VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

AOpen being a valued partner of Microsoft is working closely with the Windows Embedded team to show the benefits of the AOpen Digital Engine combined with WES 7.

At Embedded World, AOpen will demonstrate the latest AOpen Digital Engine DE67-HA that includes support for the Intel 2nd Generation Core Processor Family i3, i5 and i7. It is the strongest and most powerful AOpen Digital Engine to date. The system supports Intel Active Management Technology 7.0 to enable remote system management from a single location. AMT technology enables the system to be managed from for instance the UK while the systems are located at several locations in Europe. The system also allows to be connected to multiple displays while maintaining quality performance, thus eliminating the need to buy more media players than necessary and reducing implementation costs.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, will exhibit at Embedded World 2012 in Nuremberg, Germany on February 28 - March 1, 2012. Throughout the exhibition, Transcend will display a wide range of industrial-grade products from SSDs to memory modules, specifically designed for diverse industrial applications. Transcend's booth will be located in Hall 1, booth no. 216.

Participating at Embedded World again this year, Transcend is proud to display a more comprehensive and advanced industrial grade product portfolio, including SATA III 6Gb/s SSD, SLC SSD, mSATA and half-slim SSDs, flash modules, flash cards, and memory modules. Transcend will also set up professional on-site demonstrations, such as SSD lifespan monitoring and sudden power-off test, to highlight the ultimate stability and guaranteed reliable data transfer of Transcend SSDs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first quad core Mini-ITX boards featuring the latest VIA QuadCore E-Series processor. The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2 GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products.

The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. To meet the low power demands of the embedded market, the VIA QuadCore E-Series processor offers industry-leading energy efficiency, with the VIA QuadCore E-Series 1.2+ GHz processor delivering a thermal design power (TDP) of only 27.5 W. The distributed power of the VIA QuadCore E-Series processor makes it ideal for handling the most demanding HD video formats for immersive multi-display applications and environments.

Advantech,a global leader in the embedded computing market, is happy to announce the ARK-1120, an ultra-compact and price-competitive fanless embedded system powered by an Intel Atom N455 processor. Its compact size, affordable price, robust performance and support for both HDD and CompactFlash memory make the ARK-1120 attractive for a range of embedded usages.

This product is well-suited for applications that need a simple but dependable controller. ARK-1120 is ideal for thin client and factory automation applications with space limited or low-power-consumption designs.

Wyse Technology, the global leader in cloud client computing, today announced the newest member of its top-performing Z class thin client family with the availability of the Wyse Z90DE7 thin client. Built on an extended hardware platform that includes a PCI express (PCIe) expansion slot, this extremely secure, powerful new member of the Wyse Z class family is based on Microsoft Windows Embedded Standard 7. Like other Wyse Z90 family thin clients, the Z90DE7 combines the raw power of dual-core AMD G-series processors with Wyse's industry-leading firmware based on Windows Embedded Standard 7 optimized for thin client performance, security, and ease of use. In addition, the Z90DE7 adds an expandable hardware platform to deliver multimedia and advanced security applications with exceptional, uncompromised performance and quality.

Silicon Line GmbH, a leading provider of ultra-low power analog ICs, today announced that it has brought to market the SL82728 and SL82718 ICs targeted at notebooks, ultrabooks and tablets using the latest VESA based Embedded DisplayPort standard. The ICs are used to optically connect the graphics processor to the display and enable the replacement of traditional electrical connectors with optical connectors.

Strong consumer demand for high resolution retina type displays and 3D technology is driving the data rates inside mobile devices ever higher. These extremely high data rates not only generate significant EMI when traditional electrical cables are used to transport the data but also are reaching the limits of the practical capabilities of electrical cables.

ADLINK Technology, Inc., a leading global provider of trusted I/O platforms, announces the release of the new Matrix MXE-5300 series of rugged, quad core, fanless computers, based on the high performance 2nd Generation Intel Core i7/i5/i3 processor and QM67 chipset. The MXE-5300 is the ultimate Matrix fanless embedded computer, featuring top-of-the-line processor performance, outstanding wireless optimization capability, robust mechanical design, and Intel AMT 7.0 support. The MXE-5300's combined features make it an ideal choice for intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.

LucidLogix (Lucid) today announced GPU virtualization software designed to improve the response performance, visual quality and battery efficiency of mobile devices including smartphones, tablets, ultrabooks, notebooks and more.

Codenamed "XLR8", Lucid has taken the core technology behind its recently announced Virtu MVP software and applied it to single, embedded graphics processors like AMD Fusion, ARM Mali, Intel Ivy Bridge and NVIDIA Tegra.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced that the iNAND Ultra line of products will be the first of its embedded flash memory products to move to 19 nanometer (nm) manufacturing technology, the industry's most advanced chip making process.

TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces the availability of the 200 Mbps Powerline AV Adapter with Bonus Plug, model TPL-307E, and the 200Mbps Powerline AV Adapter Kit with Bonus Plug, model TPL-307E2K, which comes with two TPL-307E adapters. These high performance Powerline adapters network computers, televisions, and other devices using existing home or office electrical lines.

