AAEON, a leading provider of Computer-on-Modules, has today announced the launch of two new COM Express Type 6 Compact Size solutions, the COM-RAPC6 and COM-ADNC6. Targeting the advanced robotics and edge gateway markets, the COM-RAPC6 is compatible with a variety of embedded CPUs from the 13th Generation Intel Core Processor line on a compact 95 mm x 95 mm form factor. The module gives customers a range of SKUs from the 13th Generation series, from the efficient 15 W Intel Processor U300E to 13th Generation Intel Core i7 Processors, running at 45 W. This grants users up to 14 (6P/8E) cores and 20 threads of processing power alongside technologies for the acceleration of deep learning inference workloads and I/O device virtualization.

With the COM-RAPC6 clearly favoring high performance, AAEON's second addition to its COM Express Type 6 product line, the COM-ADNC6, focuses on efficiency. The COM-ADNC6 offers a selection of embedded CPUs from the Intel Atom X Series, Intel Processor N-series, and the Intel Core i3-N305 alongside 16 GB of SODIMM-based LPDDR5 system memory. Given its compatible CPUs are comparable to the Intel Atom Processor E and Intel Celeron Processor J Series CPUs in power consumption, but with far greater performance, the COM-ADNC6 is positioned as a natural successor to the COM-BT.

Leading provider of embedded PC solutions, AAEON, is delighted to announce the official launch of two new additions to its rich line of embedded AI systems, the BOXER-8653AI and BOXER-8623AI, which are powered by the NVIDIA Jetson Orin NX and Jetson Orin Nano, respectively. Measuring just 180 mm x 136 mm x 75 mm, both systems are compact and easily wall-mounted for discreet deployment, which AAEON indicate make them ideal for use in both indoor and outdoor settings such as factories and parking lots. Adding to this is the systems' environmental resilience, with the BOXER-8653AI sporting a wide -15°C to 60°C temperature tolerance and the BOXER-8623AI able to operate between -15°C and 65°C, with both supporting a 12 V ~ 24 V power input range via a 2-pin terminal block.

The BOXER-8653AI benefits from the NVIDIA Jetson Orin NX module, offering up to 70 TOPS of AI inference performance for applications that require extremely fast analysis of vast quantities of data. Meanwhile, the BOXER-8623AI utilizes the more efficient, yet still powerful NVIDIA Jetson Orin Nano module, capable of up to 40 TOPS. Both systems consequently make use of the 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores.

AAEON's UP brand, renowned for producing sophisticated developer boards with industrial-grade specifications, has announced the release of the UP Xtreme 7100, an all-in-one robotics solution available as both a single-board and Mini PC. Both the UP Xtreme 7100 and its system-level counterpart, the UP Xtreme 7100 Edge, are available in SKUs powered by Intel Core i3-N305 or Intel Processor N97 CPUs, chosen due to their balance of low power consumption and high performance. The platform consequently provides the sensor data processing, integrated graphics, and resources required for path planning and control algorithms needed to bring AGV, AGV + AI, and AMR solutions to market.

Consistent with previous product lines from AAEON's UP Division, the UP Xtreme 7100 and UP Xtreme 7100 Edge are built on compact form factors in order to address space restraints. Consequently, the UP Xtreme 7100 board-level solution measures just 120.35 mm x 122.5 mm, while the edge system version comes in at 152 mm x 124 mm x 40 mm. Targeting areas in robotics such as AGV and AMR, the UP Xtreme 7100 and UP Xtreme 7100 Edge are equipped with a number of terminal blocks for serial communication, along with a 30-pin board-to-board connector that offers digital I/O, GPIO, and isolated RS-232/422/485 function. Further, CAN 2.0B, a DIP switch, and LED indicators are onboard to make the solution conducive to establishing communication with other devices on the CANBus network.

AAEON, an industry-leading provider of embedded solutions, has announced the latest addition to its 3.5" SubCompact Board product line, the GENE-EHL7. Available in models featuring Intel Atom x6000E series, Pentium, and Celeron N and J series Processors, the GENE-EHL7 is designed to offer a power-efficient platform with which to bring smart retail, smart city, industrial automation solutions to market in a compact, easily deployed board.

