Early on in Intel's 3D XPoint teasers and announcements, the company planned to have this memory integrated not only as a system cache solution or SSD replacement, but also as a potential substitute for DRAM memory. The objective: to revolutionize the amount of DRAM memory a given system can carry, at a much lower price per GB, with a somewhat acceptable performance penalty. Intel describes the current DRAM implementation as too small, too expensive, and too unstable (read: data loss on power loss) to continue being on top of the memory food chain. This is where the 3D Xpoint DIMM implementation can bear fruits, by offering significantly higher amounts of storage at much lower pricing, while keeping attractive bandwidth and latency performance. DRAM will still be used for system-critical operations and booting, albeit in lower capacities, and will be used side by side with these 3D XPoint DIMM slots, which will take in the bulk of the work.

This kind of usage for Intel's 3D XPoint also delivers an interesting side-effect: since this memory is persistent (which means that data isn't lost when the power is turned off,) interruption or loss of power won't erase the work in memory. At the same time, this means that this kind of DRAM-substitute memory requires some security precautions DRAM doesn't, since anyone with direct physical access to the stick could just remove one and take it with all the data inside. Even though a 2018 time to market seems a little to optimistic, considering all the changes this implementation would require from adopters, the technology is definitely promising enough to tempt users to make the jump.

AMD, in an interview with Forbes, confirmed that it is working to improve DDR4 memory support of its Ryzen series processors, to enable higher memory clocks. AMD Ryzen users find it difficult to get DDR4 memory clocks to run above 3000 MHz reliably. With memory clock being linked with the chip's Infinity Fabric clock (the interconnect between two CCX units on the "Summit Ridge" silicon), the performance incentives for higher memory clocks are just that much more.

AMD confirmed that its AGESA update for May improves DDR4 memory compatibility, although it also stressed on the need for motherboard manufacturers to improve their board designs in the future, with more PCB layers and better copper traces between the DIMM slots and the SoC socket. The company assures that more updates to AGESA are in the pipeline, and would improve performance of Ryzen processors at various levels. The AGESA updates are dispensed through motherboard vendors as BIOS updates.

Intel today unveiled significant performance advances in its upcoming Intel Xeon Processor Scalable family. At the SAP Sapphire NOW conference, Intel showed up to 1.59x higher Intel Xeon processor performance running in-memory SAP HANA workloads over the generation it replaces, demonstrating what the new products will deliver to help meet the increasingly complex demands of big-data, in-memory workloads in the modern data center.

Diane Bryant, group president of the Data Center Group at Intel, outlined how the Intel Xeon Processor Scalable family - available in mid-2017 - will provide enhanced performance to in-memory applications like SAP HANA. This will provide customers faster time-to-insight and allow organizations to rapidly respond to change.

GeIL showed off its EVO-X series of high-end DDR4 memory, featuring RGB multi-colored LED lighting elements, lining the top of the modules. These DIMMs plug into a control module (included), which takes inputs from an RF remote control, that lets you set color and lighting pattern for each of the DIMMs. The EVO-X series will come in densities of 8 GB and 16 GB, in white and black heatspreader colors, in various DDR4 frequencies, and in dual- and quad-channel kits, making up for dozens of SKUs.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of its latest DDR4 server DIMMs. With speeds of 2666 MT/s, new Crucial DDR4 server memory modules allow for increased performance and bandwidth within data centres and hyperscale environments. They are also available in a variety of server module types and densities ranging from 8GB to 64GB.

New Crucial 2666 MT/s 8Gb-based server memory modules are approximately 11 percent faster than the previously released 2400 MT/s DIMMs. Additionally, the newly expanded portfolio of Crucial server memory will support cloud and enterprise environments that are migrating to next-generation Intel server platforms.

On their Facebook page, MSI have given a little tease regarding their upcoming next generation Intel Z270 boards. Details are scarce at the moment, but these motherboards are to be marketed under MSI's PRO series, with the Z270 SLI Plus featuring a clean, high-contrast black and white color scheme, while the Z270 SLI opts for an almost totally black design.

