Deutsche Messe announced on Wednesday in Hannover that it is streamlining its event portfolio: it will integrate CEBIT's industry-related topics into HANNOVER MESSE while also developing additional CEBIT topics into specialist events for decision-makers from vertical industries. The realignment is due to reduced space bookings for CEBIT 2019.

Technological developments within the digital economy have reduced demand for horizontal tradeshows such as CEBIT in recent years. Digitalization's innovative impact is particularly evident in the industrial application industries. As such, many of CEBIT's traditional core exhibitors have turned to events targeting these industries to generate new business.

"In recent years, many discussions within the German industry have involved the thematic overlap between HANNOVER MESSE and CEBIT. It is now time to integrate the topics from CEBIT that are relevant for manufacturing, energy and logistics into HANNOVER MESSE ," said Dr. Jochen Köckler, CEO of Deutsche Messe AG. "We are currently examining the digital market to determine which remaining CEBIT topics we will develop into new events."

ZOTAC International, a global manufacturer of innovation, is pleased to announce more innovation ahead of CeBIT 2017 from March 20 to 24 in Hannover. Incorporating exciting technologies in the new products that will revolutionize homes and businesses. A new ZBOX lineup containing next generation processors and features including Thunderbolt 3 dominate the Mini PC side, and the new ZOTAC flagship graphics completes the tour.

ZOTAC has a new generation of ZBOX Mini PCs for both gaming and business. Each Mini PC in the lineup features Intel Kaby Lake processor and provides DDR4 memory support as the foundation. "The Mini PC is replacing the traditional desktop at a rapid pace with their identical capabilities and space saving features, and we want to inject even more features so it is even more accessible to users," says Jacky Huang, Director of Products (Mini PC), ZOTAC International.

Lian-Li Industrial Co. Ltd is pleased to announce that it will bring the latest O Series PC-O9, Q series PC-Q34, and new PC-J60 to CeBIT 2016. Lian Li would like to extend an invitation to all to visit its booth (Hall 17, Booth H24/1) to glimpse its exciting new products.

The O Series launched in 2014 and was lauded for its aesthetics - Lian Li's hallmark brushed aluminum combined with large tempered glass windows, allowing DIY enthusiasts to showcase their most elaborate builds. Like its predecessor, the PC-O8, the PC-O9 uses a larger form factor and incorporates big, beautiful glass panels, but is halved into two compartments: an all-glass area for showcasing hardware, and a more convention aluminum section for hiding cables, drives, and the power supply.

ASUS today announced TUF Sabertooth X99, the world's first consumer desktop motherboard to support all NVM Express storage devices, including PCI Express (PCIe), M.2 PCI Express and the latest 2.5-inch solid-state drives (SSDs) with SFF-8639 via the mini SAS HD connector on the Hyper Kit1 expansion card. With built-in USB 3.1, TUF Sabertooth X99 maximizes choice for ultra-high-speed transfer options speeds, handing users total flexibility.

TUF's newest motherboard additionally introduces all-new and exclusive TUF Detective technology that displays live system information on smartphones and tablets, right at users' fingertips. TUF Sabertooth X99 is also equipped for ultimate cooling with exclusive TUF Thermal Armor, TUF Thermal Radar 2 and TUF ICe technologies. Exceptional durability and tested reliability is assured, with TUF Fortifier and TUF Components, including 10K capacitors, TUF chokes and a military-grade MOSFET.

The global leading motherboard brand ASRock will be debuting the latest SuperSpeed+ USB 3.1 motherboards at CeBIT 2015 Hall 15 Booth D21. With the USB 3.1 specification announced last summer, USB 3.1 featured devices will definitely be in the spotlight at CeBIT 2015.

