AMD is slowly preparing to launch its next-generation processors based on the new AM5 socket. The new lineup of processors will be based on the upgraded Zen 4 architecture that is said to bring multiple microarchitecture improvements and enhancements, equaling to a possible high-performance increase. Today, according to ExecutableFix, the person who provided us with renders of AMD's upcoming AM5 socket designed for next-generation Raphael processors. As we previously reported, AM5 is doing away from PGA and switching to LGA type instead, where pins are delivered on the socket, not the CPU like we used to see with AMD processors.

The LGA-1718 socket, pictured in the renders below, looks like a simple retention mechanism, where there is one metal arm to hold the lid down under pressure. If it turns out to be true, this implementation will be a very positive upgrade over the past PGA socket found on AM4 and before. We can look forward to seeing what AMD will deliver once the launch of Raphael processors gets closer.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

GIGABYTE rolled out the X570S Gaming X motherboard, expanding its line of AMD X570S motherboards that debuted in June with a trio of AORUS Gaming and AERO series products. The Gaming X sticks to GIGABYTE's main brand, and is usually priced below its AORUS Gaming models. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX and single 8-pin EPS connectors. It uses a 6-layer PCB for better memory and PCIe signalling. A 14-phase (12+2 phase) VRM powers the CPU, with an enlarged MOSFET heatsink. The AMD X570S chipset is cooled by a fanless heatsink.

The AM4 socket is wired to a PCI-Express 4.0 x16 slot, and M.2 NVMe slot with PCI-Express 4.0 x4 wiring. There are two additional M.2 NVMe slots wired to the X570S chipset, both capable of PCI-Express 4.0 x4. Other expansion slots include a PCI-Express x16 (Gen 4 x2 electrical), and two Gen 4 x1 slots. USB connectivity includes two 10 Gbps USB 3.2 ports on the rear panel, one of which is type-C; and seven 5 Gbps USB 3.2 ports, from which four are on the rear panel, one is an internal type-C port, and two ports via headers. The sole network interface is a 2.5 GbE, driven by a Realtek 8125B controller. The 8-channel onboard audio is basic Realtek ALC892 fare. The board comes with out-of-the-box support for Ryzen 5000 "Vermeer," and Ryzen 5000G "Cezanne" processors, besides Ryzen 3000 series. The company didn't reveal pricing, but we expect this to go for well under $180.

Thermaltake today introduced the ToughLiquid Ultra line of all-in-one, closed-loop liquid CPU coolers, featuring ToughFan Turbo fans. Available in two variants based on radiator size—240 mm x 120 mm and 360 mm x 120 mm, these coolers are characterized by a high-speed 3,200 RPM pump-block that has a color LCD screen that displays cooling performance monitoring, or pretty much anything you want it to display; and the ToughFan Turbo fans that turn at speeds of up to 2,500 RPM, each pushing up to 72.69 CFM of airflow with 3.78 mm H₂O static pressure, and 28.1 dBA noise output. Among the CPU socket types supported are LGA2066, LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

Thermalright is on a roll with top-flow CPU cooler launches lately, and just added its latest creation, the AXP90-X47 Full Copper. Fit for low-profile builds, this 47 mm-tall top-flow cooler, as its name suggests, uses a heatsink that's made almost entirely of copper, complete from the base-plate to the heat-pipes, to the dissipation-fins, with the only non-copper bits being the retention module.

Four 6 mm-thick copper heat-pipes make indirect contact with the CPU through a C1100-grade copper base, conveying heat to a stack of 54 copper fins. This 32 mm-tall heatsink is ventilated by a 15 mm-tall TL-9015R 90 mm fan. Featuring a hydraulic bearing, the fan spins at 2,700 RPM, pushing up to 42.58 CFM of airflow at 1.33 mm H₂O static pressure, and 22.4 dBA minimum noise. Measuring 95 mm x 94.5 mm x 47 mm (WxDxH, including fan), the AXP90-X47 Full Copper weighs 520 g. CPU socket types supported are AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Thermalright today introduced the Frost Spirit 140 BLACK V3, a variant of the Frost Spirit 140 that the company introduced in 2019. The dual fin-stack cooler has been redone with black anodized aluminium fins, heat-pipes, and a nickel-plated C1100-grade copper base.

