Samsung Electronics today announced the new Galaxy XCover7 Pro and Galaxy Tab Active5 Pro, enterprise-ready devices designed to meet the demands of today's fast-paced, high-intensity work environments. Continuing the legacy of Samsung's ruggedized devices, these latest Pro models are versatile, optimized and secure—delivering enhanced durability, steady performance and optimized workflow to empower frontline workers, from the office to the field and beyond.

With 5G connectivity, an upgraded processor and increased memory, the XCover7 Pro and Tab Active5 Pro offer enhanced mobility and reliability. The XCover7 Pro features a powerful new stereo speaker system with anti-feedback technology, which minimizes unwanted audio loops for clearer communication. Both devices offer enhanced battery capacity, with the XCover7 Pro equipped with a 4,350mAh battery for longer usage, while the Tab Active5 Pro comes with a 10,100mAh battery set designed to support demanding workflows. The Tab Active5 Pro also supports Dual Hot-Swap battery functionality, allowing workers to replace batteries without powering down their devices and ensuring seamless operation even when battery levels are low.

MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek's Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design. The Dimensity 9400+ features an All Big Core design, integrating one Arm Cortex-X925 core operating up to 3.73 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This powerful configuration accelerates single and multithreaded performance for top-tier Android UX experiences.

"The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalized AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease," said JC Hsu, Corporate Senior Vice President at MediaTek. "We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers."

Nokia today announced the launch of the FastMile Gateway 4, a new compact 5G indoor gateway with Wi-Fi 7 that enables operators to deliver 5G speeds throughout the home for the ultimate consumer experience.

The new Nokia FastMile 5G gateway features high-gain antennas (up to 8 dBi), and dual-band Wi-Fi 7 in a compact design that can be self-installed by the consumer in the home. With 4 carrier aggregation and up to 300 MHz of bandwidth, the 5G gateway conserves radio capacity, improves coverage and maximizes throughput. The 5G Gateway 4 also supports 8RX and 3TX capabilities for improved spectrum efficiency, coverage and greater speeds along with Wi-Fi 7's multi-link operation (MLO), delivering up to 4 Gbps of Wi-Fi capacity in the home. This technology boosts connection speeds by enabling devices to send and receive data simultaneously across multiple frequency bands and channels.

Qualcomm Technologies, Inc. today announced the Dragonwing FWA Gen 4 Elite, the world's first 5G Advanced-capable FWA platform. Powered by the Qualcomm X85 5G Modem-RF, the platform sets a new benchmark for 5G broadband performance with downlink speeds up to 12.5 Gbps. The Dragonwing FWA Gen 4 Elite platform introduces comprehensive AI enhancements and integrates a powerful network Edge AI coprocessor with up to 40 TOPS of NPU processing power. This optimizes wireless connectivity across 5G broadband and Wi-Fi, while unlocking the power of generative AI for more devices, enabling a more reliable and harmonized user experience.

"The Dragonwing FWA Gen 4 Elite Platform is a technological breakthrough, building on over 500 5G FWA designs to date, and extends our tradition of delivering platforms that solve the broadband industry's greatest challenges," said Gautam Sheoran, vice president and general manager, wireless broadband and communications, Qualcomm Technologies, Inc. "By integrating unprecedented AI and connectivity capabilities, with the Qualcomm X85 at its core, this platform offers ultra-fast speeds, reliability and flexibility at a lower total cost than wired broadband, ultimately, enabling a future where seamless, intelligent networks transform the way we live and work."

Semiconductor intellectual property core provider CAST today announced a new IP core that implements the SNOW-V stream cipher algorithm to meet the security and performance demands of modern communication systems. Available now for ASICs or FPGAs, the company believes it to be the first such commercial IP core.

The new SNOW-V Stream Cipher Engine provides a flexible and reusable hardware implementation of the official SNOW-V mechanism as published in 2019 by the IACR Transactions on Symmetric Cryptology. SNOW-V revises the SNOW 3G stream cipher algorithm to help satisfy the high-speed, low-latency security requirements of 5G, 6G, and future mobile networks. The core:

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

On Wednesday (February 19), Apple announced the upcoming launch of its "budget-friendly" iPhone 16e smartphone model. The Cupertino, California-based company has refreshed its entry level product tier—starting at $599—with modernized internals. Apple's new design houses an A18 chipset, as well as their much-discussed debut modem design. The C1 is a custom 5G part; fully developed in-house. Previously, modern iPhone product ranges have been fitted with Qualcomm 5G modems. As expected, Apple contracted with TSMC for the production of A18 and C1 silicon—the A-type SoC is based on a 3 nm process node (TSMC N3E). Their proprietary modem baseband design utilizes 4 mm, while the receiver uses a 7 nm process—according to insiders.

