BCM Intros Next-Gen COM-HPC Module and Carrier Board for Edge Applications
The ESM-HRPL is a next-generation COM-HPC module designed for compute-intensive edge applications. Paired with the high-performance EEV-HC10 carrier board, this solution is ideal for AI inference, smart healthcare, industrial automation, and intelligent energy systems. It delivers exceptional processing power, modular scalability, and long-term product availability for critical embedded deployments.
Advanced COM-HPC Performance for Evolving Edge Architecture
The ESM-HRPL module complies with the PICMG COM-HPC Client Type specification and supports Intel 12th, 13th, and 14th Gen Core processors (LGA 1700, up to 65 W TDP), along with the Intel R680E chipset. It includes four DDR5 SO-DIMM sockets supporting up to 128 GB of memory at speeds up to 3600 MT/s and optional ECC support, depending on the selected CPU.
Advanced COM-HPC Performance for Evolving Edge Architecture
The ESM-HRPL module complies with the PICMG COM-HPC Client Type specification and supports Intel 12th, 13th, and 14th Gen Core processors (LGA 1700, up to 65 W TDP), along with the Intel R680E chipset. It includes four DDR5 SO-DIMM sockets supporting up to 128 GB of memory at speeds up to 3600 MT/s and optional ECC support, depending on the selected CPU.