Researchers at the Fraunhofer Institute have developed a new material which allows better cooling than the conventional copper and aluminum solutions. To achieve this result, diamond powder has been added to metallic copper. Diamond conducts heat five times better than copper.

The result is a bond with 1.5 times the heat conduction of copper. Another advantage is that the material does not expand too much when heated, otherwise it couldn't be used in electronic devices.

It's not easy to create a stable bond between copper and diamond. The researchers use small amounts of chrome, which will form carbide-layers on the diamond, allowing copper to create bonds. It's possible that there are other materials with similar features.

As of yet, the material is only being demonstrated, whereas in the future it may find its way into notebooks, where heat dissipation has always been a problem.