Taiwan's Commercial Times reckons that TSMC will be the "biggest beneficiary" from the aforementioned agreement with Apple. Ctee TW's latest report cites industry analysis; soothsayers estimate annual shipments reaching roughly 22 million units annually. Additional whispers suggest that the C1 modem will turn up in non-iPhone devices—namely next-gen Watches and iPads, by next year. The report also mentions that upcoming Mac products are slated for C1 upgrades. Further leaks have linked project "Ganymede" to a "C2" custom 5G modem design—inside sources believe that a 3 nm TSMC process is on the cards. Another codename—"Prometheus"—was leaked by insiders; possibly referencing a future "C3" model.

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, has released the QSW-3205-5T, an entry-level, full 10GbE unmanaged switch. With a compact desktop form factor and ultra-quiet cooling, the QSW-3205-5T provides five 10GbE RJ45 ports and automatic network optimization features such as Jumbo Frame and loop detection. Whether for small businesses, video production teams, or homes, the QSW-3205-5T allows users to quickly achieve smooth high-speed data transmission, quick file sharing, and multi-user collaboration and editing of 4K/8K video files.

"The QSW-3205-5T is a high-performance, cost-effective 10GbE switch that requires no complicated setup or additional investment. By using existing network cables, upgrading to a 10G network is as simple as replacing your switch," said Ronald Hsu, Product Manager of QNAP, adding "Users, such as offices or video studios, can connect the QSW-3205-5T to 10GbE NAS and multiple workstations to boost work and collaboration efficiency. It can also be paired with Wi-Fi 6/6E/7 routers, and APs to efficiently deploy high-speed wireless LAN."

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is excited to introduce the MS-X6413E industrial system designed to meet the needs of a wide range of industries including automation machine builders, edge computing innovators, and HMI solution creators.

The MS-X6413E is tailored for businesses looking to stay ahead in today's fast-paced digital landscape. For system integrators, this product offers a seamless solution to keep business operations running smoothly, managing customer contact details, transaction history, and accounts with ease. Its unparalleled reliability ensures that businesses are always up-to-date and in control of their processes. Its versatility also extends to those building edge computing machines.

ASUS and Republic of Gamers (ROG) today announced a suite of innovative networking products at CES 2025, pushing the boundaries of Wi-Fi 7 connectivity for gamers, network enthusiasts and home users. In addition, ASUS RT-BE58 Go, a compact mini travels router with versatile connectivity; and ASUS 5G-GO, a sleek 5G mobile router with roaming support in up to 232 countries, both received the prestigious CES 2025 Innovation Award. The latest lineup includes ROG Rapture GT-BE19000AI, the world's first AI-powered gaming router with a built-in NPU; and the ZenWiFi outdoor series, a robust outdoor Wi-Fi 7 mesh solution. All of these solutions are designed to deliver unparalleled performance, security, and flexibility.

Edimax is pleased to announce the release of the D5G-8459 Industrial 5G NR DIN-Rail Router, a powerful solution for seamless wireless and wired connectivity in the most challenging environments. Capable of operating within a temperature range of -20°C to 70°C, this router delivers reliable 5G NR internet access in locations where fixed broadband is unavailable or impractical.

Equipped with the RM520-GL (Qualcomm Snapdragon x62), the D5G-8459 router offers enhanced reliability, compatibility, and high performance. It supports automatic failover between 5G NR and wired Ethernet, ensuring continuous connectivity even during network disruptions. This level of redundancy is vital for industries reliant on uninterrupted services, including payment systems, remote data transfers, online meetings, and video streaming, making it an indispensable tool in ensuring smooth operations.

NETGEAR, the leading provider of award-winning connected products designed to simplify and improve people's lives, today expanded its unlocked 5G mobile router lineup with the launch of the NETGEAR Nighthawk M3 Mobile Hotspot Router (MH3150). The new product meets the growing demands for accessible and powerful Wi-Fi coupled with advanced security features anywhere, anytime.

NETGEAR launched the world's first unlocked 5G mobile router and has continued to innovate, improving on-the-go connectivity experiences customers have come to enjoy. The Nighthawk M3 follows in the same vein, delivering 2.5 Gbps over 5G[1] with the capacity to reach a maximum aggregated Wi-Fi speed of up to 3.6 Gbps. Additionally, the M3 features in-home performance mode which boosts Wi-Fi coverage up to 1,000 sq ft when the device is plugged in, and the battery is removed.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, unveils a pioneering AI-powered FWA solution based on Snapdragon X75 5G Modem-RF System during Network X 2024. The solution aims to simplify configuration, enhance user experience and foster service personalization. The integration of AI into the 5G FWA devices significantly revolutionizes the user interaction with end devices and improves experience.