The original's design remains largely intact—four 8 mm-thick heat-pipes make indirect contact with the processor over the base, conveying heat to two aluminium fin-stacks, which are ventilated by a combination of a 120 mm "push" fan, and a 140 mm conveyor between the two fin-stacks. Both fans feature fluid-dynamic bearings. The 120 mm TL-C12B turns at 1,500 RPM, pushing up to 66.17 CFM at up to 25.6 dBA noise output. The 140 mm TL-D14B can do 1,500 RPM, handling up to 77.8 CFM of air-flow, at the same 25.6 dBA noise. CPU socket types supported include LGA1200, LGA115x, LGA2066, and AM4. Measuring 140 mm x 146 mm x 158 mm (WxDxH, including fans), the fully assembled cooler can weigh up to 1.28 kg. The company didn't reveal pricing.

Thermalright today rolled out the AXP90-X36 Black, a low-profile, top-flow CPU cooler. If you're having a sense of deja vu right now, it's probably because of the recent launch of the AXP90-X53 Black, a slightly taller cooler from the brand that looks similar. The numerals in the model names are key here. The "90" denotes fan diameter in mm, while the "36" denotes the cooler's height of just 36 mm. The older AXP90-X53 Black is 53 mm-tall.

The new AXP90-X36 Black uses essentially the same design, and an identical TL-9015B fan, but a slimmer heatsink. It still uses four 6 mm-thick nickel-plated copper heat pipes that make indirect contact through a copper base-plate; which twist into the fin-stack, and are ventilated by the 90 mm spinner, which turns at speeds of up to 2,700 RPM pushing up to 42.58 CFM of airflow, at noise levels as low as 22.4 dBA. The cooler measures 95 mm x 94.5 mm x 36 mm, weighing 230 g. CPU socket types supported are LGA1200, LGA115x, and AM4. The company didn't reveal pricing.

GIGABYTE is giving finishing touches to its new motherboard targeted at creators who like to game, and premium desktop builders, the X570S AERO G. This marks the debut of the company's AERO brand, associated with notebooks, over to the desktop PC components segment. The board's aesthetics appear more in line with the company's VISION line of products. The Socket AM4 motherboard is based on the new AMD X570S chipset, a low-power version of the X570 that can make do with fanless cooling.

What sets the X570S AERO G apart is its five M.2 NVMe Gen 4 slots, leveraging the PCIe Gen 4 downstream connectivity of the X570S. You also get two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and creator-relevant connectivity that includes 2.5 GbE wired LAN, Wi-Fi 6E, and GIGABYTE's highest onboard audio grade. Thunderbolt connectivity is unlikely to be found. The board will come with out-of-the-box support not just for Ryzen 5000 "Vermeer" processors, but also Ryzen 5000G "Cezanne" APUs, which it wires out through DisplayPort and HDMI ports.

Update Jul 5th: GIGABYTE formally launched the X570S AERO G. It lacks 10 GbE, unlike previously reported, offers 2.5 GbE, and comes with USB 3.2x2 (20 Gbps) ports.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready, which can pass the upgraded Windows 11 OS. verification.

Windows 11 is the latest operating system from Microsoft, and features dozens of exciting new functions and Android APP support to effectively improve productivity, system security, and gaming performance. However, most of the users might be confusing that Windows 11 requires TPM 2.0 support means they need a TPM module on board for Windows 11 upgrade.

ID-Cooling today introduced the PinkFlow Diamond Edition, an all-in-one liquid CPU cooler that has a pink+white aesthetic. The star attraction here is the RGB-illuminated ornament on top of the pump-block, which shimmers like a diamond with the LEDs underneath. White Nylon-sleeved tubing connects this to a 240 mm x 120 mm radiator that's completely white, including the fins.

Each of the two included 120 mm fans features a white frame with pink impeller, with addressable RGB LED diffusers along the bore of the frame. The fans turn at speeds ranging between 900 to 2,000 RPM, pushing up to 55.2 CFM of airflow, with up to 2.13 mm H₂O static pressure. Among the CPU socket types supported include AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000 MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets.

