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GIGABYTE Unveils AMD-50 Commemorative Aorus X470 Gaming 7 WiFi

GIGABYTE unveiled a special commemorative package of its flagship socket AM4 motherboard, the Aorus X470 Gaming 7 WiFi. Much like the Ryzen 7 2700X AMD-50 Edition processor, this GIGABYTE motherboard is a minor variation of the original it's based on, with a handful cosmetic changes. The box package features AMD-50 markings, as does the board's model name, with a "-50" suffix. The motherboard itself features some "AMD-50" and "AORUS x AMD 50th Anniversary" markings along the acrylic RGB LED diffuser along the board's top-right corner and elsewhere. Perhaps out of the box, the board's RGB LEDs shine in a more pronounced shade of gold than the Aorus default orange-gold tint. These apart, the board is every bit identical to the Aorus X470 Gaming 7 WiFi, which currently retails for around USD $220, competing with the likes of the MSI X470 Gaming M7 and the ASUS ROG Crosshair VII Hero.

BIOSTAR and TechPowerUp Gaming Ready Motherboard Giveaway: The Winners

BIOSTAR and TechPowerUp brought you a chance to win one of two AMD platform motherboards with unique design and feature-sets. The Giveaway period is up, and the results are in! Among the prizes are the BIOSTAR Racing B450GT3, a formidable socket AM4 motherboard in the micro-ATX form-factor designed to be the foundation of a highly capable gaming PC build, and the BIOSTAR A10N-8800E, which packs an embedded AMD A10-8800E processor to everyday tasks and casual gaming. Without further ado, the Winners:
  • Dumitru from Romania, wins the BIOSTAR Racing B450GT3
  • Rene from Denmark, wins the BIOSTAR A10N-8800E
A huge Congratulations to the Winners!

MSI Issues Clarification on Next-Gen AMD CPU Support on 300-series Motherboards

It has come to our attention that MSI Customer Support has regrettably misinformed an MSI customer with regards to potential support for next-gen AMD CPUs on the MSI X370 XPOWER GAMING TITANIUM motherboard. Through this statement we want clarify the current situation.

At this point, we are still performing extensive testing on our existing lineup of 300- and 400-series AM4 motherboards to verify potential compatibility for the next-gen AMD Ryzen CPUs. To be clear: Our intention is to offer maximum compatibility for as many MSI products as possible. Towards the launch of the next-gen AMD CPUs, we will release a compatibility list of MSI AM4 motherboards. Below is a full list of upcoming BIOS versions which include compatibility for the next-gen AMD APUs for our 300-Series and 400-Series AM4 motherboards based on the latest AMD Combo PI version 1.0.0.0. These BIOS versions are expected to be released in May this year.

GIGABYTE Rolls Out Aorus ATC800 CPU Cooler

GIGABYTE rolled out the Aorus ATC800 air CPU cooler. Its design involves a conventional aluminium fin-stack tower-type heatsink that's ventilated by two pre-installed custom-design fans in push-pull arrangement. A plastic shroud covers the top of the fin-stack, and frames the two fans. The top-plate is studded with an RGB LED diffuser. The two fans come with RGB LED lighting, too. All three lighting elements take input from a single 3-pin addressable RGB source.

Six 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. Each of the two 120 mm double ball-bearing fans take in 4-pin PWM input, spin between 600 to 2,000 RPM, push 14.05 to 51.7 CFM of air-flow, with a noise output ranging between 18 to 31 dBA. Measuring 139 mm x 107 mm x 163 mm, the cooler weighs 1.01 kg. It offers 37.4 mm of clearance to the memory module installed closest to the CPU socket. The cooler is rated for thermal loads of 200 W. Among its sockets supported are AM4, LGA2066, and LGA115x. The company didn't reveal pricing.

MSI Betrays AMD's Socket AM4 Longevity Promise: No Zen2 for 300-series?