The TPL-307E replaces the bulkier TPL-304E series and features a compact product housing, built in electrical outlet, embedded power saving technology, and an advanced electrical noise filter which boosts performance by reducing background electrical signal interference.

HP today announced the HP Slate 2 Tablet PC with expanded touch capabilities, enhanced multitasking performance and embedded security, providing added flexibility to mobile business users. The company also announced a new notebook PC targeting business, education and government customers.

The HP Slate 2 Tablet PC provides instant deployment for business and vertical markets such as education, healthcare, government and retail, where jobs frequently take users away from a traditional desk. With a full-featured Microsoft Windows environment, the 1.5 pound HP Slate 2 Tablet PC provides professionals with the flexibility to create, edit and review content on one highly mobile and lightweight device.

Stealth.com Inc. (Stealth Computer), a leading ISO 9001 manufacturer of industrial rugged computers and peripherals has released the new model LPC-125LPFM, a rugged, small footprint, fanless computer for industrial, Mobile/In-Vehicle and Embedded applications.

The LPC-125LPFM is a breakthrough in small form factor computing. The rugged, diminutive size, noise free computer operates in wide temperature ranges and drawing less than 20 Watts of operational power. This energy efficient & versatile PC measures out at only, 4.6" x 6.1" x 2.0" (117mm x 155mm x 52mm) or slightly larger than a deck of playing cards. The Stealth Mini PC weighs in at a mere 1.2lbs or 0.54kg. The PC operates from 10-26V of DC power making it ideal for DC powered applications typically found in vehicle and mobile applications.

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has started volume production of its SATA interface NANDrive solid state drives (SSDs). The GLS85LS product family has the same pin-out across all capacities-2 GB, 4 GB, 8 GB, 16 GB, 32 GB and higher in the future-which simplifies system-level board design.

Measuring 14mm x 24mm x 1.95mm, in a 145 ball grid array (BGA), 1 mm ball pitch package, SATA NANDrive devices are one of the smallest SSDs, giving OEMs (original equipment manufacturers) flexibility when designing data storage into their embedded products. The BGA package can be soldered directly onto the motherboard-no extra connectors are needed-providing added stability to the SSD.

Today at Embedded Systems Conference East, AMD introduced the AMD Radeon E6460 discrete graphics processor as AMD's next generation entry-level embedded graphics processor, complementing the previously announced AMD Radeon E6760. With support for up to four simultaneous displays and more than double the 3D graphics performance of the ATI Radeon E2400 GPU1, the AMD Radeon E6460 GPU sets a new bar for features and performance in an entry-level embedded GPU. With five years of planned supply availability and with the graphics memory included in the same package, the AMD Radeon E6460 GPU delivers the longevity, small footprint, and ease of design demanded by embedded system designers.

"The AMD Radeon E6460 GPU provides the high value, small footprint, and long supply demanded by embedded customers," said Richard Jaenicke, director of Embedded Client Business for AMD. "With a footprint-compatible subset of the high-performance AMD E6760 GPU, the new AMD Radeon E6460 GPU enables broadly scalable graphics and multimedia performance in a single board design."

Micron Technology, Inc., today introduced the highest-density Serial Peripheral Interface (SPI) NOR memory available, launching 1 gigabit (Gb), 512 megabit (Mb) and 256Mb products in both 1.8V and 3V power supply voltages. Employing state-of-the-art 65nm process technology, the N25Q product family offers the highest-speed quad I/O in the industry and a full set of advanced features and small packages that improve overall system performance and time-to-market in networking, set-top boxes, automotive and a wide range of industrial, computing and consumer applications.

Extending the company's legacy of memory leadership, Micron's new SPI NOR product line balances customers' needs for cost-effective solutions at higher densities while ensuring compatibility among future chipsets. Micron's long-term commitment to customers in the embedded markets is reinforced by Micron's Product Longevity Program (PLP) - a 10-year commitment to provide stable memory architectures for customer designs. The new N25Q products will be offered as part of this program to provide design assurance for its PLP customers.

Intel Corporation today reported its fifth consecutive quarter of record revenue, with double-digit revenue growth across all business segments. On a Non-GAAP basis, revenue was $13.1 billion, operating income was $4.2 billion, net income was $3.2 billion, and EPS was 59 cents. On a GAAP basis, the company reported second-quarter revenue of $13.0 billion, operating income of $3.9 billion, net income of $3.0 billion, and EPS of 54 cents. The company generated approximately $4.0 billion in cash from operations, paid cash dividends of $961 million, and used $2.0 billion to repurchase 93 million shares of common stock.

"We achieved a significant new milestone in the second quarter, surpassing $13.0 billion in revenue for the first time," said Paul Otellini, Intel president and CEO. "Strong corporate demand for our most advanced technology, the surge of mobile devices and Internet traffic fueling data center growth, and the rapid rise of computing in emerging markets drove record results. Intel's 23 percent revenue growth in the first half and our increasing confidence in the second half of 2011 position us to grow annual revenue in the mid-20 percent range."

