A couple of weeks ago, we reported on NVIDIA directing users of Intel's 13th Generation Raptor Lake and 14th Generation Raptor Lake Refresh CPUs to consult Intel for any issues with system stability. Motherboard makers, by default, often run the CPU outside of Intel's recommended specifications, overvolting the CPU through modifying voltage curves, automatic overclocks, and removing power limits.

Today, we learned that Igor's Lab has obtained a statement from Intel that the company prepared for motherboard OEMs regarding the issues multiple users report. Intel CPUs come pre-programmed with a stock voltage curve. When motherboard makers remove power limits and automatically adjust voltage curves and frequency targets, the CPU can be pushed outside its safe operating range, possibly causing system instability. Intel has set up a dedicated website for users to report their issues and offer support. Manufacturers like GIGABYTE have already issued new BIOS updates for users to achieve maximum stability, which incidentally has recent user reports of still being outside Intel spec, setting PL2 to 188 W, loadlines to 1.7/1.7 and current limit to 249 A. While MSI provided a blog post tutorial for stability. ASUS has published updated BIOS for its motherboards to reflect on this Intel baseline spec as well. Surprisingly, not all the revised BIOS values match up with the Intel Baseline Profile spec for these various new BIOS updates from different vendors. You can read the statement from Intel in the quote below.

After two years of decline, the worldwide traditional PC market returned to growth during the first quarter of 2024 (1Q24) with 59.8 million shipments, growing 1.5% year over year, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Growth was largely achieved due to easy year-over-year comparisons as the market declined 28.7% during the first quarter of 2023, which was the lowest point in PC history. In addition, global PC shipments finally returned to pre-pandemic levels as 1Q24 volumes rivaled those seen in 1Q19 when 60.5 million units were shipped.

With inflation numbers trending down, PC shipments have begun to recover in most regions, leading to growth in the Americas as well as Europe, the Middle East, and Africa (EMEA). However, the deflationary pressures in China directly impacted the global PC market. As the largest consumer of desktop PCs, weak demand in China led to yet another quarter of declines for global desktop shipments, which already faced pressure from notebooks as the preferred form factor.

While we are all used to having a system with a CPU, GPU, and, recently, NPU—X-Silicon Inc. (XSi), a startup founded by former Silicon Valley veterans—has unveiled an interesting RISC-V processor that can simultaneously handle CPU, GPU, and NPU workloads in a chip. This innovative chip architecture, which will be open-source, aims to provide a flexible and efficient solution for a wide range of applications, including artificial intelligence, virtual reality, automotive systems, and IoT devices. The new microprocessor combines a RISC-V CPU core with vector capabilities and GPU acceleration into a single chip, creating a versatile all-in-one processor. By integrating the functionality of a CPU and GPU into a single core, X-Silicon's design offers several advantages over traditional architectures. The chip utilizes the open-source RISC-V instruction set architecture (ISA) for both CPU and GPU operations, running a single instruction stream. This approach promises lower memory footprint execution and improved efficiency, as there is no need to copy data between separate CPU and GPU memory spaces.

Called the C-GPU architecture, X-Silicon uses RISC-V Vector Core, which has 16 32-bit FPUs and a Scaler ALU for processing regular integers as well as floating point instructions. A unified instruction decoder feeds the cores, which are connected to a thread scheduler, texture unit, rasterizer, clipping engine, neural engine, and pixel processors. All is fed into a frame buffer, which feeds the video engine for video output. The setup of the cores allows the users to program each core individually for HPC, AI, video, or graphics workloads. Without software, there is no usable chip, which prompts X-Silicon to work on OpenGL ES, Vulkan, Mesa, and OpenCL APIs. Additionally, the company plans to release a hardware abstraction layer (HAL) for direct chip programming. According to Jon Peddie Research (JPR), the industry has been seeking an open-standard GPU that is flexible and scalable enough to support various markets. X-Silicon's CPU/GPU hybrid chip aims to address this need by providing manufacturers with a single, open-chip design that can handle any desired workload. The XSi gave no timeline, but it has plans to distribute the IP to OEMs and hyperscalers, so the first silicon is still away.