Offering a low-cost lifecycle via its efficient processor selection, the board is available with Intel Atom x6413E, Intel Celeron Processor J6412, or Intel Celeron Processor N6210 embedded CPUs, which grant users low-cost, yet highly efficient processing suitable to a variety of vertical market deployments. Providing three configurable simultaneous displays via HDMI, DP, LDVS, and eDP, AAEON have placed emphasis on the board's potential for deployment in point-of-sale (POS) and kiosk equipment, where its compact form factor and flexible display interfaces can be used to develop applications that are friendly to end-users. Adding further value to the board's use for such purposes is its optional TPM 2.0, which enhances security, critical for protecting data while in transit.

AAEON, a global leader in embedded computing, has introduced the GENE-ADN6, a 3.5" SubCompact Board powered by Intel Atom x7000E Series, Intel Processor N Series, and Intel Core i3-N305 Processors. The GENE-ADN6 is available in SKUs featuring a variety of CPUs from the platform, ranging from the efficient 6 W Intel Processor N50 to the more powerful 15 W Intel Core i3-N305, along with a plethora of features tailored for the machine vision, drone, and AMR markets.

Designed to thrive in harsh industrial environments, the GENE-ADN6 operates reliably within a wide temperature range of -40°F to 185°F (-40°C to 85°C) and accepts power inputs from 9 V to 36 V. Additionally, the board can accommodate multiple expansion modules via M.2 2230 E-Key and M.2 3052 B-Key slots, while offering additional storage options, including a full-size mSATA slot and a SATA HDD bay.

AAEON's UP brand, renowned for its extensive selection of developer boards and compact Mini PCs, is thrilled to announce the launch of the UP Squared i12 Edge. This Mini PC, the smallest in AAEON's lineup to host 12th Generation Intel Core Processors, measures just 130 mm x 94 mm x 68 mm. It has been designed as a compact and easily deployable system specifically tailored for industrial automation applications, such as AGV and IoT Gateway. The UP Squared i12 Edge offers a wide range of peripheral device interfaces tailored to its target industries. These include two USB Type-A ports and one USB Type-C port, supporting USB 3.2 Gen 2. Additionally, it features dual-stacked RJ-45 ports for Realtek RTL8111H-CG gigabit ethernet connectivity.

One of the standout features of the UP Squared i12 Edge is its support for CNVi via its M.2 2230 E-Key interface, making it an ideal choice for wireless data exchange with retrofitted factory equipment in the manufacturing sector. Furthermore, it offers support for AI modules through an M.2 2280 M-Key slot, enhancing the capabilities of its robust CPU lineup, which includes up to i7 SKUs from the 12th Generation Intel Core platform. Consequently, the UP Squared i12 Edge is an excellent candidate for AGV applications. Additionally, there is an option to add an M.2 2230 E-Key for Wi-Fi connectivity, which, when paired with the system's onboard TPM 2.0, caters to users interested in using the product as an IoT Gateway.

Industry-leading designer and manufacturer of edge AI solutions, AAEON, has released the BOXER-8651AI, a compact fanless embedded AI System powered by the NVIDIA Jetson Orin NX module. Consequently, the BOXER-8651AI takes advantage of the module's NVIDIA Ampere architecture GPU, featuring 1024 CUDA and 32 Tensor Cores, along with support for NVIDIA JetPack 5.0 and above to provide users with accelerated graphics, data processing, and image classification.

With a fanless chassis measuring just 105 mm x 90 mm x 52 mm, the BOXER-8651AI is an extremely small solution that houses a dense range of interfaces, including DB-9 and DB-15 ports for RS-232 (Rx/Tx/CTS/RTS)/RS-485, CANBus, and DIO functions. Additionally, the device provides HDMI 2.1 display output, GbE LAN, and a variety of USB Type-A ports, supporting both USB 3.2 Gen 2 and USB 2.0 functionality.

The BOXER-8651AI, despite containing such powerful AI performance for its size, is built to operate in rugged conditions, boasting a -5°F to 131°F (-15°C to 55°C) temperature range alongside anti-shock and vibration resistance features. Consequently, the PC is ideally suited for wall mounted deployment across a range of environments.

