The ESM-HRPL is a next-generation COM-HPC module designed for compute-intensive edge applications. Paired with the high-performance EEV-HC10 carrier board, this solution is ideal for AI inference, smart healthcare, industrial automation, and intelligent energy systems. It delivers exceptional processing power, modular scalability, and long-term product availability for critical embedded deployments.

Advanced COM-HPC Performance for Evolving Edge Architecture
The ESM-HRPL module complies with the PICMG COM-HPC Client Type specification and supports Intel 12th, 13th, and 14th Gen Core processors (LGA 1700, up to 65 W TDP), along with the Intel R680E chipset. It includes four DDR5 SO-DIMM sockets supporting up to 128 GB of memory at speeds up to 3600 MT/s and optional ECC support, depending on the selected CPU.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial panel PC and embedded computing solutions, introduced the MBB1005, a robust ATX motherboard crafted for industrial edge computing, AI acceleration, and automation platforms. Powered by Intel Core Ultra 200S processors on the LGA1851 socket, this board delivers outstanding compute performance, modular expansion, and rugged reliability, enabling OEMs to scale up fast in industrial and embedded markets.

The MBB1005 offers four DDR5 U-DIMM slots, supporting up to 192 GB memory. Its integrated graphics controller supports one HDMI 2.0b and three DisplayPort 1.4a outputs, enabling multi-display configurations essential in industrial monitoring. Networking is handled by dual Intel 2.5GbE ports—the I226LM with iAMT 19.0 for remote maintenance and the I226V for standard communication. For storage and modular expansion, the board offers four SATA III ports and four M.2 slots: two M-Key (2280) for NVMe, one B-Key (3052) for cellular modules, and one E-Key (2230) for WiFi or Bluetooth.

Global industrial computer hardware manufacturer OnLogic today announced the launch of its powerful, highly-scalable Helix 520 Series of industrial computers. Engineered for the evolved edge, the Helix 520 Series leverages the latest Intel Core Ultra processors to deliver exceptional performance, integrated edge AI capabilities, and industrial-grade reliability. The system is ideal for automation, machine learning, edge AI, computer vision, robotics, autonomous systems, and distributed applications that require powerful computing in challenging environments.

"The Helix 520 Series represents our commitment to providing cutting-edge computing solutions that empower innovation at the edge," said Hunter Golden, OnLogic Senior Product Manager. "With its powerful Intel Core Ultra processors, flexible connectivity options, and ruggedized design, the Helix 520 is built to handle the complex demands of today's, and tomorrow's, industrial applications, enabling our customers to connect faster, compute smarter, and scale without limits."

The BCM RX880W is a new microATX motherboard built on Intel's latest Core Ultra platform, formerly known as Arrow Lake-S/Arrow Lake-S Refresh, pairing the Intel W880 chipset with the LGA1851 socket to support the 15th Gen Intel Core Ultra processors (Series 2). This board is designed to deliver cutting-edge performance while retaining robust legacy support, making it ideal for hardware and system engineers in the fields of medical & healthcare, industrial & automation, smart retail, digital signage, intelligent Kiosk, Edge AI server, security, and electronics distributors seeking next-generation solutions.

RX880W microATX New Design Features for Edge AI Computing and Compact Storage Servers
High-Performance with AI enabled CPU Support:

• LGA1851 socket supports Intel's latest Core Ultra 5/7/9 processors (Series 2), up to 125 W TDP
• Dual SlimSAS Connectors - High-Speed Storage in Compact Systems
  • The RX880W integrates two SlimSAS (SFF-8654) connectors—a standout feature rarely seen on industrial Micro ATX motherboards. Each SlimSAS supports PCIe Gen 4 x4, enabling flexible, high-bandwidth storage options ideal for dense, compact edge and storage platforms.

As COMPUTEX 2025, one of the most anticipated global tech events, prepares to open its doors in Taipei, AI applications are set to reach new heights. GIGAIPC, the industrial computing and edge AI subsidiary of GIGABYTE Technology, will unveil three innovative AI edge computing solutions at COMPUTEX 2025, showcasing its expertise in industrial-grade system design. Powered by NVIDIA Jetson Orin modules, the flagship QN-ORAX32-A1, QN-ORNX16GH-A1, and QN-ORNX16 deliver exceptional AI performance for smart manufacturing, intelligent surveillance, smart healthcare, smart retail, and AIoT applications, setting new benchmarks for edge computing.