The Z270 SLI Plus is the higher-end product of the two. It sports a 10-Phase PWM circuitry, cooled with the aid of two heatsinks in the ATX form-factor. As usual, it has four DIMM slots which leverage MSI's DDR4 Boost feature, and support for XMP profiles. All of these four DIMM slots are protected by metal shielding, and expansion slots include three PCIe 3.0 x16 (x16/x8/x8 electrical), three PCIe 3.0 x1 and two Turbo M.2 NVMe slots. Storage options include 6 SATA III ports and a dual USB 3.0 front panel header. It also features MSI's latest Audio Boost panel for premium audio quality, with what they call a "Mystic Light" RGB solution, and the I/O panel is covered by a black and white shroud.

ATP, the leading manufacturer of high performance DRAM and flash memory solutions, has announced the industry's first DDR3L ECC SODIMM technology capable of operating at 1866MHz. The ATP DDR3L-1866 modules are available with capacities of 4GB and 8GB and address the need for low voltage (1.35V) DDR3 memory running at 1866MHz (instead of 1600 MHz). As a result they can maximize system performance when used in conjunction with Intel Apollo Lake processors.

The new ECC SODIMM is available in both commercial temperature (CT 0°C to 85°C) and industrial temperature grade (IT -40°C to 95°C) options, providing the flexibility to meet the operating conditions of a wide variety of IoT (internet of things) systems. The industrial temperature range durability feature is especially beneficial in harsh environments and embedded applications such as industrial IoT and automation devices, telecommunication systems, healthcare technology and outdoor data collection systems.

MSI, industry leading motherboard brand, is proud to announce its latest addition to its X99 portfolio, the X99A WORKSTATION. Dedicated towards users demanding perfect stability & performance for optimal productivity while in search of a wide variety in connectivity & storage options, the new X99A WORKSTATION is sure to impress. Built from the ground up using Military Class 5 components, the X99A WORKSTATION is optimized to use ECC Registered DIMM (RDIMM) memory while benefiting from enhanced performance & stability through the presence of DDR4 Boost. The X99A WORKSTATION supports the latest Intel processors out of the box, both Broadwell-E and XEON based models. The X99A WORKSTATION motherboard is the perfect multi-tasking powerhouse to cater even the most demanding professional.

To be qualified as a true workstation motherboard, optimal & stable data handling needs to be guaranteed, no matter what. By using industries' highest quality components combined with an unmatched R&D design and extreme QA testing, the X99A WORKSTATION motherboard PCB design has been optimized to do just that. To protect the PCB and its components, besides looking cool an IO & audio cover ensures worry free use. The data and audio signals are also shielded against EMI. Heavy plated heatsinks, with a touch of grey, green and white, are used to ensure perfect operation at even the most extreme conditions. To transfer countless data, a wide variety of storage connecters such as U.2 , M.2 and SATA ports are demanded by most workstation users. The X99A WORKSTATION allows any of the latest and greatest HDD, SSD or other storage devices to be connected.

Here are some of the first pictures of GeIL EVO-X memory with its HILM (hybrid independent light module) active. GeIL essentially split the module into two PCBs, one being the more expensive, multi-layer DIMM PCB, and the other being a fewer-layered PCB holding the RGB LED lighting, with its independent power input. That's right, EVO-X is one of the first memory modules that don't use DIMM voltage to power lighting. They instead feature a tiny power input on the lighting PCB, which draws power from any vacant USB 2.0 header you may have on your motherboard (and also interfacing with your OS to let you configure the color. The EVO-X is available in reasonably high speeds such as DDR4-3866, and in densities of up to 8 GB per module.

CORSAIR, a world leader in enthusiast memory, PC components and high-performance gaming hardware today announced the latest addition to its industry leading range of XMP 2.0 certified DDR4 memory kits, the CORSAIR Dominator Platinum ROG Edition. Developed in collaboration with the ASUS Republic of Gamers team, the 16GB 4 x 4GB DDR4 kit is fitted with a unique Republic of Gamers Red and Black brushed aluminium finish, to perfectly compliment the celebrated ASUS Republic of Gamers line of motherboards.

Clocked at 3,200MHz for blistering high-bandwidth performance on Intel 100-series motherboards, CORSAIR Dominator Platinum ROG Edition also boasts a custom overclocked ROG XMP 2.0 memory profile only accessible with ASUS Z170 Republic of Gamers motherboards*, pushing the kit to an even faster 3,333MHz with just a single setting.

