In a move that could intensify competition with Intel in the cutting-edge chip manufacturing space, Samsung Foundry has reportedly decided to rebrand its second-generation 3 nm-class fabrication technology, previously known as SF3, to a 2 nm-class manufacturing process called SF2. According to reports from ZDNet, the renaming of Samsung's SF3 to SF2 is likely an attempt by the South Korean tech giant to simplify its process nomenclature and better compete against Intel Foundry, at least visually. Intel is set to roll out its Intel 20A production node, a 2 nm-class technology, later this year. The reports suggest that Samsung has already notified its customers about the changes in its roadmap and the renaming of SF3 to SF2. Significantly, the company has reportedly gone as far as re-signing contracts with customers initially intended to use the SF3 production node.

"We were informed by Samsung Electronics that the 2nd generation 3 nm [name] is being changed to 2 nm," an unnamed source noted to ZDNet. "We had contracted Samsung Foundry for the 2nd generation 3 nm production last year, but we recently revised the contract to change the name to 2 nm." Despite the name change, Samsung's SF3, now called SF2, has not undergone any actual process technology alterations. This suggests that the renaming is primarily a marketing move, as using a different process technology would require customers to rework their chip designs entirely. Samsung intends to start manufacturing chips based on the newly named SF2 process in the second half of 2024. The SF2 technology, which employs gate-all-around (GAA) transistors that Samsung brands as Multi-Bridge-Channel Field Effect Transistors (MBCFET), does not feature a backside power delivery network (BSPDN), a significant advantage of Intel's 20A process. Samsung Foundry has not officially confirmed the renaming.

Panasonic Connect today announced the latest iterations of its TOUGHBOOK G2 and 33 detachable rugged tablets. The 10.1-inch G2mk2 and 12-inch 33mk3 deliver market-leading ruggedness, battery life, customisation, connectivity and performance that provide the modern mobile worker with a balanced solution, regardless of the task, application or environment.

Unrivalled performance for any application
Panasonic's TOUGHBOOK G2mk2 and 33mk3 devices feature market-leading performance, enhanced connectivity and increased modularity to adapt to different mobile worker requirements.

Over the weekend, there have been a series of leaks from sources such as Golden Pig Upgrade, and High Yield YT, surrounding Intel's next-generation desktop processor, the Core Ultra 2-series "Arrow Lake-S." The lineup is likely to continue the new client processor naming scheme Intel introduced with the Core Ultra 1-series "Meteor Lake" on the mobile platform. "Arrow Lake-S" is rumored to debut the new Socket LGA1851, which retains cooler-compatibility with LGA1700. Although Intel has nucleated all I/O functions of the traditional PCH to "Meteor Lake," making it a single-chip solution on the mobile platform; and although the mobile "Arrow Lake" will continue to be single-chip; the desktop "Arrow Lake-S" will be a 2-chip solution. This is mainly because the desktop platform demands a lot more PCIe lanes, for a larger number of NVMe storage devices, or high bandwidth devices such as Thunderbolt and USB4 hubs, etc.

Another key finding in this latest series of leaks, is that unlike "Meteor Lake," the desktop "Arrow Lake-S" will do away with low-power island E-cores located in the SoC tile of the processor. All CPU cores are located in the Compute tile, which is expected to be built in the Intel 20A foundry node—the company's first node to implement GAAFETs (nanosheets), with backside power delivery; as well as an advanced 2nd generation EUV lithography. Intel's 1st Gen EUV is used on the current FinFET-based Intel 4 and Intel 3 foundry nodes.

MSI Claw A1M, the company's ambitious attempt at a handheld gaming console based on the Intel Core Ultra "Meteor Lake" processor, instead of AMD Ryzen Z1 "Zen 4," goes on sale from March 8, 2024. This is according to a now-retracted Newegg store listing that mentions the release dates of the three Claw A1M models. The lineup is led by the Claw A1M powered by a Core Ultra 155H processor, 16 GB of LPDDR5-6400 memory, and 1 TB of NVMe SSD storage; for $799. For $50 less at $749, you get the same device, but with 512 GB of NVMe SSD storage. For a further $100 less, at $699, you get a model with the Core Ultra 5 135H processor, but the same 16 GB LPDDR5 memory, and 512 GB SSD, as the $749 model.