The QN-ORAX32-A1, built on the NVIDIA Jetson AGX Orin 32 GB module, features an 8-core Arm v8.2 64-bit CPU and an NVIDIA Ampere GPU with 1792 CUDA cores and 56 Tensor cores, delivering up to 200 TOPS of AI performance—six times faster than its predecessor. This enhanced computing power makes it well-suited for high-load data processing and complex AI models. Beyond its computing performance, the QN-ORAX32-A1 is also built for real-world deployment. To ensure long-term durability in harsh industrial environments, the system incorporates a fanless thermal design and wide-range DC power input.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and storage devices, is excited to introduce the EdgeComp MS-J6412 industrial PC, a powerful new addition to its EdgeComp series built specifically for industrial automation and edge computing applications.

Designed to excel in demanding industrial settings, EdgeComp MS-J6412 combines powerful performance, energy efficiency, and versatile connectivity in a compact, fanless design. Powered by the Intel Elkhart Lake J6412 SoC, a quad-core processor with speeds up to 2.6 GHz and an ultra-low 10 W TDP, the system ensures stable, round-the-clock operation with minimal heat generation and silent performance. Its embedded architecture makes it ideally suited for space-limited and noise-sensitive environments where reliability is paramount.

MSI, a global leader in industrial computing solutions, proudly announces the release of the MS-C927, a highly compact and fanless embedded Box PC designed to meet the growing demand for power-efficient edge computing in harsh and space-constrained environments. Powered by Intel 's Meteor Lake-U and Arrow Lake-U series Core Ultra processors, the MS-C927 delivers high performance, reliable connectivity, AI acceleration, and rich I/O in an ultra-compact form factor.

Feature-Rich, Future-Ready
With a footprint of only 130 x 155 x 40 mm, the MS-C927 fits seamlessly into tight enclosures while offering exceptional processing power and industrial-grade durability. It features DDR5 memory up to 96 GB, dual 4K DisplayPort outputs, dual LAN including 2.5GbE, and multiple M.2 slots for NVMe storage, wireless connectivity, and cellular communication.

In industrial environments, equipment runs 24/7, handling frequent and intensive write operations. To support these demanding workloads, storage solutions must offer high endurance to extend lifespan, minimize downtime, and lower Total Cost of Ownership (TCO). Designed to meet these demands, the Cervoz T455 Series, M.2 2280 NVMe SSD delivers 35% greater endurance through a refined firmware architecture and proven storage technologies. Ideal for industrial automation, edge computing, and high-performance computing (HPC), it ensures reliable performance under heavy workloads.

Enhanced Endurance for Demanding Industrial Applications—Over-Provisioning Technology: Endurance SSD Performance and Longevity
Cervoz's Over-Provisioning technology optimizes SSD performance by reserving extra storage space, boosting efficiency, and extending lifespan. How SSD Over-Provisioning Delivers Benefits:

• Extended Lifespan: Efficiently reserves additional storage space, enhancing NAND durability at least 35%.
• Consistent Performance: Maintains steady performance levels even under high-intensity workloads.
• Optimized Resource Management: Reserved space allocation for optimal write efficiency.

Accordance Systems Inc., a leading global provider of RAID box, unveiled its latest innovation, the ARAID M6 series RAID Box for PCIe 4.0 NVMe M.2, at Embedded World 2025 in Nuremberg, Germany, from March 11-13. Accordance has been delivering easy, user-friendly RAID solutions worldwide for over a quarter of a century, providing businesses worldwide with instantaneous backup for their OS and data. The new M6 series aims to provide reliable, high-speed backup for edge computing and edge AI applications across industries.

