Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the eBOX626-311-FL, its new slim-type fanless embedded system powered by the Intel Atom processor x5-E3940. The fanless embedded box PC was designed to operate reliably in industrial environments - with an IP40-rated enclosure, extended -40°C to +60°C support, and 3 Grms vibration resistance. To ensure system security, it utilizes the Trusted Platform Module (TPM) 1.2 function. The embedded box computer eBOX626-311-FL is well-suited for industrial controllers, intelligent robotic control, intelligent gateway systems, smart kiosks, visual inspection and data visualization.

"The eBOX626-311-FL is a highly-integrated platform with high performance, abundant I/O connectivity and high reliability. The fanless embedded box PC has a wide voltage input and supports an 11 ms interruption to prevent an unexpected power outage. The wide temperature settings and 3Grms vibration resistance along with IP40-rated rugged aluminium extrusion and steel case makes it solid and durable in harsh environments," said Annie Fu, product manager of Product PM Division at Axiomtek."

5G has been a trending topic in the recent times because of the big technological breakthrough and all the solutions that its major features will make a reality: Low latency, bigger bandwidth with higher frequency, and overall faster "real-time" connection.

With those features 5G will connect virtually everyone and everything together in a fast and reliable network through the air while protecting privacy and security issues, that will mean the era of real IoT: Smart cities and smart transportations; remote medical care and wirelessly connected Industrial devices, and high-quality video streaming, to say the least.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

UP Xtreme Smart Surveillance is an all-in-one security solution that's ready to deploy out of the box. Many developers and users of security solutions are looking for ways to get more out of their surveillance systems by deploying intelligent edge computing platforms. UP Xtreme, from AAEON's UP Board division, is being deployed along with technology from partners including Intel, Milestone and SAIMOS to bring Smart Surveillance to these customers with the UP Xtreme Smart Surveillance kit.

With the ever-increasing importance of on-site security, surveillance cameras are installed virtually everywhere, recording footage passively. Smart surveillance takes things to the next level by adding intelligent processing of data that's already being gathered to analyze traffic with heatmaps, monitor areas with virtual fences, or reacting to data in other ways to allow for automated control or alerting staff on premises. UP Xtreme Smart Surveillance provides all the technology needed to power these applications in one box, working as an AI-enabled NVR solution to proactively monitor video streams supporting up to 32 cameras simultaneously (Intel Core i7 model with Milestone XProtect Express+).

IBASE Technology Inc., a leading provider of industrial motherboard and rugged computing solutions, is pleased to announce its AMS210 high-performance embedded box PC. Designed for factory automation, machine vision, digital signage and a wide range of industrial IoT applications, the AMS210 can be outfitted with 9th/8th Gen Intel Core processors, up to 32 GB of DDR4 memory and two 2.5" disk drives with RAID 0/1.

The AMS210 has a straightforward design with front I/O accessibility, including four USB 3.1, four USB 2.0, three DisplayPorts, and a serial port to connect to a diverse set of peripheral devices, as well as four Gigabit LAN ports to handle high bandwidth data processing requirements. Two flexible expansion slots supporting a combination of PCI-E (x16), PCI-E (x4) and PCI interface are also conveniently located at the front for easy access. To achieve operational reliability in harsh industrial environments, it features an operating temperature range from 0°C to 55°C and vibration endurance of up to 3 g (with SSD).

AAEON, a leader in AI and edge computing solutions, announces the VPC-3350AI embedded PC featuring Intel Movidius Myriad X. Built for industrial and in-vehicle use, the VPC-3350AI provides faster and smoother AI processing compared to similar systems which rely on CPU performance alone.

The VPC-3350AI is based on a flexible platform powered by Intel Atom x5 E3940 (formerly Apollo Lake) paired with two Intel Movidius Myriad X VPU modules. Together, these modules provide the VPC-3350AI with processing speeds up to 210 FPS and 8 TOPs as a dedicated neural network accelerator (evaluated by GooLeNet). This configuration of two VPUs with processor allows the VPC-3350AI to support asynchronous processing of AI models, allowing for higher framerates and faster, smoother image processing for AI inferences.

