Gemtek Technology Co., Ltd. announced it is highlighting an AI-native Wi-Fi 8 broadband gateway at Network X 2026, developed in collaboration with Qualcomm Technologies, Inc. and gFiber, Inc. to bring Edge AI and next-generation connectivity into the home. Built on the Qualcomm Dragonwing NPro A8 Elite Platform, the gateway is engineered by Gemtek and powered by intelligent software from Genix Networks, a Gemtek subsidiary, with gFiber as the launch service provider. It combines Wi-Fi 8 Quad-Band connectivity, Edge AI computing, and intelligent software for a more responsive broadband experience.

Bringing Intelligence into the Home Gateway
Designed as a home internet hub and a local platform for agentic AI, the gateway supports network optimization, device awareness, security, and proactive management.

Ahead of IFA, Qualcomm Technologies, Inc. today announced the Qualcomm Dragonwing Q-2390 and IQ-2390 processors, expanding the Dragonwing portfolio with highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. As demand grows for devices that can perceive, analyze and act on data locally, the Dragonwing Q-2390 and IQ-2390 processors are designed to bring AI, vision, connectivity and security to a broader range of connected devices, helping power the next wave of intelligence across homes, businesses, cities and factories.

"AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."

Arduino S.r.l., a subsidiary of Qualcomm Technologies, Inc., today opened pre-orders for Arduino VENTUNO Q, its most advanced edge AI platform to date, powered by the Qualcomm Dragonwing IQ8 Series. Now available worldwide, VENTUNO Q was built for developers, prioritizing familiarity and ease of use with the right software, accessories and extensions.

One Board to Sense, Decide, and Act
The VENTUNO Q has a dual-brain architecture, pairing a Dragonwing IQ-8275 processor, delivering up to 40 dense TOPS of AI performance, with 16 GB LPDDR5 memory, 64 GB eMMC and expandable M.2 NVMe storage, alongside a dedicated STM32H5 real-time microcontroller, enabling systems that don't just interpret sensor data but respond to it physically, immediately and offline.

Advantech (2395.TW), a global leader in industrial IoT, today announced an expanded collaboration with Qualcomm Technologies, Inc. to accelerate the deployment of generative AI (GenAI) at the edge. This collaboration centers on Advantech adopting the Qualcomm Dragonwing AI on-prem appliance solution, powered by Qualcomm Cloud AI 100 Ultra accelerator into the Advantech SKY-641E3 4U high-performance edge server. By utilizing a specialized PCIe switch backplane, this solution provides the high-bandwidth connectivity required to unlock the full potential of high-density AI inference for enterprise and industrial verticals.
Unmatched Inference Density for Massive Concurrency

Unlike standard dual-slot GPU servers, the SKY-641E3 is architected specifically for maximum inference throughput. By supporting up to 12 single-slot FH/FL accelerators within a single 4U chassis, it offers a superior density-to-footprint ratio. This configuration is optimized for high-concurrency edge workloads, such as city-wide intelligent video analytics or large-scale retail AI agents, allowing for the simultaneous processing of hundreds of real-time data streams without the thermal overhead of power-hungry training GPUs.

Ahead of Embedded World, Arduino announced the upcoming launch of its newest platform to democratize edge AI, Arduino VENTUNO Q. Named after the Italian word for twenty-one, VENTUNO Q builds on the iconic legacy of the popular Arduino UNO family and embodies the company's coming of age as it prepares to celebrate its foundation's 21st anniversary, later this month.

At the Edge of Intelligence: Where AI Takes Action
VENTUNO Q unites high-performance AI compute with deterministic real-time control, enabling systems that don't just interpret the world—they interact with it.
The board builds upon a dual-brain architecture similar to Arduino UNO Q, yet significantly upgrades capabilities leveraging the Qualcomm Dragonwing IQ8 Series for both traditional and generative AI workloads, supported by NPU acceleration delivering up to 40 dense TOPS, as well as a dedicated STM32H5 microcontroller for low-latency actuation and motor control. In addition, VENTUNO Q comes with 16 GB RAM—able to handle concurrent inference and complex multitasking—and an expandable 64 GB of storage.