AAEON, a global leader in edge AI computing, has unveiled the BOXER-8621AI, its inaugural fanless embedded AI System powered by the NVIDIA Jetson Orin Nano module. Geared towards applications such as AMR, fleet management, and traffic control solutions, the BOXER-8621AI seamlessly combines the NVIDIA Jetson Orin Nano's impressive 20 TOPS of AI performance and NVIDIA Jetpack 5.0 SDK support with robust hardware, ensuring extended durability and longevity even in challenging environments. To bolster its resilience, the system boasts an operating temperature range of -15°C to 60°C, complemented by enhanced shock and vibration resistance.

The BOXER-8621AI is equipped with an array of interfaces tailored to its designated deployment domains. These include DB-9 and DB-15 ports for RS-232/422/485, CANBus, and GPIO, all backed by high-bandwidth LPDDR5 system memory. The system also incorporates four USB Type-A ports (two offering USB 3.2 Gen 2, and two offering USB 2.0), an RJ-45 port for gigabit LAN, and an HDMI 1.4 port for display output. In terms of expansion capabilities, the system features an M.2 3042/3052 B-Key slot to accommodate 4G, 5G, as well as M.2 2242 B and M-Key storage modules. Additionally, it contains an M.2 2230 E-Key slot, granting Wi-Fi, Bluetooth, and additional storage as needed.

AAEON, a global leader in embedded computing, has introduced the EPIC-ADN9, featuring the newest iteration of Intel technology on its 4.53" x 6.50" (115mm x 165mm) EPIC series of single-board computers. Offering a range of embedded CPUs, including the Intel Core i3-N305, Intel Atom x7425E, Intel Processor N50, and Intel Processor N97, the EPIC-ADN9 strikes a balance between efficiency and performance. This selection of processors also provides support for Intel UHD Graphics, enhancing the improved display interface configuration integrated by AAEON into the board. This configuration includes HDMI 1.4, DP 1.2, VGA, and 24/48-bit Dual-Channel LVDS.

Complementing the EPIC-ADN9's display capabilities are up to four RJ-45 ports for Intel I226-V Ethernet running at 2.5 GbE, depending on the model. AAEON designed the board to be passively cooled, while also incorporating multiple options for image acquisition and high-resolution display. This design approach aligns with AAEON's focus on applications such as entry-level gateway devices and digital signage.

Leading provider of embedded PC solutions, AAEON, is delighted to announce the official launch of the BOXER-6406-ADN, a compact and fanless embedded computer built upon the Intel Atom Processor X Series/Intel Processor N-series Processor platform.

Designed to cater to the demands of smart factory applications, the BOXER-6406-ADN boasts a range of features that establish it as a remarkably robust choice for industrial projects. Notably, the system boasts an impressive operational temperature range spanning from -20°C to 60°C. Furthermore, it supports a wide voltage input range of 9 V to 36 V, inclusive of over/under-voltage current protection as well as short-circuit protection. To enhance its durability, the system is equipped with IEC 68-2-27 anti-shock tolerance and advanced anti-vibration capabilities. Lockable I/O connectors have also been incorporated to safeguard against wear and tear.

With dimensions measuring just 186 mm x 104.6 mm x 49.1 mm, the BOXER-6406-ADN's compact chassis can be easily wall-mounted for convenient deployment. The system relies solely on passive cooling mechanisms, foregoing fan-assisted cooling systems to prevent the accumulation of contaminants when deployed in smart factory settings.

AAEON, a leading producer of industrial motherboards, has released the MIX-ALND1, a versatile Mini-ITX board that supports Intel Processor N-series CPUs. Powered by either the Intel Processor N97 or the Intel Processor N50, the MIX-ALND1 offers users flexible DDR5-4800 system memory via the SODIMM slot. This provides high-bandwidth data transmission for the board's dual Realtek RTL8111H-CG Ethernet, dual USB 3.2 Gen 2 ports, and numerous internal pin headers providing functions such as RS-232/422/485, Digital I/O, and HD audio.

As with all platforms based on the new Intel Processor N-series, the MIX-ALND1 is equipped with Intel UHD Graphics. AAEON's board design takes advantage of this package with an intricate configuration of display options, which consist of HDMI 2.0 and DP 1.4 for resolutions of up to 4K @60 Hz, along with an 18/24-bit dual-channel LVDS connector (colay with eDP), resulting in the capacity to support three simultaneous displays.

