Intel and Altera today announced a collaboration to develop a flexible, real-time sensor bridge for a range of Edge & Physical AI industries including healthcare, aerospace and defense, and robotics applications. By combining Intel compute, connectivity and software with Altera FPGAs, the companies aim to help original equipment manufacturers (OEMs) address the growing complexity of connecting, processing and acting on real-world data across increasingly sensor-rich edge environments.

Edge and Physical AI systems can require data from different sensors and interfaces to be brought together while meeting requirements for timing, performance, power and cost. Some applications also require very high bandwidth or flexible form factors in which input/output (I/O) is located away from the compute board. Sensor data must then be streamed rapidly into memory for the host Intel processor to use across edge, robotics and other workloads.

Synaptics Incorporated (Nasdaq: SYNA) today introduced the xMCU, a new class of microcontrollers that runs multimodal Edge AI, with the launch of the Synaptics Astra SR200 Series. Unlike conventional MCUs constrained by limited on-chip memory and compute, the xMCU combines heterogeneous, AI-native compute and acceleration with integrated high-bandwidth custom DRAM scalable to hundreds of megabytes, enabling larger AI models and richer multimodal workloads to run entirely on-device. The Astra SR200 Series of xMCUs is designed for the next generation of AI wearables, battery-powered sensing devices, connected cameras, streamers, and industrial vision and voice systems.

The SR200 Series is powered by the Synaptics Torq AI engine, which brings a standards-based hardware architecture and unified developer experience featuring the Coral NPU from Google Research. It also comes with the industry's first pairing of the Arm Cortex -M85 and Cortex -M52. Together with integrated vision and audio capabilities and hardware-rooted security, the SR200 Series brings unmatched system design efficiency and cost benefits to Edge and Physical AI designs.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, today introduced the BIWCL-PAT industrial motherboard. Powered by Intel Core Series 3 (Wildcat Lake) processors, the BIWCL-PAT brings triple independent displays, high-speed NVMe storage expansion, and versatile wired and wireless connectivity into a small-form-factor platform. Designed for system integrators, it supports applications across industrial automation, AIoT, and edge computing, as well as human-machine interfaces (HMI), POS systems, and self-service kiosks.

With a 148 × 102 mm footprint, the BIWCL-PAT is built for integration into space-constrained equipment. It supports processor options from Intel Core 3 to Intel Core 7, and its single DDR5-6400 SO-DIMM slot supports up to 64 GB of memory, providing capacity for multitasking and local data processing. This combination gives developers a solid foundation for systems that bring computing closer to factory equipment, retail terminals, and networked devices.

Senao Networks Inc. today announced the launch of its new x86 enterprise server portfolio, featured on the company's Senao computing website at www.senaocomputing.com. The portfolio includes the SR810, SR710, SR610, SE210, and SE110 and is designed to support a broad range of enterprise computing and AI workloads, including generative AI, AI inference, model fine-tuning, data analytics, visualization, and intelligent edge computing. NVIDIA RTX GPU support is available in selected configurations.

Bringing AI Closer to Enterprise Data
As enterprises accelerate AI adoption, organizations increasingly need computing infrastructure that can address different workload requirements while maintaining greater control over sensitive corporate data.

ASRock Industrial proudly presents its latest lineup of industrial edge computing platform powered by Intel Core Series 3 processors (Wildcat Lake-U), designed to bring power-efficient computing and integrated AI acceleration to mainstream industrial and embedded edge applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 40 platform TOPS, the new platforms support up to 64 GB DDR5 6400 MHz memory, high-speed expansion and storage, rich I/O connectivity, and multi-display capabilities. Spanning industrial motherboards, NUC motherboards, and compact NUC BOX systems, ASRock Industrial's Intel Core Series 3 portfolio provides right-sized computing options for industrial control, HMI, intelligent gateways, smart retail, digital signage, and other mainstream edge applications.