All three models feature a physically identical body design, including the controller layout, and lighting. Performance between the Core Ultra 7 155H and Core Ultra 5 135H models, is bound to differ. The 155H has a 6P+8E+2LP CPU core configuration, but more importantly, maxes out the Graphics Tile, with all 8 Xe cores being enabled (1,024 unified shaders). The Core Ultra 5 135H has a 4P+8E+2LP CPU core config, while its iGPU has 7 Xe cores. The star attraction with this console is its 7-inch touchscreen with 1080p resolution at 120 Hz refresh rate. Comms on all three models include Wi-Fi 7 and Bluetooth 5.4.

The AI infrastructure of today is mostly fueled by the expansion that relies on GPU-accelerated servers. Google, one of the world's largest hyperscalers, has noted that CPUs are still a leading compute for AI/ML workloads, recorded on their Google Cloud Services cloud internal analysis. During the TechFieldDay event, a speech by Brandon Royal, product manager at Google Cloud, explained the position of CPUs in today's AI game. The AI lifecycle is divided into two parts: training and inference. During training, massive compute capacity is needed, along with enormous memory capacity, to fit ever-expanding AI models into memory. The latest models, like GPT-4 and Gemini, contain billions of parameters and require thousands of GPUs or other accelerators working in parallel to train efficiently.

On the other hand, inference requires less compute intensity but still benefits from acceleration. The pre-trained model is optimized and deployed during inference to make predictions on new data. While less compute is needed than training, latency and throughput are essential for real-time inference. Google found out that, while GPUs are ideal for the training phase, models are often optimized and run inference on CPUs. This means that there are customers who choose CPUs as their medium of AI inference for a wide variety of reasons.

The existence of Intel's upcoming Core i9-14900KS processor has been confirmed by a series of insider leaks and premature retail listings—an "alleged" example was photographed and appeared online right at the start of 2024. French e-tail listings produced evidence of two packages—a traditional retail box version, and a barebones tray option for OEM purposes. Earlier today, the I_Leak_VN social media account uploaded proof of a single "Special Edition" box sitting in an unnamed Vietnamese warehouse—it is not immediately clear whether units have reached retail facilities, or have just arrived on Southeast Asian shores. The embargo-busting post seemingly corroborates global insider information/whispers about distribution networks receiving stock—possibly in preparation for a rumored mid-March launch. VideoCardz believes that Vietnamese customers will be paying roughly $765 a pop—30% pricier than the current cost of 14th Gen Core flagship ownership.

Intel announced today that it is reviving the Altera brand name for its new standalone FPGA (field-programmable gate array) company. The business was previously known as Intel's Programmable Solutions Group before being spun off into an independent entity two months ago. The chipmaking giant acquired Altera in 2015 for $16.7 billion to bolster its FPGA capabilities. Using the well-known Altera moniker for the new standalone company signals Intel's confidence in the FPGA market opportunity, which it estimates to be over $55 billion across data centers, communications, and embedded segments. As a standalone company with its own board of directors, Altera will be able to focus exclusively on the FPGA market. Intel will remain a majority shareholder, but outside investment could help fund expansion plans.

Altera plans to build on the Programmable Solutions Group's recent efforts targeting lower-end and mid-range FPGAs for embedded devices in industrial, automotive and aerospace/defense applications. According to Intel CEO Pat Gelsinger, independence will give Altera "the mandate, focus and resources to better capitalize on the attractive expected growth of FPGAs." The revival of the Altera brand and refocus on the FPGA market comes alongside Intel's plan to invest heavily in new chip factories and advanced manufacturing capabilities. With Altera as a standalone business, Intel aims to be a significant player in the expected high growth of the global FPGA industry. Alongside new naming, Altera is introducing Agilex 9, which is now in volume production; Agilex 7 F-series and I-series released to production; Agilex 5 now broadly available, and Agilex 3 coming soon, with functions for cloud, communications and intelligent edge applications. Below, you can see the specification table of the upcoming FPGAs.