AAEON's UP brand, renowned for producing sophisticated developer boards with industrial-grade specifications, has announced the release of the UP 7000, the third generation of boards built on the 85 mm x 56 mm form factor of the original UP Board. The UP 7000 boasts numerous upgrades compared to its predecessors, including 8 GB of LPDDR5 system memory, onboard TPM 2.0, and support for both Windows and Linux OS. Most notably, it stands out as the world's smallest board featuring onboard CPUs from the Intel Processor N-series platform.

The board is available in various SKUs, hosting Intel Processor N97, Intel Processor N100, or Intel Processor N50 CPUs. Notably, these processors offer clock speeds up to 50% faster than those of previous boards from the same product line, and also support Intel AVX2 for energy-efficient AI acceleration. Equipped with three USB Type-A ports for USB 3.2 Gen 2, one GbE LAN port supporting Realtek RTL8111H CG, and a Raspberry Pi-compatible 40-pin HAT for expansion, the UP 7000 provides a dense port configuration. This makes it ideal for applications requiring low latency but versatile connectivity, such as AMR and multifunction printing device solutions.

AAEON, a leading producer of single-board computers, has released the latest offering from its line of compact boards on the PICO-ITX form factor, the PICO-EHL1. Equipped with Intel Atom x6000E Series, and Intel Pentium and Celeron N and J Series Processors, the PICO-EHL1 is a lightweight, power-efficient board which the company has earmarked for low-cost applications that require flexible function, such as digital signage, smart lockers, and ATMs.

The PICO-EHL1's display interface is particularly suitable to the aforementioned markets, with dual-channel LVDS and eDP via colay design being joined by full audio functionality thanks to its line-in, line-out, and microphone connectors. Supporting both Windows and Linux operating systems, the board has discrete TPM 2.0 compatibility for data security, making it suitable for deployment in ATMs.

AAEON's UP brand, known for its sophisticated developer board range, have announced the release of the UP Squared i12, the smallest developer board with 12th Generation Intel Core /Celeron Processor 7000 Series Processors. The 85.6 mm x 90 mm form factor is the latest to move into its third generation, and much like recent releases from the brand's UP Xtreme and UP Squared Pro collections, the UP Squared i12 displays a number of distinct upgrades on its predecessor.

With 12th Generation Intel Core processors and onboard LPDDR5 on such a tiny board, the UP Squared i12 targets a number of key markets with its potential to be deployed as a low-cost, space-efficient, and high-performance foundation for developers to work with. AAEON believe the greater bandwidth speed offered by the board's LPDDR5 will be beneficial to projects in the smart retail space, being particularly suited to applications such as frictionless shopping and intelligent vending machines.

AAEON has today announced the release of the MAX-Q670A, its first Micro-ATX industrial motherboard to incorporate the new 13th Generation Intel Core Processor platform (formerly Raptor Lake). The MAX-Q670A supports a diverse range of CPUs from both the 12th and 13th Generation Intel Core Processor ranges, from 35 W i3 to 65 W i9 SKUs, with the most advanced of these offering 8 P-cores, 16 E-cores, and 32 threads. Advanced technologies available on this platform include Intel TCC for real-time computing, Intel vPro Enterprise for robust security and stability, and Intel Turbo Boost Max Technology 3.0 for targeted workload management.

In designing the MAX-Q670A, AAEON focused heavily on providing substantial upgrades in storage, hardware-based security features, and increased speed and bandwidth via both onboard interfaces and expansion modules. Equipped with two 16-lane PCIe Gen 5 slots, the MAX-Q670A can accommodate multiple expansion modules such as graphic cards, with a further option of installing two 8-lane cards per slot while still benefiting from PCIe Gen 5 speed. Consequently, the board provides users with a far more sophisticated and diverse range of options when compared to the PCIe Gen 3 performance offered by earlier products from its Micro-ATX line.