NUC Core 300 BOX Series: Compact, Power-Efficient Edge Computing
The NUC BOX-320 and NUC BOX-304 integrate Intel Core Series 3 processors into compact fanned embedded BOX PCs, powered by the Intel Core 5 processor 320 and Intel Core 3 processor 304, respectively. The systems support up to 64 GB of single-channel DDR5 6400 MHz memory with In-Band ECC. For expansion, the systems provide one M.2 Key E (2230) slot with Wi-Fi 6E and Bluetooth 5.3 for wireless connectivity. Networking includes one Intel 2.5 Gigabit LAN and one Realtek 2.5 Gigabit LAN. Storage configuration includes one M.2 Key M (2242) slot with PCIe Gen 4 x1 and one M.2 Key M (2242/2280) slot with PCIe Gen 4 x2 for SSDs. I/O connectivity includes two USB 3.2 Gen2x2 Type-C and three USB 3.2 Gen 1 Type-A ports. The series supports triple-display output up to 4K through two HDMI 2.1 and DisplayPort 1.4a outputs from Type-C. Intel PTT and a 19 V/90 W power adapter further support secure, ready-to-deploy system integration. Built in a compact 117.5 x 110 x 49 mm fanned chassis with VESA mounting support, the NUC Core 300 BOX Series provides a space-efficient computing platform for smart retail, digital signage, kiosks, HMI, and other mainstream edge applications.

AAEON (Stock Code: 6579) today announced the release of the UP Xtreme PTL Edge Air, a Panther Lake-powered Mini PC featuring Frore Systems' AirJet solid-state active cooling technology.

With this innovative thermal management, the Mini PC replaces conventional fan-based cooling with ultrasonic-frequency membrane vibration technology to generate high-speed pulsating airflow to provide high-capacity heat dissipation without the added height that comes with a heatsink.

ASRock Industrial proudly presents its latest lineup of industrial edge AI platforms powered by Intel Core Ultra Series 3 processors (Panther Lake-H), designed to accelerate next-generation edge AI, industrial automation, and intelligent computing applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 180 platform TOPS, the new platforms support up to 128 GB DDR5 memory at speeds up to 7200 MHz, high-speed expansion, rich I/O connectivity, and advanced display capabilities. ASRock Industrial's comprehensive lineup spans industrial motherboards, NUC(S) BOX, fanless iBOX systems, and iEP-7050E industrial IoT Controller, providing scalable computing options for demanding AI inference, machine vision, robotics, smart manufacturing, and industrial edge applications.

Flexible Industrial Motherboards for Intelligent Edge Applications
ASRock Industrial expands its industrial motherboard portfolio with the IMB-1251-WV Series, SBC-377 Series, and COMHA-300, delivering flexible, high-performance platforms powered by Intel Core Ultra Series 3 processors for next-generation edge AI and industrial applications. The IMB-1251-WV Series combines Mini-ITX flexibility with up to 128 GB DDR5 7200/6400 memory with In-Band ECC, extensive I/O, dual LAN, quad-display support, flexible storage, and optional out-of-band (OOB) functionality, making it ideal for machine vision, robotics, and industrial automation.

Compact embedded systems are becoming smaller, while storage requirements continue to grow. Applications such as embedded computing, medical computers, self-service kiosks, and service robots need reliable local storage for operating systems, data, logs, updates, and system files.

However, when system space is limited, adding storage is often not as simple as installing another SSD. Designers may face limited PCB space, low-profile enclosures, and a lack of available M-Key storage slots.

ARBOR Technology Corp., a global leader in industrial IoT and edge AI computing solutions, announces the FPC-9309W-G5, a rugged Edge AI platform powered by Intel Core Ultra Processors (Series 2) and supporting NVIDIA RTX 50 Series GPUs up to 575 W. Designed for AI vision, intelligent transportation, and smart manufacturing applications, it delivers exceptional AI computing performance at the edge.

Next-Generation Computing for Demanding AI Workloads
Powered by Intel Core Ultra processors and NVIDIA RTX 5090 GPU support, the FPC-9309W-G5 delivers real-time AI inference, machine vision processing, and high-performance analytics. Its optimized thermal and power design ensures reliable operation for intensive AI applications.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the CEM570, a high-performance COM Express Type 6 Basic module powered by the Intel Core Ultra processor family. Designed to accelerate next-generation Edge AI deployment, the CEM570 combines advanced computing performance, integrated AI acceleration, high-bandwidth I/O, and industrial-grade reliability into a standardized COM Express architecture that helps reduce redesign effort and accelerate time-to-market. It is optimized for demanding applications across medical, transportation, defense, robotics, heavy industries, and energy sectors.