Microsoft, Intel, and AMD are attempting to jumpstart demand in the PC industry again, under the aegis of the AI PC—devices with native acceleration for AI workloads. Both Intel and AMD have mobile processors with on-silicon NPUs (neural processing units), which are designed to accelerate the first wave of AI-enhanced client experiences on Windows 11 23H2. Microsoft's bulwark with democratizing AI has been Copilot, as a licensee of Open AI GPT-4, GPT-4 Turbo, Dali, and other generative AI tools from the Open AI stable. Copilot is currently Microsoft's most heavily invested application, with its most capital and best minds mobilized to making it the most popular AI assistant. Microsoft even pushed for the AI PC designator to PC OEMs, which requires them to have a dedicated Copilot key akin to the Start key (we'll see how anti-competition regulators deal with that).

The problem with Microsoft's tango with Intel and AMD to push AI PCs, is that Copilot doesn't really use an NPU, not even at the edge—you input a query or a prompt, and Copilot hands it over to a cloud-based AI service. This is about to change, with Microsoft announcing that Copilot will be able to run locally on AI PCs. Microsoft identified several kinds of Copilot use-cases that an NPU can handle on-device, which should speed up response times to Copilot queries, but this requires the NPU to have at least 40 TOPS of performance. This is a problem for the current crop of processors with NPUs. Intel's Core Ultra "Meteor Lake" has an AI Boost NPU with 10 TOPS on tap, while the Ryzen 8040 "Hawk Point" is only slightly faster, with a 16 TOPS Ryzen AI NPU. AMD has already revealed that the XDNA 2-based 2nd Generation Ryzen AI NPU in its upcoming "Strix Point" processors will come with over 40 TOPS of performance, and it stands to reason that the NPUs in Intel's "Arrow Lake" or "Lunar Lake" processors are comparable in performance; which should enable on-device Copilot.

The existence of Intel's upcoming Core i9-14900KS processor has been confirmed by a series of insider leaks and premature retail listings—an "alleged" example was photographed and appeared online right at the start of 2024. French e-tail listings produced evidence of two packages—a traditional retail box version, and a barebones tray option for OEM purposes. Earlier today, the I_Leak_VN social media account uploaded proof of a single "Special Edition" box sitting in an unnamed Vietnamese warehouse—it is not immediately clear whether units have reached retail facilities, or have just arrived on Southeast Asian shores. The embargo-busting post seemingly corroborates global insider information/whispers about distribution networks receiving stock—possibly in preparation for a rumored mid-March launch. VideoCardz believes that Vietnamese customers will be paying roughly $765 a pop—30% pricier than the current cost of 14th Gen Core flagship ownership.

World's most important fuel of the AI frenzy, NVIDIA, is facing accusations of acting as a "GPU cartel" and controlling supply in the data center market, according to statements made by executives at rival chipmaker Groq and former AMD executive Scott Herkelman. In an interview with the Wall Street Journal, Groq CEO Jonathan Ross alleged that some of NVIDIA's data center customers are afraid to even meet with rival AI chipmakers out of fear that NVIDIA will retaliate by delaying shipments of already ordered GPUs. This is despite NVIDIA's claims that it is trying to allocate supply fairly during global shortages. "This happens more than you expect, NVIDIA does this with DC customers, OEMs, AIBs, press, and resellers. They learned from GPP to not put it into writing. They just don't ship after a customer has ordered. They are the GPU cartel, and they control all supply," said former Senior Vice President and General Manager at AMD Radeon, Scott Herkelman, in response to the accusations on X/Twitter.

Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

We are likely to see even more Intel Core i9-14900KS pre-release leaks as its rumored mid-March launch window approaches—hardware sleuth, momomo_us, has spent the weekend following any Team Blue breadcrumb trails. Their latest discovery points to "BX8071514900KS" and "CM8071504820506" product codes, and two listings on PC21 France's web shop. Intel seems to be offering its upcoming limited edition Raptor Lake Refresh über-flagship unit in two different guises—the first being a traditional boxed package, and the second appears to be a tray option (for system integrators). As pointed out by VideoCardz, it is not unusual to see OEM parts reach retail channels—similar cases have leaked in the past. The no frills tray choice: "offers a more cost-effective option for users who don't require fancy packaging or bundled coolers, making it a budget-friendly choice for the new CPU."

