According to the report coming from Bloomberg, European Union has approved as much as 8.1 billion Euros (about 8.6 billion USD) for research of advanced semiconductors. Accompanied by the 13.7 billion Euros in private funds, the total investment for boosting domestic semiconductor manufacturing in the EU is almost 22 billion Euros. As part of the European CHIPS Act, the project aims to develop Europe as the world's semiconductor powerhouse, with as much as 20% of all semiconductors produced in the EU by 2030. This ambitious goal is backed by state subsidies, as well as investors creating private pools of funds to aid companies in creating semiconductor manufacturing facilities on European soil.

This Important Project of Common European Interest (IPCEI) on Microelectronics and Communication Technologies is an essential step for Europe's semiconductor independence. Internal Market Commissioner Thierry Breton noted, "In a geopolitical context of de-risking, Europe is taking its destiny into its own hands. By mastering the most advanced semiconductors, the EU will become an industrial powerhouse in markets of the future." Companies like Intel, Infineon, STMicroelectronics, GlobalFoundries, and Wolfspeed announced European investments, with TSMC considering a production facility in Germany. German Economy Minister Robert Habeck has noted that Germany has 31 projects in 11 regions, adding, "We can thus increase resilience across Europe in this important field and secure value creation and jobs."

Semiconductor manufacturers worldwide are forecast to increase 300 mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026, SEMI announced today in its 300 mm Fab Outlook to 2026 report. After strong growth in 2021 and 2022, the 300 mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.

"While the pace of the global 300 mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO. "The foundry, memory and power sectors will be major drivers of the new record capacity increase expected in 2026."

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced tool extensions that bring the advantages of Microsoft Visual Studio Code (VS Code) to STM32 microcontrollers. VS Code is a popular Integrated Development Environment (IDE), acclaimed for its ease of use and flexible features such as IntelliSense that simplifies and accelerates code editing. Access to the STM32 ecosystem, from within VS Code, now makes these features available to even more embedded developers of the wide STM32 community. It also lets developers accustomed to working on high-level and consumer applications easily create embedded solutions that are power-efficient, compact, and economical.

"Connecting VS Code with our STM32 ecosystem makes the power of the industry-leading STM32 family of microcontrollers more accessible than ever," said Daniel Colonna, Marketing Director Microcontrollers, STMicroelectronics. "Communities for whom VS Code is the preferred environment, including high-level software developers, academics, and enthusiasts and makers, can now choose to make their ideas real using STM32 MCUs without leaving their preferred development environment."

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300 mm semiconductor manufacturing facility adjacent to ST's existing 300 mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300 mm wafer per year production at full build-out (~42% ST and ~58% GF).

ST and GF are committed to building capacity for their European and global customer base. This new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple variants. This includes GF's market leading FDX technology and ST's comprehensive technology roadmap down to 18 nm, which are expected to remain in high demand for Automotive, IoT, and Mobile applications for the next few decades. FD-SOI technology has origins in the Grenoble (France) area. It has been part of ST technology and product roadmap in its Crolles facility since the early beginnings, and it was later enabled with differentiation and commercialized for manufacturing at GF's Dresden facility. FD-SOI offers substantial benefits for designers and customers, including ultra-low power consumption as well as easier integration of additional features such as RF connectivity, mmWave and security.

According to TrendForce, market conditions in 1H22 were chaotic and there was disparate demand for chips of varying functionality. Given the global development of electronic devices and power systems, overall demand for power management ICs (PMIC) is still relatively good. PMICs are used in consumer electronics, communications, computing, industrial control, automotive and other fields. In 2H22, supply and demand gradually diverged and demand for automotive Switching Regulators, Multi Channel PMICs was strongest.

According to TrendForce, there are various specifications and types of PMICs, including Linear Regulators, etc. Even usage scenario dependent products such as Battery Charging & Management, Voltage References, and USB Power Delivery ICs all fall into this category.

