Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

TrendForce research indicates that in 1H23, the utilization rate of 8-inch production capacity primarily benefited from sporadic inventory restocking orders for Driver ICs in the second quarter. Additionally, wafer foundries initiated pricing strategies to encourage clients into early orders, offering solid backup. However, in 2H23, persistent macroeconomic and inventory challenges led to the evaporation of an anticipated demand surge.

Meanwhile, stockpiles in automotive and industrial control segments grew after meeting initial shortages, tempering demand. Under fierce price competition from PMIC leader Texas Instruments (TI), inventory reductions for Fabless and other IDMs were drastically inhibited. With IDMs ushering in output from their new plants and pulling back outsourced orders, this compounded reductions to wafer foundries. This dynamic saw 8-inch production capacity utilization dipping to 50-60% in the second half of the year. Both Tier 1 and Tier 2/3 8-inch wafer foundries saw a more lackluster capacity utilization performance compared to the first half of the year.

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300 mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.

The planned fab is expected to have a monthly production capacity of 40,000 300 mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe's semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

Today, U.S. Deputy National Security Advisor Anne Neuberger, Chairwoman of the Federal Communications Commission (FCC) Jessica Rosenworcel, and Laurie Locascio, Director of the National Institute of Standards and Technology (NIST) unveiled the U.S. national IoT security label at the White House.

Infineon Technologies AG supports this action to address the growing need for IoT security. The new label supports the IoT security requirements under NISTIR 8425, which resulted from an Executive Order to improve the nation's cybersecurity. This label will recognize products that meet these requirements by permitting them to display a U.S. government label and be listed in a registry indicating that these products meet U.S. cybersecurity standards.

According to the report coming from Bloomberg, European Union has approved as much as 8.1 billion Euros (about 8.6 billion USD) for research of advanced semiconductors. Accompanied by the 13.7 billion Euros in private funds, the total investment for boosting domestic semiconductor manufacturing in the EU is almost 22 billion Euros. As part of the European CHIPS Act, the project aims to develop Europe as the world's semiconductor powerhouse, with as much as 20% of all semiconductors produced in the EU by 2030. This ambitious goal is backed by state subsidies, as well as investors creating private pools of funds to aid companies in creating semiconductor manufacturing facilities on European soil.

This Important Project of Common European Interest (IPCEI) on Microelectronics and Communication Technologies is an essential step for Europe's semiconductor independence. Internal Market Commissioner Thierry Breton noted, "In a geopolitical context of de-risking, Europe is taking its destiny into its own hands. By mastering the most advanced semiconductors, the EU will become an industrial powerhouse in markets of the future." Companies like Intel, Infineon, STMicroelectronics, GlobalFoundries, and Wolfspeed announced European investments, with TSMC considering a production facility in Germany. German Economy Minister Robert Habeck has noted that Germany has 31 projects in 11 regions, adding, "We can thus increase resilience across Europe in this important field and secure value creation and jobs."

TSMC, a Taiwanese semiconductor giant, is reportedly talking to its partners to develop an $11 billion (€10 billion) factory in Germany with the help of a few European partners. Currently assessing the plant location for Saxony in Germany, the fab wouldn't only be exclusively made by TSMC but will bring in NXP, Bosch, and Infineon that, will create a budget of around 7 billion Euros, including state subsidies, while the total budget is leaning closer to 10 billion Euros in total. However, it is essential to note that TSMC is still assessing the possibility of a Europe-based plant altogether.

Asking for as much as 40% of the total investment to be European-backed subsidies, TSMC wants to create a European facility that will be focused on a growing sector--automotive. If approved in August, the TSMC plant will become the company's first European facility and will first focus on manufacturing 28 nm chips. As one of the first significant EU Chips Act €43 billion investment, it will heavily boost European semiconductor manufacturing.

Semiconductor manufacturers worldwide are forecast to increase 300 mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026, SEMI announced today in its 300 mm Fab Outlook to 2026 report. After strong growth in 2021 and 2022, the 300 mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.

"While the pace of the global 300 mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO. "The foundry, memory and power sectors will be major drivers of the new record capacity increase expected in 2026."

NFC-based sensing controllers with energy-harvesting capabilities are critical for the development of passive smart devices that can operate with high accuracy, efficiency, and design convenience in a wide range of IoT applications. With the NGC1081, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its product portfolio of NFC tag-side controllers. The new IC is a single-chip solution that enables the IoT industry to develop low-cost, miniaturized, smart edge computing/sensing devices, maximizing the benefits for both end-users and manufacturers. Such devices can be controlled and powered by mobile phones, with potential applications ranging from medical patches and disposable point-of-case testers to data loggers, smart thermostats, and sensor inlays.