Greedy motherboard vendors such as MSI want you to buy a new motherboard every two generations of processor for no sound reason at all. MSI is reportedly blocking support for 3rd generation Ryzen "Matisse" processors on its AMD 300-series chipset motherboards, including those based on high-end AMD X370 and OC-capable B350 chipsets. This would also put those who own $300 motherboards such as the X370 XPower out of luck. To recap, AMD announced on numerous occasions that it doesn't want to be a greedy clique like its competitor, by forcing motherboard upgrades and promised that socket AM4 motherboards will be backwards and forwards compatible with at least four generations of Ryzen processors, running all the way up to 2020.

This normally should mean that any 300-series motherboard must support 4th generation Ryzen processors with a simple BIOS update. Most 300-series motherboards, including from MSI, even ship with USB BIOS Flashback feature to help with forwards compatibility. Unfortunately, motherboard companies such as MSI care more about their bottom-lines than the consumer. In a support e-mail to an X370 XPower Titanium owner, MSI confirmed that it will not extend Zen 2 support to AMD 300-series. Other motherboard vendors could follow MSI's suit as a representative of another motherboard vendor, on condition of anonymity, told TechPowerUp that "Zen 2" processors have steeper electrical requirements that 300-series motherboards don't meet. This is an excuse similar to the one Intel gave for the planned obsolescence of its 100-series and 200-series chipsets, even as it was repeatedly proven that those motherboards can run and overclock 9th generation processors with custom firmware just fine. Would MSI care to explain whether a B450M PRO-M2 has a stronger VRM than an X370 XPower Titanium to warrant "Zen 2" support? Will all "Zen 2" processor SKUs have steep electrical requirements? Will there not be any SKUs with double-digit-Watt TDP ratings?

Update (16/04): MSI posted a clarification on this issue.

DeepCool Intros Castle 240 RGB V2 Cooler with Anti-leak Tech Inside

DeepCool today introduced the Gamer Storm Castle 240 RGB V2 all-in-one closed-loop liquid CPU cooler with an innovation that minimizes the risk of coolant leakages caused due to environmental air-pressure fluctuations. Called DeepCool Anti-leak Tech Inside, the innovation is an elastic pressure-relief bag inside the radiator's reservoir, which has an opening on one end to the air outside. When there is a pressure differential between the air outside and the coolant inside, the elastic bag either contracts or expands, adjusting the reservoir's volume to normalize pressure. DeepCool also extended the design-goal of leakage prevention to the coolant tube design, by using IIR (isobutyline-isopropylene rubber), a material used in slick aircraft tyres that has high elasticity to cope with touchdown. The inner tube is reinforced by fiber-weave sleeving.

This aside, the Castle 240 RGB V2 looks and performs like the original. Its design includes a somewhat tall, cylindrical pump-block with an RGB LED diffuser up top, plumbed to a 240 mm x 120 mm radiator with two included RGB LED fans. The pump's rated noise is 17.8 dBA at its fixed speed of 2,500 RPM. Each of the included fans spins between 500 to 1,800 RPM, pushing up to 69.34 CFM of air, with a noise output under 30 dBA. DeepCool includes retention modules for AMD sockets TR4 and AM4; and Intel sockets LGA2066 and LGA115x. The company didn't reveal pricing.

AMD "Castle Peak," "Rome," and "Matisse" Referenced in Latest AIDA64 Changelog

FinalWire over the past week posted the latest public beta of AIDA64, which adds support for the three key processor product lines based on AMD's "Zen 2" microarchitecture. The "Matisse" multi-chip module, which received extensive coverage over the past few weeks, will be AMD's main derivative of "Zen 2," designed for the client-segment socket AM4 platform, with up to 16 CPU cores, and the initial flagship product featuring 12 cores. "Rome" is AMD's all-important enterprise-segment MCM for the SP3 platform, with up to 64 CPU cores spread across eight 8-core chiplets interfacing a centralized I/O controller die with a monolithic 8-channel memory controller. It so happens that AMD also wants to update its Ryzen Threadripper line of high-end desktop processors, with "Castle Peak."