Microsoft has just announced that their new DirectSR Super Resolution API for DirectX will provide a unified interface for developers to implement super resolution in their games. This means that game studios no longer have to choose between DLSS, FSR, XeSS, or spend additional resources to implement, bug-test and support multiple upscalers. For gamers this is huge news, too, because they will be able to run upscaling in all DirectSR games—no matter the hardware they own. While AMD FSR and Intel XeSS run on all GPUs from all vendors, NVIDIA DLSS is exclusive to Team Green's hardware. With their post, Microsoft also confirms that DirectSR will not replace FSR/DLSS/XeSS with a new upscaler by Microsoft, rather that it builds on existing technologies that are already available, unifying access to them.

While we have to wait until March 21 for more details to be revealed at GDC 2024, Microsoft's Joshua Tucker stated in a blog post: "We're thrilled to announce DirectSR, our new API designed in partnership with GPU hardware vendors to enable seamless integration of Super Resolution (SR) into the next generation of games. Super Resolution is a cutting-edge technique that increases the resolution and visual quality in games. DirectSR is the missing link developers have been waiting for when approaching SR integration, providing a smoother, more efficient experience that scales across hardware. This API enables multi-vendor SR through a common set of inputs and outputs, allowing a single code path to activate a variety of solutions including NVIDIA DLSS Super Resolution, AMD FidelityFX Super Resolution, and Intel XeSS. DirectSR will be available soon in the Agility SDK as a public preview, which will enable developers to test it out and provide feedback. Don't miss our DirectX State of the Union at GDC to catch a sneak peek at how DirectSR can be used with your games!"

TrendForce underscores that the primary momentum for server shipments this year remains with American CSPs. However, due to persistently high inflation and elevated corporate financing costs curtailing capital expenditures, overall demand has not yet returned to pre-pandemic growth levels. Global server shipments are estimated to reach approximately. 13.654 million units in 2024, an increase of about 2.05% YoY. Meanwhile, the market continues to focus on the deployment of AI servers, with their shipment share estimated at around 12.1%.

Foxconn is expected to see the highest growth rate, with an estimated annual increase of about 5-7%. This growth includes significant orders such as Dell's 16G platform, AWS Graviton 3 and 4, Google Genoa, and Microsoft Gen9. In terms of AI server orders, Foxconn has made notable inroads with Oracle and has also secured some AWS ASIC orders.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched the latest generation of the XPG XENIA 15G gaming laptop to markets around the globe. Designed to be an all-around price to performance laptop for gamers, developers, and content creators, XPG has worked tirelessly to deliver a product that will meet all your needs without breaking the bank. With XENIA 15G (2024), no obstacle is too great.

Do Anything and Everything
XENIA 15G is the culmination of many years of gaming laptop development. In that time, countless hours of research and testing have gone in to produce a cost-effective laptop for the modern user. With a 14th Gen Intel Core i7-14700HX processor, up to an NVIDIA GeForce RTX 4070 series GPU, high-speed ADATA DDR5 DRAM, and a 15.6" FHD IPS 144 Hz display, you can play anything and do everything without sacrificing performance.

ASUS today announced ExpertBook B3 Flip (B3402FVA), a refreshed model of the powerful and versatile convertible laptop designed for both hybrid working and learning, empowering maximum flexibility anytime, anywhere - and now with the added power of Copilot, just a button press away. ExpertBook B3 Flip is built to embrace the future of both work and education. It's the perfect colleague for business users and pros, and an ideal ally for educators and students alike. With its versatile and tough design, studying or working everywhere is no longer a dream.

B3 Flip is equipped with a 360° any-position hinge for total display flexibility, a world-facing camera for a new perspective, and a fast-charging garaged stylus for simple, intuitive input. It includes several convenient health protection features, including ASUS Antibacterial Guard and a TÜV Rheinland-certified display for everyday eye care. The WiFi 6E technology is further enhanced by ASUS WiFi Master technology for faster, more stable connections; and it's also supplemented by an optional fast 4G LTE nano-SIM for fast and portable connectivity. Two-way AI-powered noise-cancelation technology and noise-reducing cameras ensure excellent remote learning and conferencing experiences.

TECNO, a global innovative technology brand once again participated in the Mobile World Congress (MWC) 2024 Barcelona, unveiled its two Mini PC products and awarded by "BEST OF MWC" from high technology media-- the"world-first" MEGA MINI Gaming G1 with water-cooling in the smallest gaming Mini PC size, and the MEGA MINI M1 for Pocket-Sized Desktops Solution. In collaboration with TECNO's latest release of AR glasses, the MiniPC can achieve a larger screen for enhanced productivity and a more immersive gaming experience.

