Intel's Vision 2025 conference ended yesterday—since then, media outlets have spent time poring over a multitude of announcements made during the two-day Las Vegas, Nevada event. Notably, Team Blue leadership confirmed that their Core Ultra 300 "Panther Lake" processor series is built to scale (on) 18A, and is on track for production later this year." Prominently-displayed presentation material indicated a roadmapped 2026 launch of "Panther Lake" client chips. The success of this next-gen mobile processor family is intertwined with Intel's Foundry service making marked progress. As summarized by the company's social media account, production teams are celebrating another milestone: "Intel 18A has entered risk production. This final stage is about stress-testing volume manufacturing before scaling up to high volume in the second half of 2025."

Under Pat Gelsinger's command, Team Blue set off on a "five nodes in four years" (5N4Y) adventure around mid-2021. This plan is set to conclude with the finalization of 18A, at some point this year, under a newly refreshed regime—with Lip-Bu Tan recently established as CEO. During an on-stage Intel Vision 2025 session, Kevin O'Buckley—Senior VP of Foundry Services—explained the meaning of: "risk production, while it sounds scary, is actually an industry standard terminology, and the importance of risk production is we've gotten the technology to a point where we're freezing it...Our customers have validated that; 'Yep, 18A is good enough for my product.' And we have to now do the 'risk' part, which is to scale it from making hundreds of units per day to thousands, tens of thousands, and then hundreds of thousands. So risk production..is scaling our manufacturing up and ensuring that we can meet not just the capabilities of the technology, but the capabilities at scale." By original "5N4Y" decree, top brass demanded that process nodes be (fully) available for production, rather than be stuck in a (not quite there) final high volume manufacturing (HVM) phase.

Industry insiders posit that TSMC's two flagship fabrication facilities are running ahead of schedule with the development of an advanced 2 nm (N2) process node. A cross-facility mass production phase is tipped to begin later this year, which leaves room for next-level experiments. Taiwan's Economic Daily News has heard supply chain whispers about the Baoshan "P2" plant making internal preparations for a truly cutting edge 1.4 nm-class product. According to the report, unnamed sources have claimed that: "TSMC has made a major breakthrough in the advancement of its 1.4 nm process. (The company) has recently notified suppliers to prepare the necessary equipment for 1.4 nm, and plans to install a trial production 'mini-line' at P2 (Baoshan Fab 20)."

Their Hsinchu-adjacent "Fab 20" site is touted as a leading player in the prototyping of this new technology. Industry moles reckon that "1.4 nm expertise" will eventually trickle over to nearby "P3 and P4 plants" for full production phases. Allegedly, these factories were originally going to be involved in the manufacturing of 2 nm (N2) wafers. Additionally, TSMC's "Fab 25" campus could potentially play host to trial 1.4 nm activities—the Economic Daily News article proposes that four plants based in the Central Taiwan Science Park are pitching in with collaborative work. As interpreted by TrendForce, "P1" could begin "risk trial production" by 2027, followed by full-scale output within the following year.

Over the past weekend Jukanlosreve declared via social media that Samsung's: "Exynos 2600 (mobile SoC) is definitely back, and it will be used in the Galaxy S26 series. But the chip volume is so limited that it'll likely be similar to the Exynos 990 situation. I'm not sure if SF2 is actually any good." Mid-way through March, the keen observer of semiconductor industry conditions posited that Samsung's Foundry business could abandon a 1.4 nm (SF1.4) process node. SF2 (aka 2 nm GAA) seems to be in a healthier place, according to insiders—thanks to rumored assistance from an external AI-specialist partner. The development of next-generation flagship Exynos smartphone processors are allegedly closely tied with Samsung Foundry's 2 nm GAA manufacturing process.

As alluded to by Jukanlosreve's recent prediction, the statuses of leaked 2 nm-based "Exynos 2600" and "Exynos 2500" chips were often questioned by industry watchdogs in the past. The latter is purportedly destined for rollout in forthcoming affordable "Galaxy Z Flip FE" models, albeit in mature 4 nm form. Vhsss_God—another source of inside track info—has weighed in on the topic of Samsung's next-gen chipset roadmap. Compared to Jukanlosreve's musings, their similarly-timed weekend projection seemed to be quite fanciful: "exclusive leak...Samsung doesn't want to use Exynos or Qualcomm Snapdragon chips anymore. S26 line is targeted to launch with the new Samsung developed chip (2 nm)—formerly referred to as Exynos 2600. (The company) will try its hardest to ditch Snapdragon on the entire Galaxy line next year." Perhaps there is too much of a negative stigma attached to Samsung's long-running chipset nomenclature, but the majority of foundry moles continue to label incoming designs as Exynos processors.