"Castle Peak" is codename for 3rd generation Ryzen Threadripper and a client-segment derivative of the "Rome" MCM with a reconfigured I/O controller die that has a monolithic 4-channel DDR4 memory interface, and an unspecified number of CPU cores north of 24. This is for backwards compatibility with the existing AMD X399 motherboards. AMD configures core-count by physically changing the number of 8-core chiplets on the MCM, in addition to disabling cores in groups of 2 within the chiplet. The company could scale core counts looking at its competitive environment. The monolithic quad-channel memory interface could significantly improve the chip's memory performance compared to current-generation Threadrippers, particularly the Threadripper WX series chips in which half the CPU cores are memory bandwidth-starved. The AIDA64 update also improves detection of existing Ryzen/EPYC processors with the K17.3 and K17.5 integrated northbridges.

DOWNLOAD: FinalWire AIDA64 Extreme 5.99.4983 beta

AMD to Simultaneously Launch 3rd Gen Ryzen and Unveil Radeon "Navi" This June

TAITRA, the governing body behind the annual Computex trade-show held in Taipei each June, announced that AMD CEO Dr. Lisa Su will host a keynote address which promises to be as exciting as her CES keynote. It is revealed that Dr. Su will simultaneously launch or unveil at least four product lines. High up the agenda is AMD's highly anticipated 3rd generation Ryzen desktop processors in the socket AM4 package, based on "Zen 2" microarchitecture, and a multi-chip module (MCM) codenamed "Matisse." This launch could be followed up by a major announcement related to the company's 2nd generation EPYC enterprise processors based on the "Rome" MCM.

PC enthusiasts are in for a second major announcement, this time from RTG, with a technical reveal or unveiling of Radeon "Navi," the company's first GPU designed from the ground up for the 7 nm silicon fabrication process. It remains to be seen which market-segment AMD targets with the first "Navi" products, and the question on everyone's minds, whether AMD added DXR acceleration, could be answered. Lastly, the company could announce more variants of its Radeon Instinct DNN accelerators.

Spire Intros LCG-HSR Line of AIO Liquid CPU Coolers

Spire today introduced the LCG-HSR line of all-in-one closed-loop liquid CPU coolers, with two models, the CG-AE-LCG-H24SR-P featuring a 240 mm x 120 mm radiator, and the CG-AE-LCG-H12SR-P "Solo," with a 120 mm x 120 mm radiator. These coolers are characterized by a cubical pump-block, Nylon-sleeved coolant tubes, and one or two included CG-AE-H30K3AR-6PM fans. These fans feature RGB LED diffusers along the inner and outer walls of the frame, with 16 diodes taking input from a standard 4-pin RGB connector. Unlike the fan's standalone package, Spire isn't including RGB LED controllers with these coolers.

The included fans take in 4-pin PWM input, spin between 300 to 2,000 RPM with minimum airflow of 30 CFM, and noise-level ranging between 12 to 35 dBA, each. Both coolers support most common CPU socket types, including AM4, AM3(+), LGA2066, LGA2011(v3), LGA1366, and LGA115x. Spire is listing the CG-AE-LCG-H24SR-P at USD $80 and CG-AE-LCG-H12SR-P at USD $70, in 200-unit bulk quantities. Retail prices will be higher than these.

Thermalright Intros Silver Arrow IB-E Extreme Rev. B CPU Cooler

Thermalright today rolled out the Silver Arrow IB-E Extreme Rev. B CPU cooler. Thermalright has made changes to the design to make sure the fin-stack is slightly offset from the base in directions that free up headroom near the memory area and topmost expansion slot of a typical mainstream-desktop motherboard, giving you easy access to the memory and M.2 slots closest to the CPU socket.