MiTAC Computing Technology, a subsidiary of MiTAC Holdings Corp., proudly reveals its groundbreaking suite of server solutions that deliver unsurpassed capabilities with the 5th Gen Intel Xeon Scalable Processors. MiTAC introduces its cutting-edge signature platforms that seamlessly integrate the Intel Data Center GPUs, both Intel Max Series and Intel Flex Series, an unparalleled leap in computing performance is unleashed targeting HPC and AI applications.

MiTAC Announce its Full Array of Platforms Supporting the latest 5th Gen Intel Xeon Scalable Processors
Last year, Intel transitioned the right to manufacture and sell products based on Intel Data Center Solution Group designs to MiTAC. MiTAC confidently announces a transformative upgrade to its product offerings, unveiling advanced platforms that epitomize the future of computing. Featured with up to 64 cores, expanded shared cache, increased UPI and DDR5 support, the latest 5th Gen Intel Xeon Scalable Processors deliver remarkable performance per watt gains across various workloads. MiTAC's Intel Server M50FCP Family and Intel Server D50DNP Family fully support the latest 5th Gen Intel Xeon Scalable Processors, made possible through a quick BIOS update and easy technical resource revisions which provide unsurpassed performance to diverse computing environments.

EK, the leading computer cooling solutions provider, is happy to announce that the latest generation of its TEC solutions - the EK-Quantum Delta² TEC - a CPU water block for extreme cooling made in collaboration with Intel, is now unlocked for the 14th generation of Intel Core desktop CPUs. EK is thankful to Intel for collaborating to bring this extreme cooling technology to the market.

EK is now taking over and continuing support for the 14th generation with the EK Delta² TEC Integrated Intel Cryo Cooling Technology software.

Last week at the Intel Foundry Services Connect event, Intel unveiled its Intel 14A foundry node (1.4 nm-class), to succeed its Intel 18A and Intel 20A nodes, with mass production on this node expected to commence in 2026. It turns out that there is an even more advanced node Intel is working on, which it didn't announce last week, but which was part of an NDA presentation that the company forgot to lift. We're talking about the new Intel 10A node, a 1 nm-class silicon fabrication node that's a generation ahead of Intel 20A. The company says that it expects mass production on the node to begin toward the end of 2027. It is on the backs of these sub-2 nm class nodes, and the impending organizational changes that sees Intel Foundry Services become a more independent commercial entity, that Intel CEO Pat Gelsinger thinks that Intel will become the "TSMC of the West."

Currently, fabs that utilize EUV (extreme ultraviolet) lithography, namely the Intel 4, Intel 3, and Intel 20A; together make barely 15% of Intel's wafer volumes, with the bulk of the foundry's production focusing on the DUV based Intel 7. EUV-based nodes are expected to linearly grow till 2025, but what's interesting is that Intel doesn't see the kind of multi-year stagnation on Intel 4 and Intel 3 that it's currently experiencing with Intel 7; with wafer volumes of Intel 20A and 18A expected to exceed those of the Intel 4 and Intel 3 within 2025. By 2026, Intel expects that there will be twice as many Intel 20A/18A wafers pushed as Intel 4 and Intel 3. Although they use EUV, Intel 4 and Intel 3 are Intel's final nodes to implement FinFET transistors, as the company transitions to nanosheets with Intel 20A (which are called RibbonFETs in Intel jargon). Intel did not get into the technology behind Intel 10A. The company, along with Samsung and TSMC, demonstrated its stacked CFET transistor in 2023, which will power foundry nodes as nanosheets mature. Intel in its presentation also talked about the next wave of factory automation implemented by IFS, which sees AI-driven "cobots" (collaborative robots) replace humans for more roles in the clean room.

Intel today launched Core Ultra vPro line of mobile processors for commercial notebooks. These chips are based on the "Meteor Lake" silicon, but come with the exhaustive vPro Enterprise or vPro Essentials set of features that let large organizations manage notebooks and other devices they hand out to their personnel. The processor models themselves align with the regular Core Ultra chips the company launched in December for the consumer notebook segment; but with the added vPro brand extension. Notebooks with Core Ultra vPro processors will be available in the commercial notebook channels open to large organizations ordering from OEMs to their exact specs in large enough volumes.