Recent news suggests that TSMC isn't too interested in setting up a fab in Europe, but it appears there are other interested parties that are now courting the EU, namely a potential joint venture between GlobalFoundries and STMicroelectronics. The two companies are hoping to get a slice of the same cake as Intel, namely the European Chips Act, to help subsidise the cost of the proposed fab. Although GlobalFoundries are headquartered in New York and STMicroelectronics in Geneva, the latter being a French-Italian conglomerate, the planned location for the new fab will be somewhere in France.

It's highly unlikely that this will be a cutting edge or even a leading edge fab, as neither company is in the business of producing products in those market segments. ST makes a wide range of chips from MCUs and other types of microprocessors, to specialised memory products, a wide range of sensors, MEMS based devices and all kinds of electronics for electrical vehicles, as well as highly specialised components for the space industry. GloFo obviously stepped off the competitive foundry ladder some years ago and have been focusing on specialised processes and nodes since then, such as FD-SOI, a technology, something the two companies announced a joint partnership around earlier this year. As such, it's likely that this potential fab will focus on making parts needed for the automotive industry in Europe, among other things. There's still a long way to go and neither company has made any kind of official statement about the potential partnership as yet.

USound, a global developer and manufacturer of micro-electro-mechanical systems (MEMS) loudspeakers for personal devices and wearable technology, today announced that it has raised $30 million (€25 million) to move into mass production of its second generation MEMS loudspeakers for several global companies. The investment round was led by Austria's leading venture capital firm, eQventure, with participation from venture capitalists Hermann Hauser (co-founder of ARM) and Longzhong Yang (co-founder of BYD), as well as a strong participation from the European Investment Bank.

USound MEMS loudspeakers take up 50% less space, use 80% less energy, and boast a greater frequency range than rival speaker products used in TWS earphones, headphones, smartphones, VR/AR glasses, wearables, and hearing aids. Due to its reduced size, MEMS speakers impact the size and weight of any wearable, providing more in-ear comfort and style for the consumer. USound's MEMS speakers are dramatically reducing system costs due to its SMT reflow capability, enabling fully automatic assembly of audio products to achieve the highest quality and performance. In comparison to a pure monolithic MEMS solution, USound's MEMS speakers are smaller and offer higher sound pressure levels, better sound quality, and lower manufacturing costs.

Due to material shortages caused by insufficient semiconductor supply, to date, power management IC (PMIC) prices remain on an upward trend, according to TrendForce's latest investigations. Average selling price (ASP) for 1H22 is forecast to increase by nearly 10%, reaching a record six year high.

In terms of the global supply chain, in addition to the production capacity of major IDM manufacturers including TI, Infineon, ADI, STMicroelectronics, NXP, ON Semiconductor, Renesas, Microchip, ROHM (Maxim has been acquired by ADI and Dialog by Renesas), IC design houses such as Qualcomm and MediaTek (MTK) have obtained a certain level of production capacity from foundries. Of these, TI is in a leadership position and the aforementioned companies possess a combined market share of over 80%.

The third-generation semiconductor industry was impaired by the US-China trade war and the COVID-19 pandemic successively from 2018 to 2020, according to TrendForce's latest investigations. During this period, the semiconductor industry on the whole saw limited upward momentum, in turn leading to muted growth for the 3rd gen semiconductor segment as well. However, this segment is likely to enter a rapid upturn owing to high demand from automotive, industrial, and telecom applications. In particular, the GaN power device market will undergo the fastest growth, with a $61 million revenue, a 90.6% YoY increase, projected for 2021.

Thermaltake, a leading brand in producing green power supply unit, today released the latest Toughpower DPS G RGB Titanium Series (850W/1000W/1500W). Thermaltake released the Toughpower DPS G RGB 1250W Titanium at CES 2016, and it has been the most discussed power ever since. To provide users more options, Thermaltake has extended the range with the 850W, 1000W, and 1500W. The Toughpower DPS G RGB Titanium Series is pre-installed with an ultra-silent 140mm patented RGB fan and manufactured by premium components, the Titanium Series is the most ideal choice for those looking for the perfect balance between PC aesthetics and 4K gaming performance.

