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AMD Ryzen Embedded R1305G

2
Cores
4
Threads
10 W
TDP
1500 MHz
Frequency
2.8 GHz
Boost
Zen
Codename
Socket FP5
Socket
Front
Front
AMD Socket FP5
AMD Socket FP5
The AMD Ryzen Embedded R1305G is a mobile processor with 2 cores, launched in February 2020. It is part of the Ryzen Embedded lineup, using the Zen (Banded Kestrel) architecture with Socket FP5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 4 threads. Ryzen Embedded R1305G has 4 MB of L3 cache and operates at 1500 MHz by default, but can boost up to 2.8 GHz, depending on the workload. AMD is making the Ryzen Embedded R1305G on a 14 nm production node using 4,950 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of GlobalFoundries. The multiplier is locked on Ryzen Embedded R1305G, which limits its overclocking potential.
With a TDP of 10 W, the Ryzen Embedded R1305G consumes very little energy. AMD's processor supports DDR4 memory with a dual-channel interface. The highest officially supported memory speed is 2400 MT/s, but with overclocking (and the right memory modules) you can go even higher. For communication with other components in the system, Ryzen Embedded R1305G uses a PCI-Express Gen 3 connection. This processor features the Radeon Vega 3 integrated graphics solution.
Hardware virtualization is available on the Ryzen Embedded R1305G, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) can run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.

Physical

Socket: AMD Socket FP5
Foundry: GlobalFoundries
Process Size: 14 nm
Transistors: 4,950 million
Die Size: 209.8 mm²
Package: FC-BGA1140
tJMax: 105°C

Processor

Market: Mobile
Production Status: Active
Release Date: Feb 25th, 2020
Part#: YE1305C9T2OFG

Performance

Frequency: 1500 MHz
Turbo Clock: up to 2.8 GHz
Base Clock: 100 MHz
Multiplier: 15.0x
Multiplier Unlocked: No
TDP: 10 W
Configurable TDP:8 W

Architecture

Codename: Zen
Generation: Ryzen Embedded
(Zen (Banded Kestrel))
Memory Support: DDR4
Rated Speed: 2400 MT/s
Memory Bus: Dual-channel
ECC Memory: No
PCI-Express: Gen 3, 8 Lanes
(CPU only)

Core Config

# of Cores: 2
# of Threads: 4
SMP # CPUs: 1
Integrated Graphics: Radeon Vega 3

Cache

Cache L1: 96 KB (per core)
Cache L2: 512 KB (per core)
Cache L3: 4 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP

Notes

SoC Features
Ethernet: 1x 10GbE
USB: 2x USB 2.0, 4x USB 3.1 Gen2
SATA: 2x SATA3
Interfaces: AZ, EMMC, eSPI, GPIO, I2C, I2S, LPC, SD, SMBus, SPI, UART

Radeon Vega turbo frequency: 1000MHz
May 2nd, 2024 11:33 EDT change timezone

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