Heat drawn from a heavier mirror-finished nickel-plated copper base is conveyed to the fin-stacks by eight 6 mm-thick heat pipes. The lavish use of heavy copper used in this heatsink make it tip the scales at 850 g, without fans. With both its fans installed, the Silver Arrow IB-E Extreme Rev. B can handle thermal loads of up to 320W. Each of the two included TY-143 140 mm fans spin between 600 to 2,500 RPM, pushing 31.4 to 130 CFM of air, with a noise output ranging between 21 to 45 dBA. Thermalright has updated the CPU socket support to include AM4 and LGA2066, besides LGA115x and LGA2011(v3). The heatsink measures 155 mm x 130 mm x 163 mm (LxWxH). The company didn't reveal pricing.

AMD Ryzen 3000 "Zen 2" BIOS Analysis Reveals New Options for Overclocking & Tweaking

AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips.

At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.

ENERMAX Announces LIQMAX III AIO Liquid CPU Cooler

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, introduces LIQMAX III, the new generation of LIQMAX, one of the proclaimed AIO CPU cooler series from ENERMAX. Like the award-winning predecessors featuring superior cooling performance as well as rock-solid quality, LIQMAX III is built with a luminous Aurabelt water-block supporting synchronizabale RGB lighting with RGB motherboards from ASRock, ASUS, Gigabyte, and MSI. LIQMAX III is undoubtedly an excellent choice for mainstream water-cooled RGB gaming rigs.

The premium Aurabelt water-block provides luminous RGB lighting; besides, the exquisite water block is able to support RGB lighting synchronization with motherboards that come with 4pin RGB header(s) (12V/G/R/B). Users can select the preferred lighting styles via the RGB motherboard software.

Scythe presents Kotetsu Mark II & Choten TUF Gaming Alliance Coolers

Japanese cooling expert Scythe presents two special editions of its CPU Cooler models Kotetsu Mark II and Choten as part of the ASUS TUF Gaming Alliance series. Both products bundle their unique advantages with the fancy design of the TUF Gaming Alliance series and gorgeous RGB illumination.

Scythe Kotetsu Mark II TUF Gaming Alliance Edition is based on the award-winning Kotetsu Mark II, offering outstanding performance even for overclocking purposes at impressively low noise levels. The Scythe Choten TUF Gaming Alliance on the other hand, aims for much more compact PC case environments while providing excellent balance between size, compatibility and performance.

Alpenföhn Unveils the Brocken ECO Advanced CPU Cooler

Alpenföhn today unveiled the Brocken ECO Advanced CPU cooler, available for pre-order through Overclockers UK in the EU. The Brocken ECO Advanced is the latest CPU cooler from German manufacturer Alphenfohn. It sports an asymmetrical design, with a compact size allowing almost universal compatibility of the adjacent RAM modules - no matter the height of the heat spreader.

The Brocken ECO Advanced offers an overall increased cooler size and with a new high performance fan gives cooling support for a TDP of 170 Watts; making it perfect for overclockers. It's ultra-quiet 120 mm WingBoost 3 fan, featuring redesigned blades and a fixed guide, increased volume flow whilst reducing total noise output.

MSI Rolls Out AMD 400-series BIOS Updates with "Zen 2" Microcode

MSI mid-March began quietly rolling out BIOS updates for its socket AM4 motherboards based on AMD 400-series chipset, with a very ominous BIOS change-log entry: "Support new upcoming AMD CPU." At first, we dismissed this for being the company's follow-up to its 6th March announcement of support for some of the newer Athlon processor models, namely the 220GE and 240GE. After updating our MSI B450 Gaming Pro Carbon AC with one of these BIOSes, however, we discovered a very interesting microcode string - AGESA COMBO-AM4 0.0.7.2.