Qualcomm Technologies, Inc. today announced its industry-leading Wi-Fi 8 portfolio, a key step toward building the connectivity foundation for the AI era. The comprehensive portfolio features the Qualcomm FastConnect 8800 Mobile Connectivity System and five new Qualcomm Dragonwing Networking Platforms. Each is engineered to deliver the connectivity and compute performance required to anchor a new generation of products, leveraging unparalleled intelligence with breakthrough architecture for today's AI demand realities.

"Today's network traffic profile is fundamentally changing as AI-fueled demand requires a re-thinking of the core architecture. Qualcomm Technologies is redefining that architecture to enable AI everywhere," said Gautam Sheoran, Senior Vice President and General Manager, Connectivity, Broadband and Networking, Qualcomm Technologies, Inc. "Next-gen networks and devices not only need to be AI-native, but they need a new breed of intelligent, high performance connectivity. Qualcomm Technologies' Wi-Fi 8 generation of products is the whole package: faster speeds, higher reliability, longer range, and powerful AI."

Today (Feb. 4, 2026) Arm (NASDAQ: ARM) published a letter to its shareholders containing the company's results for the third quarter of fiscal year 2026 ended December 31, 2025. The infographic below provides the key highlights:

Here are what the results mean and how they were achieved:

• Revenue grew 26% year-on-year to $1.24 billion, representing Arm's fourth consecutive billion-dollar revenue quarter.
• Royalty revenue grew 27% year-over-year to a record $737 million, driven by growth across Arm's target end markets, including AI and general-purpose data center, smartphones, physical AI and edge AI.
• License and other revenue of $505 million increased 25% year-over-year, as more leading companies sign high-value licenses for next-generation Arm technologies.
• Demand for Arm Compute Subsystems (CSS) continues to exceed expectations as adoption grows in light of increasingly complex chip designs. This represents a significant tailwind to royalty growth, as Arm expands both the value delivered and economics captured per chip.
  • During the quarter, Arm signed two CSS licenses for use in both edge AI tablets and smartphones, bringing the total number of CSS licenses to 21 across 12 companies.
  • Additionally, five customers are now shipping Arm CSS-based chips, including two shipping its second-generation platform, while the top four Android smartphone vendors are all shipping Arm CSS-powered devices.

We've already seen lots of amazing projects based on Arduino UNO Q come up since its launch in early October - but we're doubling down anyway! Today, we are launching a new Arduino UNO Q variant with 4 GB of RAM and 32 GB of eMMC storage, allowing all of you to dream bigger and go further, while still enjoying the same Arduino UNO Q form factor and ease of use.

4 good reasons to choose 4 GB
In this 4 GB variant, Arduino UNO Q still leverages a unique combination of powerful Qualcomm Dragonwing QRB2210 microprocessor and real-time STM32U585 microcontroller, but can now better meet the needs of developers who require a more ample memory configuration.

NETGEAR Inc., a global leader in intelligent networking solutions designed to power extraordinary experiences, today announced the launch of the Nighthawk 5G M7 Portable Wi-Fi 7 Hotspot (MH7150) supported by a new mobile app (iOS and Android) and eSIM Marketplace. The innovative device combines reliable, portable connectivity with groundbreaking flexibility, allowing users to choose coverage that fits their needs, connecting instantly to high-speed internet in more than 140 countries.

The M7 is engineered for modern life, providing fast connections for travelers, remote workers, and families on the move. Its compact, lightweight design makes it an effortless travel companion, while the powerful battery delivers up to 10 hours of continuous connectivity for work, streaming, gaming, and staying in touch.

HiBy has officially launched its new flagship portable Hi-fi player, RS8 II, on October 30, 2025. The RS8 II integrates HiBy's advanced technologies in portable audio with deep insights into market trends, redefining high-end portable music players. It features a high-performance processor, upgraded audio architecture, and multiple connectivity options, supporting high-resolution audio formats and versatile output, providing users with a complete digital audio experience and flexible connectivity.

