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EK Water Blocks Ectotherm TIM Now Sold Separately in 5 g Syringes

EK Water Blocks, Ljubljana based premium computer liquid cooling gear manufacturer, is proud to introduce EK-TIM Ectotherm in retail packaging. The very same thermal compound, previously only available when bundled with EK Full Cover water blocks, is now available for separate purchase in a practical 5g dose.

EK-TIM Ectotherm is a best in-class thermal compound with exceptional value for money. This thermal interface material provides an effective heat transfer and easy application between CPU, GPU or any other PCH/chipset and heat sink.

Intel Updates Desktop CPU Roadmap, Haswell-E, Broadwell, Devil's Canyon Blip

At GDC, Intel announced a backpedal from its plans to eventually reshape desktop CPUs into components that come hardwired to the motherboards across the line, by announcing three new CPU families. It includes the Haswell-E HEDT platform, Broadwell performance platform, and Devil's Canyon. The three are expected to launch in reverse order, beginning with Devil's Canyon. A variant of existing "Haswell" silicon in the LGA1150 package, Devil's Canyon is codename for a breed of hand-picked chips with "insane" overclocking potential. In addition to binned dies, the chips feature a performance-optimized TIM between the die and the integrated heatspreader (IHS). The dies will be placed on special "high tolerance" packages, with equally "special" LGA contact points. The chips will be designed with higher voltage tolerance levels. Devil's Canyon is expected to branded under the existing Core i7-4xxx series, possibly with "Extreme" brand extension. It will be compatible with motherboards based on the Z97 chipset.

Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.

X2 Releases the Thermica Thermal Interface Material

Introducing the latest addition to the X2 series of high performance pc hardware and accessories, the X2 Thermica is a high performance, composite thermal interface material designed to maximize heat transfer from processors to heat-sink enabling you to get more cooling performance!

The high viscosity formula efficiently fills invisible surface imperfections to improve contact and thermal conductivity. The supplied 0.5g syringe is sufficient for 2 processor cooler installations. The X2 Thermica is a must have for every PC enthusiast. X2 - All geared up!

EK Unveils the Indigo XS Ultra-Performance Engineered Thermal Interface

EK Water Blocks, Ljubljana-based premium water cooling gear manufacturer, is proud to introduce the latest latest generation Engineered Thermal Interface (ETI) for Intel Core LGA-115x processors.

EK-TIM Indigo XS is the successor to EK-TIM Indigo Xtreme and represents the latest generation Engineered Thermal Interface (ETI). Fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. Indigo XS achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.

GIGABYTE GTX TITAN with WindForce 3X Bundle Official

At Computex, GIGABYTE unveiled its GeForce GTX TITAN with WindForce 3X bundle (GV-NTITANOC-6GD-B), in which you get a reference-design yet factory-overclocked card, and a WindForce 3X cooling solution that you DIY install it on the card yourself. Both the card and the cooler are bundled into a single large box. The card comes factory-overclocked at 928 MHz core, 980 MHz GPU Boost, and 6.00 GHz memory. It maintains these clocks even with the reference cooler, but it could get louder than normal, and may not be able to sustain boost states as the GPU temperature jousts with the 80°C mark. With the WindForce 3X cooler installed, the card will run quieter, and the GPU will sustain boost states better.

The WindForce 3X cooler is complex aluminum fin-stack heatsink, in which two equally-sized aluminum fin stacks draw heat from the GPU, using five 8 mm-thick copper heat pipes. These are ventilated by a trio of 80 mm fans suspended on a metal shroud. Included in the add-on package are thermal pads for the memory and VRM, two syringes of TIM, screws, washers, an Allen key, and a large mouse-pad. GIGABYTE could price the card at a premium.

XIGMATEK Also Announces Xi-3 HDT Thermal Compound

In addition to the Dark Knight Frostbourne Edition CPU cooler, XIGMATEK announced the new Xi-3 HDT thermal compound optimized for CPU coolers with heatpipe direct touch (HDT) bases. In such a base, heatpipes of the cooler make direct contact with the CPU, and are nested inside grooves of the base. Gaps between the base and the heat pipes tend to reduce surface area of contact between the cooler and the CPU. By design, HDT bases are less "polished," it helps to have a thermal compound that can seep into to surface irregularities better.

The Xi-3 HDT from XIGMATEK is advertised to have smaller particle size, while making up with higher density. The company didn't specify the composition of the compound, but detailed its characteristics. Its viscosity is rated at 104 Pa·s, specific gravity at 2.5 g/cm³, and an impressive 9.1 W/mK thermal conductivity. As with most performance TIMs on the market, it features an anti-bleed composition, isn't electrically conductive, and has an applied life rated at 10 years. It is sold in 4 g syringes, the company did not reveal pricing.
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