Unlocking Next-Level Edge AI Performance with Integrated NPU
Powered by Intel Core Ultra processors with up to 14 cores and 20 threads, the CEM570 integrates Intel Graphics with a dedicated NPU to efficiently accelerate Edge AI workloads directly at the edge. Compared with conventional edge architectures relying on discrete graphics cards, the CEM570 significantly improves AI inference throughput and multitasking efficiency while operating within standard power envelopes of 15 W, 28 W, and 45 W. This architecture helps simplify system design, reduce power consumption, and accelerate AI adoption across embedded applications.

NVIDIA reported its Q1 2026 earnings with revenue reaching $81.6 billion, setting a new record. Amid these record-breaking results, the company announced a change in how it reports revenue from its GeForce RTX gaming GPUs. According to NVIDIA CFO Colette Kress, the standalone GeForce RTX GPU gaming revenue is no longer separately listed and is now integrated under the "Edge Computing" segment. This segment "highlights devices for agentic and physical AI, including PCs, game consoles, workstations, AI-RAN base stations, robotics, and automotive." The last standalone report for gaming revenue was in Q4 2025, where NVIDIA posted $3.7 billion. Now, under the "Edge Computing" category, NVIDIA reported $6.4 billion, an increase of 10% from the previous quarter and 29% from the same period last year, when this segment had a different name.

With the new reporting structure, NVIDIA includes revenue from GeForce RTX GPU sales, as well as contributions from AI models, automotive, software libraries, and accelerated networking infrastructure like AI-RAN. These segments now form a smaller portion of NVIDIA's total revenue, collectively referred to as "Edge Computing." This new segment accounted for only 7.84% of the total Q1 revenue, indicating that NVIDIA's reporting structure now aligns with its revenue sources. This might be one of the last ways to track quarterly gaming revenue, as the company is integrating other verticals here. We may not know exactly how the GeForce GPU segment is performing unless NVIDIA provides separate information. Below you can see highlights form the Gaming and AI PC segment in the Q4 2025, versus the "Edge Computing" transition in Q1 2026.

As artificial intelligence (AI) and data-intensive applications continue to drive demand for real-time processing and low-latency computing, high-performance computing (HPC) is rapidly expanding beyond traditional data centers to the edge. Addressing this growing trend, Avalue Technology has launched the HPS-GNRU1A 1U high-density server system and the HPM-GNRUP industrial server board, combining the latest Intel Xeon 6 platform, PCIe Gen 5 architecture, and high-density NVMe storage to deliver flexible and high-performance solutions for emerging Edge HPC applications.

Unlike conventional HPC platforms primarily designed for centralized data centers, Avalue's latest Edge HPC portfolio is optimized for on-site computing environments. In smart manufacturing, AOI inspection systems require real-time image processing to improve production yield and process stability. In healthcare, image-guided therapy depends on precise and low-latency image analysis, while smart city applications such as airport security screening demand rapid processing of high-frequency imaging data. In life sciences, next-generation sequencing (NGS) workloads also require intensive computing performance for large-scale data analysis. These applications share common challenges, including massive data throughput, real-time processing requirements, and deployment in space-constrained environments, making Edge HPC a critical market focus.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces its latest Pico-ITX single board computer, the PICO570. Powered by the Intel Core Ultra processors (Series 1), this ultra-compact solution is designed to meet the evolving demands of edge AI computing. It integrates an 11 TOPS NPU to enable efficient on-device AI inference without requiring discrete accelerators, offering developers a faster time-to-market for space-constrained systems.

AI-Ready Performance with Integrated NPU
Built with Intel Core Ultra processors, the PICO570 features an integrated NPU to accelerate AI workloads directly at the edge. This enables real-time data processing with reduced latency while maintaining power efficiency. With these AI-on-device capabilities, users can simplify system architecture for applications such as edge AI gateways and inference nodes.

At Embedded World 2026, Intel launched the Intel Core processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools for AI-powered patient monitoring solutions.

"Intel continues to lead in edge computing, which remains one of our fastest-growing business segments," said Dan Rodriguez, Intel corporate vice president and general manager of the Edge Computing Group. " With the introduction of Core Series 2, our CES launch of Core Ultra Series 3, and our expanding Edge AI Suites, we continue to deliver comprehensive platforms that meet diverse edge customer needs with breakthrough performance, reliability, and integrated AI acceleration."

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that provide real-time AI processing, deterministic performance, and long-term reliability in always-on environments.