The value of the SD-WAN solutions market is projected to hit $13.7 billion worldwide by 2026, with more and more organizations making data security a priority. As one of the leading manufacturers of advanced network computing and security hardware platforms, AAEON seeks to make a big contribution in the attempt to achieve this market growth, with greater focus on providing versatile and cost-effective networking solutions to the US market.

To do this, AAEON has strengthened ties with Adaptiv Networks, a leading cloud-native SD-WAN-as-a-Service vendor with whom AAEON have had a strong partnership with for a number of years. In collaboration with Adaptiv, AAEON will help enterprises to simplify their network infrastructure, increase network performance, and improve security.

Converting the ingenuity of the UP Squared Pro 7000 board to its edge system range, AAEON's UP Squared Pro 7000 Edge is the first mini PC to harness the power of Intel Core i3 Processor N-series, Atom Processor X Series, and Intel Processor N-series processors in a fanless chassis.

The first fanless mini PC to utilize the processor platforms, the UP Squared Pro 7000 Edge provides developers with the same performance boost as its board counterpart, but with a more convenient route to market. The device's heatsink offers effective heat dissipation without the obvious drawbacks of a fan-based cooling system, opening the door to deployment in more settings, such as smart manufacturing and healthcare.

Following its successful demonstration of a MIPI camera solution using the UP Squared Pro 7000 at Embedded World, AAEON have announced a MIPI Expansion Kit for the newly released third generation board. Equipped with the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor and Intel Processor N Series (formerly Alder Lake-N) and an FPC port supporting MIPI-CSI interface, the UP Squared Pro 7000 emphasizes AAEON's continued dedication to bringing the latest Intel technologies to a wider variety of platforms. One such platform is the LI-ADL-ADP-IMX415-MIPI-081H, a 4K MIPI Camera Module from leading intelligent embedded camera creator, Leopard Imaging Inc.

The company recently announced that the camera has been designed with full-function drivers to support the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor, and Intel Processor N Series (formerly Alder Lake-N), allowing users to take advantage of the peripheral Intel technologies that come with the processor platform, such as Intel UHD Graphics on a Windows 10 IoT Enterprise OS.

AAEON, an industry leading provider of edge AI solutions, will present new additions to its extensive line of platforms powered by NVIDIA Jetson system-on-modules during GTC, a global conference on AI and the metaverse. As a gold sponsor of the conference, which offers over 650 discussions, panels, and events from industry leaders in the AI space, AAEON highlights upcoming products from their range of embedded Box PCs across the entire NVIDIA Jetson Orin series; including NVIDIA Jetson AGX Orin, NVIDIA Jetson Orin NX, and NVIDIA Jetson Orin Nano.

The BOXER-8645AI and BOXER-8646AI systems will join BOXER-8640AI and BOXER-8641AI, which were released in December 2022, as part of AAEON's product range powered by the NVIDIA Jetson AGX Orin. Equipped with one HDMI 2.1 and eight GMSL2 ports, the BOXER-8645AI will possess an exceptional interface for peripheral devices, making it particularly suitable for AMR applications. The BOXER-8646AI meanwhile, will feature an astonishing 12 PoE LAN ports, giving customers a versatile smart city solution.

Diversifying its solutions based on the NVIDIA Jetson line of system-on-modules, AAEON have released the BOXER-8224AI, comprised of a carrier board with a heatsink and NVIDIA Jetson Nano module to offer system-level capabilities on a tiny form factor of just 4.7" x 3.1" x 0.8" (120 mm x 80 mm x 22 mm).

A first for this line of AAEON products, the BOXER-8224AI's board layout includes a wafer-based coastline rather than full I/O ports to provide users with the full functionality of AAEON's system-level edge AI solutions in a more flexible way. Included in this configuration are two MIPI-CSI camera connectors for the installation of smaller, more cost-effective peripheral cameras for space-limited applications such as drones.

