ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.

Lexar, a leading global brand of flash memory solutions, is unveiling a variety of new products that are estimated to be launched in Q4 2023. Designed for photography professionals and PC enthusiasts to accelerate their workflow, the expanded portfolio includes a new microSD card, internal SSDs, DRAM, and portable SSDs.

The new Professional GOLD micro SDXC UHS-II card, available in 128 GB and 256 GB, leverages the high-speed performance and a Video Speed Class 60 (V60) rating, allowing users to quickly capture, play back, and transfer high-definition multimedia files, including 4K video, with a read transfer speed up to 280 MB/s. This card is also great for use with gaming devices, sports camcorders, tablets, or smartphones, and drones.

Chuwi, a leading global technology company, has unveiled its latest product, the CoreBox 5th Mini PC. The CoreBox 5th Mini PC is a powerful and versatile solution for the modern office, offering a combination of high performance, compact design, and state-of-the-art features.

The CoreBox 5th Mini PC is powered by Intel's latest 13th Gen Core i5-13500H processor, which is based on the Intel Alder Lake architecture. The Intel Core i5-13500H is a mobile CPU designed for mid-range laptops, utilizing the Raptor Lake-H series (Alder Lake or Raptor Lake architecture). Its release in early 2023 boasts 4 out of 6 performance cores (P-cores) based on the Golden Cove architecture, alongside all 8 efficient cores (E-) using the Gracemont architecture. With Hyper-Threading support on the P-cores, the CPU can handle up to threads in conjunction with the E-cores. The clock rate ranges from 2.6 to 4.7 GHz for single core boost (and up to 4.6 GHz for all cores) on the performance cluster, while the efficient cluster operates between 1.9 and 3.5 GHz. The performance of the E-cores is expected to be comparable older Skylake cores.

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

collaboration with diverse industries and support various applications
Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12 nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung's leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory.

"With our 12 nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data," said SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology."

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, proudly introduces the groundbreaking AORUS Z790 X Gen Motherboards. These motherboards are meticulously crafted to usher in the next generation of computing power, designed to perfectly complement Intel Core processors. With an exceptional focus on DDR5 performance, user-centric BIOS advancements, and innovative hardware enhancements, the AORUS Z790 X Gen Motherboards are built to fully unleash the next-gen power.

DDR5 Performance Redefined
GIGABYTE's commitment to achieving unparalleled next-gen performance shines through in the AORUS Z790 X Gen Motherboards. Equipped with cutting-edge technologies, these motherboards deliver best-in-class DDR5 compatibility and performance. With support for up to DDR5 XMP-8266 or higher, the DDR5 XMP Auto Booster allows users to effortlessly boost native DDR5-5600 to 6000 with a single click. Furthermore, the newly introduced Back Drilling Technology enhances signal integrity, leading to improved system performance and heightened reliability.

Lexar, a leading global brand of flash memory solutions, joined Gamescom 2023 for the first time. Lexar also unveiled some of the new products that are estimated to be launched in Q4 2023 for the first time at the show. Designed for PC enthusiasts to accelerate their workflow, the new portfolio includes internal SSDs, DRAM.

The performance of Lexar ARES RGB DDR5 Desktop Memory reaches a new height of 8000MT/s and 8400MT/s, allowing hardcore gamers and PC enthusiasts to experience superior performance with next-gen DDR5. And, in addition to the performance, this memory also features Lexar RGB Sync so gamers can customize the RGB LED to their own style, and its sleek premium aluminium heat spreader keeps the system cool. It is built with on-die ECC, which leverages real-time data error correction for increased data stability and reliability. With on-board Power Management IC (PMIC), it provides better power control and power delivery.

V-Color Technology Inc, announced the highly anticipated expansion of their product lineup with the launch of the MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit, now available in the SCC 2+2 configuration starting this mid-August. This combo will feature speeds from 6200 up to 6600. The kit showcases v-color's commitment to innovation and quality, highlighted by the Patented RGB Filler Kit designed specifically for Intel systems. It is fully Intel XMP 3.0-Ready, ensuring seamless automatic overclocking. It offers full control over lighting and performance, while being synchronized across motherboards from leading brands like ASUS, GIGABYTE, MSI, and ASROCK. The MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit in SCC 2+2 configuration is set to be available in mid-August 2023, providing tech enthusiasts and professionals alike with a remarkable solution for their computing needs.

