ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today takes the award-winning ZBOX to SuperSpeed with the new ID41 series. The ZOTAC ZBOX ID41 series introduces SuperSpeed USB 3.0 and DDR3 technologies to the ZBOX mini-PC.

"External expansion is vital with mini-PCs. By adding SuperSpeed USB 3.0 technology to our award-winning ZBOX mini-PCs, we are able to offer external connectivity capable of speeds up to 5.0 Gb/s," said Carsten Berger, marketing director.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today introduces three new do-it-yourself friendly mini-ITX platforms - the new ZOTAC ION-ITX R, S and T-series. The new ZOTAC ION-ITX R, S and T series reinvigorates the ION-ITX series with an added boost of graphics power.

Next-Generation NVIDIA ION graphics and a dual-core Intel Atom D525 processor combine to deliver a perfect balance of performance and energy-efficiency in the new ZOTAC ION-ITX R, S and T series. High-definition video playback capabilities enable the ZOTAC ION-ITX R, S and T series to deliver a premium multimedia experience with hardware decode acceleration for smooth playback of high-definition Blu-ray 3D and streaming Internet video content.

At a time when everyone including ASUS is cramming the AMD Fusion E-350 APU into netbooks and mini-ITX motherboards to get rid of Atom; the motherboard major saw "bigger" prospects for the E-350, and designed a micro-ATX motherboard based on it. The E35M1-M Pro from ASUS uses AMD Fusion E-350 APU that embeds a dual-core x86-64 processor based on the "Bobcat" architecture with an AMD Radeon HD 6310 DirectX 11 compliant GPU. The processor is backed by the brand new Hudson M1 single-package chipset. The E35M1-M Pro is intended for everything from office PCs to home PCs, and HTPCs. It draws power from conventional 24-pin ATX and 4-pin CPU power connectors, and uses a 3+1 phase VRM.

The CPU and chipset share a heatsink. The CPU is wired to two DDR3 DIMM slots. Expansion slots include one PCI-Express 2.0 x16, one PCI-E x1, and two PCI slots. Storage expansion includes five internal SATA 6 Gb/s and one eSATA 6 Gb/s. Connectivity includes 6-channel HD audio with optical SPDIF output, 7.1 channel audio over HDMI, gigabit Ethernet, two USB 3.0 ports, FireWire, and a number of USB 2.0 ports. ASUS added a bunch of exclusive features that can let you squeeze out the most performance, and manage power consumption.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced that it has developed a range of performance components that fully exploit the potential of the new Intel 2nd Generation Core Processor family, including the new LGA1155 Core i5 and Core i7 processors.

These components include the previously announced Corsair Vengeance DDR3 memory modules, which operate with a low VDIMM voltage of 1.5V, and include XMP-certified performance profiles for Core i5 and Core i7 processors. In addition, Corsair is also announcing the next-generation Performance 3 Series, a new range of solid-state drives, based on the Marvell 9174 controller and designed to take full advantage of the SATA 6Gbps (SATA Revision 3.0) support native to the new Intel chipsets.

SAPPHIRE Technology, the world's largest manufacturer and supplier of graphics systems based on technology from AMD has just announced its first mainboard based on the exciting new APU (Accelerated Processing Unit) architecture from AMD. As a result of close collaboration with AMD, SAPPHIRE will introduce the SAPPHIRE Pure White Fusion E350M1W mainboard through its Global channel - heralding a new generation of low-power, fully featured PC solutions.

The SAPPHIRE Pure White Fusion E350M1W is a mini-ITX mainboard featuring the E350 (Zacate) APU from AMD. Zacate is the first generation of APU - a combination of CPU and GPU computing technologies onto a single die to improve the performance of both visual and data-intensive tasks. For the first time it combines high-performance serial computing and parallel graphics processing cores on a single chip. The SAPPHIRE Pure White Fusion E350M1W also uses the companion Hudson-M1 (A50M) Chip from AMD.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today supercharges energy-efficient computing with the new ZBOX Blu-ray AD03 series powered by the AMD E-350 APU platform. The ZOTAC ZBOX Blu-ray AD03 series combines discrete-class graphics processing with a dual processor cores for the perfect synergy of CPU and GPU that delivers a perfect digital media experience with unprecedented energy-efficiency.

AMD Radeon HD 6310 discrete-class graphics processing takes charge of all digital media processing tasks to enable the ZOTAC ZBOX Blu-ray AD03 series to deliver stunning Blu-ray and smooth streaming high-definition video playback. The ZOTAC ZBOX Blu-ray AD03 series is a potent casual gaming platform capable of rendering stunning 3D visuals with Microsoft DirectX 11 technology.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the launch of a new, highly overclocked, low voltage memory kit. This 4GB Dominator GT memory kit, implemented using a matched pair of 2 GB DIMMs, is guaranteed to operate at 2133MHz, with latency settings of 9-11-9-27, and at a memory voltage of only 1.5V.