Such a major change in AGESA shouldn't be warranted to add support for two new chips based on existing "Raven Ridge" architecture that both AGESA "Summit Ridge" and AGESA PiR (Pinnacle Ridge) series microcodes should be able to comfortably run. We spoke with sources familiar with AMD microcode, who revealed that this AGESA COMBO-AM4 0.0.7.2 is designed for the upcoming "Zen 2" microarchitecture, and its first socket AM4 implementation, codenamed "Matisse." AMD internal versions of AGESA with Matisse support begin with the version sequence 0.0.7.x., and as we head closer to formal launch of these chips, AMD could release a 1.0.0.0 version of "AGESA COMBO-AM4." For our B450 Gaming Pro Carbon AC, the BIOS version packing this new AGESA is v1.60, and we wager this board should now be able to run Ryzen "Matisse" engineering samples. Now, if we can only get our hands on one.

Noctua Presents NH-U12A Premium Class 120mm CPU Cooler

Noctua today presented its new NH-U12A premium-quality quiet CPU cooler. The NH-U12A is the latest, 5th generation of Noctua's award-winning U12 series of 120mm size coolers. Conceived to push the envelope of the 120mm form factor, it combines two of Noctua's flagship model NF-A12x25 PWM 120mm fans with a completely redesigned heatsink featuring 7 heatpipes and an increased fin surface area for superior heat dissipation. This way, the NH-U12A can rival the performance of many 140mm sized coolers while offering 120mm class case and PCIe compatibility.

"The original NH-U12 was the very first product we introduced back in 2005 and the U12 series has been at the core of our product line-up ever since," explains Roland Mossig (Noctua CEO). "Today, we're proud to continue this successful legacy by introducing the 5th generation that provides even better quiet cooling performance, which enables it to compete with much larger units while offering superior compatibility. In a nutshell, the NH-U12A is an ideal choice for customers who are looking for a cutting-edge cooler that's hassle-free to integrate in most setups."

Intel to Refresh its LGA2066 HEDT Platform This Summer?

Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the "Cascade Lake" microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new "Cascade Lake-X" silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of "Meltdown" and "Spectre."

Elsewhere in the industry, and sticking with Intel, we've known since November 2018 of the existence of "Comet Lake," which is a 10-core silicon for the LGA1151 platform, and which is yet another "Skylake" derivative built on existing 14 nm process. This chip is real, and will be Intel's last line of defense against AMD's first 7 nm "Zen 2" socket AM4 processors, with core-counts of 12-16.

Alphacool Unveils Eisbaer Solo Chrome DIY CPU Pump+Block

Alphacool today unveiled the Eisbaer Solo Chrome DIY pump+block, a variant of Eisbaer Solo that features a chrome mirror-finish body along three out of four sides, and the top, with a clear acrylic window covering one of the sides. You plumb your own coolant tubes and radiator to the contraption, which combines the functionality of a CPU water-block, a 70 l/h pump, and reservoir into one. The pump features an ultra low-noise ceramic bearing and operational speed of 2,600 RPM and a maximum head of 0.85 m. The package includes mounting brackets for LGA2066/2011, LGA115x, LGA1366, and AM4 sockets; in addition to some thermal compound. Available now, it is priced at 54.95€ including taxes.

Noctua CPU Coolers Now Include AM4 Mounting at No Extra Cost

Noctua today announced that all of its current multi-socket desktop CPU coolers, such as the popular NH-D15, NH-U14S and NH-U12S, now also include installation hardware for the AM4 socket of AMD's Ryzen processors. Although Noctua introduced its dedicated SE-AM4 models in early 2017 and has provided free-of-charge upgrade kits ever since the launch of the AM4 platform, the updates of the existing multi-socket models now allow customers to install them on all current mainstream sockets without ordering extra mounting kits. As suggested retail prices remain unchanged, the updates come at no extra cost to the customers.

"We've supported AMD's Ryzen platform with our SE-AM4 models and free-of-charge mounting upgrades from the very beginning", says Roland Mossig (Noctua CEO). "As with Intel's LGA115x and 20xx platforms, our customers have greatly appreciated our free upgrade policy. We've provided many thousands of free mounting kits and quite a few customers have migrated 10-year-old heatsinks they had already used on several socket generations. This means a lot to us and we'll continue to offer the free kits of course. However, with AM4 becoming more and more popular, we think it is time to also include the mountings with our existing models so that customers have everything at hand when they purchase new coolers."