AMD today announced revenue for the first quarter of 2020 of $1.79 billion, operating income of $177 million, net income of $162 million and diluted earnings per share of $0.14. On a non-GAAP* basis, operating income was $236 million, net income was $222 million and diluted earnings per share was $0.18.

"We executed well in the first quarter, navigating the challenging environment to deliver 40 percent year-over-year revenue growth and significant gross margin expansion driven by our Ryzen and EPYC processors," said Dr. Lisa Su, AMD president and CEO. "While we expect some uncertainty in the near-term demand environment, our financial foundation is solid and our strong product portfolio positions us well across a diverse set of resilient end markets. We remain focused on strong business execution while ensuring the safety of our employees and supporting our customers, partners and communities. Our strategy and long-term growth plans are unchanged."

Matrox today announced a collaboration with NVIDIA for the development of a new range of multi-display embedded graphics cards purpose-built for high-density video walls. Leveraging NVIDIA's industry-renowned GPU technology, Matrox will design graphics innovations powered by a custom-built Quadro embedded GPU to accelerate graphics-intensive video wall applications in commercial and 24/7 critical environments.

"Matrox is thrilled to work alongside NVIDIA, the leader in GPU computing, to bring to market a new standard of high-density video walls," said David Chiappini, executive vice president of research and development at Matrox. "This collaboration is yet another example of our commitment to expanding our video wall portfolio while customers continue to benefit from our graphics expertise, world-class engineering, dedicated technical support, and long product life cycles."

Global industrial and IoT computer hardware manufacturer, OnLogic, has teamed up with AMD to release a line of small form factor industrial computers powered by AMD Ryzen Embedded processors. Both the ultra-compact fanless ML100G-40, and actively-cooled MC510-40 are available for pre-order now and limited quantities are expected to begin shipping to customers in December.

Global industrial and IoT computer hardware manufacturer, OnLogic, has teamed up with AMD to release a line of small form factor industrial computers powered by AMD Ryzen Embedded processors. Both the ultra-compact fanless ML100G-40, and actively-cooled MC510-40 are available for pre-order now and limited quantities are expected to begin shipping to customers in December.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2019 of $1.80 billion, operating income of $186 million, net income of $120 million and diluted earnings per share of $0.11. On a non-GAAP(*) basis, operating income was $240 million, net income was $219 million and diluted earnings per share was $0.18.

"Our first full quarter of 7 nm Ryzen, Radeon and EPYC processor sales drove our highest quarterly revenue since 2005, our highest quarterly gross margin since 2012 and a significant increase in net income year-over-year," said Dr. Lisa Su, AMD president and CEO. "I am extremely pleased with our progress as we have the strongest product portfolio in our history, significant customer momentum and a leadership product roadmap for 2020 and beyond."

The AMD Embedded business provides SoCs and discrete GPUs that enable casino gaming companies to create immersive and beautiful graphics for the latest in casino gaming platforms, which are adopting the same high-quality motion graphics and experiences seen in modern consumer gaming devices. AMD Embedded provides casino and gaming customers a breadth of solutions to drive virtually any gaming system. The AMD Ryzen Embedded V1000 SoC brings CPU and GPU technology together in one package, providing the capability to run up to four 4K displays from one system. The AMD Ryzen Embedded R1000 SoC is a power efficient option while providing up to 4X better CPU and graphics performance per dollar than the competition.

Beyond SoCs, AMD also offers embedded GPUs to enable stunning, immersive visual experiences while supporting efficient thermal design power (TDP) profiles. AMD delivers three discrete GPU classes to customers with the AMD Embedded Radeon ultra-high-performance embedded GPUs, the AMD Embedded Radeon high-performance embedded GPUs and the AMD Embedded Radeon power-efficient embedded GPUs. These three classes enable a wide range of performance and power consumption, but most importantly offer features that the embedded industry demands including planned longevity, enhanced support and support for embedded operating systems.