Innodisk, the service-driven flash and DRAM module provider, introduces a brand new DDR4 Mini DIMM DRAM that is fully compliant with ATCA (Advanced Telecom Computing Architecture). Featuring a 228 pin (a mere 0.72" in height) and a capacity of up to 16GB, it is simply the best choice for small, high-speed, large-capacity storage devices.

Innodisk uses original ICs in DDR4 Mini DIMM and has upgraded the transfer speed up to 2400MHz. Its ECC modules are designed to detect and correct single-bit errors that may occur during data storage and transmission. In addition, the DDR4 Mini DIMM series' built-in thermal sensor provides temperature monitoring and system reliability. Innodisk also utilizes value-added conformal coating on the module that protects against moisture, contaminants, dust and acid materials, thus ensuring high-performance operation in harsh environments.

Corsair, a world leader in enthusiast memory, PC hardware and components, is pleased to announce the global availability of its fastest ever Vengeance LPX 128GB, 64GB and 32GB DDR4 kits. Boasting frequencies of up to 3,600MHz, these new XMP 2.0 kits bring high-frequency performance to even the largest capacity DDR4 modules.

Corsair's fastest 128GB DDR4 kit ever, the Vengeance LPX 128GB (4x16GB) 3,000MHz is designed to push Intel's X99 quad-channel platform to the next level, reaching frequencies of 3,000MHz or higher. With full XMP 2.0 support and running at 1.35V with CL16-18-18-36 low latency timings, the kit offers both the massive capacity and high-frequency DDR4 performance required by top-end work stations running the most demanding applications.

Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the addition of HyperX FURY DDR3L high-performance, low-voltage DIMMs, as well as brand-new HyperX Impact DDR4 SO-DIMMs.

HyperX FURY DDR3L runs at a low 1.35V, meaning less power consumption and less heat. It is available in 1600MHz and 1866MHz frequencies, and comes in 8GB or 16GB dual-channel kits of two as well as 4GB and 8GB modules featuring a stylish asymmetrical heatspreader in black with black PCB for a stand-out system. HyperX FURY DDR3L is fully Plug-and-Play (PnP) enabled for automatic overclocking out of the box and is perfect for entry-level gamers and enthusiasts who want a cost-efficient upgrade for the 6th Generation Intel Core Processors (former codename Skylake-S) and 100 Series Chipset.

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has announced that its JC-45 Committee has approved the first standards for support of "hybrid" DDR4 memory modules which are defined as modules that plug into standard dual in-line memory module (DIMM) sockets and appear like a DDR4 SDRAM to the system controller, yet contain non-volatile (NV) memories such as NAND Flash on the module. These hybrid module families are referred to as Non-Volatile DIMMs, or NVDIMMs, and they may share the memory channel with other standard DDR4 DIMMs. Publication is expected later this year.

"The introduction of hybrid memory modules into system platform architectures adds new levels of functionality to the computer memory hierarchy," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "Non-volatile memory may be used for data persistence, mass storage, and the door is now opened for innovative new applications using the high speed of the DRAM channel. NAND Flash is the first non-volatile memory to be incorporated into the channel; however, the industry is poised for other memory types to be included as well. The framework established by JEDEC is flexible enough to allow for a variety of memories to be included under the 'hybrid' umbrella."

Intel's future enterprise computing business, post-2017, could see a unification of its 2-socket (2S), 4-socket (4S), and >8-socket (8S+) platforms unify into one, codenamed "Purley." The platform will consist of multiple SKUs, but a common socket type (Socket-P), and a new interconnect technology replacing InfiniBand, which will wire the sockets and core-logic across multiple server blades, together. Called Omni-Path Interconnect, the tech appears to be fiber-optic at the physical layer, with extremely thin cables, and bandwidths could start at 100 Gbps, for the first generation. The controller driving it will be codenamed "Storm Lake." The inter-socket communication will be care of a newer 10.4 GT/s UPI interconnect, each socket will feature three such UPI channels. The platform will support up to eight sockets per blade, with more sockets across neighboring blades over Omni-Path.