The Core i9-14900KS is far from being a wallet friendly prospect, yet the untimely listings indicate that the OEM option shaves off a grand total of €16 (~$17.25) when lined up against its fancy boxed sibling. The French retailer states that both items are on order, with zero stock in their warehouses. The boxed Core i9-14900KS seems to cost €768.34 (~$828) including taxes, while the tray variant's entry indicates a charge of €752.62 (~$811), with VAT factored in. These leaked prices are subject to change—perhaps the current figures are based on a distributor's pre-launch estimation. PC21 France does not display any pricing for the already released Core i9-14900K and 14900KF SKUs, but VideoCardz has checked other retail listings in the country—they reckon that the gulf between "K" and "KS" is €146 (best case scenario).

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

Binarly's research team has discovered a collection of security vulnerabilities known as "LogoFAIL", which affects image parsing components within the UEFI firmware of a wide array of devices. These vulnerabilities are especially concerning because they are embedded within the reference code provided by Independent BIOS Vendors (IBVs), affecting not just a single vendor but a broad spectrum of devices that utilize this code. LogoFAIL is particularly dangerous because it allows attackers to bypass crucial security measures such as Secure Boot and Intel Boot Guard by executing a payload during the device's boot process. This is achieved by storing malicious images on the EFI System Partition or within unsigned sections of firmware updates. This method can compromise system security deeply without altering the runtime integrity of the bootloader or firmware, unlike other threats such as BlackLotus or BootHole.

The potential reach of LogoFAIL vulnerability is rather wide, with millions of consumer and enterprise-grade devices from various vendors, including ones like Intel, Acer, and Lenovo, being vulnerable. The exact list of affected devices is still undetermined, but the prevalence of the IBVs' code across numerous devices suggests that the impact could be widespread, with both Windows and Linux users being affected. Only PCs that don't allow any logotype displayed in the UEFI during the boot process are safe. Apple's Macs are secure as they don't allow any add-on images during boot, and some OEM prebuilt PCs, like the ones from Dell, don't allow images in the UEFI. Some makers like Lenovo, AMI, and Insyde have already published notes about cautiously uploading custom images to the UEFI and providing BIOS updates. Consumers and enterprises must check with their OEMs and IBVs for BIOS microcode updates to patch against this vulnerability.Below, you can see the proof of concept in a YouTube video.

Micron Technology, Inc., today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible. The Micron 3500 SSD, available in the M.2 form factor and with capacities up to 2 TB, provides a superior user experience over the competition as proven by its best-in-class SPECwpcsm performance, including an up to 71% improvement for product development applications.

"At Micron, we are focused on delivering exceptional products that best meet the rigorous needs of end-users," said Prasad Alluri, Micron's vice president and general manager of Client Storage. "With impressive specs like a remarkable 132% improvement in scientific computing benchmark scores, the 3500 SSD will turn your next PC or workstation into a powerhouse to enable insights and empower creativity."

According to the latest Canalys forecasts, worldwide PC shipments are on the verge of recovery following seven consecutive quarters of decline. The market is expected to return to growth of 5% in Q4 2023, boosted by a strong holiday season and an improving macroeconomic environment. Looking ahead, full-year 2024 shipments are forecast to hit 267 million units, landing 8% higher than in 2023, helped by tailwinds including the Windows refresh cycle and emergence of AI-capable and Arm-based devices.

"The global PC market is on a recovery path and set to return to 2019 shipment levels by next year," said Canalys Analyst Ben Yeh. "The impact of AI on the PC industry will be profound, with leading players across OEMs, processor manufacturers, and operating system providers focused on delivering new AI-capable models in 2024. These initiatives will bolster refresh demand, particularly in the commercial sector. The total shipment share of AI-capable PCs is expected to be about 19% in 2024. This accounts for all M-series Mac products alongside the nascent offerings expected in the Windows ecosystem. However, as more compelling use-cases emerge and AI functionality becomes an expected feature, Canalys anticipates a fast ramp up in the development and adoption of AI-capable PCs."