At the Taiwan Embedded Forum, AMD announced the Ryzen embedded product family is growing with the new AMD Ryzen Embedded R1000 SoC. Building upon the success of the Ryzen Embedded V1000 SoC, the AMD Ryzen Embedded R1000 SoC provides embedded customers with dual core, quad-threaded performance, as well as the ability to run fanless, low power solutions for 4K displays; while providing leading-edge security features. The AMD Ryzen Embedded R1000 is perfect for applications in digital displays, high-performance edge computing, networking, thin clients and more.

Customers like Advantech, ASRock Industrial, IBASE, Netronome, Quixant and others are already working on Ryzen Embedded R1000-based products. As well, Atari© is using the high-performance Vega 3 graphics and 'Zen' CPU architecture in the AMD Ryzen Embedded R1000 SoC to power the upcoming Atari VCS game system.

Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company's BiCS FLASH 3D flash memory and a controller in a single package. The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices.

The company's Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade 2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB.

ZOTAC Technology, a global manufacturer of innovation, is proud to expand its reach to the embedded computing market with the launch of ZBOX PRO. ZBOX PRO represents the emerging of ZOTAC's professional embedded solution that embodies high performance for commercial and industrial applications and differing business needs worldwide. The product line will make its debut appearance at Integrated Systems Europe (ISE) 2019.

ZBOX PRO re-engineers the functionality and small footprint of ZBOX Mini PCs to offer embedded product selections with more controlled tolerances. The series features a diverse range of industrial design and engineering from passive-cooled embedded computers, pint-sized display solutions to powerful workstation-class systems. Professional-grade hardware are integrated inside the durable chassis, with an array of connectivity, memory capacity and storage options provided. With up to 5 years of supply longevity, ZBOX PRO guarantees a long lifespan to provide stable and enduring service supporting your business.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.

"The 1 TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "What's more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market."

British PC maker Tranquil PC is making its comeback with three new fanless mini PCs based on AMD Ryzen Embedded SoCs. The three are part of the "mini multi display" series, and are its variants, named "Basic," "Advance," and "Advance+." The three feature Tranquil PC's latest octagonal fanless aluminium chassis measuring 180 mm x 157 mm x 54 mm. The body panels of the case double up as heatsink for the sub-25 Watt SoCs. Connectivity is common between the three. On the front-panel, you get two USB 3.0 ports, one of which is type-C; HDA audio jacks, and interestingly an RS232 serial COM port.

The rear panel gives you access to four DisplayPort 1.2 connectors, which can each drive a 4K UHD display; two additional type-A USB 3.0 ports, two 1 GbE interfaces, and hardpoints for the WLAN antennae (802.11ac + Bluetooth 4.1). SoC variant and storage is what differentiates the three. The Basic trim gives you a Ryzen Embedded V1202B (2-core/4-thread, up to 3.20 GHz) chip, 8 GB of DDR4 memory, and 256 GB of SSD storage. The Advance trim gets you the faster 4-core/8-thread Ryzen Embedded V1605B (up to 3.60 GHz); 16 GB of memory, and 256 GB SSD storage. The Advance+ trim steps that up with 32 GB of memory, and 1 TB of SSD storage. The company didn't reveal pricing.

Sapphire introduced the FS-FP5V, a mini-ITX (147.3 mm x 139.7 mm) SFF motherboard designed for AIO desktops, digital signage boxes, and compact desktops. At the heart of this board is an AMD Ryzen Embedded V1000 series FP5 SoC based on the 14 nm "Raven Ridge" silicon. Since this SoC also integrates a southbridge, the board is practically chipset-less. The Ryzen Embedded V1000 chip is configured with a 4-core/8-thread "Zen" CPU clocked at 2.00 GHz with 3.35 GHz boost, and 4 MB L3 cache. The iGPU is a Radeon Vega 11, which may look overkill, but is required to pull the four DisplayPort 1.4 outputs of this board (handy for digital-signage applications).

