A video review has highlighted some curious internal changes on the NVIDIA GeForce RTX 4080 SUPER Founders Edition graphics card—Geekerwan has discovered that the board design has been "updated" to a small degree, when cross examined with the non-SUPER variant. Team Green engineers have chosen to decrease the number of phases from 13 to 11, while the memory phase count goes from 3 down to 2. HXL (@9550pro) TLDR-ed the situation on social media: "4080 Super FE vs 4080 FE: Core: -2 phase & VRAM: -1 phase." Tech experts have also noticed that the new SUPER FE's board does not have a phase near to its power connector. VideoCardz found these changes to be a little bit odd, considering that the card arrives with faster memory and a increased core count.

Geekerwan reckons that NVIDIA has implemented these internal adjustments in an effort to reduce power consumption in gaming scenarios. The official comparison table confirms this ambition—in the "Average Gaming Power" category we see the GeForce RTX 4080 SUPER target 246 W, and GeForce RTX 4080 (non-SUPER) aim for 251 W. The reviewer notes that their ASUS ROG STRIX RTX 4080 SUPER GAMING sample card features the same power layout as its non-SUPER sibling. They believe that NVIDIA's Founders Edition is the only model bearing an adjusted phase tally—while Team Green's board partners have simply rolled out the previous RTX 4080 layout.

EK Water Blocks, or simply EK as the company refers to itself now, had a decent showing at the virtual Computex 2021 event including new AIO CPU coolers, additions to its Fluid Gaming and Fluid Works portfolio, and more water blocks based on current designs and supporting newer hardware, including one we reported on just a few hours ago. These all interested me, but then there was a nearly two hour private conversation followed by a live stream that ended minutes ago which shed more light on future updates and products in its mainstream Quantum DIY liquid cooling lineup.There were renders of the upcoming Velocity² CPU blocks shared before, but seeing them actually manufactured is a whole other thing. Velocity² is the update to EK's popular Velocity CPU blocks, with a complete redesign that evokes more comparisons to monoblocks than other CPU blocks. Taking cues from the flagship EK-Quantum Magnitude, you will see different cooling engines to better cool different CPU sockets. There is also a concealed aesthetic theme here, especially for the acetal top version where you can't see any screws in use, thanks to a patent-pending mounting mechanism from the back- again taking cues from monoblocks. EK says the new system uses "pre-tensioned springs concealed in the water block top, so with just a few turns on the thumb-nuts, the installation is finished". We look forward to checking these out in person when they release in the Sept 2021 timeframe. Read past the break for more from EK!

The X299 MICRO ATX 2 is a reimagined mATX board designed to support the power, performance, and cooling necessary to power Intel's i5/i7/i9 CPU's for the X299 Chipset. With a 14 Phase power design, a thick VRM heatsink/fan, two 8 pin EPS power connectors, an additional 6 pin PCIe power connector, and external BCLK, this motherboard was born for the enthusiast desiring maximum power in a small form factor. The X299 MICRO ATX 2 supports current storage standards, including M.2 NVMe, Intel Optane, Intel VROC and SATA 6Gb/s to give you a blazing fast access to your data, while Intel Dual-Band WIFI/BT and an Intel i219V Gigabit NIC Keeps you connected.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or 'PCRAM') technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM's expertise in such disciplines with SK Hynix's cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

Last week we got a glimpse of Gigabyte's new 3D BIOS technology, a UEFI setup program with an innovative and functional user interface built into Gigabyte's upcoming X79 motherboards. Today Gigabyte released a new video detailing another such innovation, called 3D Power. This program gives you total and unrestricted control over the three main dimensions of your motherboard's power delivery: voltages, PWM frequency, and phase control. Gigabyte announced that all its upcoming X79 motherboards will feature PWM (pulse width modulation) CPU power design, backed by highly capable PWM controllers that give you a plethora of things you can tweak.

To begin with, the 3D Power application starts up with a cube that has the icons of the three main elements. Clicking on "voltage" gives you control over voltage-related settings in three main pages, turbo voltage response, load line calibration (active V-droop control), and active over-voltage protection. Load line calibration allows you to fine-tune the extant of V-droop correction over a variety of power domains, such as CPU, VTT, IMC, and DRAM.

Thermaltake today announced an initiative with AMD to redesign the revolutionary Xpressar micro refrigeration cooling system for use with ATI Radeon HD 4000 series graphics cards. First introduced in a specialized case designed to achieve CPU temperatures much lower than standard liquid cooling systems, the Xpressar technology will be modified for use as a graphics cooling solution. When commercially available, the Xpressar graphics solution could reduce graphics processor temperatures by as much as 20°C when compared to common liquid cooling products.

The Thermaltake Xpressar micro refrigeration cooling system utilizes a miniature version of the compressor cooling module commonly used in refrigerators and air conditioners. To streamline installation, the graphics cooling module will utilize a compact design, occupying only the drive bay area in the computer.

Broenderslev, Denmark, June 21 2007 - Asetek, the market leader of thermal management solutions for semiconductors, announced today that they have signed a research agreement with Professor, Ph.D. Massoud Kaviany from University of Michigan.

CPU and GPU capabilities improve by continuously growing the number of transistors in the core, by increasing the clock frequency, and by implementing more CPU cores into multicore processors. This results in higher power consumption which makes thermal management much more challenging. However, there is another factor which is becoming more critical than power consumption; hotspots. Hotspots can generate a very high heatflux and therefore impose tremendous demands on the effectiveness of the CPU and GPU cooler.

To meet this challenge Asetek will work in cooperation with Professor Massoud Kaviany to develop advanced single and two phase cooling solutions. These solutions will have the ability to handle the highly localized and extreme heatfluxes in the future CPU and GPU systems.

"It is an exciting time at Asetek, and we are really pleased to have partnered with Professor Massoud Kaviany on the development of these new cooling solutions," says Christian Christiansen, VP of Engineering at Asetek. Christian Terp, Thermodynamics Specialist at Asetek, goes on to say, "Professor Kaviany's knowledge and expertise in two phase cooling and porous media technologies is extremely impressive and we are looking forward to the product innovation that will come from his contributions."