According to a report produced by semiconductor industry analysts at Kiwoom Securities—a South Korean financial services firm—Semiconductor Manufacturing International Corporation (SMIC) is expected to complete the development of a 5 nm process at some point in 2025. Jukanlosreve summarized this projection in a recent social media post. SMIC is often considered to be China's flagship foundry business; the partially state-owned organization seems to heavily involved in the production of (rumored) next-gen Huawei Ascend 910 AI accelerators. SMIC foundry employees have reportedly struggled to break beyond a 7 nm manufacturing barrier, due to lack of readily accessible cutting-edge EUV equipment. As covered on TechPowerUp last month, leading lights within China's semiconductor industry are (allegedly) developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production.

Huawei is reportedly evaluating an in-house developed laser-induced discharge plasma (LDP)-based machine, but finalized equipment will not be ready until 2026—at least for mass production purposes. Jukanlosreve's short interpretation of Kiwoom's report reads as follows: (SMIC) achieved mass production of the 7 nm (N+2) process without EUV and completed the development of the 5 nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC's 5 nm process is 40-50% higher than TSMC's, and its yield is roughly one-third." The nation's foundries are reliant on older ASML equipment, thus are unable to produce products that can compete with the advanced (volume and quality) output of "global" TSMC and Samsung chip manufacturing facilities. The fresh unveiling of SiCarrier's Color Mountain series has signalled a promising new era for China's foundry industry.

In a letter addressed to stockholders, Intel's new CEO—Lip-Bu Tan—roadmapped the importance of a couple of major upcoming product launches. Starting off, Team Blue's new chief detailed a fresh approach, with the casting off of old strategies: "achieving the results I know Intel is capable of starts by refocusing on our customers. This has been priority number one since my first day on the job. I am listening carefully to their feedback so that we continue driving the changes needed to delight our customers and strengthen our competitive position. Plain and simple, the time for talk is over. We must turn our words into action and deliver on our commitments. I have been pleased to see the leadership team has already started driving the culture change needed to make this happen. As CEO, I will continue to drive this transformation so that we move faster, work smarter and make it easier for customers to win with Intel."

Tan's mentioning of Core Ultra "Panther Lake" processors arriving within the second half of this year aligns with prior official statements. Insiders posited that Panther Lake-H (PTL-H) mobile CPUs were delayed into 2026 due to issues with the Foundry's 18A process node, but an Intel executive dismissed these claims a few weeks ago. Interestingly, the firm's Chinese office outlined an "early 2026 volume launch" of "Panther Lake (18A)" chips during a mid-March AI PC press event. A presentation slide indicated that an Early Enablement Program (EEP) is expected to start in October; Team Blue's loose terminology likely classes the sending off of samples—to OEMs, for approval—as a "real" product launch.

Intel and SK Hynix have finalized an $8.85 billion transaction involving Intel's NAND flash memory operations, marking the conclusion of a two-phase deal initiated in 2020. In the first phase of the transaction, SK Hynix acquired Intel's SSD division along with a NAND production facility in Dalian, China, for $6.61 billion. The Dalian facility was later rebranded as Solidigm. Notably, this phase transferred only the physical assets and operational facilities, leaving behind critical intellectual property, research and development infrastructure, and specialized technical staff. The second phase, finalized with a payment of $1.9 billion this Tuesday, addressed these remaining components. With this payment, SK Hynix secured full rights to Intel's proprietary NAND technology, R&D resources, and the technical workforce dedicated to NAND operations.