TrendForce reports that rising demand for AI servers has driven growth in HBM shipments. Combined with the wave of inventory buildup for DDR5 on the client side, the second quarter saw all three major DRAM suppliers experience shipment growth. Q2 revenue for the DRAM industry reached approximately US$11.43 billion, marking a 20.4% QoQ increase and halting a decline that persisted for three consecutive quarters. Among suppliers, SK hynix saw a significant quarterly growth of over 35% in shipments. The company's shipments of DDR5 and HBM, both of which have higher ASP, increased significantly. As a result, SK hynix's ASP grew counter-cyclically by 7-9%, driving its Q2 revenue to increase by nearly 50%. With revenue reaching US$3.44 billion, SK hynix claimed the second spot in the industry, leading growth in the sector.

Samsung, with its DDR5 process still at 1Ynm and limited shipments in the second quarter, experienced a drop in its ASP by around 7-9%. However, benefitting from inventory buildup by module houses and increased demand for AI server setups, Samsung saw a slight increase in shipments. This led to an 8.6% QoQ increase in Q2 revenue, reaching US$4.53 billion, securing them the top position. Micron, ranking third, was a bit late in HBM development. However, DDR5 shipments held a significant proportion, keeping their ASP relatively stable. Boosted by shipments, its revenue was around US$2.95 billion, a quarterly increase of 15.7%. Both companies saw a reduction in their market share.

In a groundbreaking leap forward for small form factor computing, Simply NUC, Inc, a leading mini PC solutions company, is thrilled to announce the launch of a new product family called Onyx. Powered by Intel's 13th Gen Raptor Lake "H" series processors, Onyx is the world's first 4x4 NUC to feature a Core i9 option. With support for up to an unprecedented 96 GB of DDR5-5200 memory, up to 16 TB of storage, and never before seen benchmark results, Onyx delivers unmatched computing performance for modern business.

"With the launch of Onyx we're redefining what is possible from a 4x4 NUC," said Jonny Smith, Co-CEO at Simply NUC. "Onyx is the culmination of customer-driven innovation and sets the new standard for ultra-small form factor compute power and performance."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, today announced a new VMware vSAN solution optimized to run enterprise class hyperconverged virtualized workloads. As virtualized workloads become more advanced, processing power and storage performance requirements increase, requiring greater capacity to meet application SLAs and maximize virtual machine density. This solution also utilizes the latest Intel AMX accelerator for AI workloads.

When compared to the Supermicro X11 BigTwin, benchmark testing conducted by Supermicro showed up to 4.7X higher IO throughput and 8.2X lower latency on the HCIBench benchmark, up to 4.9X faster image classification inference throughput on the ResNet50 model and up to 4X faster natural language processing throughput on BERT-Large model. In addition, the superior power and efficiency of the Supermicro X13 BigTwin architecture can deliver up to 3X cost and performance improvement within the same node footprint compared to a similar deployment based on older generation Supermicro systems, creating a compelling case for organizations to upgrade their aging infrastructure.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new DDR5 memory kit specifications at DDR5-6400 CL32-39-39 in kit capacities of 32 GB (16 GB x2) and 48 GB (24 GB x2) under the Trident Z5 Neo RGB series, which also now comes in a new white version. Designed for AMD Ryzen 7000 series processors and AMD X670 chipset motherboards with AGESA 1.0.0.7c BIOS updates, and programmed with AMD EXPO overclock profile technology, these new specifications enable PC enthusiasts, overclockers, and DIY builders to build an ideal AMD system.

Overclocked Memory Speed Up to DDR5-6400
With the introduction of the AGESA 1.0.0.7c update, G.SKILL is updating the Trident Z5 Neo RGB series with DDR5-6400 memory kits, designed for use on compatible AMD platforms. Refer to the screenshot below to see the DDR5-6400 CL32-39-39 32 GB (16 GB x2) memory kit validated on the AMD Ryzen 9 7950X desktop processor and the ASUS ROG CROSSHAIR X670E HERO motherboard with the 1602 BIOS update. Memory performance and results may vary depending on the motherboard model, CPU model, and BIOS version used.

Intel's upcoming desktop platform based on Socket LGA1851 will retire support for the DDR4 memory standard. The socket will only support DDR5. With this, Intel would have gracefully transitioned the market from DDR4 to DDR5, with its current Socket LGA1700 that enables both memory stardards, having supported three generations of Core processors (12th thru 14th). Leaf Hobby, a reliable source with Intel leaks, says that LGA1851 will remain Intel's desktop platform till 2026.