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

According to SemiAccurate, Qualcomm is currently navigating through many challenges with its Oryon SoC for laptops. The current problem is that Qualcomm is insisting on integrating its own PMICs (Power Management Integrated Circuits), which are inherently designed for cell phones, causing significant compatibility and efficiency issues. This approach is reported to have led to escalated costs and disagreements with OEMs (Original Equipment Manufacturers), seemingly hindering Qualcomm's foothold in the laptop sector. These PMICs are highlighted as unsuitable and highly priced, requiring the adoption of high-density interconnect (HDI) PCBs engineered explicitly for cell phones, thus not designed to meet the current requirements of laptops optimally. The subsequent spike in production costs has ignited conflicts with OEMs, with several contemplating withdrawing from the project.

In response to the rising tensions, Qualcomm is allegedly providing financial compensation to the OEMs, potentially leading to selling SoCs at cost. The only good thing is the reported success of Nuvia-based Oryon SoC. The silicon is perfect at A0 stepping, and performance is reportedly good. However, power usage and efficiency are still in question. Forcing OEMs to use proprietary PMICs will likely have far-reaching impacts on Qualcomm's market strategies and relationships with OEMs. With disputes like this, we expect that Qualcomm-powered laptops are nearing availability, and we could see them in the coming months.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

Jon Peddie Research reports the growth of the global PC-based graphics processor unit (GPU) market reached 61.6 million units in Q2'23 and PC CPU shipments decreased by -23% year over year. Overall, GPUs will have a compound annual growth rate of 3.70% during 2022-2026 and reach an installed base of 2,998 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in the PC will grow to reach a level of 32%.

Year to year, total GPU shipments, which include all platforms and all types of GPUs, decreased by -27%, desktop graphics decreased by -36%, and notebooks decreased by -23%.

AMD appears set to enhance the core count for its renowned Threadripper series. After a prolonged wait, the high-end desktop (HEDT) platform boasting a significant CPU count returns with the Ryzen Threadripper PRO 7995WX, which features an impressive 96 cores and 192 threads. This marks the series' first core count upgrade since the Threadripper 3000 series. The 7995WX CPU was spotted in the HP Z6 G5 Workstation system, potentially one of the inaugural prebuilt systems from AMD's OEM partners. The Threadripper PRO series seems poised to dominate AMD's HEDT offerings, with no indications of non-PRO consumer models emerging for now.

The latest Geekbench listing unveiled the 7995WX CPU's 96-core configuration. Although the base frequency appears misrepresented, benchmark data hints at the 96-core CPU potentially reaching a boost clock of 5.14 GHz, a detail further confirmed by Geekbench's output. Another notable enhancement in the Threadripper series is introducing the DDR5 memory standard. While the benchmarking tool doesn't explicitly mention this, it does highlight a memory configuration of 503.27 GB (512 GB) in use. The CPU managed to score 2095 points for single-core score and 81408 points for multi-core score on Geekbench v5.5 for Linux (Ubuntu 22.04 LTS), making it one of the fastest CPUs in the database.

An unusual MSI RTX 3080 Ti SUPRIM X graphics card is up for sale, second hand, on Facebook Marketplace—the Sydney, Australia-based seller is advertising this component as a truly custom model with a non-standard allocation of VRAM: "Yes this is 20 GB not 12 GB." The used item is said to be in "good condition" with its product description elaborating on a bit of history: "There are some scuff marks from the previous owner, but the card works fine. It is an extremely rare collector's item, due to NVIDIA cancelling these variants a month before release. This is not an engineering sample card—this was a finished OEM product that got cancelled, unfortunately." The seller is seeking AU$1100 (~$740 USD), after a reduction from the original asking price of AU$1,300 (~$870 USD).

MSI and Gigabyte were reportedly on the verge of launching GeForce RTX 3080 Ti 20 GB variants two years ago, but NVIDIA had a change of heart (probably due to concerns about costs and production volumes) and decided to stick with a public release of the standard 12 GB GPU. Affected AIBs chose to not destroy their stock of 20 GB cards—these were instead sold to crypto miners and shady retailers. Wccftech points out that mining-oriented units have identifying marks on their I/O ports.