The tag-side controller supports a dual power supply function, allowing it to operate in a passive mode (battery-free) based on energy harvesting, or in a battery-powered mode, operating as a self-contained sensing node via a 3 to 3.3 V external power supply. In passive mode, the entire sensing system, including the IC and its connected sensors, can draw power via energy harvesting from the NFC field of a mobile phone. Together with its naturally galvanically isolated sensing interface, these features open up countless possibilities for creating many innovative sensing use cases that require no batteries and minimal maintenance. This is particularly useful for applications where the power supply needs to be galvanically isolated to meet the safety requirement.

New product alert! In January last year, we launched the $4 Raspberry Pi Pico, our first product built on silicon designed here at Raspberry Pi. At its heart is the RP2040 microcontroller, built on TSMC's 40 nm low-power process, and incorporating two 133 MHz Arm Cortex-M0+ cores, 264kB of on-chip SRAM, and our unique programmable I/O subsystem. Since launch, we've sold nearly two million Pico boards, and RP2040 has found its way into a huge number of third-party products. We always believed that RP2040 was a great fit for commercial and industrial applications, but the global semiconductor shortage has vastly accelerated adoption. With millions of units on hand today, and pipeline in place for tens of millions more, design engineers who have been let down by their current suppliers have a perfect excuse to experiment.

Fast cores, large memory, and flexible interfacing make RP2040 a natural building block for Internet of Things (IoT) applications. But Pico itself has one obvious missing feature for IoT: a method for connecting to the network. Now, this is about to change. Today, we're launching three new members of the Pico family. Raspberry Pi Pico W is priced at $6, and brings 802.11n wireless networking to the Pico platform, while retaining complete pin compatibility with its older sibling. Pico H ($5) and Pico WH ($7) add pre-populated headers, and our new 3-pin debug connector, to Pico and Pico W respectively. Pico H and Pico W are available today; Pico WH will follow in August.

According to TrendForce, market conditions in 1H22 were chaotic and there was disparate demand for chips of varying functionality. Given the global development of electronic devices and power systems, overall demand for power management ICs (PMIC) is still relatively good. PMICs are used in consumer electronics, communications, computing, industrial control, automotive and other fields. In 2H22, supply and demand gradually diverged and demand for automotive Switching Regulators, Multi Channel PMICs was strongest.

According to TrendForce, there are various specifications and types of PMICs, including Linear Regulators, etc. Even usage scenario dependent products such as Battery Charging & Management, Voltage References, and USB Power Delivery ICs all fall into this category.

Due to material shortages caused by insufficient semiconductor supply, to date, power management IC (PMIC) prices remain on an upward trend, according to TrendForce's latest investigations. Average selling price (ASP) for 1H22 is forecast to increase by nearly 10%, reaching a record six year high.

In terms of the global supply chain, in addition to the production capacity of major IDM manufacturers including TI, Infineon, ADI, STMicroelectronics, NXP, ON Semiconductor, Renesas, Microchip, ROHM (Maxim has been acquired by ADI and Dialog by Renesas), IC design houses such as Qualcomm and MediaTek (MTK) have obtained a certain level of production capacity from foundries. Of these, TI is in a leadership position and the aforementioned companies possess a combined market share of over 80%.

Finally some good news from the semiconductor industry, Infineon has announced the opening of its new €1.6 billion, 300 mm, or 12-inch wafer semiconductor factory. That said, we're somewhat confused with the press release, as it states that "the chips are manufactured on 300-millimeter thin wafers, which at 40 micrometers are thinner than a human hair" and that Infineon is a "global pioneer in 300-millimeter thin-wafer technology". This is why you need someone to proofread press releases before distributing them.

Anyhow, back on topic. The fab has nearly 60,000 square meters of gross floor space and production will be ramped up over the next four to five years, so it's not going to alleviate the current chip shortage any time soon. The fab is located in Villach, Austria and has taken three years to build. The first wafers produced in the fab are said to be leaving it this week and although Infineon didn't specify what chips they'll end up as, the fab is set up to initially cater for the automotive industry, data centers and the renewable energy industry.

News just keep flowing that are bound to have impact on pricing for components users of this website know and love. The Austin-American Statesman reports that Samsung has been ordered to shutter its Texas factories in wake of recent power shortages that have impacted the state. The order, which came from Austin Energy, doesn't just affect Samsung: all industrial and semiconductor manufacturers in the state were ordered to idle or shut down their facilities, meaning that NXP Semiconductors and Infineon Semiconductors have also been affected. According to Austin Energy, all companies have complied with the order. A date for the lifting of these restrictions still hasn't been given.