During the transition period, Intel maintained control over these elements, which limited integration between Solidigm and Intel's NAND teams. This separation was designed to manage operational risks and gradually transfer capabilities. Completing this deal helps with a strategic restructuring of Intel's portfolio as it shifts focus toward high-growth areas such as AI chip development, foundry services, and next-generation semiconductor manufacturing. A $1.9 billion financial injection is perfect in time for Intel Foundry business, burning billions per year, to offset some of the losses. For SK Hynix, consolidating the complete range of Intel's NAND operations enhances its competitive position in the global NAND market, providing access to established technologies and key industry expertise. This finalization is part of a broader trend where companies divest from commoditized memory products to concentrate on more advanced semiconductor solutions like AI chips and other accelerators, which are enjoying higher margins and a better business outlook.

According to an investment bank UBS note, two industry titans—NVIDIA and Broadcom—are potential future clients that could significantly enhance Intel's Foundry business revenue. To revitalize Intel, newly appointed CEO Lip-Bu Tan reportedly aims to forge strategic alliances with two AI chip manufacturers. Tan, who assumed leadership earlier this month, is determined to rebuild the company's reputation by focusing on customer satisfaction and accelerating the development of its foundry business. UBS analyst Tim Arcuri suggests that while Broadcom might join the client roster, NVIDIA appears to be the more likely candidate. Rather than initially manufacturing NVIDIA's AI GPUs, Intel is expected to begin production with gaming GPUs. NVIDIA could even move to AI GPU production at Intel's fabs if satisfied.

Despite some early optimism, Intel's new CEO is now committed to addressing issues related to power consumption in Intel's manufacturing processes. UBS analyst Tim Arcuri noted that the firm is pushing hard to introduce a lower-power version of its 18A process, the so-called 18AP, which has reportedly struggled to meet energy requirements. Additionally, Intel is working to improve its advanced packaging techniques to rival Taiwan's TSMC CoWoS (S/L/R variants) technology, aiming to overcome packaging constraints that have slowed AI chip production. Analysts speculate that Intel might also become a secondary supplier to tech giant Apple. A promising partnership with Taiwan's United Microelectronics (UMC) could pave the way for Intel's chips to find their way into future Apple products. Whatever materializes, we are yet to see. Switching foundries from TSMC to Intel entirely is not possible for any of the aforementioned fabless designers, so it will likely be dual-sourcing at first, with some non-flagship SKUs getting the full port to Intel 18A.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

Intel just started a succession of its Foundry division management. According to an Intel spokesperson for Tom's Hardware, Dr. Ann Kelleher is heading for retirement after spending 30 years at Intel. Dr. Kelleher is the executive vice president of Intel Foundry and has been the head of foundry technology development since 2020. For the past 30 years, Dr. Kelleher has been there for Intel's ups and downs, overcoming many challenges for the company. This year, Dr. Kelleher's impressive 30-year run at Intel is coming to an end as she heads to a well-deserved retirement. While not being active, her immense knowledge and education are still valuable, and she will remain a board advisor.

Succeeding her at the head of the Foundry front-end division will be Naga Chandrasekaran, who brings over three decades of semiconductor experience, 20 of which have been spent at Micron. Assisting Naga Chandrasekaran with back-end foundry operations like packaging will be Navid Shahriari, who spent over 35 years at Intel and is currently a senior vice president. In a statement for Tom's Hardware, Intel noted: "As previously announced, Dr. Ann Kelleher plans to retire later this year following a distinguished career spanning over 30 years with Intel. With a strong foundry leadership team in place and Intel 18A progressing well ahead of our first product launch and external customer tape-outs, this is a well-planned transition as we continue to advance our Foundry priorities in service to customers."

Over a year ago, industry watchdogs posited that Apple was patiently waiting in line at the front of TSMC's 2 Nanometer GAA "VVIP queue." The securing of cutting-edge manufacturing processes seems to be a consistent priority for the Cupertino, California-headquartered fabless chip designer. Current generation Apple chipsets—at best—utilize TSMC 3 nm (N3E) wafers. Up until very recently, many insiders believed that the projected late 2026 launch of A20 SoC-powered iPhone 18 smartphones would signal a transition to the Taiwanese foundry's advanced 2 nm (N2) node process. Officially, TSMC has roadmapped the start of 2 nm mass production around the second half of 2025.