To meet these needs, AMD is expanding its AMD Ryzen AI Embedded P100 Series processor portfolio. New processors feature up to 2x higher CPU core counts, up to 8x higher graphics processing unit (GPU) compute, and an estimated 36% higher system tera operations.

Global high-performance computing and industrial embedded platform leader MSI will showcase a complete Edge AI ecosystem at Embedded World 2026, integrating edge computing platforms and vertical industry solutions to demonstrate industrial-grade Edge AI computing and on-site deployment capabilities.

As artificial intelligence applications increasingly extend from the cloud to field environments, MSI leverages industrial-grade reliability and platform integration expertise to help enterprises build intelligent systems with long-term operational stability, accelerating digital transformation across transportation, manufacturing, retail, agriculture, and UAV applications.

Advantech (TWSE: 2395), a global leader in Edge Computing and IoT automation solutions, today announced the launch of the EKI-6333BE-4GD, its first industrial-grade Wi-Fi 7 Access Point designed to deliver deterministic wireless connectivity for next-generation smart factories, autonomous logistics, and AI-driven industrial environments.

As mobile automation, robotics, and Edge AI applications rapidly expand across industrial environments, reliable wireless infrastructure has become critical for ensuring uninterrupted operations. The EKI-6333BE-4GD addresses these challenges with high-throughput Wi-Fi 7 connectivity, industrial-grade resilience, and advanced network management, enabling enterprises to build secure and scalable wireless infrastructure for mission-critical industrial systems.

ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel Xeon 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen 5 connectivity, and up to 2 TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities. Built for professional computing environments, it includes a robust 1600 W power supply unit, TPM 2.0 security, and Intel vPro manageability. With support for both 4U tower or rack-mount configurations, the series is primed for advanced edge AI computing platforms, powering Gen AI LLMs, AI training and inference, visual computing, data analytics, and compute-intensive industrial applications that demand exceptional processing power and reliability.

iEPF-11000S: Quad-GPU Edge AI Platform with Intel Xeon 600
Powered by Intel Xeon 600 processors, the iEPF-11000S Series delivers high performance for edge AI computing, real-time analytics, and compute intensive industrial automation. Supporting up to 2 TB of quad-channel DDR5 ECC RDIMM memory, it ensures fast, reliable, and memory-intensive processing for AI model training, predictive maintenance, and automation. Designed for AI acceleration, deep learning, and high-performance visual computing, the iEPF-11000S Series supports up to four discrete GPUs, delivering the compute power needed for multimodel parallel inference, AI training, and intensive visual computing. Its powerful computing resources enable accelerated deployment of real-time AI inference, data analytics, and intelligent industrial automation.

Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XR9700 server, a first of its kind closed-loop liquid-cooled, fully-enclosed, ruggedized server engineered to run Cloud RAN and edge AI workloads in unprotected outdoor environments. Designed to mount on utility poles, rooftops and building exteriors, the PowerEdge XR9700 brings high performance computing into dense urban areas, remote locations and space-constrained facilities where traditional data center infrastructure cannot reach.

Why it matters
Telecommunications operators and those working at the edge often struggle to deploy compute due to lack of power and space. The PowerEdge XR9700 solves this, delivering high performance compute directly at the point of need in an ultra-compact, zero-footprint IP66-rated enclosure that's sealed from the elements. For telecommunications operators, it provides a flexible, software-defined alternative to traditional RAN solutions, supporting Cloud RAN and Open RAN processing at the cell site. At the same time, the platform can run edge and AI applications directly where data is created and consumed.

The AMD VEK385 Evaluation Kit provides a fast, feature-rich, and scalable path to evaluating AMD Versal AI Edge Series Gen 2 XC2VE3858 devices. With heterogeneous compute, high-performance I/O, comprehensive memory bandwidth, ready-to-run workloads, and robust bring-up tools, engineers can quickly assess system performance and accelerate the path from prototype to production.