Besides Type-A Super Speed+ USB 3.1 which is backwards compatible with former USB 3.0/2.0/1.1 ports, ASRock motherboards are also going to be the first in the world to carry Type-C USB 3.1 ports that will support next generation mobile devices. Now, all types of USB 3.1 grants up to 10Gb/s data rates, however only this Type-C interface has a reversible design, so that connectors may fit either way. Moreover, compared to USB 3.0 which only allows 0.9 ampere charging, Type-C USB 3.1 supports up to 3.0 ampere fast device charging, and its durability has been enhanced to withstand over ten thousand plugs and removals. Selected ASRock Z97 chipset motherboards will support both USB 3.1 Type-A and Type-C ports.

Elitegroup Computer System (ECS) is proud to show off whole new LIVA series mini PC in CeBIT! ECS LIVA series mini PC get over 50 recommendations and awards form worldwide media since 2014! New LIVA mini PC features with 14nm processors, provides better graphics performance! In addition, ECS will display whole new LIVA mini PC prototype which adopts with Intel Core M processors. It features with 14% smaller size, larger capacity of SSD, could upgrade up to 1TB, and faster Wi-Fi connection; a perfect balance between size, performance and extension. ECS focus in developing more powerful, multi-functional mini PC, and bring more and better choice to users.

ECS will display exclusive DURATHON technology motherboards also. Implement above and beyond industry standards components and testing to ensure durability and stability. Adopts with triple density PCB to provide better moisture proofing, high quality solid CAPs for longer lifespan; passing over 1500 test stages and extreme temperature resistance. ECS DURATHON motherboard brings best quality product to all users.

Lian-Li Industrial Co. Ltd is pleased to announce that prototypes of the latest O Series Chassis and Desk Chassis will be on display at CeBIT 2015. Lian Li invites all to get a sneak peak at its booth (Hall 17, D26) of the latest editions of the some of the most talked about chassis lines.

Combining the symbiotic relationship of desks and computer cases, the DK-01 and DK-02 were the first desk chassis to be brought to the mainstream market. Now, almost a year after their initial release, Lian Li will be debuting a desk chassis prototype, DK-Q2, that is a result of user feedback. Major updates include a removable motherboard tray, new leg design, and a slimmer body.

The internationally renowned event of the digital industry, CeBIT 2014 is packed with innovations and will start on 10th March in Hannover, Germany. More than 4,000 companies from over 70 countries will showcase their latest high-tech innovations. Among them, MSI, world leading brand in gaming technology, will proudly present a comprehensive line-up of all new gaming hardware, including notebooks, AIO PCs, motherboards, graphics cards, etc.

Eric Kuo, MSI Notebook vice president for global sales & marketing, points out, "As a result of the booming competitive gaming market, there has been an increasing number of heavy-load games, even up to 15.6" 3K monitors and higher resolution gaming experience, so gamers are demanding more in terms of graphics, functions, and other design features. MSI has heard their longings and responded with numerous breakthroughs and innovations. The result has been gaming hardware with the latest processors and graphics technology, coupled with the most advanced and rich array of gaming features like XSplit Gamecaster and SteelSeries Engine (SSE), to create a perfect gaming experience in 2014."

In the year of their 28th anniversary, Antec Inc., leading provider of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, present numerous innovations in the course of this year's CeBIT exhibition in Hanover, Germany. From 10th to 14th March 2014, Antec' new products will be showcased at booth D21 in Hall 15 at the joint stand with Pilot Computer. Among the novelties are the latest models from the Performance One and Gaming series of Chassis, the innovative, in-house designed Antec CPU-H2O coolers, the new High Current Pro power supplies and the brand new EDGE PSU range.

The new Antec EDGE PSU series provides stable output voltages and efficient and reliable system performance. The fully modular power supplies are Haswell-ready, compatible with the new ATX12V 2.4 standard and they are covered with five years of warranty. The models EDGE 550, EDGE 650, EDG 750E and EDG-850 deliver 550 watts, 650 watts, 750 watts and 850 watts of continuous Power. All models are 80 PLUS Gold certified and achieve an efficiency of up to 92 percent. High-performance Japanese capacitors provide a stable DC output and safe regulations. Sufficient PCI Express port connectors and a 13.5cm fan with white LEDs make EDGE the ideal PSU for high-end gamers and enthusiasts.