"Purley" will feature a new platform core-logic, in the form of the "Lewisburg" PCH. It will feature the new DMI3 chipset-bus, which is PCI-Express 3.0 x4 at the physical layer. This chipset will support up to four 10 GbE interfaces. On the processor front, will be as processors based on the "Skylake" micro-architecture. Intel will carve out several silicons based on "Skylake," the biggest one will feature 28 physical CPU cores, with HyperThreading enabling 56 logical CPUs, and for the first time, a six-channel (384-bit wide) DDR4 integrated memory controller, with support for DDR4-2666. On the flip side, this IMC only supports one DIMM per channel (DPC). The 3DPC support from previous platforms is gone. These chips will be built on the 14 nm silicon fab process, and their TDP will range between 45W and 165W, depending on the number of cores and clock speeds.

With 4K-ready media center PCs upon us, Intel decided to equip one of its next-gen NUC (next unit of computing) desktops with one of its most powerful integrated graphics solutions, which can either accelerate 4K video, 1080p to 4K upscaling GPU algorithms (think MadVR), or make for a reasonably fast 720p or 900p gaming machine. The NUC5i7RYH from Intel features a Core i5-5557U processor, which integrates Iris 6100 Graphics. Based on the "Broadwell-GT3" silicon, Iris 6100 offers 48 execution units, between 300 and 1100 MHz GPU core frequency, and an L4 eDRAM cache. A passive cooling solution deals with this 28W TDP chip. Other specs include two DDR3-1866 SO-DIMM slots, supporting up to 16 GB of memory, HDMI 1.4a and DisplayPort 1.2 display-outputs, four USB 3.0 ports, including one high-current port.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, today announced the expansion of its NVDIMM product line with its new 8GB and 16GB DDR4 NVDIMMs available in a single rank, four bit configuration. SMART's full lineup of DDR4 NVDIMMs now include two configurations; a single rank eight bit configuration in 4GB and 8GB densities, and the new 8GB and 16GB options. The new NVDIMMs are targeted for server and storage applications to improve performance.

NVDIMMs transform main DRAM memory into persistent memory resulting in higher performing servers by allowing big data, transaction logs, and other latency and performance-sensitive data to be accessed at DRAM speeds without the risk of data loss. Rather than reading and writing big data or transaction logs to traditional storage media such as SATA SSDs, PCIe NVMe SSDs, or HDDs, they can be written to and read from main memory without the risk of data being lost due to any sudden power loss (SPL) event. Server performance in terms of lower latency, higher IOPS, and greater endurance all increase dramatically with the use of SMART's NVDIMMs.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.

Intel's next-generation NUC (next unit of computing) compact desktop, believed to be based on the company's Core "Broadwell" processor, was spotted on the company website. Pictures reveal that the next NUC could be pocketable, yet have the computing power of a full-blown desktop. The NUC system board features some of the newer connectivity, such as DDR3L SO-DIMM slots, M.2 slots, an mPCIe slot, an additional SATA 6 Gb/s port, and processors from the Core i3 and Core i5-5000 series. Intel could unveil the next-gen NUC in January 2015, likely at CES 2015.

Based on the Intel H97 chipset, Shuttle today launches the XPC Barebone SH97R6, a solution measuring just 20 cm in height and designed for the rapid creation of customised Mini PCs. Motherboard, cooling system and power supply come pre-installed enabling speedy assembly.

The chassis, case cover and front panel are all made from strong lightweight aluminium. Measuring just 33.2 x 21.6 x 19.8 cm (DWH), this model opens up new options for stationary and mobile applications with multiple high-resolution monitors.

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

SanDisk Corporation (NASDAQ:SNDK), a global leader in flash storage solutions, today announced broad support for VMware Horizon 6 and Virtual SAN with a series of virtual desktop infrastructure (VDI) and end-user computing (EUC) solutions for Horizon 6, utilizing the award-winning ULLtraDIMM solid state drive (SSD) and Fusion ioMemory.

When coupled with VMware's Horizon 6, ULLtraDIMM and Fusion ioMemory allow customers to deploy high-performance, cost-effective virtual desktop infrastructure solutions and increase virtual desktop density. Additionally, through the combination of solid-state hardware and software technology, SanDisk enables enterprise organizations to select the right deployment option for their environment, providing greater flexibility and reducing barriers to adoption.