Designed for Embedded AI, Control, and Vision Workloads
The VEK385 Evaluation Kit enables engineers to evaluate embedded AI, vision, and control systems through multiple, industry-standard interfaces:

• HDMI RX/TX and USB3/DP for 4K/8K vision pipelines
• PCIe x8 edge connector for Gen 5 x4 and Gen 3/4 x8 support
• QSFP28 and SFP28 connectors for 25-100 Gb/s high-speed Ethernet applications
• FMC+ for I/O expansion
• CAN-FD with PL/PS Ethernet for deterministic robotics and industrial control

Chinese firm M5Stack has released its new AI Pyramid series, a small-form-factor edge AI PC aimed at developers and makers working with local inference workloads that stands out with its unique pyramid shape design. The lineup consists of two variants: AI Pyramid and AI Pyramid-Pro. Both models are built around the Axera AX8850 SoC, which combines an octa-core Arm Cortex-A55 CPU running at up to 1.7 GHz with a 24 TOPS INT8 NPU. The platform targets fully local AI processing, covering use cases such as computer vision, multimodal input, and on-device model inference, without depending on cloud acceleration.

Memory configurations differ between the two versions, with the standard AI Pyramid shipping with 4 GB of LPDDR4x, while the Pro model offers 8 GB. Storage is provided by 32 GB of onboard eMMC. The AX8850 supports hardware-accelerated H.264 and H.265 encoding and decoding at resolutions up to 8K at 30 FPS, as well as up to 16 concurrent 1080p decode streams. The specs are completed with dual Gigabit Ethernet and USB 3.0 ports, HDMI output, with the AI Pyramid-Pro adding HDMI input support. The device also integrates onboard audio hardware, an OLED status display, RGB lighting, and an active cooling solution. Pricing starts at $199 for the 4 GB AI Pyramid Computing Box, with the 8 GB Pro variant listed at $249 on the M5Stack website.

SolidRun has announced the first industrial PC based on the AMD Ryzen AI 9 HX 370 with support for the latest AMD ROCm 7 stack. The combination of high-performance Zen 5 cores, Radeon iGPU, XDNA NPU and high memory capacity in a compact and ruggedized x86 device provides secure and robust edge AI processing capabilities.

AMD Ryzen AI 9 HX 370 processor contains a 12C/24T Zen 5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU. Up to 128 GB of DDR5 capacity allows for the local execution of large AI models.

Chatsworth Products Inc. (CPI), a global leader in power, cooling and rack infrastructure for IT environments, today announced the launch of VersaEdge Wall-Mount Cabinet, a versatile new edge infrastructure product designed to dramatically simplify deployment and management of distributed computing environments. The new solution will make its public debut at BICSI Winter 2026, where attendees can experience its modular design, advanced thermal performance, and rapid-deployment capabilities firsthand. The VersaEdge Wall-Mount Cabinet combines modular scalability, streamlined installation, and robust reliability—delivering a turnkey solution that meets the growing performance, density and flexibility demands of today's edge-driven workloads.

"With increasing demand for distributed compute and edge deployments, customers need infrastructure that can adapt quickly—without sacrificing reliability or performance," said Michael Moore, Senior Product Manager, Open Architecture Systems, CPI. "The VersaEdge Wall-Mount Cabinet represents our commitment to delivering future-ready infrastructure that empowers organizations to deploy edge resources faster, scale with confidence, and optimize cost and efficiency."

Following the unveiling of the new Intel Core Ultra Series 3 processors (formerly Panther Lake) at CES, AAEON's UP brand (stock code: 6579) has announced its development timeline for the UP Xtreme PTL Edge, an AI Mini PC leveraging the platform.

Expected to enter mass production during the latter part of Q1, the UP Xtreme PTL Edge will be available with either the Intel Core Ultra X7 358H or Intel Core Ultra 5 Processor 338H from the new series, featuring an integrated Intel Arc GPU with up to 12 Xe3 Cores and Intel NPU 5.0 for up to 180 TOPs of AI performance in total.

Acer Inc., Esquarre Vision Limited, and OPTOELECTRONICS CO., LTD., a Japanese AIDC (Automatic Identification and Data Capture) solution provider known as Opticon, jointly announced plans for Acer and Esquarre to invest approximately 38% and 20%, respectively, in Opticon for JPY 1,589,419,104 and JPY 819,000,000. The transaction is expected to be completed in early 2026, supporting Opticon's growth and global expansion.

For Acer, the move expands its portfolio, adding identification and machine vision solutions that will create synergy with its subsidiaries AOPEN (TWSE: 3046) and Posiflex (TWSE: 8114). AOPEN is a company which focuses on industrial computers for display engines and edge computing, while Posiflex Group is a global leader in Commercial AIoT, delivering smart online-to-offline (O2O) integrated solutions and scenario-defined embedded edge computing platforms.