ASMedia to Continue as Chipset Supplier to AMD, But X570 an In-house Chipset

AMD's socket AM4 and socket TR4 chipsets are originally designed by ASMedia. With its "Zen" family of processors being full-fledged SoCs, the motherboard "chipset" only serves to increase connectivity, and ASMedia already holds certifications for key groups such as the PCI-SIG, USB-IF, SATA-IO, NVM-Express group, etc. It's being reported now that ASMedia will develop some, if not all 500-series chipsets, with the exception of X570. The X570 will be an in-house design by AMD, which will use its own foundry partners (likely GloFo 14 nm) to manufacture it. This presents AMD with an opportunity to harden it against vulnerabilities, and have greater control over pricing, not to mention overcoming key design shortfalls of "Promontory," such as downstream PCIe connectivity.

This flies in the face of speculation that AMD would discontinue ASMedia's supply of chipset, especially in the wake of the "Chimera" vulnerability affecting "Promontory" 300-series and 400-series chipsets. The supposedly security-hardened 500-series chipset will feature PCI-Express gen 4.0 certification. What this means is that the chipset bus between the AM4/TR4 SoC and the chipset will be PCI-Express 4.0 x4 (64 Gbps), translating to double the bandwidth. It remains to be seen if the downstream PCIe lanes put out by the chipset are gen 4.0, too. Current 400-series chipsets continue to put out stale gen 2.0 lanes, compensated for by additional gen 3.0 lanes put out by the SoC. Sources also mention that ASMedia-supplied chipsets will only hit the market toward the end of 2019, which means AMD X570 could be the only 500-series chipset option between the mid-2019 launch of 3rd generation Ryzen, and late-2019. You should be able to run these processors on older socket AM4 motherboards via BIOS updates, though.

ASRock Readies Nine AMD X570 Motherboards with "Zen 2" Matisse Support

Sometime mid-2019, AMD will launch its 3rd generation Ryzen "Zen 2" processors with core counts of up to 16 cores in the AM4 package. These processors will launch alongside the new AMD 500-series desktop chipset family, led by the X570. AMD assures backwards compatibility of these processors with older chipsets provided motherboard vendors support their customers with BIOS updates. You'll probably need a 500-series chipset motherboard to use PCI-Express gen 4.0 connectivity, while older chipsets will limit connectivity to gen 3.0 (not that there are any GPUs that use gen 4.0).

ASRock is developing as many as nine motherboard models based on the AMD X570, according to a list scored by VideoCardz. These include the X570 Phantom Gaming X and X570 Taichi leading the top-end; X570 Phantom Gaming 6, X570 Phantom Gaming 4, and X570 Extreme4 covering the mid-range, and the entry-level of the lineup consisting of the X570 Pro4/R2.0 and X570M Pro4/R2.0.

ASRock Launches World's First Mini-STX Platform Based on AMD A300: DeskMini A300

The leading global motherboard and graphics card manufacturer, ASRock, pleasure to announce the world's first AMD based Mini STX Platform - DeskMini A300 at CES 2019. It adopts with AMD A300 chipset, not only supports AMD AM4 65W APU, but also provides up to 32GB DDR4-2933MHz high-speed memory, which leads to outstanding computing power and 3D performance. DeskMini A300 offers up to 4 storage interfaces, supports three display outputs simultaneously, M.2 Wi-Fi module and various accessories within 1.9 Liter compact size. DeskMini A300 is an ideal choice to build a home entertainment PC and mini data center.

