Kingston Technology today announced its ultra low-latency, or ULL, DDR3 HyperX memory modules. The new ULL PC3 HyperX modules arrive capable of speeds up to 1375 MHz. Kingston rates the ULL PC3 1375 MHz HyperX with a CAS latency of 5, a new low for DDR3 latencies.

Kingston offers the new ULL PC3 1375 MHz HyperX modules in two packages - a single 1GB module or a 2x1GB kit for dual-channel. Manufacturer suggested retail pricing for the ULL PC3 1375 MHz HyperX modules start at $400 for the KHX11000D3UL/1G single 1GB module and $800 for the KHX11000D3ULK2/2G dual-channel kit.

Super Talent Technology today launched three significant new DDR3 memory modules. The W1600UX2G7 is a 1600MHz PC3-12800 2GB kit (2x1GB) that is tested at very aggressive 7-7-7-18 latencies at 1.8 volts. The W1600UX2G9 is a 1600MHz PC3-12800 2GB kit (2x1GB) that is tested at 9-9-9-21 latencies at 1.8 volts. These kits are built with the newest gigabit IC's, using eight pieces of 128M x 8 chips to produce a single-sided module. Last but not least comes the W1333UB2G8 - the world's first 1333MHz PC3-10660 single 2GB DDR3 DIMM. This product works at CL8-8-8-18 latencies with only 1.8 volts. Street price on the W1600UX2G7 will be approximately $648, while the W1600UX2G9 will sell for $598. The W1333UB2G8 single module will retail for approximately $417. Every Super Talent module built is hand tested under load to ensure the highest level of reliability, and backed with a lifetime warranty.

OCZ Technology Group, today announced the newest OCZ DDR3 product addition. The leading-edge PC3-10666 Platinum Edition was developed to offer the enthusiast community a solution that fully exhausts the capabilities of the Intel P35 and X38 Express chipsets. At 1333MHz, the OCZ PC3-10666 Platinum edition is rated to run CL7-7-7-20, featuring the ideal balance of sheer DDR3 speed and enhanced timings so users can truly take these next generation platforms to greater heights.

G.Skill announced today the availability of its new DDR3-1333 (PC3-10600) CL8 and CL9 kits rated to operate at 1.65 Volts. Available in 2x1GB matched pairs the new F3-10600CL8D-2GBHK (CL8-8-8-21) and F3-10600CL9D-2GBPK (CL9-9-9-24) kits will be available through G.Skill's authorized resellers and distributors worldwide. All G.Skill memory modules come with a lifetime warranty. For more information and specifications of the new PK series products, please click here.

Corsair, today unveiled the world's fastest production DDR3 memory rated at a blazing-fast 1600MHz (PC3-12800) and the world preview of the Corsair DOMINATOR memory running at 2000MHz (PC3-16000). Live demonstration of the new DOMINATOR memory will be on display in the Corsair VIP suite (#1334) at the Grand Hyatt Hotel. The TWIN3X2048-1600C10D DOMINATOR (CL10-8-8-24) is the latest addition to the Corsair line of high-performance memory modules. Also on display is the upcoming generation of DDR3 DOMINATORs, ranging from 1GB modules running at over 2000MHz and 2GB modules showing performance promise for 64-bit based applications. All DDR3 products have been developed to support the new Intel P35 and X38 Express platforms.

Corsair, a worldwide leader in high performance computer products, has formally announced a range of XMS3 modules to complement Intel's Bearlake chipsets. The TWIN3X2048-1066C7 is a 2GB DDR3 kit of matched memory that operates at an effective 1066MHz with 7-7-7-21 timings, representing JEDEC-approved values. The TWIN3X2048-1333C9DHX sports even-faster speeds of 1333MHz with 9-9-9-27 timings. Corsair also expects to launch 1600MHz DDR3 memory modules in the coming months. Presumably, all Corsair DDR3 memory products will be backed by a lifetime warranty and complete customer support.

OCZ Technology Group, today announced their official crossover into DDR3 memory to coincide with the recent launch of the Intel Bearlake Chipset. OCZ's hand-tested DDR3 solutions enable ardent enthusiasts to take advantage of the highly-anticipated P35 platform while experiencing the legendary quality and reliability of OCZ memory. The first OCZ DDR3 products will accommodate standard JEDEC specifications for third generation DDR and offer Gold Series memory kits in PC3-8500 (1066MHz) and PC3-10666 (1333MHz) speed grades. OCZ Gold DDR3 modules are currently available in limited quantity in 2x512MB and 2x1024MB dual channel kits, backed with lifetime warranty and free technical support. For more information on the new OCZ DDR3 solutions, please click here.

Memory maker Super Talent Technology, today officially launched its new line of extreme performance 1333MHz and 1066MHz DDR3 modules. These JEDEC compliant 1GB modules and 2GB kits were designed specifically for the new Intel P35-Bearlake platform, and have already been validated on multiple P35 motherboards. These modules feature custom black cast aluminum HE heat spreaders for optimum thermal performance.

W1333UX2G9 2GB DDR3 Kit (2x 1GB) 1333MHz PC3-10600 9-9-9-27
W1333UB1G9 1GB DDR3 module 1333MHz PC3-10600 9-9-9-27
W1066UX2G7 2GB DDR3 Kit (2x 1GB) 1066MHz PC3-8500 7-7-7-20
W1066UB1G7 1GB DDR3 module 1066MHz PC3-8500 7-7-7-20
These products are all sampling now, and will be shipping in volume in June. W1066UX2G7 is expected to retail for approximately $489.

