Framework Laptop 16 Liquid Metal Cooling Solution Explored
The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.
Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.
Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.