BIOSTAR, a leading manufacturer of edge AI computing solutions, industrial PC, graphics cards, and storage devices, today introduces the EdgeComp MT-N150, a compact edge computing system built for intelligent security, surveillance, and smart city applications.

With support for AI acceleration solutions from AI NPU partners, the EdgeComp MT-N150 gives system integrators and AI solution developers the freedom to choose an accelerator platform that aligns with their AI workload, software environment, and project requirements. From facial recognition and crowd monitoring to fire and smoke detection, PPE detection, and license plate recognition, the system brings AI processing closer to where security and monitoring data is generated.

DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip—a pace that industry observers describe as highly unusual for an emerging fabless company at such an early stage of commercialization.

The orders span seven major Physical AI application domains, including robotics, smart factories, edge AI servers, industrial AI, surveillance, AI IT services, and smart cities, with deployments now active across Asia, North America, and Europe.

Ahead of CES 2026, DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today announced the official launch of the DX-H1 vision neural processing unit (V-NPU), a dedicated video intelligence chipset capable of processing hundreds of AI video channels at just 30 W.

Redefining Video AI Infrastructure
The DX-H1 V-NPU is an all-in-one video intelligence solution combining a multi-channel engine capable of decoding, encoding and transcoding with dedicated NPU architecture. Unlike traditional setups that require parallel configurations of GPU servers and hardware codecs, the DX-H1 V-NPU handles the entire pipeline on a single chip -- from stream input to preprocessing, AI inference, and re-encoding.

AAEON's UP brand, a leading designer and manufacturer of industrial development boards, today announced its collaboration with DEEPX, a pioneer in producing power-efficient yet sophisticated AI acceleration modules. The partnership will see multiple models from UP's Development Kit and Mini PC series utilize DEEPX's innovative DX-M1 AI chip to satisfy market demand for ultra-low power, compact, and AI-ready edge platforms upon which customers can build new, innovative industrial automation solutions.

Designed to bring GPU-class AI model execution at just 2 W-5 W, DEEPX's DX-M1 AI chip is particularly well-suited for integration with the UP brand's portfolio of small form factor products, given the module's low power footprint and innovative thermal management. The first UP products to be equipped with the DX-M1 chip will be the recently-released UP Squared Pro TWL and UP Xtreme ARL Development Kits, granting the platforms a boost of 25 TOPs of AI performance alongside preinstalled Linux Ubuntu Pro 24.04 LTS with the UP AI Software Suite and NPU driver.

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX's booth (#9045) in the North Hall of the Las Vegas Convention Center.

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.