"We have seen an increasing number of requests from overclockers for memory that can achieve high clock speeds at lower voltages," stated Thi La, Vice President of Memory Products at Corsair. "At 2133MHz, this 4GB memory is the world's fastest commercially available memory at 1.5 volts."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of an eight gigabyte (GB) registered dual inline memory module (RDIMM) based on its advanced Green DDR3 DRAM. The new memory module, which has just been successfully tested by major Samsung customers, delivers superior performance, in particular because of its use of a three-dimensional (3D) chip stacking technology referred to as 'through silicon via' (TSV).

"At Samsung, we're well positioned to accommodate early market demand for our state-of-the-art TSV technology as the industry continues to forge forward with even further advances in bonding technology to enable greater performance and operational efficiency," said Dr. Chang-Hyun Kim, senior vice president and Samsung fellow, memory product planning & application engineering at Samsung Electronics. "Our 40nm-class* RDIMM being announced today marks the introduction of a more advanced eco-friendly 'Green Memory' product line up utilizing 3D-TSV technology that is expected to enhance the leadership of Samsung and our allies in server and enterprise storage."

MSI, the global leading brand in motherboard, announces the latest mini-ITX motherboard, IM-PV-C, to IPC market. IM-PV-C is designed the latest Intel Atom processors N455/ N475/ D425/ D525 and the Intel ICH8M chipset which is an ideal low power and high performance solution for industrial applications.

MSI IM-PV-C comes to meet the requirements of a low power platform, especially in power input design. MSI IM-PV-C supports ATX and wide range DC 12V ~ 24V inputs as the different BOM option. For supporting high resolution video, MSI debuts IM-PV-C with great 3D graphics performance for a high definition up to 1080P videos.

In the view of the demand for an ultra mini size platform with fanless design strongly inquired from customers, MSI IPC announces the latest 3.5" small form factor, I3-945GSE-D, based on the Intel Atom N270 processor and the Intel 945GSE chipset which gives devices based on it enhanced graphics and power-saving capabilities.

MSI I3-945GSE-D is fanless and comes to meet the requirements of an ultra-low power platform, especially in power input design, MSI I3-945GSE-D support wide range DC 9V ~ 36V inputs, and it also supports for numerous display, includes VGA and LVDS.

Apacer, one of the world's leading brands of memory modules, announced today its ARES DDR3 Overclocking Memory Module. The newly-unveiled memory module is named after the god of war "ARES." Features include advanced memory chips, zero noise heat pipe cooling system with a large red aluminum heat dissipation fin. It is able to operate at a blazing-fast clock rate of 2400MHz, allowing not only overclockers to create overclocking miracles but hardcore gamers to achieve their optimum performance during the games.

ARES, the god of war, clad in armor dashing in the ferocious battlefield, is thought to have been invincible in Greek mythology. After the previous launch of second-to-none Aeolus equivalent, Apacer again named its DDR3 memory module from the mythology. Just as its name suggested, ARES DDR3 Overclocking Memory Module promises to deliver amazing and stable overclocking performances that feed the needs of the overclocking experts.

Exceleram - the Highend Memory based in Landau, Germany, announces the availability of the first four Rippler Memory Kits. The name Rippler stands for a new Heatsink designed especially for the overclocking community. The German Exceleram Team completed the development and the Rippler Series is ready to ship now. First shipments are leaving the German warehouse this week. The Rippler Series will be expanded during the next weeks.

"We already have customer requests for other Rippler Kits and we will consider them of course." said Martim Reis Silva - Sales Director Exceleram. As a goody, there are also 2 highend kits with black 8layer PCB available. In the beginning the memory will be delivered in a noble aluminiumbox instead of plastic blister.

Mushkin, a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat dissipation qualities, enthusiasts the world over have demanded the Ridgeback heatsink for their memory cooling needs. Now, this exciting piece of technology has been prepared for Mushkin's world-renowned Redline Series with an engaging and strong blood-red appearance.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. Because of Ridgeback's success, we wanted to offer the cooling technology with a sharp new look, and to give customers new aesthetic options. Case modders and system builders now have a striking new look available to them when using Ridgeback. Redline has always been Mushkin's premier memory line, and we're happy to add Ridgeback to its mix. Our new blood-red Ridgeback heatsinks scream 'performance' and offer it in every respect." - Brian Flood, director of product development.