Wednesday, October 7th 2020
Sony has decided to post a teardown video of its latest, upcoming PlayStation 5 console. The video shows how to disassemble the console and what is inside it. The new console features a different design from the previous generation, and thus a different internal layout. What is perhaps the most exciting thing shown in the video is the new cooling solution Sony implements. The new design uses some pretty interesting solutions that combine good airflow generated by 120 mm wide, 45 mm thick blower fan cooling the vapor chamber heatsink. Under the heatsink, the silicon company has made is running at high clocks and is said to generate a lot of heat, so to manage it, the console uses liquid metal thermal interface material (TIM) instead of regular thermal paste for heat transfer. Combined with good airflow and good heatsink, heat management shouldn't be a problem on this console.