According to Jeff Pu—a Hong Kong-based analyst at GF Securities—the speculated A20 (2026) chipset could stick with N3P. Leaks suggest that aspects of Apple's next in line "A19" and "A19 Pro" mobile SoCs could be produced via a 3 nm TSMC process. MacRumors has picked up on additional inside track whispers; about Apple M5 processors (for next-gen iPad Pro models) being based on N3P—"likely due to increased wafer costs." Pu reckons that Apple's engineering team has provisioned a major generational improvement with A20's AI capabilities, courtesy of TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology. This significant upgrade is touted to tighten integration between the chip's processor, unified memory, and Neural Engine segments. Revised insider forecasts have positioned A21 chip designs as natural candidates for a shift into 2 nm GAA territories.

Samsung Foundry could abandon its 1.4 nm (SF1.4) process node initially targeted for 2027 production, according to industry leaker @Jukanlosreve. This decision comes amid ongoing yield problems with the company's 3 nm SF3 node and follows the shutdown of underutilized 5 nm and 7 nm production lines. This could significantly impact Samsung's technology roadmap, which had positioned SF1.4 alongside automotive-focused SF2A and SF2Z nodes. According to Korea Economic Daily data, the foundry division's market share has fallen to 8.2% compared to TSMC's 67.1%. Samsung continues the development of Exynos 2600 on the SF2 node and maintains orders from Japan's Preferred Networks but has failed to attract major clients beyond Chinese firms, avoiding US sanctions. Internal restructuring appears imminent, with reports suggesting the Exynos design team may move under the Mobile Experience division.

While Samsung may prioritize improving yields on existing nodes rather than pursuing SF1.4, this approach risks competitive disadvantages in high-performance computing and AI markets. The SF2Z node with Backside Power Delivery Network (BPDN) technology remains under development, though its commercial viability depends on resolving broader manufacturing issues. Samsung's retreat would further fall behind advanced node manufacturing, competing with TSMC and potentially Intel, raising questions about competition in leading-edge semiconductor fabrication. The company's decisions in the coming months will determine whether it can regain manufacturing credibility or face production of trailing-edge semiconductor nodes. Manufacturing advanced silicon remains a challenge for everyone except TSMC.

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

Intel's 18A node, often referred to as Intel's silver lining, has just produced tangible result. In a LinkedIn post of Intel's engineering manager Pankaj Marria, we learn that Intel's 18A node is now being produced in initial wafer lots for testing and evaluation by Intel's customers. This means that Intel's 18A node PDK is officially in version 1.0, and customers are already using that PDK for testing of custom chips. "The Eagle has landed," noted the post, referring to the node development as a major milestone for a node developed and made in US. There were even posters with the same slogans being brought up, meaning that possible customers are also happy with inital test runs. With high-volume manufacturing slated for second half of 2025, we could even see 18A HVM going before initial targets.

Intel's leadership transition to CEO Lip-Bu Tan has overlapped with a recalibration of corporate messaging around the foundry business. Tan's internal communication explicitly frames Intel's strategy as a dual-track approach that maintains both product development and foundry services under unified corporate governance. This position counters speculation regarding potential foundry spinoff scenarios, though it doesn't categorically exclude future structural changes. Previous industry rumors had outlined potential joint venture configurations involving TSMC and major US semiconductor firms, including AMD, Broadcom, and NVIDIA, taking equity positions in a separate foundry entity. While such arrangements remain theoretically viable, Tan's emphasis on fab strategic importance aligns with predecessor Pat Gelsinger's manufacturing-centric vision, suggesting continuity in Intel's Foundry and Product model despite market pressure.

TSMC is still considering a strategic joint venture to operate Intel's manufacturing capacity, according to four sources close to Reuters that are familiar with the discussions. The proposed arrangement would limit TSMC's ownership to less than 50% and potentially distribute stakes to major American chip designers, including AMD, Broadcom, NVIDIA, and Qualcomm. The initiative emerged following direct intervention from the Trump administration, which has prioritized revitalizing domestic semiconductor manufacturing while maintaining American control of critical technology infrastructure. Under the proposed framework, Intel would spin off its Intel Foundry division, with TSMC acquiring a minority stake and bringing in partner companies as co-investors.

