Delivered flat-packed, POC minimizes packaging materials and weight, reducing environmental impact.