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AMD Zen 4 Reportedly Features a 29% IPC Boost Over Zen 3

While AMD has only released a few Zen 3 processors which are still extremely hard to purchase for RRP we are already receiving leaks on their successors. Zen 3 Milan processors will likely be the final generation of AM4 processors before the switch to AM5. AMD appears to be preparing a bridging series of processors based on the Zen 3+ architecture before the release of Zen 4. Zen 3+ is expected to be AMD's first AM5 CPU design and should bring small IPC gains similar to the improvements from Zen to Zen+ in the range of 4% - 7%. The Zen 3+ processors will be manufactured on TSMC's refined N7 node with a potential announcement sometime later in 2021.

Zen 4 is expected to launch the next year in 2022 and will bring significant improvements potentially up to 40% over Zen 3 after clock boosts according to ChipsandChesse. A Zen 4 Genoa engineering sample reportedly performed 29% faster than an existing Zen 3 CPUs at the same clock speeds and core counts. The Zen 4 architecture will be manufactured on a 5 nm node and could potentially bring another core count increase. This would be one of the largest generational improvements for AMD since the launch of Ryzen if true. Take all this information with a heavy dose of skepticism as with any rumor.

AMD Confirms "Zen 4" on 5nm, Other Interesting Tidbits from Q2-2020 Earnings Call

AMD late Tuesday released its Q2-2020 financial results, which saw the company rake in revenue of $1.93 billion for the quarter, and clock a 26 percent YoY revenue growth. In both its corporate presentation targeted at the financial analysts, and its post-results conference call, AMD revealed a handful interesting bits looking into the near future. Much of the focus of AMD's presentation was in reassuring investors that [unlike Intel] it is promising a stable and predictable roadmap, that nothing has changed on its roadmap, and that it intends to execute everything on time. "Over the past couple of quarters what we've seen is that they see our performance/capability. You can count on us for a consistent roadmap. Milan point important for us, will ensure it ships later this year. Already started engaging people on Zen4/5nm. We feel customers are very open. We feel well positioned," said president and CEO Dr Lisa Su.

For starters, there was yet another confirmation from the CEO that the company will launch the "Zen 3" CPU microarchitecture across both the consumer and data-center segments before year-end, which means both Ryzen and EPYC "Milan" products based on "Zen 3." Also confirmed was the introduction of the RDNA2 graphics architecture across consumer graphics segments, and the debut of the CDNA scalar compute architecture. The company started shipping semi-custom SoCs to both Microsoft and Sony, so they could manufacture their next-generation Xbox Series X and PlayStation 5 game consoles in volumes for the Holiday shopping season. Semi-custom shipments could contribute big to the company's Q3-2020 earnings. CDNA won't play a big role in 2020 for AMD, but there will be more opportunities for the datacenter GPU lineup in 2021, according to the company. CDNA2 debuts next year.

Distant Blips on the AMD Roadmap Surface: Rembrandt and Raphael

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

AMD Financial Analyst Day 2020 Live Blog

AMD Financial Analyst Day presents an opportunity for AMD to talk straight with the finance industry about the company's current financial health, and a taste of what's to come. Guidance and product teasers made during this time are usually very accurate due to the nature of the audience. In this live blog, we will post information from the Financial Analyst Day 2020 as it unfolds.
20:59 UTC: The event has started as of 1 PM PST. CEO Dr Lisa Su takes stage.

AMD "Zen 4" 2021 Launch On Track as TSMC Optimistic About 5 nm

AMD's "Zen 4" CPU microarchitecture is on track for a 2021 launch as its principal foundry partner, TSMC, is optimistic about early yields of its 5 nm silicon fabrication node. TSMC supports the 5 nm product roadmaps of not just AMD, but also Apple and HiSilicon. "Zen 4" is particularly important for AMD, as it will release its next enterprise platform, codenamed "Genoa," along with the new SP5 socket. The new socket will present AMD with the opportunity to significantly change the processor's I/O, such as support for a new memory standard, a new PCIe generation, more memory channels, more PCIe lanes, etc. As early as 2019, the foundry is seeing yields of over 50 percent for the 5 nm node (possibly risk production designed to test the node), which is very encouraging for its customers.

AMD's roadmap for 2020 sees the introduction of "Zen 3" on the 7 nm EUV process (dubbed 7 nm+). AMD recently commented that the performance uplift of "Zen 3" versus "Zen 2" will be "right in line with what you would expect from an entirely new architecture." The 7 nm EUV node provides a significant 20 percent increase in transistor-density compared to the current 7 nm DUV node "Zen 2" chiplets and the company's "Navi" family of GPUs are built on. "Zen 3" could see the company do away with the CCX (quad-core CPU complex), and make chiplets monolithic blocks of CPU cores without sub-divisions. For the client-segment, 5 is a recurring number in 2021. It will see the introduction of the 5th generation Ryzen processors (5000-series), built on the 5 nm process, supporting DDR5 memory, PCI-Express gen 5, and the new AM5 client-segment CPU socket.

AMD Zen 3 Could Bid the CCX Farewell, Feature Updated SMT

With its next-generation "Zen 3" CPU microarchitecture designed for the 7 nm EUV silicon fabrication process, AMD could bid the "Zen" compute complex or CCX farewell, heralding chiplets with monolithic last-level caches (L3 caches) that are shared across all cores on the chiplet. AMD embraced a quad-core compute complex approach to building multi-core processors with "Zen." At the time, the 8-core "Zeppelin" die featured two CCX with four cores, each. With "Zen 2," AMD reduced the CPU chiplet to only containing CPU cores, L3 cache, and an Infinity Fabric interface, talking to an I/O controller die elsewhere on the processor package. This reduces the economic or technical utility in retaining the CCX topology, which limits the amount of L3 cache individual cores can access.

This and more juicy details about "Zen 3" were put out by a leaked (later deleted) technical presentation by company CTO Mark Papermaster. On the EPYC side of things, AMD's design efforts will be spearheaded by the "Milan" multi-chip module, featuring up to 64 cores spread across eight 8-core chiplets. Papermaster talked about how the individual chiplets will feature "unified" 32 MB of last-level cache, which means a deprecation of the CCX topology. He also detailed an updated SMT implementation that doubles the number of logical processors per physical core. The I/O interface of "Milan" will retain PCI-Express gen 4.0 and eight-channel DDR4 memory interface.
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