LGA1851 is expected to debut with the company's Core desktop processor generation that succeeds 14th Gen "Raptor Lake Refresh." The socket itself has the same dimensions as LGA1700, and is expected to be cooler-compatible with the older socket. The socket will feature pins for up to 32 PCIe lanes—16 toward PEG, 8 toward DMI chipset bus, and two sets of 4 lanes toward CPU-attached NVMe storage. From these, the 16 PEG lanes, and one set of 4 lanes are expected to be Gen 5, while the chipset bus is expected to remain DMI Gen 4 x8, and the second CPU-attached NVMe slot is expected to be Gen 4. The socket could also feature wiring for updated display I/O, as Intel's next-gen processors are expected to introduce updates to the iGPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to present the brand-new B650MT and B650MS2 motherboards, designed to empower both work and entertainment. Built on the performance-oriented AMD B650 chipset, with support for AMD Ryzen 7000 series processors and the latest Ryzen 7000X3D line, these motherboards stand out with unmatched features and top-notch performance for casual and business use, optimized for system integration businesses, enabling seamless management of business data and overall business processes.

The B650MT and B650MS2 feature DDR5 memory, boasting an impressive capacity of 48 GB per module and a 50% increase in bandwidth compared to its predecessor, DDR4. These features make multitasking a breeze and provide a significant increase in productivity. Users can enjoy hassle-free data transfer speeds thanks to the inclusion of PCIe 4.0 and PCIe 4.0 M.2, with the latter offering a bandwidth of 64 Gb/s, making it twice as fast as the PCIe 3.0 M.2. System updates are now more seamless and efficient, courtesy of the Smart Update feature and the SMART BIOS UPDATE, designed to offer online updates and driver installations automatically.

AMD appears set to enhance the core count for its renowned Threadripper series. After a prolonged wait, the high-end desktop (HEDT) platform boasting a significant CPU count returns with the Ryzen Threadripper PRO 7995WX, which features an impressive 96 cores and 192 threads. This marks the series' first core count upgrade since the Threadripper 3000 series. The 7995WX CPU was spotted in the HP Z6 G5 Workstation system, potentially one of the inaugural prebuilt systems from AMD's OEM partners. The Threadripper PRO series seems poised to dominate AMD's HEDT offerings, with no indications of non-PRO consumer models emerging for now.

The latest Geekbench listing unveiled the 7995WX CPU's 96-core configuration. Although the base frequency appears misrepresented, benchmark data hints at the 96-core CPU potentially reaching a boost clock of 5.14 GHz, a detail further confirmed by Geekbench's output. Another notable enhancement in the Threadripper series is introducing the DDR5 memory standard. While the benchmarking tool doesn't explicitly mention this, it does highlight a memory configuration of 503.27 GB (512 GB) in use. The CPU managed to score 2095 points for single-core score and 81408 points for multi-core score on Geekbench v5.5 for Linux (Ubuntu 22.04 LTS), making it one of the fastest CPUs in the database.

The global server market, grappling with the impact of worldwide inflation, saw significant shifts in 2023. Server OEMs and CSPs revamped their investment strategies, resulting in cutbacks in both annual shipments and ODM production plans. TrendForce observes that as the server market continues to decline, demand for AI surges. These combined factors have had a domino effect, compressing the rollout of new server platforms across the board.

Forecasts predict that this year's shipments of server motherboards are expected to decline by a market of 6~7%. Concurrently, shipments of whole servers aren't faring much better, with a projected decrease of 5~6%.

Tachyum today announced that new EDA tools, utilized during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools - including an increase in the number of Prodigy cores to 192.

After RTL design coding, Tachyum began work on completing the physical design (the actual placement of transistors and wires) for Prodigy. After the Prodigy design team had to replace IPs, it also had to replace RTL simulation and physical design tools. Armed with a new set of EDA tools, Tachyum was able to optimize settings and options that increased the number of cores by 50 percent, and SERDES from 64 to 96 on each chip. Die size grew minimally, from 500mm2 to 600mm2 to accommodate improved physical capabilities. While Tachyum could add more of its very efficient cores and still fit into the 858mm2 reticle limit, these cores would be memory bandwidth limited, even with 16 DDR5 controllers running in excess of 7200MT/s. Tachyum cores have much higher performance than any other processor cores.