Microsoft Corp. today announced the following results for the quarter ended June 30, 2023, as compared to the corresponding period of last fiscal year:

• Revenue was $56.2 billion and increased 8% (up 10% in constant currency)
• Operating income was $24.3 billion and increased 18% (up 21% in constant currency)
• Net income was $20.1 billion and increased 20% (up 23% in constant currency)
• Diluted earnings per share was $2.69 and increased 21% (up 23% in constant currency)

"Organizations are asking not only how - but how fast - they can apply this next generation of AI to address the biggest opportunities and challenges they face - safely and responsibly," said Satya Nadella, chairman and chief executive officer of Microsoft. "We remain focused on leading the new AI platform shift, helping customers use the Microsoft Cloud to get the most value out of their digital spend, and driving operating leverage."

TrendForce reports that OEMs have continued making concerted efforts to scale back production. However, given that the trajectory of market demand is still unclear, it's expected that the NAND Flash market will continue to be in a state of oversupply in 3Q23. Cautious inventory management by buyers is preventing a stabilization in NAND Flash prices even with an anticipated seasonal surge in demand for 2H23. TrendForce predicts that NAND Flash wafers will be the first to see a price hike in 3Q23 as prices for module products such as SSDs, eMMCs, and UFS will likely continue to fall due to tepid downstream demand. Consequently, the overall ASP of NAND Flash is forecast to continue dropping by about 3~8% in 3Q23, though a possibility exists prices may recover in 4Q23.

Client SSD: Although notebook shipments are expected to gradually recover in 3Q23, reversing an oversupply of SSD will continue to be challenging. Furthermore, a portion of suppliers have implemented aggressive promotions to secure customer orders and hit shipping targets in light of weakened demand and less-than-satisfactory order volumes from major clients, putting pressure on other suppliers. TrendForce estimates that the ASP of client SSDs will fall by 8~13% in the third quarter.

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline. Despite suppliers' concerted efforts, inventory levels persistently remain high, keeping prices low. While production cutbacks may help to curtail quarterly price declines, a tangible recovery in prices may not be seen until 2024.

PC DRAM: The benefits of consolidated production cuts on DDR4 by the top three suppliers are expected to become evident in the third quarter. Furthermore, inventory pressure on suppliers has been partially alleviated due to aggressive purchasing by several OEMs at low prices during 2Q23. Evaluating average price trends for PC DRAM products in 3Q23 reveals that DDR4 will continue to remain in a state of persistent oversupply, leading to an expected quarterly price drop of 3~8%. DDR5 prices—influenced by suppliers' efforts to maintain prices and unmet buyer demand—are projected to see a 0-5% quarterly decline. The overall ASP of PC DRAM is projected to experience a QoQ decline of 0~5% in the third quarter.

Ampere Computing today announced a new AmpereOne Family of processors with up to 192 single threaded Ampere cores - the highest core count in the industry. This is the first product from Ampere based on the company's new custom core, built from the ground up and leveraging the company's internal IP. CEO Renée James, who founded Ampere Computing to offer a modern alternative to the industry with processors designed specifically for both efficiency and performance in the Cloud, said there was a fundamental shift happening that required a new approach.

"Every few decades of compute there has emerged a driving application or use of performance that sets a new bar of what is required of performance," James said. "The current driving uses are AI and connected everything combined with our continued use and desire for streaming media. We cannot continue to use power as a proxy for performance in the data center. At Ampere, we design our products to maximize performance at a sustainable power, so we can continue to drive the future of the industry."

TrendForce reveals that alongside the four major CSPs reducing their procurement volumes, OEMs like Dell and HPE have also scaled back their annual shipment volume forecasts at some point between February and April, predicting YoY declines of 15% and 12%, respectively. Furthermore, server demand in China is facing headwinds due to geopolitical and economic challenges. Consequently, TrendForce projects a downward revision in global server shipment volumes for this year—a 2.85% YoY decrease at 13.835 million units.

TrendForce emphasizes that the server market in 1H23 remains pessimistic, with 1Q23 shipments experiencing a 15.9% QoQ decrease due to off-season factors and end-user inventory adjustments. The expected industry boom in 2Q23 failed to materialize, leading to a modest QoQ growth estimate of only 9.23%. Persistent influences on server shipments include OEMs lowering shipment volumes, subdued domestic demand in China, and continuous supply chain inventory adjustments. ESG issues have also led CSPs to prolong server lifecycles and reduce procurement volume. Moreover, OEMs are lengthening supports period for older platforms as businesses seek to control capital expenditures, further contributing to market strain.