Apacer, the global leader in memory module, is making aggressive moves into the sector of value-added products by debuting today a new industrial SD card designed for embedded systems in harsh storage environments. Features include high reliability, high storage and resistance to extended temperatures. These advantages enable the new card to be widely applied to industrial, military, communication, surveillance, medical devices and car navigation, thereby satisfying the storage need of demanding industrial enterprises.

Compliant with Ver. 2.0 standard and SDHC Class 10 high-speed transmission standard as defined by the SD Association, the new SD card from Apacer also supports SD and SPI modes. By using the superbly reliable SLC chip, it not only delivers the features of anti-shock, anti-vibration and low power consumption, but also boasts resistance to extended temperatures (-40ºC to 85ºC). Available in capacities from 256 MB to 8 GB, the new SD card can substantially accelerate data transfer, due to its sequential read/write speed reaching up to 20/13 MB per second. It is also worth noting that the card's automatic standby and sleep modes help save power more effectively.

Intel's Smart Response technology is doing wonders to the low-cost SSD market. The technology lets low-capacity, usually low-cost SSDs to be used as caches for hard drives, improving the system's overall responsiveness. The technology makes these low-cost SSDs more of a component than a product (such as 2.5-inch SATA SSDs), and hence it makes sense to offer them in the mSATA form-factor. Intel made its headstart by launching the Intel 311 "Larson Creek" series 20 GB SSD that comes in both 2.5-inch SATA 3 Gb/s and mSATA form factors. While mSATA makes it easy to deploy the technology into notebooks, desktop motherboard vendors such as Gigabyte thought it would be nice to give their motherboards an mSATA slot.

Capitalizing on this very market is A-Data, with a couple of new low-cost mSATA SSDs in the ISFM series. First is the ISFM-XM13, an mSATA SSD driven by a SandForce SF-1200 series controller. Even with some of the controller's channels unoccupied (due to obvious lack of space to put NAND flash chips), this card doles out decent transfer rates of up to 250 MB/s read and 170 MB/s write. This card comes in capacities of 30 GB (32 GB with 2 GB overprovisioned) and 60 GB (64 GB with 4 GB overprovisioned). This card uses MLC NAND flash. Next up, is the ISFM-IXM01, that looks to be using a JMicron-made controller. The bigger difference here is the use of SLC NAND flash on one of its two variants, which traditionally offers higher rewrite cycles. The other variant uses MLC NAND flash. The SLC variant offers transfer rates of 90 MB/s read and 90 MB/s write, and comes in capacities of 2, 4, 8, and 16 GB. The MLC variant gives you 150 MB/s read, 120 MB/s write; and comes in capacities of 32, 64, and 128 GB.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

AMD today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 "Bobcat" CPU cores and a discreet class DirectX 11-capable GPU on a single die.

"We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement," said Buddy Broeker, director, Embedded Solutions, AMD. "System designers can now unleash their creativity without being constrained by heat or size issues."

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q1'11. We found that shipments during the first quarter of 2011 behaved according to past years with regard to seasonality, and was nominal on a year-to-year comparison for the quarter. The situation changed over the course of the year and Q4'10 did not conform to the normal seasonal cycle, but was down a bit compared to previous years, so the growth in Q1 was a welcomed change. Our forecast for the coming years has been modified since the last report, and is less aggressive on both desktops and notebooks.

Today at Embedded Systems Conference Silicon Valley 2011, AMD introduced the AMD Radeon E6760 embedded discrete graphics processor. Available now, the AMD Radeon E6760 GPU is the first of its kind to offer embedded system designers the combination of OpenCL support along with support for six independent displays.

"The AMD Radeon E6760 GPU provides customers with superior business economics through long lifecycle management and product stability," said Richard Jaenicke, director of Embedded Client Business for AMD. "Embedded system designers faced with power and density constraints now have a solution that delivers the advanced 3D graphics and multimedia features they require in this performance-driven market."

Netlist, Inc., a designer and manufacturer of high-performance memory subsystems, today announced the expansion of its Embedded Flash product portfolio with two new mSATA module additions to the SSD Flash product line. The mSATA mini SSD module offers storage capacity of up to 32GB with onboard 64MB DRAM cache. The mSATA slim SSD module offers storage capacities up to 128GB with onboard 64MB DRAM cache. Both products' smaller form-factor and SSD support for ultra-dense applications makes the mSATA mini and slim modules ideal for datacenter equipment and embedded systems.

"As datacenter equipment becomes increasingly compact, Netlist is tackling space limitations with an innovative Flash product portfolio," said Steve McClure, vice president of worldwide sales and marketing for Netlist. "With our new mSATA mini and mSATA slim SSDs, Netlist addresses the constrained space requirements by providing 2x to 5x the storage density of legacy form-factor solutions."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its VIA ART-5450 embedded box PC system, designed to offer embedded developers the ideal system platform for today's sophisticated logistics and fleet management applications.

Based on a uniquely compact, fanless and rugged design, the VIA ART-5450 offers a full feature set that includes a range of wireless 3G communications, dual display and advanced power management support, creating a flexible and stable platform for in-vehicle systems that control, monitor and manage commercial vehicles.