DeskMini A300 features the brand new A300M-STX motherboard. Continuing the design of the ASRock DeskMini series, the AMD AM4 socket is able to support the Bristol Ridge and Raven Ridge's 65W APU, as well as two DDR4 SO-DIMM slots, which can support up to 32GB of capacity. With overclocking memory module, it will power up 20% of 3D gaming performance even more . Moreover, the DeskMini A300 supports three display outputs simultaneously, greatly improves the user experience.

ASRock Announces Steel Legend Family of Motherboards

The leading global motherboard manufacturer, ASRock, is proud to introduce the new ASRock Steel Legend motherboard series. ASRock Steel Legend motherboards are built around the most demanding specs and features to provide a wide array of materials, components, and features that ensure stable and reliable performance. Steel Legend motherboards stand out from the crowd through its massive and luscious XXL Aluminum Alloy Heatsinks, I/O Armor, PCI-E Steel Slot, Polychrome Sync (Addressable RGB LED) support, and detailed PCB print on Sapphire Black PCB for mainstream users, gamers, and professionals that choose to work and play in style. With support for the latest AMD Ryzen processors, as well as high-quality audio featuring the highest quality Nichicon golden audio caps and signal shielding integrated into the PCB.

ASRock has gone to great lengths to ensure optimum stability and protection. With ASRock Full Spike Protection on all USB, Audio and LAN ports, users are always protected from Lightning/ESD damage, which is a comforting thought when using Steel Legend motherboards in challenging environments. Use of Premium 60A Power Chokes and Nichicon 12K Black Caps means not only that the B450 Steel Legend and B450M Steel Legend will remain rock solid no matter the task, but it also keeps your system stable when overclocking, for extra performance, whether you're gaming or rendering professional content.

ENERMAX Expands LIQFUSION RGB Liquid Cooler Lineup with 360 Version

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is expanding the acclaimed RGB liquid cooler series, LIQFUSION, with the addition of a 360mm AIO cooler. After the launch of the 240 variant, LIQFUSION has got users' attention and recognition for its cooling performance and brilliant lighting effects. With the larger cooling surface, LIQFUSION 360 is able to easily handle a large amount of heat produced by the overclocked CPUs. Moreover, LIQFUSION comes with an addressable RGB-sync waterblock featuring patented flow indicator, which allows the users to monitor the status of coolant flow. Along with ENERMAX addressable RGB fans, LIQFUSION can create visual appealing lighting effects.

LIQFUSION can sync the RGB lighting with motherboards featuring addressable RGB headers (4-pin assignment: +5V/D/-/G). Users can select preferred effects via the motherboard RGB software with 16.8 million color options. On the other hand, for those who use non-RGB motherboards, they can use the included RGB control box to select preferred lighting color, speed, and effects (10 pre-set effects).

AMD 3rd Gen Ryzen AM4 Package Capable of Two 8-core Chiplets

At its CES 2019 keynote, AMD unveiled two killer client-segment products, the Radeon VII graphics card, which beats the GeForce RTX 2080; and a sneak preview of the 3rd generation Ryzen socket AM4 processor based on the company's "Zen 2" microarchitecture. As part of the unveil, CEO Lisa Su demonstrated an 8-core/16-thread 3rd generation Ryzen prototype processor in a head-to-head CineBench nT face-off with the Intel Core i9-9900K processor, which has the same core-count. The Ryzen narrowly beat the Intel flagship. Following this, Dr. Su held up a de-lidded sibling of the processor that was tested, revealing not one, but two dies.

This confirms that AMD is taking the heterogeneous multi-chip module approach to building its 3rd generation Ryzen processors, much like its 2nd generation EPYC processors that were unveiled late last year. The MCM of the processor Dr. Su held up had two chips, the smaller chip is an 8-core CPU chiplet built on the 7 nm process, that appears to have the same die-size as the 8-core chiplets that make up the 64-core 2nd gen EPYC MCMs, the larger die is an I/O controller logic built on the 14 nm process. This die controls the memory, PCIe, and SoC connectivity of the package. We noticed something curious about the way the two dies are arranged on the package substrate.
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