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Intel Reassures Investors of its Server Processor Roadmap: Ice Lake-SP in 2020, Sapphire Rapids in 2021

Intel's Investor Relations head Trey Campbell, in a "fire-side chat" with top investors at the Cowen Virtual Technology Media and Telecom Conference, reaffirmed Intel's commitment to its server processor roadmap. Intel is on course to introducing its 10 nm Xeon "Ice Lake-SP" enterprise processor family by the end of 2020, and "Sapphire Rapids" sometime within 2021.

"Ice Lake-SP" processor will introduce the new "Whitley" platform, with a new 4,189-pin LGA socket, which leverages PCI-Express gen 4.0. While retaining the DDR4 memory standard, the memory interface has been broadened to 8-channel, and reference memory clock speeds are expected to be increased to DDR4-3200. The company's "Sapphire Rapids" processor is expected to shake up the market, as it introduces next-generation I/O, when it launches alongside the "Eagle Stream" platform in 2021. The processor will be built on the refined 10 nm+ silicon fabrication node, feature "Willow Cove" CPU cores, and I/O feature set that sees the introduction of DDR5 memory standard, and PCI-Express gen 5.0.

Intel "Elkhart Lake" Atom Processor Surfaces on Chinese Components Marketplace, "Tremont" Meets Gen11

Intel's next-generation Atom processor is codenamed "Elkhart Lake." Built on the 10 nm silicon fabrication process, the chip combines up to four CPU cores based on the "Tremont" microarchitecture, with an iGPU based on the Gen11 architecture, and a single-channel memory interface that supports DDR4 and LPDDR4. Differentiation of the processor include 2-core and 4-core CPU variants, and TDP variants spanning 6 W, 9 W, and 12 W. "Tremont" is a lightweight CPU core by Intel that lacks AVX capabilities. Besides "Elkhart Lake," the core is featured in the "Lakefield" Core heterogenous processors as the their low-power cores.

Chinese electronics B2B marketplace CogoBuy.com has the processor listed, although without listing out any processor model numbers. The marketplace is accepting RFQs (requests for quotations) for bulk purchase of these BGA chips on trays, without listing prices. Also listed is an "industrial variant" of the chip, which has an increased TJmax of 110 °C (compared to 105 °C of the standard variant). The Gen11 iGPU wasn't detailed, but it's likely to have a lower execution unit count than the variant found on "Ice Lake" processors, while retaining its display- and media-engines (ability to pull 8K60 displays).

Intel Tiger Lake Processor Spotted with Boost of 5 GHz

Intel is preparing to launch its next-generation Tiger Lake lineup of processors for the middle of 2020. The processors are based on the new "Willow Cove" CPU core, which supposedly brings even more IPC gains compared to previous "Golden Cove" CPU cores found in Ice Lake processors. The Tiger Lake lineup will use Intel's advanced 10 nm+ manufacturing process. This alone should bring some gains in frequency compared to the 10 nm Ice Lake processor generation, which was spotting a maximum of 4.1 GHz boost frequency on 28 W TDP model named Core i7-1068NG7. This processor is labeled as the highest-performing Ice Lake parts available today and the best 10 nm products available so far from Intel.

Thanks to the popular hardware leaker Rogame, we have evidence that the gains from 10 nm+ manufacturing process are real and that Tiger Lake will show us an amazing boost frequency of 5 GHz. In the benchmark, an unknown OEM laptop was spotted running the benchmark with a Tiger Lake CPU. This CPU is a 4 core, 8 threaded model with a base frequency of 2.3 GHz and a surprising boost frequency of 5 GHz. This information should, of course, be taken with a grain of salt until we get more information about the Tiger Lake lineup and their specifications.
Intel Tiger Lake Benchmark Report

Intel Showcases Ice Lake iGPU Performance in Premiere Pro 14.2

As we reported earlier this week, the release of Adobe Premiere Pro 14.2 brought GPU acceleration to select NVIDIA and AMD GPUs taking advantage of NVIDIA's NVENC chips to boost encoding and decoding speeds. Intel has now showcased the improvements to encoding and decoding with Intel Quick Sync Video (QSV) on 11th generation iGPUs found in mobile Ice Lake chips with Adobe Premiere Pro 14.2.

