SK hynix appears to be expanding its DDR5 lineup with several new chips rated for a native 7200 MT/s speed above the current JEDEC 6400 MT/s standard. Listings spotted by @unikoshardware on Chinese retailer JD.com show new SK hynix DDR5 modules using part numbers not yet seen in the market. According to the findings, SK hynix has prepared four new dies, all capable of 7200 MT/s (denoted by the "KB" suffix), with densities ranging from 2 GB to 4 GB. These include the company's first 2 GB B-die and a 4 GB M-die, marking the first time this process node has been offered at that capacity.

Just last week, we reported on the second generation of SK hynix DDR5 memory chips with 3 GB A-die ICs where the sample reportedly uses an 8-layer PCB. As noted before, to fully exploit the new die's potential, manufacturers are expected to move to 10 or 12-layer PCBs for greater signal integrity, something that would come in handy especially when overclocked. These listings likely represent early samples, with improved designs expected once production ramps up. SK hynix hasn't officially announced the new chips yet, but the listings suggest development is well underway.

As the world becomes more and more centered on data, as well as its processing and storage, increased memory density across products is becoming more of a necessity. It seems that out of this necessity and a need to streamline its memory production towards favoring denser outputs, Samsung is killing of the famous B-die chips, which were - and still are - part of a love affair with any enthusiast's Ryzen desktop.

Memory compatibility issues with the first gen Ryzen took a while to dissipate, and didn't vanish entirely; however, overclockers quickly found that the most stable and overclockable memory ICs all were of the Samsung B-die type. Now, the company has updated its product catalogue to reflect EOL (End of Life) status for B-dies, replacing it with denser M-Die and A-Die products. M-dies were supposed to bring 32 GB densities to a single rank of memory - and have apparently been siphoned off to server applications and left out in the cold for consumer purchase), while the new A dies increase memory density per IC, meaning less of these are necessary to achieve the same final memory footprint. Whether or not these will feature the same Ryzen compatibility and overclockability as their B-die predecessors is unknown at this point, but it would make a lot of enthusiasts slightly unhappy - and increase the value of B-die offerings in any sort of discerning second-hand market - if they did not.