The player is powered by the Qualcomm Dragonwing QCS8550 (8 Gen 2 platform) and the upgraded third-generation DARWIN audio architecture, paired with AdaptiveAMP, offering dynamic A/B-class amplification with 64-level adjustability and THD+N as low as 0.0008%. Its powerful CPU+GPU+NPU+FPGA+DSP array combined with a precisely matched R2R resistor network ensures accurate high-resolution audio reproduction. Sankofa AI tonality simulation allows users to enjoy sound signatures modeled after classic audio sources such as MD, CD, cassette, and reel-to-reel tape players, with free updates for a personalized Hi-fi experience.

Inseego Corp., a global leader in 5G mobile broadband and 5G fixed wireless access (FWA) solutions, today introduced a new approach to enterprise FWA with a completely new 5G hardware platform, the Inseego Wavemaker FX4200, and updated software suite, Inseego Connect. Designed to bridge the gap between performance and ease-of-use for enterprise wireless networks, this innovative approach to FWA pairs the power and functionality of enterprise network solutions with the simplicity and ease-of-management of small- and medium-sized (SMB)-oriented solutions.

"In order to take advantage of the power of 5G for business, organizations have been forced to choose between feature-heavy solutions that can be complicated and expensive to deploy, and simplistic products that can't scale or meet business needs," said Juho Sarvikas, CEO of Inseego. "With the FX4200, X700 mesh Wi-Fi, and the innovative Inseego Connect software, we're eliminating that tradeoff. We've built the solution that the market has been asking for, and it will propel growth in FWA and 5G use in business."

Qualcomm Technologies, Inc. today announced a new groundbreaking processor, the Qualcomm Dragonwing Q-6690, which is the world's first enterprise mobile processor with fully integrated UHF RFID capabilities. The processor includes built-in 5G, Wi-Fi 7, Bluetooth 6.0, and ultra-wideband, supporting proximity-aware experiences and superior global connectivity. Designed to support a wide range of form factors from ruggedized handhelds to retail point-of-sale systems and smart kiosks, the Dragonwing Q-6690 offers OEMs and ODMs a scalable and upgrade-ready platform with software-configurable feature packs that can be upgraded over the air.

"The Dragonwing Q-6690 combines integrated RFID, AI, and next-gen wireless capabilities in a single, scalable platform, designed to accelerate innovation across industries including retail, logistics, and manufacturing," said Art Miller, vice president and head of retail, Qualcomm Technologies, Inc. "We are particularly excited about working with retailers today that need platforms that are not only powerful and connected, but also adaptable to evolving customer expectations, from smarter kiosks and handhelds to real-time inventory analytics and contactless experiences."

Qualcomm Technologies, Inc., a technology leader enabling connected intelligent computing, and HUMAIN, a national artificial intelligence (AI) champion advancing Saudi Arabia's goals for AI, today signed a Memorandum of Understanding (MOU) with the intent to enter a strategic collaboration for the development of next-generation AI data centers, infrastructure and cloud-to-edge services to meet the rapidly growing demand for AI across the globe, including the Kingdom of Saudi Arabia. The MOU was signed during the Saudi-US Investment Forum in Riyadh, which was held during the official visit of President of the United States Donald Trump to the Kingdom of Saudi Arabia.

The data centers and supporting ecosystem are intended to provide both government and enterprise organizations with access to high-performance and power efficient CPU and AI cloud infrastructure and cloud-to-edge services. These offerings will enable the deployment of AI solutions that can make real-time predictions and decisions, in addition to significantly increasing the availability and value of advanced AI-enabled applications.

At Embedded World Germany, Qualcomm Technologies, Inc. announced the entry into an agreement to acquire EdgeImpulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT. The closing of this deal is subject to customary closing conditions. This acquisition is anticipated to complement Qualcomm Technologies' strategic approach to IoT transformation, which includes a comprehensive chipset roadmap, unified software architecture, a suite of services, developer resources, ecosystem partners, comprehensive solutions, and IoT blueprints to address diverse industry needs and challenges.