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

MSI, industry leader in motherboard and graphics card technology is happy to announce the availability of its complete Gaming motherboard lineup. At CeBIT 2013 the world got a first hands-on experience with the new models and the completely new look and feel of the motherboards and thanks to that we've received overwhelming positive reviews from gamers and media. As part of the 2013 series of motherboards, the new Z77 Gaming models will be available far into 2014. Together with the recently introduced Gaming Graphics Cards from MSI, they allow awe-inspiring PC builds from PC Gamers and Enthusiasts.

The MSI Z77 Gaming motherboards are designed to have as little lag as possible, to have the best possible input relay connections from your devices (mouse, keyboard and headset) and have the best audio set up integrated in the motherboard and have room for several graphics cards. These are but a few examples of how MSI has tried to perfect this Gaming motherboard for the enthusiasts who want the best hardware to get the best performance where it counts: in-game.

At CeBIT, Plextor showed off a yet unnamed line of consumer SSDs featuring 19 nm triple-level cell (TLC) NAND flash memory. The series consists of 128 GB, 256 GB, and 512 GB variants, with 256 MB, 512 MB, and 768 MB of DDR3 DRAM cache, respectively. The three are driven by Marvell 88SS9189 processor, and are built in the 2.5-inch form-factor, with SATA 6 Gb/s interface.

The 128 GB variant offers sequential read speeds as high as 530 MB/s, with up to 380 MB/s writes, and 72,000 IOPS 4K random write performance. The 256 GB variant ups that with 540 MB/s reads, and 450 MB/s writes. Leading the pack is the 512 GB variant, with 540 MB/s reads, and 465 MB/s writes. The lineup is expected to be launched this August.

Cooler Master showed off a trio of air-cooling solutions at CeBIT, which includes the TPC 612 and V8 GTS CPU coolers, and JetFlo 120 case fans. The TPC 612 is a compacted version of the TPC 812. It retains the design concept of its older sibling, that of a heatpipe-fed aluminum fin stack that also uses a vapor-chamber tube for more efficient heat transfer; while using just four heat pipes, and a more compact vapor-chamber tube. Measuring 145 x 97 x 161.6 mm (WxDxH, including the fan), it weighs about 640 g. It uses a single 120 mm PWM fan that spins in the range of 600 to 2,000 RPM, pushing 24.9 to an impressive 82.9 CFM of air. The TPC 612 is compatible with all modern CPU socket types.

Moving on, the V8 GTS is Cooler Master's latest monstrosity, one that is designed to take on pre-assembled closed-loop liquid CPU coolers. It uses a triple independent aluminum fin stack design, which is ventilated by a pair of 140 mm fans. An unknown (we're guessing six) number of 6 mm-thick nickel plated copper heat pipes convey heat from the base through the three fin stacks. Measuring a whopping 154 x 149 x 160 mm, it weighs 1,140 g. Each of its two 140 mm fans uses a 4-pin PWM connection, spins at 600 to 1,600 RPM, pushing 28 to 82 CFM of air. Lastly, Cooler Master showed off its JetFlo 120, a neat little 120 mm spinner featuring PWM, 800 to 2,000 RPM speed range, and up to 85 CFM air-flow.

Asustor displayed its first consumer NAS devices implementing Intel's recently announced Atom CE5315 SoC. The new model fill into the company's 3-series. On display at CeBIT are the 2-bay AS-302T and 4-bay AS-304T. The two are positioned a notch below the 2 GHz Atom dual-core powered AS-602T and AS-604T. The two feature single gigabit Ethernet interfaces, a couple of USB 3.0 and USB 2.0/1.1 ports, and HDMI display outputs. The company's ADM 1.0 "Dolphin" interface is standard issue. The two are expected to launch some time in June.