Among the vPro Enterprise features are the popular Intel Active Management tech, which allows remote administration of devices; Remote Platform Erase; Unique Platform ID, Service Record, and platform features such as VT-D, System Resources Defence, total memory encryption, Threat Detection Technology, CFET, and a hardware-based firmware authentication mechanism. All current Core Ultra 5, Core Ultra 7, and Core Ultra 9 processor models have vPro variants, with identical clock speeds, core-configurations, cache sizes, and performance levels to their consumer notebook siblings.

CTL, a global cloud computing solution leader for education and enterprise, will demonstrate the world's first Chromebook supporting 5G RedCap connectivity powered by, which was the world's first announced commercial release 17 5G RedCap modem RF system. CTL is preparing its Chromebook product lines for the future, where 5G will replace LTE connectivity. With more schools and enterprises standing up private cellular networks for anytime, anywhere connectivity, CTL is at the forefront of bringing built-in 5G connectivity to Chromebook devices.

Erik Stromquist, CTL's CEO, said, "CTL is committed to developing and introducing affordable solutions for the education and enterprise markets. We believe there is a big opportunity to address the digital divide by providing more advanced and affordable private network solutions to extend internet access to every user regardless of location. We are thrilled to collaborate with Qualcomm Technologies in demonstrating 5G next-gen possibilities at this year's Mobile World Congress."

Samsung Electronics is making 2024 the year of the AI PC with the release of its most powerful and intelligent Galaxy Book product line yet, the Galaxy Book4 series. This latest lineup—consisting of the Galaxy Book4 Ultra, Galaxy Book4 Pro and Galaxy Book4 Pro 360—offers intelligent performance, enhanced security and a vivid, interactive display, all in an ultra-portable design. From the new Intel Core Ultra Processor to the suite of AI features, the Galaxy Book4 series is packed with cutting-edge technology that aims to not only simplify but amplify users' computing experience.

Visitors discovered the Galaxy Book4 series' full capabilities inside Samsung's booth at Mobile World Congress (MWC) 2024, the world's largest mobile exhibition held from February 26-29 in Barcelona, Spain. Samsung Newsroom sat down with Mincheol Lee, Head of Galaxy Eco Biz Team, Mobile eXperience Business at Samsung Electronics, and David Feng, Vice President of Client Computing Group and General Manager of Client Segments at Intel, to explore how the advancements in the Galaxy Book4 series can enrich the lives of users.

At MWC Barcelona 2024, Huawei launched the Huawei OptiXtrans DC908 Pro, a new platform for Data Center Interconnect (DCI) designed for the intelligent era. This innovative platform ensures the efficient, secure, and stable transmission of data between data centers (DCs), setting a new standard for DCI networks. As AI continues to proliferate across various service scenarios, the demand for foundation models has intensified, leading to an explosion in data volume. DCs are now operating at the petabyte level, and DCI networks have evolved from single-wavelength 100 Gbit/s to single-wavelength Tbit/s.

In response to the challenges posed by massive data transmission in the intelligent era, Huawei introduces the next-generation DCI platform, the Huawei OptiXtrans DC908 Pro. Compared to its predecessor, the DC908 Pro offers higher bandwidth, reliability, and intelligence.

Intel today released the Arc GPU Graphics Drivers 101.5333 WHQL. These come with Game On (day-zero) optimization for "Last Epoch" and the new DirectX 12 update of "Sea of Thieves." The drivers also provide sweeping game DirectX 11 game performance updates for the Xe-LPG Arc iGPU powering Intel Core Ultra "Meteor Lake" processors, ranging anywhere between 6% to 155%. You can find specific performance in the list below. The company hasn't fixed any new issues with this release, but identified a handful new issues with Arc A-series GPUs, Core Ultra iGPUs, older Xe-LP based Iris Xe iGPUs, and the Arc Control application.