The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

AMD Socket AM5 motherboards are set to arrive in Q2-2022, according to PJ, the editor of Uniko's Hardware. This would mean that the Zen 3 + 3D Vertical Cache chiplet AMD CEO Dr Lisa Su showed off in her Computex keynote, could very well be built in the Socket AM4 package, compatible with existing motherboards. The prototype Dr Su showed off appeared Socket AM4, too. AMD claims that the 3D Vertical Cache feature, when paired with a "Zen 3" chiplet, improves gaming performance by a significant 15 percent, helping AMD catch up with Intel's "Rocket Lake-S" processor at gaming. Elsewhere across the landscape, PJ predicts that the Z690 chipset, which goes with "Alder Lake-S" processors in the LGA1700 package, will arrive by Q4 2021, with cost-effective chipsets such as the B660 and H610 in Q1-2022.

Thermalright today updated its CPU cooler lineup with the new TA140 EX, a tower-type air CPU cooler. The cooler looks slender, but that's only because it's ventilated by a large 140 mm fan. Five 6 mm-thick nickel-plated copper heat pipes make contact with the processor through a mirror-finish base of nickel-plated C1100 copper, conveying heat through an aluminium fin-stack of 53 fins.

The included TL-D14X fan features a fluid-dynamic bearing, turns at speeds of up to 1,800 RPM, pushing up to 95.5 CFM of airflow, at 2.25 mm H₂O static pressure, and 30.2 dBA maximum noise output. Among the CPU socket types supported by the Thermalright TA140 EX, are the LGA1200, LGA115x, LGA2066, and AM4. Measuring 145 mm x 72 mm x 158 mm (LxWxH, including fan); the cooler weighs 840 g. The company didn't reveal pricing.

Noctua's ambitious 100% fanless CPU heatsink, the NH-P1, was briefly listed on Newegg for $100. The heatsink offers clearance for standard-height memory and VRM heatsinks of most motherboards; and completely fanless cooling due to the sheer amount of surface area on offer to dissipate heat without the need for an active airflow. The design of the NH-P1 involves a nickel-plated copper base, from which six heat-pipes emerge passing through a gargantuan aluminium fin-stack.

Noctua claims that the cooler can handle mainstream desktop CPUs without the need for fans. These include the Core i9-9900K, Ryzen 7 2700X, etc., which should mean that most non-K 10th Gen and 11th Gen Intel processors; as well as Ryzen 3000 and Ryzen 5000 chips up to 8 cores should run perfectly fine with this heatsink. Among the CPU socket types supported are LGA1200, LGA115x, LGA2066, and AM4. For higher TDP chips, particularly HEDT chips in the LGA2066 package, the heatsink supports the mounting of a pair of 120 mm fans.

AMD today announced the launch of its first Ryzen 5000 series desktop processors with integrated graphics, under the Ryzen 5000G and Ryzen Pro 5000G lines. These processors are based on the 7 nm "Cezanne" silicon, featuring up to 8 CPU cores based on the "Zen 3" microarchitecture, an iGPU based on the "Vega" graphics architecture with up to 8 compute units, but updated display- and media-acceleration engines; 512 KB of L2 cache per core, and 16 MB of L3 cache that's shared between all eight cores. Built in the Socket AM4 package, the processors are compatible with AMD 500-series chipset motherboards. The chips feature PCI-Express Gen 3 downstream I/O.

The consumer Ryzen 5000G series include the Ryzen 7 5700G, and the Ryzen 5 5600G. The 5700G features an 8-core/16-thread CPU, clock speeds of 3.80 GHz, with up to 4.60 GHz boost, and all 8 iGPU compute units being unlocked with up to 2.00 GHz engine clocks. The 5600G, on the other hand, has a 6-core/12-thread CPU clocked at 3.90 GHz, with up to 4.40 GHz boost, and 7 iGPU compute units with up to 1.90 GHz engine clocks. Both chips have their TDP rated at 65 W. AMD claims that the 5700G beats the Core i7-11700 in a variety of content creation and iGPU gaming tasks, as shown in the graphs below; and the iGPU is capable of 1080p e-sports gaming. The 5700G is priced at USD $359, and the 5600G goes for $259. Both chips are available from August 5, 2021.