Compared to the previous 9th generation graphics found in Skylake and Kabylake CPUs the new 11th generation iGPUs perform anywhere from 49-82% better. While impressive, these performance gains can only be found on limited low power 10 nm mobile chips with a maximum of four cores and are yet to arrive on desktop platforms.

Intel Gen12 Xe iGPU Twice as Fast as Gen11, Enters AMD Vega iGPU Territory

Intel Xe graphics architecture makes its commercial debut as an iGPU solution in the company's upcoming "Tiger Lake" mobile processors. The iGPU can be configured along three tiers, with GT1 featuring 48 execution units (EUs), GT2 80 EUs, and GT3 leading the pack with 96 EUs, all within a 15 W envelope (for the total chip). There's a higher tier still of GT3 that comes with higher boost frequencies, tapping into the chip's overall increased 28 W TDP, but this variant of "Tiger Lake" could likely be an Apple-exclusive like its "Ice Lake" based predecessor.

NotebookCheck compiled a 3DMark FireStrike comparison between the various tiers of the Xe iGPU, and compared it to the Gen11 iGPU found with current-generation "Ice Lake-U" processors. The graph doesn't put out scores, but relative performance. Apparently, the 48 EU version of Gen12 Xe is a little over twice as fast as Gen11 GT1, and faster than even the 64 EU Gen11 GT2. The Gen12 GT2 with 80 EUs is around 1.7x faster than the Gen11 GT2 (64 EU). The 96 EU GT3 trim is over twice as fast, and its 28 W variant faster still. These performance give Gen12 a shot against AMD's Radeon Vega-based iGPU solution found in "Renoir." AMD has slimmed the number of CUs down to 8 (512 SP) with "Renoir," down from 11 CUs in the previous generation, compensating for it with higher GPU engine clocks.

Intel Apparently Reserving 28 W Ice Lake Mobile Chips for Apple, Removes Entries from ARK

The idea of an ARK is to preserve that which enters it; however, the legend on the basis of arks and their concept must've slipped Intel's internal memos. The company has de-listed a previously detailed Ice Lake mobile CPU from its database - the Core i7-1068G7 - which was a 28 W part available for system integrators to build machines around. That part was special, because it was - then - the only 28 W part listed for mobile Ice Lake, with the rest of the CPU lineup having configurable TDPs between 12 W and 25 W - thus having a lesser maximum theoretical performance due to reduced TDP.

In its stead, Intel has entered a new, Core i7-1068NG7 (yes, the same naming with an extra N), which places this as an Apple-exclusive CPU, according to the folks over at Notebookcheck. Besides this entry, Intel has also listed the i5-1038NG7, which also features a 28 W TDP that's higher than the other available CPUs for other system integrators. If this is true, then Intel is reserving its cream-of-the-crop CPUs for Apple. Since the California-based company wouldn't be using parts with worse thermal and power consumption figures than what's available for others, the only answer to how these products came to being is that they are binned CPUs with better than average characteristics. Intel could be doing this to keep Apple happy even as the California-based company is well on its way to eschew its dependence on x86 with a fully internally-developed ARM CPU.