"We are thrilled about the opportunity to significantly enhance our IoT offerings with Edge Impulse's advanced AI-powered end-to-end platform that will complement our strategic approach to IoT transformation," said Nakul Duggal, group general manager, automotive, industrial and embedded IoT, and cloud computing, Qualcomm Technologies, Inc. "We anticipate that this acquisition will strengthen our leadership in AI and developer enablement, enhancing our ability to provide comprehensive technology for critical sectors such as retail, security, energy and utilities, supply chain management, and asset management. IoT opens the door for a myriad of opportunities, and success is about building real-world solutions, enabling developers and enterprises with AI capabilities to extract intelligence from data, and providing them with the tools to build the applications and services that will power the digital transformation of industries."

On Monday (March 3), Qualcomm introduced its Dragonwing FWA Gen 4 Elite model—advertised as the world's first 5G Advanced-capable FWA platform. Inevitably, the company's brand-new Snapdragon X85 5G modem will be compared to a rival design—Apple's proprietary C1 chip launched last month; as featured in the A18 SoC-powered iPhone 16e series. The two companies were closely intertwined for a number of years; with a longer than anticipated co-development of 5G solutions for multiple iPhone product generations. Cristiano Amon—the CEO of Qualcomm—believes that his team's X85 5G design will end up as the victor, when pitched against Apple's C1. In a CNBC-conducted interview, he boasted: "it's the first modem that has so much AI, it actually increases the range of performance of the modem—so the modem can deal with weaker signals. What that will do will set a huge delta between the performance of premium Android devices, and iOS devices, when you compare what Qualcomm can do versus what Apple is doing."

Smartphone industry watchdogs reckon that Apple's C1 model will leverage superior power efficiency; courtesy of the contained modem and receiver being based on TSMC 4 nm and 7 nm processes (respectively). Qualcomm has not revealed the fundamental aspects of its new Snapdragon X85, so it is difficult to project its power consumption habits. Official press material concentrates on two big selling points: downlink speeds up to 12.5 Gbps, and 40 TOPS of NPU processing power. Insiders have posited that the in-house designed C1 modem will make its way into next-gen iPads and Apple wearables—additionally, the development of a successor is rumored. Despite doing less business with Apple, Amon thinks that the future is peachy: "if modem is relevant there's always a place for Qualcomm technology. In the age of AI, modems are going to be more important than they have ever been. And I think that's going to drive consumer preference about do they want the best possible modem in the computer that's in their hand all the time." Qualcomm's chief expects that the supply of Snapdragon 5G Modem-RF Systems—to Apple—will end in 2027.

Qualcomm Technologies, Inc. today announced the Dragonwing FWA Gen 4 Elite, the world's first 5G Advanced-capable FWA platform. Powered by the Qualcomm X85 5G Modem-RF, the platform sets a new benchmark for 5G broadband performance with downlink speeds up to 12.5 Gbps. The Dragonwing FWA Gen 4 Elite platform introduces comprehensive AI enhancements and integrates a powerful network Edge AI coprocessor with up to 40 TOPS of NPU processing power. This optimizes wireless connectivity across 5G broadband and Wi-Fi, while unlocking the power of generative AI for more devices, enabling a more reliable and harmonized user experience.

"The Dragonwing FWA Gen 4 Elite Platform is a technological breakthrough, building on over 500 5G FWA designs to date, and extends our tradition of delivering platforms that solve the broadband industry's greatest challenges," said Gautam Sheoran, vice president and general manager, wireless broadband and communications, Qualcomm Technologies, Inc. "By integrating unprecedented AI and connectivity capabilities, with the Qualcomm X85 at its core, this platform offers ultra-fast speeds, reliability and flexibility at a lower total cost than wired broadband, ultimately, enabling a future where seamless, intelligent networks transform the way we live and work."

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.