Two of the world's biggest memory makers - Samsung and Elpida have been validated today on Intel Corporation's reference platform to work with Intel's next generation DDR3 chipsets. This is the largest number of DDR3-based solutions to have passed the validation program. Samsung's Intel-validated solutions include 13 modules and eight monolithic devices in combinations of 512MB/1GB densities with speeds of 800 or 1066MHz. In addition, Japanese Elpida Memory, Inc. has also received Intel's validation of its DDR3 main memory based on the G33 chipset reference platform. As a leading vendor of DDR3, Elpida has a diverse line-up of DDR3 products that include 512MB and 1GB DDR3 modules rated to run 800MHz at CL5-5-5 and 1066MHz at CL7-7-7 timings. DDR3 memory will provide at least twice the bandwidth of today's primary memory - DDR2 - with data transfer rates now up to 1.6Gb/s and default operating voltages down to 1.5V. Samsung and Elpida plan to begin full-scale mass production of its DDR3 chips later this quarter.

Hynix Semiconductor today announced it has received validation on its DDR3 memory components and modules from Intel. The newly-validated DDR3 products are 1GB DDR3 SDRAM Unbuffered-DIMMs manufactured on 80nm process technology. These devices have operating speeds from 800MHz to 1066MHz with reduced voltage to 1.5V. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for the 800MHz, and 7-7-7 for the 1066MHz memory modules. Mass production of the 1GB DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on a 66nm process beginning in late 2007.

Akiba PC Hotline has pictures of DDR3 memory sticks that can be purchased in Japan. The price for a 1GB stick is ~$350.

Japanese Buffalo Ltd. anounced that it will ship its first DDR3 memory modules in Japan by the end of the month. The company will offer a kit of 512MB memory modules (2x 512MB), a single 1GB module as well as a 2GB set (2x1GB). The DDR3 memory standard is considered as the successor of the DDR2 SDRAM. It promises power consumption reduction of 40% compared to current DDR2 modules, allowing lower operating voltages (1.5V, compared to 1.8V in DDR2 modules). Buffalo's new modules run at 1,066MHz((PC3-8500) and maintain the 240-pin DIMM interface of DDR2. Intel has preliminarily announced that they expect to be able to offer support for DDR3 in mid 2007 with a version of their upcoming P35 Bearlake chipset. AMD's roadmap indicates their own adoption of DDR3 to come in 2008.

INTEL DEVELOPER FORUM, Beijing, April 17, 2007 -- Intel Corporation executives today detailed more than 20 new products, technology innovations and industry initiatives -- many of them industry firsts -- aimed at making the World Wide Web, computers and consumer electronics devices much more responsive, friendlier and secure.

Under the backdrop of Intel's leadership in 45nm Hi-k metal gate silicon technology and how it will ignite new innovation and growth opportunities, Intel executives at the Intel Developer Forum disclosed new performance details for its next-generation "Penryn" processor family. The company also unveiled two product roadmaps for Intel architecture (IA)-based System on Chip (SOC) consumer electronic (CE) devices and business uses.

There is one disturbing fact about DDR3. The timings will go bad but the speed of the memory will increase.

DDR3 800 memory will work at CAS latency 5 and 5-5-5 timings and as we all know DDR 2 can beat these settings as some good DDR 2 modules work at 3-4-4 timings and CAS Latency 3 (CL3). Well, that is not the worst latency you will see with DDR3. Some DDR3 800 modules will work at 6-6-6, CL6 timings but will probably end up cheaper.

DDR 3 1066 will start with CL7, 7-7-7 timings and DDR 2 at this speed works well at 5-5-5, CL 5 settings.

DDR3 1333 will work at CL8 with 8-8-8 settings while the fastest DDR 3 at 1600 will end up at 9-9-9, CL 9 settings. The good part is that all of these modules should work at 1.5 V.

We are sure that the companies such as OCZ and Corsair or similar ones will make these modules with even better settings and timings but these are the numbers to start with. CeBIT, the world's biggest IT tradeshow, will reveal a bunch of motherboards and DDR 3 memory modules.

Is the era of low-latency memory over for good?

Super Talent has completed construction of its first DDR3 prototype modules and will be the first to introduce commercial modules. As a member of JEDEC, Super Talent is devoting engineers and time to defining and finalizing the DDR3 specifications. DDR3 is set to be the next PC memory standard and the successor to DDR2 memory. It holds a number of technological advantages over its predecessor. Power consumption has been decreased to 1.5 Volts, while clock speeds have gone up ranging from 800MHz to 1600MHz. In addition, DDR3 modules will also use the same 240-pin form factor. They will not, however, be inter-compatible as DDR2 and DDR3 memory chips have the middle notch located at different positions. Super Talent expects to begin shipping its DDR3 modules long before motherboards supporting them are actually released. Current ship time is estimated at mid-2007.

Pictures of parts of a motherboard using Intel's P35 Express chipset have been posted at Chile Hardware:Motherboards featuring the upcoming Intel P35 Express variant from the upcoming Bearlake-family desktop chipsets will be some of the first to support DDR3 memory. They are officially slated for late 2007.

Apparently the chipset not only supports DDR3, but is also backwards compatible with DDR2. However, both cannot be used at the same time. The leaked motherboard supports up to four sticks of DDR3 memory rated at 800 MHz or 1066 MHz.

It will also support up to a 1333 MHz front-side-bus on Socket T, also known as LGA775 processors. LGA775 processors supported by the upcoming P35 Express-based board include Intel Core 2 Duo, Core 2 Quad and Celeron 4xx-series. There is no mention if previous Pentium 4, Pentium D and Celeron D processors for LGA775 remain supported on the new platform.