At its CeBIT booth, German PC peripherals maker Be Quiet! unveiled the Shadow Rock 2, its latest high-performance air CPU cooler. Pictured below, the Shadow Rock 2 uses a fairly cube-shaped (120 x 120 x 120 mm) aluminum fin stack with jagged and curved edges; through which four 8 mm-thick copper heatpipes pass; which draw heat from a copper base. A 120 mm Shadow Wings fan comes included. The Shadow Rock 2 is expected to be priced around €45.

At a private media unveiling held on the sidelines of CeBIT, GIGABYTE disclosed its next-generation flagship motherboard, the Z87X-OC. Like most socket LGA1150 motherboards unveiled this week, this one is still under development, and the company is yet to finalize color-scheme and heatsinks for the PCH and VRM, so don't judge it by its looks just yet. The Z87X-OC is designed primarily for overclockers.

The LGA1150 socket is powered by an 8-phase VRM, which draws power from a combination of 4-pin ATX and 8-pin EPS, in addition to the board's 24-pin ATX connector. To stabilize the board's various power domains, you can optionally plug in a 6-pin PCIe power connector. The board gives overclockers a high degree of physical on-the-fly voltage control, and measurement points. One of the chipset's four USB 3.0 ports are wired out as a type-A port on-board, letting you install and run your Windows 7/8 installation off a USB 3.0 flash-drive.

At CeBIT, Enermax showed off its premium Fanless 650W Platinum PSU. Relying entirely on passive cooling, this box offers 100% modular cabling (including the 24-pin ATX and 8-pin EPS connectors), a dynamic hybrid topology, and DC-to-DC switching. To sweeten the deal for those concerned with its 650W capacity, the PSU is 80 Plus Platinum-compliant, with over 94 percent efficiency. It appears to include sufficient cabling for a gaming PC build with up to two graphics cards (a total of four 6+2 pin PCIe connectors).

Here is the first selection of ASRock socket LGA1150 motherboards, pictured at the 2013 CeBIT expo being held in Hanover, Germany. Intel's 4th generation Core "Haswell" desktop processor family introduces the new 1150-pin LGA socket and Intel 8-series chipset, to form the platform. An upgrade to to "Haswell" processors should hence also involve buying new motherboards. Top-two motherboard manufacturers ASUS and GIGABYTE reportedly lack booths at CeBIT, leaving only the rest to show off their LGA1150 goods. This first compilation includes boards by ASRock and BIOSTAR. The boards are also a little rough on the edges, as their component/PCB color schemes, heatsinks, etc., haven't been finalized.

ASRock unveiled two LGA1150 motherboard models, the entry-level B85M, and the high-end Z87-Extreme6 (pictured in that order). The B85M, based on the chipset that succeeds today's small business-optimized B75 chipset, is a compact micro-ATX motherboard. It features just the two DDR3 DIMM slots, an expansion area with a PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical x4), and two legacy PCI slots. Connectivity includes six SATA 6 Gb/s ports, 8-channel HD audio, four USB 3.0 ports, gigabit Ethernet; DVI, D-Sub, and HDMI display outputs, legacy connections such as COM/LPT over headers, and PS/2 mouse/keyboard connectors.

OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced the general availability of the next release of its popular VXL Cache and Virtualization Software. VXL 1.3 has evolved its synchronous data mirroring capabilities and automatic server failover mechanisms to enable 'SAN-less,' highly available, fault tolerant environments based entirely on virtualized host flash. The ability to provide uninterrupted service for business-critical applications even during severe system failures is a requirement for IT managers of any sized data center, and ideally suited for virtualized database deployments, email servers, or cloud computing applications.

Another innovation in this new version of VXL allows IT managers to pre-load the cache with critical data at pre-determined schedules to ensure that important data is available on SSD flash at the precise time it is required by the application.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

With consumers increasingly sharing and viewing content among different devices, Intel Corporation today introduced storage solutions based on the Intel Atom media processor CE5300 series. The new low power system-on-chip (SoC) enables high definition (HD) video to be simultaneously watched on smartphones, tablets and other smart devices, in real time, while also shared with consumer devices such as a Smart TV. "Streaming content across numerous mobile devices, not just from the cloud but locally, has become a common practice for today's consumers," said Bev Crair, general manager, of Intel's Storage Division. "New storage solutions based on the Intel Atom CE5300 series elevate this to a whole new level by making it simple to 'browse, click, and play'. The new SoC provides an excellent foundation for creating compelling entertainment experiences."