High-Speed Data Backup and Storage for PCIe 4.0 NVMe M.2 Drives
Making its debut at Embedded World was Accordance's M6 series RAID box. This latest addition to the company's long-running ARAID product line supports multiple drive interfaces, including 2.5" SATA, SAS, U.2, U.3 and NVMe M.2 (PCIe Gen 4x4). The ARAID RAID box automatically backs up a PC's system and data into a second drive, ensuring critical systems keep running in the event of boot drive failure, OS corruption or ransomware attacks. The new M6 series is designed to support the high data speeds needed in AI applications growing more common across industries, such as finance, agriculture, transportation, and manufacturing. Keeping with the original vision for ARAID—a RAID box as easy to use as a point-and-shoot camera—the M6 series requires no IT knowledge to use, enabling all users to quickly upgrade their systems with RAID 1.

A global leader in intelligent IoT systems and embedded platforms, is excited to introduce its latest AIR series Edge AI systems, powered by the comprehensive AMD compute portfolio. These next-generation solutions leverage AMD Ryzen and EPYC processors alongside Instinct MI210 accelerators and Radeon PRO GPUs, delivering exceptional AI computing performance for demanding edge applications.

"Advantech and AMD continue to strengthen our collaboration in the Edge AI era, integrating advanced CPU platforms with high-performance AI accelerators and GPU solutions," said Aaron Su, Vice President of Advantech Embedded IoT Group. "This joint effort enables cutting-edge computing power to meet the demands of the rapidly evolving embedded AI applications.

Advantech, a leading provider of edge computing and edge AI solutions, is pleased to announce their high-performance server and network appliances are now powered by the latest AMD EPYC Embedded 9005 Series processors. By leveraging these cutting-edge platforms, Advantech is driving edge computing and AI to new heights—making solutions ideal for 5G edge cloud, AI, machine learning, and enhanced data security.

"We are excited about the launch of Advantech's latest generation of innovative edge computing and AI solutions powered by AMD EPYC Embedded 9005 Series processors," said Amey Deosthali, Senior Director of embedded core markets at AMD. "Optimized for embedded markets, EPYC Embedded 9005 provides exceptional compute performance for edge AI applications while delivering enhanced IO capabilities, product longevity, and system resiliency."

ASUS IoT, a global leader in AIoT solutions, today unveils its latest innovations at Embedded World 2025. Showcasing a comprehensive lineup of advanced Edge AI and embedded computing technologies, ASUS IoT empowers businesses to accelerate AI adoption and enhance efficiency across industries such as manufacturing, robotics, and smart city infrastructure.

Revolutionary edge AI computing
This year, ASUS IoT is showcasing the upcoming RUC-1000G, its rugged 19-inch 2U edge AI computer - the world's first to support a 600 W GPU and PCIe 5.0. Designed for mission-critical industrial applications, it features advanced thermal management to ensure superior real-time AI inference and deep learning performance. Enhanced data security with TPM IC and IEC 62443-4-1 compliance ensures protection, while the iBMC module enables rapid system recovery.

Synaptics Incorporated has extended its award-winning Synaptics Astra AI-Native platform with the SR-Series high-performance adaptive microcontroller units (MCUs) for scalable context-aware Edge AI. The series features three tiers of operation: performance (100 GOPS), efficiency, and ultra-low-power (ULP) always-on (AON) to deliver intelligence at every power level. Based on an Arm Cortex-M55 core and the Arm Ethos-U55 neural processing unit (NPU), the SR-Series is supported by the Astra Machina Micro development kit and open-source SDK. It is optimized for multimodal consumer, enterprise, and industrial Internet of Things (IoT) workloads with accelerators and adaptive vision, audio, and voice algorithms. The small-form-factor MCUs have a rich set of peripherals—including multiple camera interfaces—to help minimize system cost, power, and footprint while enabling integration into a wide range of devices, such as battery-operated security cameras, sensors, appliances, point-of-sale, digital signage, and scanners.

Announced at EW2024 with the SL-Series MPUs, the Synaptics Astra AI-Native compute platform for the IoT combines scalable, low-power compute silicon for the device Edge with open-source, easy-to-use software and tools and Veros wireless connectivity. The platform was built upon Synaptics' foundation in neural networks, field-hardened AI hardware and compiler design expertise for the IoT, and refined, in-house support of a broad base of modalities.

Cincoze will showcase its full range of embedded computing solutions at Embedded World 2025 (Hall 1, Booth No.: 1-407) in Nuremberg, Germany, on March 11-13. Cincoze will display world-class industrial embedded computing products around the theme of "Edge AI, Smart Integration," encompassing the full spectrum of industrial application environments in four dedicated zones, including GPU embedded computers, DIN-Rail computers, rugged embedded computers, and industrial panel PCs and monitors.