The 5G AI FWA solution is designed to utilize AI intelligence to understand and respond to users' requests and streamline task management processes through voice input or text messages to OpenAI's Whisper service, or the conversations can be realized through the web interface. Offering a seamless, intuitive communication system, significantly expands the CPE capability and improves user experience. The AI-powered FWA solution also extends its intelligence to network optimization, latency reduction to meet customer satisfaction, serving as a hub for unified task management.

TCL, a pioneer in display across feature-rich smartphones, tablets, and connected devices, today showcased its latest 5G AI CPE device and 5G RedCap Family products at the Broadband World Forum 2024, part of Network X, held from 8-10 October in Paris, France. The event featured the AI-driven 5G CPE TCL LINKHUB 5G HH516, a device enhancing user experiences with advanced AI technology, and the TCL LINKPORT IK511, the industry's first 5G RedCap USB Dongle for consumer & M2M scenarios. These recent releases highlight TCL router's commitment to 'Connect the Unconnected and Create Seamless Connection' by leveraging its technological prowess and supporting global 5G adoption with a diverse range of products.

"With over two decades of experience in cellular technology, TCL continues to forge paths in 5G connectivity by broadening access to advanced network technologies through our innovative product offerings," said Jesse Wu, General Manager of Smart Connected Device Business Unit at TCL. "Entering the 5G RedCap market is a strategic move to address the burgeoning demand for enhanced 5G capabilities in a variety of consumer and industrial applications."

Qualcomm Technologies, Inc., a global leader in wireless technology innovation, today announced the launch of the Qualcomm Networking Pro A7 Elite, a groundbreaking wireless networking platform set to transform how people will experience their networks with edge AI integration. Leveraging an AI co-processor with 40 TOPS of NPU processing power, the platform delivers elevated Wi-Fi 7 connectivity and networking performance, while also equipping connected devices with powerful and centralized generative AI processing capabilities.

This transformative integration of computing power into the network unlocks opportunities for operators and enterprises to deploy innovative applications and services in areas such as security and surveillance, energy management and automation, personalized virtual assistants, aging in place and health monitoring among others. Edge AI can enhance privacy by processing sensitive information on the gateway, while enabling personalization through contextualized understanding of the environment and immediacy through near real-time responses. This approach unlocks the power of advanced AI for more devices, even legacy ones, enabling a more reliable and harmonized user experience across connected devices.

Samsung Electronics today unveiled the Galaxy Tab S10 Ultra and Galaxy Tab S10+, Samsung's first tablets purposefully built for AI. The premium hardware includes 14.6-inch and 12.4-inch Dynamic AMOLED 2X displays—the ideal canvas for the intuitive S Pen bundled with both models. Performance upgrades for the Galaxy Tab S10 Ultra include an 18% increase in CPU, 28% increase in GPU and 14% increase in NPU compared to the Galaxy Tab S9 Ultra.

This improved processing power enables faster and more responsive AI features, which are now easily accessible with written prompts using the new Galaxy AI Key on the Book Cover Keyboards to customize AI assistant. Cutting-edge software includes features such as Note Assist and Drawing Assist, optimized for the tablet form factor. The Galaxy Tab S10 series also acts as a home AI device, with a 3D Map View that gives a visual overview of the home and all connected devices to streamline device management across the SmartThings ecosystem. Robust Samsung Knox security ensures data privacy and control, while innovative materials underscore Samsung's commitment to a more sustainable future.

NETGEAR, Inc., the leading provider of innovative and secure solutions for people to connect and manage their digital lives, today expanded its portfolio of high-performance WiFi 7 devices with the introduction of the Nighthawk M7 Pro Mobile Hotspot (MR7400). Based on NETGEAR's nearly 30 years of pioneering network expertise, powered by the Qualcomm Snapdragon SDX75 chipset and running on AT&T's reliable 5G network, the M7 Pro provides flexible, high-speed connectivity for consumers and businesses anywhere, anytime.