AMD CEO Dr Lisa Su takes centerstage to demonstrate the latest from AMD. These include announcements from nearly all of the company's business lines, including Ryzen processors, EPYC enterprise processors, Radeon graphics, and more.02:14 UTC: AMD is all about high-performance - Dr Su02:15 UTC: Nearly 100 EPYC based server solutions, and over 400 EPYC-powered cloud instances, by 2022

ASUS teased what is possibly its final round of Socket AM4 motherboards based on the AMD X570 chipset. The boards are based on the X570 chipset with the latest AGESA update that runs the chipset cooler, so thay can made do with fanless heatsink cooling. The teaser pic reveals at least four models—one based in the coveted ProArt line of creator motherboards; one from the TUF Gaming line of value-ended gaming motherboards; one form the ROG Strix series of premium gaming motherboards; and the last from the ROG Crosshair series of enthusiast/overclocking motherboards.

The motherboard in the bottom-right quadrant isn't the Crosshair VIII Dark Hero, but very likely a next-gen Crosshair Formula product. The bottom-left board could be a successor to the ROG Strix X570-E Gaming. The top-right board could be a TUF Gaming X570 Pro successor; while the top-left could be an all new product based in the ProArt series.

Update May 31st: ASUS clarified in a Facebook post that these motherboards use the same X570 chipset, but take advantage of the latest AGESA firmware that lowers TDP of the chipset just enough for motherboard designers to use fanless heatsinks.

Leading global motherboard manufacturer, ASRock, is proud to announce its latest X570S & B550 PG Riptide motherboards for AMD Ryzen AM4 desktop processors. "Riptide is named after a specific kind of water current with strong wave that occurs in the ocean. Riptide is unapparent, yet strong, fast and carries a powerful punch; this is the design philosophy of ASRock PG Riptide series motherboards" Said Chris Lee, General Manager of ASRock motherboard & gaming peripherals business unit.

The Riptide is a new crew of Phantom Gaming series, these stylishly PG Riptide series motherboards are armed to the teeth with gear designed to fulfill gamers everyday needs, without biting into the bank account unlike other similarly spec'd, high-end motherboards.

Tech innovator GELID Solutions unveils the latest ultimate-performance CPU Cooler for AMD and Intel CPU. The GLACIER RGB is a product of GELID Solutions GAMER product line. The newly designed twin-tower heatsink - a core part of the GLACIER RGB - comes with the powerful set of 6 U-Stacked heat pipes to deliver the most efficient heat distribution through the heatsink elements. The twin-tower build of the GLACIER RGB also provides enlarged dissipation area to drain heat out and helps reduce air flow resistance. Additionally, the new heatsink introduces the Enhanced Heatpipe Direct Contact (EHDC) Technology to guarantee perfect thermal contact and facilitate heat transfer between CPU and the heat pipes. As the result, the GLACIER RGB supports TDP over 220 W and makes itself a super-hero CPU Cooler for avid gamers and performance enthusiasts.

A matched pair of the multi-award winning STELLA ARGB Fans compliments the heatsink. Each fan carries 24 ultra-bright and independently controllable ARGB LEDs on board to illuminate stylish Dual Ring Lighting and create spectacular RGB effects. The fans also boast Double Ball Bearing which ensures durable functioning, and integrate the optimized impeller to boost airflow. The intelligent GELID PWM (Pulse Width Module) constantly keeps the fans silent but accelerates speed whenever additional cooling is needed. With the 3 sets of fan mounts, a third optional fan can be installed to raise performance even further.

JONSBO today released the HX6250, a large tower-type CPU cooler that's capable of handling thermal loads of up to 250 W. A massive 1.15 kg tower-type aluminium fin-stack heatsink forms the main cooling muscle. The fin-stack pulls heat from a nickel-plated copper base through six copper heat-pipes. These heat-pipes, and the aluminium fins, feature a graphene-based surface treatment that improves heat dissipation. The heatsink is ventilated by an included 140 mm fan that does 700 to 1,800 RPM, pushing between 34.57 to 90.2 CFM of airflow, and 38 dBA maximum noise output. An included resistor cable can dial things down to 400 to 1,200 RPM, 17.68 to 57.81 CFM, and 28 dBA noise output. The cooler measures 121 mm x 144 mm x 162 mm (DxWxH). Among the CPU socket types supported are LGA2066, LGA1200, LGA115x, and AM4.