GPU Embedded Computers: AI Application Solutions
The GPU Computing - GOLD product line combines powerful CPUs and GPUs to meet the ultimate performance requirements for edge AI applications. The three-series lineup covers Light, Medium, and Heavy AI use cases. The GJ series features an NVIDIA Jetson SoM GPU with a low-power design specially designed for Light AI applications. The GM series supports MXM GPUs and can meet mobile or Medium AI application requirements. The flagship GP series supports up to two 250 W full-length GPU cards and has patents for heat dissipation, scalability, and securing, making it the best choice for Heavy AI applications. The entire product line has passed EN50121-3-2, E-mark, and MIL-STD-810H to ensure reliability across applications in different industries.

GIGABYTE, a global leader in computing innovation and technology, will showcase its full-spectrum AI computing solutions that bridge development to deployment at MWC 2025, taking place from March 3-6.

"AI+" and "Enterprise-Reinvented" are two of the themes for MWC. As enterprises accelerate their digital transformation and intelligent upgrades, the transition of AI applications from experimental development to democratized commercial deployment has become a critical turning point in the industry. Continuing its "ACCEVOLUTION" initiative, GIGABYTE provides the comprehensive infrastructure products and solutions spanning cloud-based supercomputing centers to edge computing terminals, aiming to accelerate the next evolution and empower industries to scale AI applications efficiently.
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Advantech, a leader in edge computing solutions, is excited to announce the launch of the UBX-330M, a compact NUC-sized edge computer designed to power intelligent city services with advanced AI capabilities.

The UBX-330M is powered by Intel Core Ultra Processors (Meteor Lake H and U), which integrate a CPU, GPU, and NPU to deliver exceptional AI performance in a small form factor. Built as an AI-ready platform, the UBX-330M is perfect for applications requiring robust processing power across industries such as smart retail, hospitality, public spaces, education, entertainment, enterprise, and smart buildings.

ADLINK Technology Inc., a global leader in edge computing, unveiled its new "DLAP Supreme Series", an edge generative AI platform. By integrating Phison's innovative aiDAPTIV+ AI solution, this series overcomes memory limitations in edge generative AI applications, significantly enhancing AI computing capabilities on edge devices. Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment and accelerating the adoption of generative AI across various industries, especially in edge computing.

Lower AI Computing Costs and Significantly Improved Performance
As generative AI continues to penetrate various industries, many edge devices encounter performance bottlenecks due to insufficient DRAM capacity when executing large language models, affecting model operations and even causing issues such as inadequate token length. The DLAP Supreme series, leveraging aiDAPTIV+ technology, effectively overcomes these limitations and significantly enhances computing performance. Additionally, it supports edge devices in conducting generative language model training, enabling them with AI model training capabilities and improving their autonomous learning and adaptability.

GIGABYTE Technology, internationally renowned for its R&D capabilities and a leading innovator in server and data center solutions, continues to lead technological innovation during this critical period of AI and computing advancement. With its comprehensive AI product portfolio, GIGABYTE will showcase its complete range of AI computing solutions at CES 2025, from data center infrastructure to IoT applications and personal computing, demonstrating how its extensive product line enables digital transformation across all sectors in this AI-driven era.

Powering AI from the Cloud
With AI Large Language Models (LLMs) now routinely featuring parameters in the hundreds of billions to trillions, robust training environments (data centers) have become a critical requirement in the AI race. GIGABYTE offers three distinctive solutions for AI infrastructure.
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Advantech, a leading global provider of industrial edge AI solutions, is excited to introduce its GPU server SKY-602E3 equipped with the NVIDIA H200 NVL platform. This powerful combination is set to accelerate the offline LLM for manufacturing, providing unprecedented levels of performance and efficiency. The NVIDIA H200 NVL, requiring 600 W passive cooling, is fully supported by the compact and efficient SKY-602E3 GPU server, making it an ideal solution for demanding edge AI applications.