Whether it's working remotely, staying in touch with family and friends, or enjoying entertainment on the go, having a reliable, secure and fast internet connection anywhere can make a huge difference in productivity, convenience, and satisfaction. The Nighthawk M7 Pro Mobile Hotspot conveys the benefits of WiFi 7 and 5G technology, which offer faster speeds, lower latency, and better coverage than ever before. The M7 Pro provides a strong, reliable connection with 5G speeds of up to 6 Gbps. With tri-band WiFi 7 and dual-band concurrent operation, it unleashes aggregated WiFi speeds of up to 5.8 Gbps.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

ASUS today announced the ROG Rapture GT-BE19000, ASUS RT-BE86U and ROG USB-BE92 during Gamescom 2024. These three devices showcase the ASUS commitment to offering an array of perfomant, reliable and robust featured Wi-Fi 7 products. These three products offers demanding digital homes and offices alongside networking enthusiast and gamers outstanding range, throughput and low latency ensuring outstanding wired and wireless connectivity. Additionally, the ROG Rapture GT-BE19000 alongside the latest Intel Wi-Fi 7 BE200 network card are being demonstrated in a dedicated section at the ASUS Gamescom 2024 booth, where attendees can see these two latest gen devices work ideally to deliver an ultra performance Gigabit+ network experience.

Wi-Fi 7 functionality is coming to Windows 11 later this year, and the new ROG GT-BE19000 can unleash Wi-Fi 7 gaming experiences with speeds up to 2.4 times faster and coverage up to 73% greater. Its ROG Gaming Network feature uses Guest Network Pro to deliver a dedicated Gaming Network SSID and VLAN with complete game-acceleration technology. Meanwhile, the new ASUS RT-BE86U offers up to 20 Gbps of wired capacity, triple that of the RT-AX86U, with 30% more CPU power and rich Ethernet backhaul options to create a feature-packed AiMesh extendable network. And the ROG USB-BE92 tri-band Wi-Fi 7 USB adapter supports both USB Type-A and USB 3.2 Gen 1 x1 Type-C connections, and give users access to the wide-open 6 GHz band for low-interference networking.

Qualcomm Technologies, Inc. today announces the Snapdragon 4s Gen 2 Mobile Platform - designed to make 5G more accessible and reliable. This new platform is another example of how Qualcomm is committed to engineering human progress, pioneering the global transition from 4G to 5G to empower communities and industries alike. Snapdragon 4s Gen 2 is also packed with feature-rich enhancements, including robust CPU performance for seamless multitasking and productivity, dual band navIC for better position accuracy, AI-enhanced audio, and entertainment experiences like smooth gameplay and powerful video streaming.


"The Snapdragon 4s Gen 2 Mobile Platform is a significant leap forward in making 5G technology more accessible, so more people can navigate the world at 5G speeds," said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Thanks to cutting-edge engineering, we balanced affordability with strong performance and all-day battery life, as well as widespread access to 5G for more enhanced mobile experiences."

D-Link Corporation, a global leader in networking solutions, proudly announces the launch of its cutting-edge G530 5G NR AX3000 Wi-Fi 6 router. This advanced router empowers users to harness the full potential of 5G technology by using a mobile carrier's SIM card to deliver high-speed 5G connectivity through a robust Wi-Fi 6 network. Engineered with the renowned MIT (Made in Taiwan) quality assurance, the G530 provides a fast, reliable, and flexible networking solution ideal for homes, offices, remote sites, and temporary setups where traditional wired connections are limited or unavailable.

Ultra-Fast Speed
The G530 unlocks the next generation of connectivity, offering 5G speeds of up to 3.4 Gbps and Wi-Fi 6 capabilities reaching AX3000. Leveraging Wi-Fi 6 technology, the G530 expands Wi-Fi bandwidth to 160 MHz and incorporates bi-directional MU-MIMO and OFDMA technologies, enhancing data rates and reducing latency for multiple users and devices. Whether users are gaming online, streaming 4K/8K content, participating in conference calls, or downloading large files, the G530 ensures a seamless, high-speed connection without lag.

MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

Today, Lenovo launched the Lenovo ThinkPad P14s Gen 5 designed for professionals who need top-notch performance in a portable 14-inch chassis. Featuring a stunning 16:10 display, this mobile workstation is powered by AMD Ryzen PRO 8040 HS-Series processors. These processors are ultra-advanced and energy-efficient, making them perfect for use in thin and light mobile workstations. The AMD Ryzen PRO HS- Series processors also come with built-in Artificial Intelligence (AI) capabilities, including an integrated Neural Processing Unit (NPU) for optimized performance in AI workflows.

The Lenovo ThinkPad P14s Gen 5 is provided with independent software vendor (ISV) certifications and integrated AMD Radeon graphics, making it ideal for running applications like AutoCAD, Revit, and SOLIDWORKS with seamless performance. This mobile workstation is ideal for mobile power users, offering advanced ThinkShield security features and passes comprehensive MIL-SPEC testing for ultimate durability.

United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the industry's first 3D IC solution for RFSOI technology. Available on UMC's 55 nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G.

As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company's 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data - in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC's 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production.