Apple, TSMC's largest customer, is absent from these preliminary discussions, suggesting careful strategic positioning within the competitive ecosystem—however, significant technical and operational challenges are facing the potential joint venture. Intel's manufacturing and real estate assets are valued at approximately $108 billion, requiring substantial capital commitments from prospective partners. More fundamentally, the technological integration presents massive obstacles, as Intel and TSMC utilize fundamentally different manufacturing processes with distinct equipment configurations and material requirements. However, the complex negotiations remain in the early stages, with significant technical, financial, and regulatory hurdles to overcome before any formal agreement materializes. Intel is still not giving the clear green light to spin off rumors.

TrendForce's latest research reveals that the global foundry industry exhibited a polarized trend in 4Q24. Advanced process nodes benefited from strong demand in AI servers, flagship smartphone application processors (APs), and new PC platforms, driving high-value wafer shipments. This growth helped offset the slowdown in mature process demand, allowing the top 10 foundries to achieve nearly 10% QoQ revenue growth, reaching US$38.48 billion, and marking another industry record.

TrendForce notes that new U.S. trade tariffs under the Trump administration have started affecting the foundry industry. A surge in recent orders for TVs, PCs, and notebooks bound for the U.S. in 4Q24 is expected to extend into 1Q25. Additionally, China's consumer subsidy program—introduced in late 2024—has spurred early inventory restocking among upstream customers. Combined with persistent demand for TSMC's AI-related chips and advanced packaging, these factors suggest that despite Q1 being a seasonally weak quarter, foundry revenue will only decline slightly.

Earlier in the week, online chatter pointed to a possible delay in the production of Panther Lake silicon. Well-known industry analyst—Ming-Chi Kuo—has kept tabs on the inner workings of several big semiconductor players. A previous insider tale revealed NVIDIA's allegedly revised "Blackwell" architecture roadmap. Kuo's latest insight focused on Intel and their 18A node process; rumored setbacks have reportedly pushed the launch of next-gen Panther Lake (PTL) mobile processors into 2026. Team Blue leadership has already reacted to the relatively fresh allegations—earlier in the week, John Pitzer sat down with Morgan Stanley Semiconductor Research's Joe Moore. During their conference fireside chat, Intel's Corporate Vice President of Investor Relations addressed recent internet whispers.

When asked about 18A being developed on schedule, Pitzer responded with: "yes, it is. I mean, I tend to wake up every morning trying to fish through rumors that are coming across on social media about Intel 18A. I want to be very clear. Panther Lake is on track to launch in the second half of this year. That launch date has not changed. We feel really good about the progress that we are making. In fact, if you look at where our yields are on Panther Lake today, they're actually slightly ahead at a similar point in time to Meteor Lake, if you look at the development process for Meteor Lake. I think a couple of weeks ago, there was a technical paper out that actually looked at our SRAM density on Intel 18A that compared well with TSMC's N2. Lots of different metrics you can compare technologies on. I think in general, we think about Intel 18A being an N3 type/N2 sort of comp with the external peers." Panther Lake is set to become the company's first product family that will utilize its own Foundry's 18A node process. Mid-way through February, we heard about the importance of PTL with Intel's portable gaming strategy.

Intel still depends on external partners for its semiconductor manufacturing strategy, with approximately 30% of its wafers currently outsourced to TSMC, according to Intel's Corporate Vice President of Investor Relations. This marks a significant shift from previous plans to eliminate external foundry dependencies, as the company now intends to maintain a permanent multi-foundry approach. "That is probably a high watermark for us," said John Pitzer during a recent investor dialogue with Morgan Stanley analyst Joe Moore. "But to the extent that I think a year ago, we were talking about trying to get that to zero as quickly as possible. That's no longer the strategy." Pitzer elaborated that Intel now views TSMC as "a great supplier" whose continued involvement "creates a good competition between them and Intel Foundry." The company is reportedly evaluating the optimal long-term outsourcing ratio, considering targets between 15-20% of total wafer production.

This strategic adjustment comes amid leadership changes at Intel, with interim CEOs Dave Zinsner and Michelle Johnston Holthaus granted increased decision-making authority while maintaining the core dual approach of developing "a world-class fabless company and a world-class foundry." The executive team focuses on strengthening Intel's product competitiveness before fully optimizing its foundry operations. This pragmatic approach is viewed as recognizing manufacturing realities in the highly complex semiconductor creation. Intel's willingness to leverage TSMC's advanced process technologies reflects both practical necessity and strategic flexibility as the company navigates its manufacturing transformation. Intel's fabrication self-sufficiency goals remain essential but will be balanced against product competitiveness and time-to-market considerations.