Thermalright today rolled out the Black variant of the AXP90-X53 top-flow CPU cooler. The AXP90-X53 Black comes with black anodized aluminium fins, matching copper heat-pipes, and an all-black TL-9015B fan. The cooler's design entails four 6 mm-thick copper heat pipes making contact with the CPU through a nickel-plated copper base, and passing through a stack of 54 aluminium fins arranged along the plane of the motherboard. This is ventilated by a 92 mm hydraulic bearing fan. This fan can turn at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of airflow at 1.33 mm H₂O pressure, with a noise output of 22.4 dBA. The cooler supports LGA1200, LGA115x, and AM4 CPU socket types. The company didn't reveal pricing.

ASUS today announced the Republic of Gamers (ROG) Strix LC II line of all-in-one, liquid, closed-loop, CPU coolers. The series includes five models—the ROG Strix LC II 240, ROG Strix LC II 240 ARGB, ROG Strix LC II 280 ARGB, ROG Strix LC II 360, and ROG Strix LC II 360 ARGB. These coolers are based on the 7th generation of AIO CLCs by Asetek, which feature variable pump speeds starting at 840 RPM, and improved ROG Strix fans included with the coolers. The round pump-block of the ROG Strix LC II is Asetek-standard, and compatible with AMD's sTRX4/sWRX8 CLC brackets.

The Strix LC II 240, ROG Strix LC II 240 ARGB are nearly identical in featuring 240 mm x 120 mm radiators, but the latter comes with addressable RGB LED-illuminated fans like the rest of the series. The ROG Strix LC II 280 is the first in the series to include 140 mm spinners, as it comes with a 280 mm x 140 mm radiator. The ROG Strix LC II 360 comes with the largest radiator of the series—360 mm x 120 mm, its ARGB model includes illuminated fans.

Thermaltake today unveiled the Floe RC 240 Snow Edition and Floe RC 360 Snow Edition all-in-one, closed-loop, liquid CPU+memory coolers. These provide liquid cooling to not just the processor, but also up to four memory modules. Addressable RGB LED illumination covers the pump+block, memory block, and the included 120 mm fans. As Snow Edition SKUs, these feature a white color scheme dominating most bits on the cooler, including the radiator fins. The memory block is compatible only with Thermaltake's own ToughRAM RC line of DDR4 memory modules, as it's designed to attach onto their heatspreaders. Each of the two fans spins between 500 to 1,500 RPM, pushing up to 59.28 CFM of airflow at 1.31 mm H₂O pressure, and noise output of 28.2 dBA. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066.

EK, the premium liquid cooling gear manufacturer, is releasing a Full Nickel version of the EK-Quantum Momentum ROG Crosshair VIII Hero monoblock. This monoblock is engineered specifically for the ROG Crosshair VIII Hero and ROG Crosshair VIII Dark Hero motherboards and features a full-metal design that possesses unrivaled durability and a premium finish. This complete all-in-one (CPU and motherboard) liquid cooling solution for Ryzen AMD processors is compatible with the X570-based ROG Crosshair VIII Hero and Dark Hero motherboards.

The monoblock is equipped with the latest-generation EK cooling engine, used in the Quantum Line to ensure the best possible CPU cooling while not reducing the flow to other components. This water block directly cools AM4 socket type CPU as well as the voltage regulation (MOSFET) module. Liquid flows directly over all critical areas, providing enthusiasts with a great solution for high and stable overclocks. Like every EK monoblock, the EK-Quantum Momentum ROG Crosshair VIII Hero D-RGB also features a high flow design and can be easily used with weaker water pumps or lower pump speed settings as well.

MSI, the world leading gaming motherboard brand, will release optimized BIOS updates for AMD 500-Series and 400-Series motherboards. From now on, the BIOS based on AM4 Combo PI V2 1.2.0.2 for all MSI 500 and 400 series motherboards will be available for download until the end of April. Please refer to the following.

• Optimized compatibility for AMD 500-Series and 400-Series motherboards
• Improved USB device compatibility