Leading provider of embedded PC solutions, AAEON, is delighted to announce the official launch of the BOXER-6406-ADN, a compact and fanless embedded computer built upon the Intel Atom Processor X Series/Intel Processor N-series Processor platform.

Designed to cater to the demands of smart factory applications, the BOXER-6406-ADN boasts a range of features that establish it as a remarkably robust choice for industrial projects. Notably, the system boasts an impressive operational temperature range spanning from -20°C to 60°C. Furthermore, it supports a wide voltage input range of 9 V to 36 V, inclusive of over/under-voltage current protection as well as short-circuit protection. To enhance its durability, the system is equipped with IEC 68-2-27 anti-shock tolerance and advanced anti-vibration capabilities. Lockable I/O connectors have also been incorporated to safeguard against wear and tear.

With dimensions measuring just 186 mm x 104.6 mm x 49.1 mm, the BOXER-6406-ADN's compact chassis can be easily wall-mounted for convenient deployment. The system relies solely on passive cooling mechanisms, foregoing fan-assisted cooling systems to prevent the accumulation of contaminants when deployed in smart factory settings.

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will attend Europe's largest and the most iconic consumer electronics trade show, IFA Berlin 2023, to exhibit a series of new laptops for education and business.

Optimize Cloud-Based Learning & Teaching: A New Series of Education Chromebooks Can Fulfill Teachers' and Students' Different Needs
After the world enters the post-pandemic era, there are enormous changes in both teaching and learning modes. Meanwhile, digital trend is arising. To meet various requirements from education fields, ECS launches the brand new SG20, SE40, and EP20 education PC series. These thin and ultraportable laptops feature rugged chassis certified by MIL-STD-810H tests. Equipped with Chrome OS, their battery life can last up to 10 hours. Besides, they support 4G LTE and Wi-Fi 6, which is ideal for remote learning.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has begun supplying the industry's first 24-gigabyte (GB) Low Power Double Data Rate 5X (LPDDR5X) mobile DRAM package to its customers, following the mass production of LPDDR5X in November 2022. SK hynix, in January, developed LPDDR5T, which is an upgraded product of LPDDR5X prior to the development of the 8th generation LPDDR6, and is currently processing customer validation.

"The company integrated the High-K Metal Gate (HKMG) process in the 24 GB LPDDR5X package, enabling the product to deliver outstanding power efficiency and performance," said SK hynix. "The addition of the 24 GB package to our mobile DRAM product portfolio has given us a more flexibility in accommodating customers' needs."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

Valve's Steam Deck handheld gaming console has launched with 16 GB of LPDDR5 memory running at 5500 MT/s. This is distributed over four 32-bit channels for 88 GB/s total bandwidth memory bandwidth. While the storage option can be upgraded, the memory is limited to 16 GB, and the memory chips are soldered. However, it seems like that problem can also be solved only if you are a professional and can solder well. Thanks to the Balázs Triszka on Twitter/X, we have witnessed a mod of Steam Deck, where memory gets upgraded from 16 to 32 GB.

The modder successfully bumped up the system memory using Samsung's LPDDR5 K3LKCKC0BM-MGCP memory chips. All it was needed was some experience with ball grid array (BGA) resoldering. No glue was under the chips, and they were easy to remove. You can see the pictures below, and the system shows the higher memory count.

Every week, Zheng Jiong (ZJ), Intel China's senior director of Client Customer Engineering in the Client Computing Group (CCG), and his team of engineers make the hourlong drive across Shanghai to meet with their counterparts at Lenovo. They make a beeline to the new Advanced System Innovation Lab deep inside Lenovo's offices. It's here that engineers from both companies pool their collective brainpower to solve some of the world's toughest hardware and software challenges - the ones that pave the path to lighter, sleeker and ever-more-powerful laptops that many consumers and businesses depend on every day. This new 750-square-foot lab, which opened in July, is filled with cutting-edge tech tools and laptop prototypes in various stages of development. It's one of many joint engineering labs across the world populated by Intel and Lenovo engineers.

Joint labs like these allow engineers to focus on solving tough issues-- ones that need to be addressed to prevent product delays or empty holiday gift boxes.
Said ZJ: "We share a long and illustrious history of deep engineering collaboration with Lenovo." He added that Intel has dedicated engineers tasked with specific roles in enabling and developing new designs together with their lead collaborator. "We work together very well and are thankful for the innovation support Lenovo has given us through joint labs like these."