The powerful, dual-core Intel Atom CE5300 series delivers simple application and I/O support, making it ideal for synchronizing and streaming video content without compromising power for the performance necessary to allow seamless I/O and media transcoding. Storage solutions based on the Intel Atom CE5300 series allow consumers to easily set up all of their media in one place and avoid capacity limitations of mobile devices. They can use their storage system either as an iTunes server or DLNA (Digital Network Living Alliance) media server, and access that content from their mobile device of choice. Users can also simultaneously transcode 1080p video content to a smartphone, tablet, TV, Ultrabook or other smart device. The media processor system intelligently adapts to the screen resolution for each of these devices.

Touting the innards of a gaming notebook, MSI's Gaming Series AG2712 is a prominent exhibit at the company's CeBIT booth. It features a 27-inch 1080p matte display (which isn't a touchscreen), various Intel Core i5/i7 "Ivy Bridge" processor choices (with chance of a near-future Core "Haswell" refresh), NVIDIA GeForce GTX 670MX as standard equipment, HDMI and D-Sub display outputs, USB 3.0, multi-format card reader, and what appears to be a THX-certified sound-bar lining its bottom.

We've known since a little earlier this week that MSI has been working on a new product line targeting gamers, which builds on the success of its Gaming Series notebooks; that the company has been working on a variant of the Z77A-GD65 motherboard based on the series; and that the series could also include graphics cards and gaming-grade all-in-one desktops. MSI revealed a few more byte ahead of its big CeBIT unveiling.

To begin with, our suspicious voiced last week are true, the company's first Gaming Series motherboard is in fact a variant of the Z77A-GD65, with a few changes: an overhauled VRM and chipset heatsink design inspired by the dragon-head logo; a black+red color scheme, Bigfoot Killer E2200 low-latency network controller, and possibly Creative Sound Blaster Cinema audio. Moving on, we're hearing that the first graphics card in the Gaming Series will be based on GeForce GTX 670. It could be positioned above the company's fastest GTX 670, the Power Edition/OC. In addition to a slightly new cooling solution, the card could feature an improved VRM.

Enermax plans to enter CeBIT with a three main attractions to its booth. First, a new lineup of fanless/silent PSUs; second, additions to its Fulmo line of ATX mid~full-tower cases; and third, the DreamBass line of notebook coolers that replace your notebook's built-in tweeters speakers with ones that can begin to do justice to bass. To begin with, Enermax is looking to launch a line of fanless PSUs in the mid-capacity range (500W-700W), which toss out fans for chunkier heatsinks, feature modular cabling, and are 80 Plus Platinum-compliant.

Moving on, Enermax will show off a handful of its newest gaming PC cases, including the Fulmo ST ATX mid-tower, pictured below. The Fulmo ST, according to the company, is spacious enough for triple graphics-card gaming PC builds, with room for 240 mm radiators, and a liquid-cooling loop that doesn't stick out. It will pack ten 3.5-inch/2.5-inch drive bays, and various nifty locking/mounting mechanisms that help PC enthusiasts. Following its CeBIT unveil, the Fulmo ST will make it to stores in April.

MSI, the world-leading manufacturer of Gaming motherboards, graphics-cards and All-in-Ones PCs storms CeBIT with a new line-up of Gaming products. Hardware enthusiasts and gamers will flock to MSI's new Z77 GAMING motherboards with their new distinctive looks. To complement MSI's new Gaming motherboards MSI will also display a new concept of graphics cards that match the striking looks of the new gaming motherboards. CeBIT 2013 will also be the first opportunity to touch MSI's new AG2712, world's first Gaming All-in-One. 2013 is an exciting year in the computer industry and MSI has reserved a spot in the driver's seat, as can be seen on CeBIT 2013.