Packaging and Contents
You will receive:
- Graphics card
Visually, the EVGA GTX 1650 Super SC Ultra looks identical to the company's GTX 1660 Super SC and other similar products. A dual-fan heatsink ensures the card stays cool at all times. Unlike most of the competition, EVGA managed to squeeze in a high-quality metal backplate on this MSRP-priced card.
Dimensions of the card are 20 cm x 11 cm.
Installation requires two slots in your system.
Display connectivity options include DisplayPort 1.4a, HDMI 2.0b, and dual-link DVI-D. This DVI connector lacks analog pins; should you still have an analog VGA monitor, you'll have to buy an active DVI-to-VGA adapter.
NVIDIA has updated their display engine with the Turing microarchitecture, which now supports DisplayPort 1.4a with support for VESA's nearly lossless Display Stream Compression (DSC). Combined, this enables support for 8K@30Hz with a single cable or 8K@60Hz when DSC is turned on. For context, DisplayPort 1.4a is the latest version of the standard that was published in April, 2018.
At CES 2019, NVIDIA announced that all their graphics cards will now support VESA Adaptive Sync (aka FreeSync). While only a small number of FreeSync monitors have been fully qualified with G-SYNC, users can enable the feature in NVIDIA's control panel regardless of whether the monitor is certified or not.
The board uses one 6-pin power connector. This input configuration is specified for up to 150 watts of power draw.
GeForce GTX 1650 Super does not support SLI.
The cooler uses an aluminium fin-stack heatsink. A copper base plate makes contact with the GPU, and two flattened copper heat pipes spread heat across the heatsink. Thick thermal pads pull some heat from the memory chips. Two 90 mm fans ventilate the heatsink. This is the exact same cooler as on the EVGA GTX 1660 Super SC Ultra.
The metal backplate protects the card against damage during installation and handling.
Interesting design choice. Not only did EVGA use thermal pads as thick as pencil erasers, but they stacked two of these up near the main cluster of memory chips to reach between the two flattened heat pipes. Perhaps they did this to disperse retention force rather than convey heat. Now, this thick thermal pad of course doesn't transfer heat from the memory chips to the heatsink all that well as a lot of heat will migrate through the BGA solder balls and into the PCB instead.