To provide unbeatable performance for Virtual Reality, the Titanium Series is equipped with 100% Japanese capacitors which are rated up to 105°C. The fully modular Toughpower DPS G RGB Titanium Series is specially designed with a digital control board, and adopted a 32Bit Microcontroller Unit (MCU) from STMicroelectronics. In addition, the Thermaltake Toughpower DPS G RGB Titanium Series (850W/1000W/1500W) offers a 10 year warranty, ensuring the best power supply quality and top VR experience.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in ICs for home multimedia, today added the STDP43 series of products to its innovative DisplayPort portfolio. These Systems-on-Chips (SoCs) are the world's first high-speed active-protocol bi-directional media-routing devices that manage audio and video data from various sources and send this data to multiple displays. The devices support DisplayPort 1.2 and HDMI 1.4, the latest versions of the two most common digital-display interface technologies used in computer and consumer electronics. The STDP43 SoCs are catalytic in the rapidly expanding markets for next-generation digital signage, universal docking stations and video hubs required by the new generation of notebooks and PCs based on the latest Intel and AMD CPUs that support the multi-stream features of DisplayPort 1.2.

The Video Electronics Standards Association (VESA) today announced the release of the Mobility DisplayPort (MyDP) Standard. MyDP is an extension of the DisplayPort connectivity standard that enables mobile devices to share high-definition video, audio, and 3D content with the broad universe of larger external displays through common, widely adopted connectors. Offering the industry's highest mobile-to-display image resolution, MyDP allows consumers to experience their mobile content in full, uncompressed 1080p (HDTV).

"Today's mobile devices with powerful processors and mass storage capacities have become the new hub of media content," said Soumendra Mohanty, senior director of marketing for Analogix. "However, consumers wish to experience their mobile content in a more diverse manner, beyond what a four-inch screen can offer. MyDP gives the industry a standard interface to break down screen size limitations, and Analogix is ready today with its compatible SlimPort products."

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

The Portland Group, a wholly-owned subsidiary of STMicroelectronics and a leading supplier of compilers for high-performance computing (HPC), today announced it is developing a CUDA C compiler targeting systems based on the industry-standard general-purpose 64- and 32-bit x86 architectures. The new PGI CUDA C compiler for x86 platforms will be demonstrated at the SC10 Supercomputing conference taking place in New Orleans, LA, November 13-15, 2010.

The NVIDIA CUDA architecture was developed to enable offloading computationally intensive kernels to massively parallel GPUs. Through function calls and language extensions, CUDA gives developers explicit control over the mapping of general-purpose computational kernels to GPUs, as well as the placement and movement of data between an x86 processor and the GPU.

In a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM, Chartered Semiconductor Manufacturing Ltd., GLOBALFOUNDRIES, Infineon Technologies, Samsung Electronics, Co., Ltd., and STMicroelectronics have defined and are jointly developing a 28-nanometer, high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.

The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive mobile and consumer electronics applications, including the fast-growing mobile Internet device market segment. The favorable leakage characteristics of the HKMG technology result in optimized battery life for the next generation of mobile products.

Intel Corporation and STMicroelectronics reached a key industry milestone today as they began shipping prototype samples of a future product using a new, innovative memory technology called Phase Change Memory (PCM). The prototypes are the first functional silicon to be delivered to customers for evaluation, bringing the technology one step closer to adoption.

The giant memory chip firms confirmed yesterday in separate statements that the planned partnership, dubbed Numonyx, has been pushed back to 28 March next year. The deal had been expected to be completed by the end of this year, but serious cash problems will put the deal on hold for a while. In May $1.55bn had been offered in debt financing for the new Geneva-based company. Lenders have now significantly reduced that figure, to $650m along with a further $100m in a revolving credit facility. Intel said: "We are in the process of renegotiating credit agreements, and clearly [the total] will be less. "The markets have changed significantly since we first announced the deal." The new venture could have annual revenue of up to $3.6bn and will create products for mobile devices such as MP3 players and digital cameras. Once the deal finally completes, Intel will take a 45.1% stake while STMicro will take 48.6%. Francisco Partners, a Silicon Valley-based private equity group, will invest $150m for a 6.3%.