The Ryzen Embedded V1000 is wired to two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2933 memory. Storage connectivity includes an M.2-2280 slot with PCI-Express 3.0 x4 wiring, an M.2 E-key slot with x1 wiring for WLAN cards; and a SATA 6 Gbps port. Networking options include two 1 GbE interfaces. USB connectivity includes two USB 3.1 gen 1 ports at the rear-panel, and two USB 3.1 gen 1 ports (direct ports) at the front side of the board, one each of type-A and type-C. Stereo HD audio makes for the rest of it. The board draws power from either 2-pin DC (external) or 4-pin ATX.

Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced several new additions to its edge computing and network appliance portfolio based on the new Intel Xeon D-2100 SoC (System-on-a-Chip) processor.

Leveraging its deep expertise in server technology, Supermicro is bringing customers some of the first Intel Xeon D-2100 System-on-a-Chip (SoC) processor-based solutions. The company's X11SDV series motherboards offer infrastructure optimization by combining the performance and advanced intelligence of Intel Xeon processors into a dense, lower-power system-on-a-chip. Supermicro is introducing a wide range of new systems to the market including compact embedded systems, rackmount embedded systems, as well as multi-node MicroCloud and SuperBlade systems.

ADATA Technology, a leading manufacturer of highperformance DRAM modules, SSD and NAND based Flash products, is pleased to confirm participation in Embedded World 2018, which is the premiere embedded systems and industrial PC trade show in Europe. The event is scheduled for February 27th to March 1st 2018 and taking place in Nuremberg, Germany. ADATA is fielding its entire industrial-grade portfolio, covering SSDs, SD cards, and CFAST products that now use new-generation 3D NAND.

ADATA will showcase several PCIe M.2 2280 SSDs and DDR4 2666 DRAM modules, which feature extreme high speed, wide temperature tolerance and sustained reliability for industrial embedded applications, as well as for AI, AR, VR and video gaming. In addition, industrial box PCs, embedded cards, server motherboards, smart car infotainment, and casino gaming controls will be at the show. ADATA ex! pects Embedded World 2018 to be the most productive and exciting show yet after years of taking part in the event.

AMD today introduced two new product families - the AMD EPYC Embedded 3000 processor and AMD Ryzen Embedded V1000 processor - to enter a new age for high-performance embedded processors. AMD EPYC Embedded 3000 brings the power of "Zen" to a variety of new markets including networking, storage and edge computing devices, while AMD Ryzen Embedded V1000 targets medical imaging, industrial systems, digital gaming and thin clients. These new AMD Embedded processors deliver breakthrough performance, exceptional integration and on-chip security.

"Today we extend the high-performance x86 'Zen' architecture from PCs, laptops and the datacenter to networking, storage and industrial solutions with the AMD EPYC Embedded and AMD Ryzen Embedded product families, delivering transformative performance from the core to the edge," said Scott Aylor, corporate vice president and general manager, Datacenter and Embedded Solutions Business Group, AMD. "AMD EPYC Embedded 3000 raises the bar in performance for next-generation network functions virtualization, software-defined networking and networked storage applications. AMD Ryzen Embedded V1000 brings together the 'Zen' core architecture and 'Vega' graphics architecture to deliver brilliant graphics in a single chip that provides space and power savings for medical imaging, gaming and industrial systems. With these high-performance products, AMD is ushering in a new age for embedded processors."

Axiomtek, one of the world's leading design and manufacturing companies of innovative, high performance and reliable PC-based industrial computer products, is proud to announce the launch of the eBOX560-512-FL, an embedded system powered by Intel Core i5-7300U or Celeron 3965U processors. The ultra-compact computer is packed with features in its small IP40 aluminum and steel enclosure. It offers scalable computing performance; rich graphical capabilities that support dual independent display of up to 4K resolution; flexible communication options; and thoughtful design that offers versatility and values for Industrial Internet of Things use. The system is made for smart factory automation, digital signage and smart retail applications or any applications that require a good balance of a high performance industrial-grade computer and a good price point - with space-serving design and rich features.