Among the DirectX 11 titles that get performance updates with this release at 1080p with Medium settings for "Meteor Lake" iGPUs, include "Assassin's Creed Syndicate" (+65%), "Call of Duty: Infinite Warfare" (+17%), "Divinity Original Sin 2" (+25%), "Far Cry 5" (+8%), "Halo: The Master Chief Collection" (+19%), "It takes two" (+24%), "Just Cause 3" (+18%), "Just Cause 4" (+155%), "Palworld" (+14), "Rise of the Tomb Raider" (+9%), "Rust" (+9%), "SCUM" (+6%), "Sid Meier's Civilization VI" (+27%), "Snowrunner" (+49%), "Warframe" (+7%), and "XCOM 2" (+8%).

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5333 WHQL

Samsung Electronics today announced the company has successfully completed the industry's first end-to-end call in a lab environment with a future Intel Xeon processor (codenamed Granite Rapids-D), on a virtualized Open RAN network powered by Samsung's vRAN 3.0. This achievement between Samsung and Intel is another milestone in the companies' multi-year collaboration and represents the companies' mutual dedication to advance virtualized Open RAN for enhanced performance and capacity.

Conducted in Samsung's R&D lab in Korea, the companies completed the end-to-end data call using Samsung's versatile and O-RAN-compliant virtualized RAN (vRAN) integrated with Intel's Granite Rapids-D, Samsung's Core and test devices. During the test, Samsung achieved significant gains as well as reduced power consumption. The test results will be demonstrated at Mobile World Congress 2024 (Samsung Networks booth, invitation-only).

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, in collaboration with ASUS ROG and Intel, celebrates a monumental achievement of setting a new SuperPi-32M overclocking world record at an astonishing 2 min 59 sec 919 ms, marking the first time this benchmark category was achieved in under 3 minutes. This amazing world record was achieved by SAFEDISK, the legendary South Korean extreme overclocker, using G.SKILL Trident Z5 RGB DDR5 memory, ASUS ROG Maximus Z790 Apex Encore motherboard, and Intel Core i9-14900KF desktop processor under liquid nitrogen cooling, demonstrating the bleeding edge of hardware performance of the latest computing hardware. For more information, visit the validation page on hwbot.org.

Overclocking Milestone Unlocked - SuperPi-32M at 2 min 59 sec 919 ms
SuperPi-32M is one of the most popular benchmarks for CPU and memory overclockers, and this extreme overclocking milestone commemorates the first time a score of under 3 minutes was achieved. Using liquid nitrogen extreme cooling, SAFEDISK lowered the CPU temperature as low as -188°C to reach a remarkable 8449.2 MHz and the G.SKILL Trident Z5 RGB DDR5 memory as low as -60°C to reach DDR5-9052 with 32-48-45-36 timings on an ASUS ROG Maximus Z790 Apex Encore motherboard. This expertly configured setup and operation under extreme conditions gives testament to the breathtaking technical performance of modern computer systems.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

Today at MWC 2024, Lenovo unveiled its latest portfolio of purpose-built AI devices, software, and infrastructure solutions, as well as showcased two proof-of-concepts devices that challenge the traditional PC and smartphone form factors. The company also revealed the future of hybrid AI fueling multi-device, software, and service offerings for more personalization, collaboration and efficiency.

"Lenovo's suite of AI-enabled, AI-ready, and AI-optimized devices, infrastructure, solutions, and services at MWC provides a wider look at our vision for "AI for All"," said Lenovo Chairman and CEO, Yuanqing Yang. "Lenovo's AI technology benefits organizations of all sizes, driving intelligent transformation across all industries while reinforcing our commitment to sustainability."

To answer network operators' demands for energy-efficient scaling, Intel Corporation disclosed two major updates to drive footprint, power and total cost of ownership (TCO) savings across 5G core networks: the preview of its Intel Xeon next-gen processors, code-named Sierra Forest, with up to 288 Efficient-cores (E-cores), and the commercial availability of the Intel Infrastructure Power Manager (IPM) software for 5G core.

"Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out. With the majority of 5G core networks deployed on Intel Xeon processors today, Intel is uniquely positioned to address these efficiency challenges. By introducing new Efficient-cores to our roadmap and with the commercial adoption of our Intel Infrastructure Power Manager software, service providers can slash TCO while achieving unmatched performance and power savings across their networks," said Alex Quach, Intel vice president and general manager of Wireline and Core Network Division. Energy consumption and reduction of the infrastructure footprint remain top challenges that network operators face in building out their wireless 5G core network.