Samsung's foundry operation has experienced many setbacks over the past six months, according to a steady feed of insider reports. Last November, industry moles leaked details of an apparent abandonment of the company's 3 nm Gate-All-Around (GAA) process. Significant yield problems prompted an alleged shift into 2 nm territories, with a next-gen flagship Exynos mobile processor linked to this cutting-edge node. According to a mid-week Chosun Daily article, Samsung and its main rival—TSMC—are in a race to establish decent yields of 2 nm wafers, ahead of predicted "late 2025" mass production kick-offs. The publication's inside track points to the Taiwanese foundry making the most progress (with an estimated 60%), but watchdogs warn that it is too early to bet against the South Korean competitor.

Despite murmurs of current 20 - 30% yields, the Samsung's Hwaseong facility is touted to make "smooth" progress over the coming months. Chosun's sources believe that Samsung engineers struggled to get 3 nm GAA "up to snuff," spending around three years on development endeavors (in vain). In comparison, the making of 2 nm GAA is reported to be less bumpy. A fully upgraded "S3" foundry line is expected to come online by the fourth quarter of this year. An unnamed insider commented on rumors of better than anticipated forward motion chez Samsung Electronics: "there are positive aspects to this as it has shown technological improvements, such as the recent increase in the yield of its 4 nm process by up to 80%." Recent-ish reports suggest that foundry teams have dealt with budget cuts, as well as mounting pressure from company leadership to hit deadlines.

On Feb. 28, 2025, Naga Chandrasekaran, executive vice president, chief global operations officer and general manager of Intel Foundry Manufacturing, sent a message to Intel employees in Ohio updating them on the latest planned construction completion dates for Ohio One Mod 1 and Mod 2 that are under construction in New Albany, Licking County, Ohio. I continue to be impressed by the progress you are driving on our Ohio One campus. We have come a long way since construction began, and I am grateful for all that you've accomplished to lay the groundwork for our future as we make Ohio one of the world's leading hubs of advanced semiconductor manufacturing.

Last quarter, we achieved our "go vertical" milestone when the "basement" level of the fab was completed - and work on the above-ground structure is now underway. The campus has been transformed in ways that bring Ohio's natural beauty to the site. You are also doing so much beyond our campus to support Ohioans in our neighborhood and across the state by creating education and workforce development initiatives, building local business partnerships, and volunteering and investing in the community. I am proud of the impact you are making.

Earlier in the year, we heard about TSMC being ahead of the game with its speculated trial production run of cutting-edge 2 nm (N2) silicon. Taiwan's premier foundry company is reportedly prepping its Baoshan and Kaohsiung plants for full-on manufacturing of next-gen chips. The latest insider whispers propose that TSMC is making "rapid" progress on the 2 nm (N2) front, as company engineers have moved onto an "intensive" trial production phase. Taiwan's Economic Daily News has picked up on compelling projections from industry moles; the Hsinchu Baoshan facility's current monthly production capacity is (allegedly) around 5000 to 10,000 2 nm wafers. The other 2 nm-specialist site—Kaohsiung—has reportedly moved into a small-scale appraisal phase.

TSMC declined to comment on recently leaked data points, but they released a general statement (to UDN), emphasizing that: "(our) 2 nm process technology is progressing well and will go into mass production as scheduled in the second half of this year." The Baoshan plant could ramp up to 25,000 2 nm wafers per month, once it moves into a mass production phase. Combined with the same estimated output from its sister site (Kaohsiung), insiders reckon that the combined total could reach 50,000 units per month. Following a predicted successful "second phase" transition, TSMC's most advanced facilities have a "chance" to pump out 80,000 2 nm parts (combined total). The latest murmurs suggest that this milestone could be achieved by the end of 2025. Industry watchdogs believe that Apple will have first access dibs on TSMC's upcoming cutting-edge offerings.

In nearly every corner of our lives, the buzz about AI is impossible to ignore. It's destined to revolutionize how we work, learn, and play. For those of us immersed in the world of gaming—whether as players or creators—the question isn't just how AI will change the game, but how it will ignite new possibilities.