As we know, semiconductor manufacturing is a drawn-out process, with some particular wafers taking several months in their journey from initial fabrication until they reach completion. This meas that it's a particularly sensitive business in regards to power outages or general service interruptions. The entire semiconductor manufacturing lines - and products therein, in various stages of production - can be rendered unusable due to these events, which will have a sizable impact in the final manufacturing output of a given factory. It remains to be seen the scale of this production impact, but a few percentage points difference in the overall global semiconductor manufacturing could have dire implications for availability and pricing, considering the already insufficient operational capacity in regards to demand. Considering the impact adverse temperatures are having on Texas residents, here's hoping for the quick resolution of these problems, which affect much more than just semiconductor manufacturing capabilities.

IC Insights' November Update to the 2020 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2020. This research bulletin covers the expected top-15 2020 semiconductor suppliers (Figure 1).

The November Update also includes a detailed five-year forecast through 2024 of the IC market by product type (including dollar volume, unit shipments, and average selling price) and a forecast of the major semiconductor industry capital spenders for 2020. A five-year outlook for total semiconductor industry capital spending is also provided.

Cypress, an Infineon Technologies Company, today announced that in less than five years, the company has achieved a landmark milestone by shipping its one billionth USB-C device. As the leading provider of USB-C technology, Cypress' leadership position spans a wide range of markets with its controllers used within mobile, computing, and power applications.

Cypress offers the industry's most complete portfolio of USB solutions, including device controllers, embedded hosts, hubs, application-specific bridges, and transceivers. Cypress' EZ-PD portfolio was the first in the industry to support the latest USB Power Delivery (USB PD) 3.0 specification, which enables more robust end-to-end power delivery and charging solutions for laptop and mobile devices. Cypress also offers AEC-Q100 certified versions of its controllers for automotive-grade performance.

ASUS updated its AMD socket sTRX4 motherboard series with the new ROG Zenith II Extreme Alpha, a slight step-up from the original ROG Zenith II Extreme that debuted with AMD's 3rd gen Ryzen Threadripper family. Although ASUS' entire sTRX4 motherboard lineup will support the upcoming 64-core Threadripper 3990X, the new Extreme Alpha is better designed for overclocking it. The new board looks visually identical to the original ROG Zenith II Extreme, and has an almost-identical feature-set, with the only difference being the CPU VRM solution. The new ROG Zenith II Extreme Alpha implements a 16-phase CPU VRM with Infineon TDA21490 power-stages replacing the TDA21472 power-stages on the original ROG Zenith II Extreme (possibly increase output current or I-out from 70 A to 90 A). This could marginally increase the product price. The rest of the feature-set is identical.

Motherboard vendors are betting big on the success of AMD's "Valhalla" desktop platform that combines a Ryzen 3000-series Zen 2 processor with an AMD X570 chipset motherboard, and have responded with some mighty premium board designs. GIGABYTE deployed its full spectrum of Aorus branding, including Ultra, Elite, ITX Pro, Master, and Xtreme. The X570 I Aorus Pro WiFi mini-ITX motherboard is an impressive feat of engineering despite its designers having to wrestle with the feisty new PCIe gen 4 chipset. It draws power from a combination of 24-pin and 8-pin connectors, and conditions power for the SoC with an impressive 8-phase VRM that uses high-grade PowIRstage components. A rather tall fan-heatsink cools the X570 chipset, with a 30 mm fan.

Connectivity options on the X570 I Aorus Pro WiFi are surprisingly aplenty. The sole expansion slot is a PCI-Express 4.0 x16, but the storage connectivity includes not one, but two M.2-2280 slots (reverse side of the PCB), each with PCI-Express 4.0 x4 and SATA 6 Gbps wiring. Four SATA 6 Gbps ports make for the rest of the storage connectivity. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0 (Intel , and 1 GbE, all pulled by Intel-made controllers. USB connectivity includes six 5 Gbps USB 3.2 gen 1, and two 10 Gbps USB 3.2 gen 2 ports (of which one is type-C), and two 5 Gbps ports by headers. The onboard audio solution has 6-channel analog output, but is backed by a premium Realtek ALC1220VB Enhance CODEC (114 dBA SNR).

The United States tech industry has overnight dealt a potentially fatal blow to Chinese electronics giant Huawei, by boycotting the company. The companies are establishing compliance with a recent Executive Order passed by President Donald Trump designed to "stop the import, sale, and use of equipment and services by foreign companies based in countries that are potential adversaries to U.S. interests," particularly information technology security. Google has announced that it will no longer allow Huawei to license Android, and will stop updates and Google Play access to Huawei smartphones. Huawei can still equip its phones with open-source Android, but it cannot use Google's proprietary software, including Google Play Store, Chrome, and all the other Google apps. Intel decided to no longer supply processors and other hardware to Huawei, for use in its laptops and server products. Sales of AMD processors will stop, too. Qualcomm-Broadcom have decided to stop supply of mobile SoCs and network PHYs, respectively. Microsoft decided to stop licensing Huawei to use Windows and Office products.