To showcase its ever-expanding line of Industry 4.0 solutions, AAEON will present world-class augmented reality (AR) solutions at Embedded World 2023, with live demonstrations illustrating how its product lines have amplified AR realization for two of its Industry 4.0 partners. AAEON will be at Booth 306, Hall 1, at Embedded World 2023 in Nuremberg between 14 - 16 March 2023. Along with a number of product showcases, AAEON will present two live demos of AR applications that were developed with its partners, Seabery Augmented Technology and XYZ Reality. Demonstrating cutting-edge AR technology, AAEON will give attendees an insight into the AR revolution it is pioneering.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q670A1, the most advanced Mini-ITX board it has ever produced. The first AAEON solution across any of its product ranges to support both 12th and 13th Generation Intel Core i9/i7/i5/i3/Pentium /Celeron processors (formerly Alder Lake-S and Raptor Lake-S respectively), the MIX-Q670A1 harnesses up to 24 cores, 32 threads, and a host of peripheral technologies including Intel vPro, Intel Thermal Velocity Boost, and Intel UHD Graphics 770.

AAEON believe the MIX-Q670A1 will become the gold-standard for applications requiring real-time, high-performance computing on the edge. Supporting 64 GB of dual-channel DDR5 4800 MHz system memory and a PCIe [x16] Gen 5 slot, the MIX-Q670A1 offers a 44% increase in memory speed over previous generations. Combining this speed with an I/O consisting of two LAN, two COM, and ten USB ports, the MIX-Q670A1 offers both a wealth of connectors for peripheral devices and real-time data transmittance on the edge for smart city applications.

AAEON, a leading manufacturer of AI development solutions, has released the UP Squared Pro 7000, bringing the acclaimed UP Squared Pro series into its third generation. The UP Squared Pro 7000 sees dramatic improvements when compared to the boards preceding it. The first of these is that it is the world's first industrial motherboard equipped with the Intel Core /Atom /N-Series processor platform (formerly Alder Lake-N), which offers 1.4x the CPU performance of the previous generation, alongside the benefit of supporting the Intel Distribution of OpenVINO Toolkit. In addition, the board hosts 16 GB of onboard LPDDR5 4800 MHz system memory, doubling the bandwidth and data transfer speed of the previous model, while also increasing overall energy-efficiency.

A first for the UP Squared Pro product line, the UP Squared Pro 7000 supports MIPI CSI cameras via an FPC port, freeing up its two 2.5 GbE (Intel i226-IT) and three USB 3.2 Gen 2 ports for other peripheral devices. Developers also gain access to exceptional expansion from the dense, 4" x 4" (101.6 mm x 101.6 mm) board, with the same 40-pin GPIO header alongside M.2 E, M, and B Keys for CNVI, PCIe, and USB add-ons.

AAEON, a leading manufacturer of industrial-grade server solutions, has announced the release of the ZEUS-WHI0 4U Rackmount Whitely Platform Server System. The ZEUS-WHI0 is AAEON's first system-level solution to utilize a 3rd Generation Intel Xeon Scalable Processor (formerly Ice Lake-SP). With up to 40 cores and 80 threads, this platform provides server-grade power while also benefitting from peripheral technologies such as Intel Crypto Acceleration, Intel VT-x, and Intel AES-NI.

Equipped with seven PCIe slots with up to Gen 4 speed capability, the ZEUS-WHI0 is exceptionally expandable, making it capable of supporting up to four GPU cards for AI acceleration and enhanced graphics realization. Further to this, the ZEUS-WHI0 also supports eight 2.5" or 3.5" HDD via two 4-bay inputs for storage, alongside an additional M.2 2280 M-Key for PCIe [x4].

AAEON, a provider of elite embedded solutions, has expanded its line of fanless embedded box PCs powered by 12th Generation Intel Core /Celeron processors (formerly Alder Lake-P U15) with the release of the BOXER-6451-ADP. Boasting the smallest chassis of AAEON's trifecta of new box PCs utilizing the latest Intel technology, the BOXER-6451-ADP offers 10 cores and 12 threads of processing power in a compact 7.48" x 4.37" x 2.5" (190 mm x 111 mm x 63.5 mm) model. AAEON believe this will help to bring compact, flexible solutions such as smart kiosks and charging stations to market with ease.

Adding to the BOXER-6451-ADP's suitability to smaller deployment spaces is its innovative new heat dissipation framework, which has seen AAEON replace the tubular heat pipe typically used to conduct heat from a PC's CPU to its heatsink with a flattened pipe to both increase its conduction area and accelerate heat transfer. This enables the system to maintain thermal regulation during periods of high workloads.