At Xbox, we're all about using AI to make things better (and more fun!) for players and game creators. We want to bring more games to more people around the world and always stay true to the creative vision and artistry of game developers. We believe generative AI can boost this creativity and open up new possibilities. We're excited to announce a generative AI breakthrough, published today in the journal Nature and announced by Microsoft Research, that shows this potential to open up new possibilities—including the opportunity to make older games accessible to future generations of players across new devices and in new ways.

Last December, Intel revealed that its next-generation "Celestial" GPU architecture was "complete." At the time, Team Blue's Tom "TAP" Petersen revealed: "our IP that's kind of called Xe3, which is the one after Xe2, that's pretty much baked... And so the software teams have a lot of work to do on Xe3. The hardware teams are off on the next thing (aka Xe4/Druid), right." Noted Intel inside info leaker—Raichu—believes that "Celestial" will be: "different from Panther Lake, Celestial dGPU looks like will maybe be based on Xe3P instead of Xe3. I estimate it will (be) based on INTC's process instead of outside." Their Friday evening (February 14) social media declaration suggests that Team Blue is bringing things in-house for the manufacturing of discrete "Celestial" graphics cards; utilizing an Intel Foundry node process, rather than rely on TSMC once more. The latter's foundry produced the Arc "Alchemist" and "Battlemage" dGPU generations.

Intel's rumored "Xe3P" architecture is not a fully known quantity, but reports from last November pointed to the existence of multiple "Xe3" variants; courtesy of information gleaned from an employee's LinkedIn profile. Over the past two weeks, we have witnessed plenty of leaks alluding to future Intel CPU families, but the flow of Arc graphic solutions-related leaks seemingly slowed down around the launch of Intel's budget-friendly "Battlemage" B570 card. Recent-ish insider disclosures have uncovered a possible expansion of the current-gen Arc series, with more SKUs rumored to be on the way. A certain group of industry watchdogs reckon that the unannounced "BGM-G31" GPU will be the basis for higher-end "Battlemage" B-series models, but others believe that options above B580 and B570 are canceled—potentially paving the way for "Xe3P-based" C-series designs later this year, or in 2026.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

Mid-week—at the World Economic Forum in Davos—India's government announced that its native semiconductor industry will release its debut product at some point this year. A similar announcement was made at last year's event, but the reported 28 nm "Made in India" chip would eventually miss its (then) projected December 2024 launch date. Press outlets have focused on Ashwini Vaishnaw's latest prediction for 2025—the Union Minister believes that everything will align neatly for his nation's fledgling semiconductor industry. Additionally, industry stakeholders have expressed confidence in the Semicon India program (initiated back in 2021).

He stated: "Our first 'Made in India' chip will be rolled out this year, and now we are looking at the next phase, where we can get equipment manufacturers, material manufacturers and designers in India...For materials, from parts per million purity, we need to go to parts per billion purity levels. This requires huge transformative changes in the process and the industry is working to achieve this." Vaishnaw is chief of India's AI Mission—this program has set itself some ambitious goals for 2025 and beyond. A primary objective is the founding of a common compute facility that will make use of 10,000 GPUs. The Minister for Electronics and Information Technology outlined the country's next phase of AI industry development—the creation of an indigenous AI model, and homegrown AI chip designs.

Earlier this week, Taiwan experienced a magnitude 6.4 earthquake—this seismic event interrupted manufacturing activities at several TSMC chip-making facilities. As a precaution, foundry employees in both Central and Southern Taiwan were evacuated. Production resumed fairly quickly following inspections of crucial infrastructure—no major damage to facilities or equipment was noted. The latest reports suggest that a relatively minor number of TSMC wafers have been affected by the recent quake, while some recalibration of instrumentation is required to get things back on track.

Inside sources reckon that up to 20,000 wafers (possibly 10,000 at a minimum) could be scrapped—assessments are reportedly still underway, but a small proportion of client shipments could be disrupted. News articles point to this total being spread across three affected locations. Fab 18 is a key 3 nm production hub—situated in Taiwan's Southern Science Park, Tainan's Fab 14 specializes in 4 nm and 5 nm processes, and Fab 8 (Hsinchu) takes care of 200 nm. Industry experts believe that TSMC will bounce back quickly, and that the damaged wafer count represents a minor dent in the proverbial armor—on a good day, manufacturing output can reach up to 37,000 units.