The ban is a consequence of the U.S. Government placing Huawei on a list of banned entities, forcing all U.S. companies to abandon all trade with it, without prior approval from the Department of Commerce. Trade cuts both ways, and not only are U.S. firms banned from buying from Huawei, they're also banned from selling to it. Huawei "buys from" over 30 U.S. companies, (for example, Windows licenses from Microsoft). CNN reports that U.S. firms could lose up to $11 billion in revenues.

HTPC case maker HDPLEX unveiled the DC-ATX 800W, a nano-ATX form-factor power-converter. This accessory, roughly as big as a power brick, takes in 6-pin PCIe, 8-pin PCIe, and 8-pin EPS connectors from your main rig, and depending on how many connectors you plug-in, puts out up to 800 Watts of power through a 24-pin ATX, and three downstream PCIe/EPS connectors, with the unit itself handing DC-to-DC switching of 12V to 5V and 3.3V voltage domains. This accessory is ideal if you have a high-Wattage power supply with multiple vacant EPS and PCIe connectors, and want to power a second mini-ITX machine, while saving a lot of space on the side. It uses some pretty high-grade components to ensure 24x7 operation, including Sanyo Japan-made solid-state capacitors, Infineon-made MOSFETs, Würth Elektronik inductors, and controller chips supplied by National Semiconductor and MPS. Available in the coming weeks, the DC-ATX 800W is priced at $190.

Super Flower, a global leader in PC gaming power supplies (and whose designs are used by a multitude of PSU manufacturers ranging anywhere from 80+ Bronze to 80+ Platinum rated power supplies), today announced its upcoming double forward 80+ Bronze product line, with available wattages ranging from 400W to 850W, with the 750W , 800 W and 850 W also being available in semi-modular options. Super Flower's own innovative layout design with optimized & refined topology includes various first grade and high-quality components, on products with power ratings of 400W / 450W / 500W / 550W / 600W / 650W / 700W / 750W / 800W and 850W.

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures. Production of the next generation 40nm eFlash MCUs will take place at different GLOBALFOUNDRIES sites, initially in Singapore with subsequent transfer to its site in Dresden, Germany.

"Next generation embedded Flash microcontrollers with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets," says Arunjai Mittal, Member of the Management Board of Infineon Technologies. "We trust in GLOBALFOUNDRIES with their excellent manufacturing background and sites on different continents to fulfill Infineon's stringent quality, infrastructure security and business continuity requirements."

Intel Corporation reported record EPS and revenue on both a GAAP and non-GAAP basis. On a non-GAAP basis, revenue was $12.9 billion, operating income was $4.3 billion, net income was $3.3 billion, and EPS was 59 cents. On a GAAP basis, the company reported first-quarter revenue of $12.8 billion, operating income of $4.2 billion, net income of $3.2 billion, and EPS of 56 cents.

The company generated approximately $4.0 billion in cash from operations, paid cash dividends of $994 million, and used $4.0 billion to repurchase 189 million shares of common stock. "The first-quarter revenue was an all-time record for Intel fueled by double digit annual revenue growth in every major product segment and across all geographies," said Paul Otellini, Intel president and CEO. "These outstanding results, combined with our guidance for the second quarter, position us to achieve greater than 20 percent annual revenue growth."

Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon's Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately $1.4 billion.

WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel's strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.

"The global demand for wireless solutions continues to grow at an extraordinary rate," said Paul Otellini, Intel president and CEO. "The acquisition of Infineon's WLS business strengthens the second pillar of our computing strategy -- Internet connectivity -- and enables us to offer a portfolio of products that covers the full range of wireless options from Wi-Fi and 3G to WiMAX and LTE. As more devices compute and connect to the Internet, we are committed to positioning Intel to take advantage of the growth potential in every computing segment, from laptops to handhelds and beyond."

As many as nine major chip vendors were fined a total of 331 million Euros (US $404.2 million) for participating in illegal price-fixing activities, by the European Union authorities. These include Samsung, Hynix, Nanya, Elpida, Infineon, NEC, Toshiba, Hitachi, and Mitsubishi. A 10th company in this price-fixing cartel was Micron Technology, which escaped the fine for exposing the malpractice to the EU authorities. Of these Samsung was given the single biggest fine of 146 million Euros, followed by Infineon at 57 million Euros. The fines were reduced by 10% because all companies extended cooperation in the investigations.

The price-fixing cartel mostly involved bad trade of DRAM chips, and was active between 1998 and 2002, operating with a network of contacts which secretly exchanged pricing information. They colluded to fix prices of DRAM chips sold to major PC and server manufacturers. Investigations in the scam began in 2002 when Micron blew the whistle on the cartel. "By acknowledging their participation in a cartel the companies have allowed the Commission to bring this long-running investigation to a close and to free up resources to investigate other suspected cartels," said EU's Competition Commissioner, Joaquin Almunia. "As the procedure is applied to new cases it is expected to speed up investigations significantly," he added.