The eBOX560-512-FL comes with many communications options such as four USB 3.0 ports, two RS-232/422/485 ports, two Gigabit Ethernet ports, one PCI Express Mini Card slot and two antenna. This tiny embedded PC offers two HDMI ports, a lockable 12 VDC power input with power protection feature and a user-friendly AT/ATX DIP switch for adjustments between automatic and manual operation control. The eBOX560-512-FL has 2.5" SATA HDD and one mSATA for data storage, and one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. It is compatible with Windows 10 IoT and supports Axiomtek's exclusive AXView 2.0 software for smart device monitoring and remote management for IoT applications. For flexible mounting options, this fanless rugged embedded platform is compatible with a wall mount, a VESA mount and a DIN-rail mount.

Transcend Information Inc., a leading manufacturer of storage and multimedia products, is proud to introduce the SSD430, an industrial-grade solid-state drive. Compatible with SATA III 6Gb/s specifications, the SSD430 delivers impressive transfer speeds of up to 560MB/s read and 490MB/s write. In addition to blazing speed, Transcend's SSD430 features excellent reliability and comes in a small, stylish case. The drive is loaded with low-density parity check (LDPC) error-correction code (ECC) and advanced protective technologies, making it an excellent choice for industrial needs.

The industrial-grade SSD430 solid-state drive is constructed of 3D MLC NAND flash chips. 3D engineering has increased SSD430's speeds to an incredible sequential 560MB/s read and 490MB/s write; the random transfer efficiency is also boosted to 310MB/s read and 350MB/s write. Low power consumption and high reliability are also hallmarks of 3D NAND. Transcend's SSD430 is manufactured for a long-term, stable operation for various types of data and application, and is suited for industrial PCs, automated machinery, and fanless industrial systems.

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today announced that it has extended its popular family of SATA 6 Gb/s FerriSSD Industrial BGA SSDs to support the latest 3D NAND with end-to-end data path protection, NANDXtend ECC, and IntelligentScan feature - delivering unsurpassed data reliability for embedded storage applications. The new FerriSSD products offer flexible data capacity options up to 256GB and feature proprietary data protection technologies that eliminate drive downtime and extend the service life of these SSDs. FerriSSD products offer customized solutions for various end-market demands and are optimized to meet the specific needs of the customer.

Toshiba America Electronic Components, Inc. (TAEC) has enhanced its lineup of managed NAND devices with the addition of new Embedded Multimedia Card (e-MMC) and Universal Flash Storage (UFS) embedded memory solutions. Featuring enhanced integrated controller technologies, the new 'Supreme+' e-MMC (JEDEC ver. 5.1) and UFS (JEDEC ver. 2.1) offerings deliver significant read and write speed improvements to demanding applications.

In contrast to raw NAND flash memory solutions, e-MMC and UFS devices integrate NAND flash memory and a controller chip in a single package. This saves space and relieves host processors of the burden of key memory management functions including bad block management, error correction, wear leveling, and garbage collection. As a result, e-MMC and UFS devices simplify design when compared to standalone memory ICs with a standard NAND flash interface.

AMD today released their earnings call for 3Q 2016, giving us some interesting tidbits in regards to their financial robustness. The balance of AMD's economics seems to be pending towards better execution, and, coeteris paribus, a much better outlook for the coming quarters, after the monumental missteps in the past that almost threw AMD under the proverbial bus. Reception for the results seems to be a tangled mess, however, with some sides claiming that AMD beat expectations, while others prefer to draw attention to AMD's 2% stock decline since the report was outed.

AMD posted revenue of $1,307 million, up 27% sequentially and 23% year-over-year. This revenue was distributed unevenly through AMD's divisions, though. "Computing and Graphics" segment revenue was $472 million, up 9% from Q2 2016, primarily due to increased GPU sales (where Polaris picked up the grunt of the work, being responsible for 50% of AMD's GPU revenue), offset by lower sales of client desktop processors and chipsets; whereas "Enterprise, Embedded and Semi-Custom" segment revenue was $835 million, up 41% sequentially, primarily due to record semi-custom SoC sales (such as those found in Microsoft's XBOX One and Sony's PS4 and upcoming PS4 Pro).