Core of Factory LLM Deployment: AI Vision
The SKY-602E3 GPU server excels in supporting large language models (LLMs) for AI inference and training. It features four PCIe 5.0 x16 slots, delivering high bandwidth for intensive tasks, and four PCIe 5.0 x8 slots, providing enhanced flexibility for GPU and frame grabber card expansion. The half-width design of the SKY-602E3 makes it an excellent choice for workstation environments. Additionally, the server can be equipped with the NVIDIA H200 NVL platform, which offers 1.7x more performance than the NVIDIA H100 NVL, freeing up additional PCIe slots for other expansion needs.

Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs.

As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs.

At AAEON Technology, we recognize growing demand for secure and reliable industrial systems. In collaboration with Canonical, AAEON Technology validates Ubuntu Pro across our Intel-based industrial systems. Each unit comes with a preinstalled Ubuntu image, an Ubuntu Pro license sticker, and 10 years of Canonical-backed updates for ongoing security and maintenance. "This collaboration means our customers benefit from cutting-edge hardware paired with the secure, long-term support offered with Ubuntu Pro enabled. With ongoing updates, they're always protected, allowing them to focus on their core goals," said Victor Lai, Managing Director at AAEON.

Ubuntu Pro provides enterprise-level security, compliance, and long-term stability for industrial and edge applications. It meets strict regulatory standards while delivering high performance in demanding environments.

The MS-CF16 Pico-ITX SBC is powered by Intel Alder Lake-N/Amston Lake series processors, offering up to 16 GB of LPDDR5X memory for efficient, high-performance computing. It supports dual independent displays via HDMI and LVDS/eDP interfaces, and features multiple I/O options including 2.5 GbE/1GbE, USB 10 Gbps/5 Gbps and two M.2 slots for flexible connectivity. The board's ultra-compact 2.5" Pico-ITX form factor ensures easy integration into space-constrained environments.

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.

ADLINK Technology Inc., a global leader in edge computing and a renowned supplier of industrial PCs and motherboards, is proud to announce the launch of the new SBC35 Series of 3.5" Single Board Computers (SBC). This innovative series introduces a range of motherboards specifically engineered to maximize efficiency in compact spaces. The SBC35 Series features two models: the high-performance SBC35-RPL, powered by the 13th Gen Intel Core processors, and the energy-optimized SBC35-ALN, equipped with the Intel N97 processor. Additionally, the series boasts an expansive range of I/O modules and SBC-FM Adaptive Function Modules (AFM) that significantly enhance system capabilities. These advancements make the SBC35 Series exceptionally suitable for a wide array of applications in automation, transportation, medical fields, and smart city projects, including Autonomous Mobile Robots (AMRs), Electric Vehicle (EV) charging stations, and self-service kiosks.

The SBC35 Series showcases two compact models in a 146x102mm 3.5" SBC form factor, each designed to maximize space and functionality in demanding settings. While the high-performance SBC35-RPL supports up to 64 GB DDR5 4800 MHz RAM and four independent displays, the efficiency-optimized SBC35-ALN accommodates up to 16 GB DDR5 4800 MHz RAM and three independent displays. Both units are equipped with an extensive array of connectivity options, including four USB ports and versatile M.2 slots (2280 M Key, 2230 E Key, 3042 B Key), supplemented by dual RS-232/422/485, and additional dual RS-232 ports, audio, and digital I/O capabilities. Optional TPM 2.0 further enhances security, making these models highly adaptable for a broad range of industrial applications. Their comprehensive I/O and expansion options ensure that they can be customized to meet specific project requirements, providing exceptional versatility and scalability.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC products, is excited to introduce the all-new BIAST-PAT industrial motherboard solution. The BIAST-PAT motherboard is expertly designed to meet the diverse needs of System Integration (SI) businesses and industry professionals seeking to build robust, efficient, and future-proof systems for business and industrial applications. It is a highly versatile platform, perfectly suited for applications in AIOT machines, automation systems, edge computing devices, HMI machines, and digital signage.

The BIOSTAR BIAST-PAT motherboard, with its robust wide temperature and broad voltage support, is engineered to excel in a variety of demanding environments, making it a prime choice for numerous outdoor applications. Its design incorporates M.2 Key-M, Key-B, and Mini-PCIe slots, offering exceptional versatility in connectivity options. This compatibility extends to Hailo AI acceleration cards, further enhancing its edge AI utility.