Intel Core i7-1185G7 "Tiger Lake" Ships with 4.70 GHz Turbo Boost Speeds

Intel spoke of a "double digit percentage performance growth generation on generation" at its product reveal for "Tiger Lake" along the sidelines of its CES event. We now have a theory as to how they arrived at that. The company's 11th generation Core "Tiger Lake" processor, scheduled to launch sometime mid-2020, could bring about big gains in per-core performance for the ultraportable segment. PC enthusiast MebiuW, who has had a high hit-rate with Intel leaks, revealed that the flagship "Tiger Lake" part, the Core i7-1185G7, could ship with a CPU Turbo Boost speed of 4.70 GHz, a steep increase from the 3.90 GHz of the top current "Ice Lake" part, the i7-1065G7. The increased clock speeds, coupled with the more advanced "Willow Cove" CPU cores appear to be the 11th generation chip's value proposition.

GDP Win Max is an 8-inch Gaming Laptop with Intel's Ice Lake CPU

GDP, a company specializing in the creation of tiny laptops designed for gaming, has just announced the latest addition to its family of tiny notebooks - the GDP Win Max gaming laptop. This model is an 8-inch gaming laptop packing a lot for its size. On the outside, this laptop is equipped with joysticks on both sides, so there is even an option to directly play games using these joysticks instead of the built-in keyboard. The display of the device is an IPS screen that features a 1280×800 resolution, resulting in a 16:10 aspect ratio of the display. What's more important, however, is what is under the hood of the small body.

It is powered by Intel's latest Ice Lake CPU - the Intel Core i5-1035G7. Being a 4 core/ 8 threaded CPU with Gen11 Iris Plus 940 graphics it is accompanied by 16 GB of LPDDR4X RAM and 512 GB SSD. GDP has provided some of the benchmark results of this configuration which you can check out below, however, please take these with a grain of salt. As far as I/O goes, this small laptop is rather well equipped with plenty of ports. There is one Thunderbolt 3 port to connect to external GPU is it is needed. There is one USB Type-C 3.1 Gen2 port and two USB Type-A 3.1 Gen1 ports for the connection of external peripherals. If you wish to connect the laptop to the outside screen, there are options of HDMI, USB Type-C or Thunderbolt 3 ports for connection. A welcome addition to I/O is the inclusion of the RJ45 connector, meaning that if you have access to ethernet you can easily plug it into this laptop.
GDP Win Max GDP Win Max GDP Win Max Benchmarks GDP Win Max Benchmarks

ASUS Leaks PRIME Z490-P and Z490-A Motherboards for Intel's 10th Gen

ASUS has inadvertently leaked images of their upcoming PRIME Z490-P and Z490-A motherboards, which will accompany the introduction of Intel's 10th Gen "Ice Lake" CPUs. As is usual with Intel, the new generation CPU release will be met with a new chipset launch, of which ASUS apparently has finalized designs: the company has uploaded Z490 pictures on their current Z390 PRIME webpage.

Like with previous ASUS designs, the PRIME Z490-P seems to target budget-conscious users, with a reduced feature set including a no-frills VRM heatsink design (which means the VRM itself isn't a top-tier one) and a pretty basic on-board sound processor. The motherboard still packs 2x M.2 slots and 2x PCIe 3.0 x16 slots, though the rest of the expansion slots are of the 1x kind (4x slots in total). The Z490-A, though, boasts of a more premium construction, with oversized heatsinks (including for at least one of the M.2 slots) and 3x PCIe 3.0 x16 slots alongside 3x Pcie 3.0 1x slots. The sound processing subsystem has also been clearly beefed up in comparison.
ASUS PRIME Z490-P ASUS PRIME Z490-A

Intel 10nm Product Lineup for 2020 Revealed: Alder Lake and Ice Lake Xeons

A leaked Intel internal slide surfaced on Chinese social networks, revealing five new products the company will build on its 10 nm silicon fabrication process. These include the "Alder Lake" heterogenous desktop processor, "Tiger Lake" mobile processor, "Ice Lake" based Xeon Scalable enterprise processors, DG1 discrete GPU, and "Snow Ridge" 5G base-station SoC. Some, if not all of these products, will implement Intel's new 10 nm+ silicon fabrication node that is expected to go live within 2020.

"Alder Lake" is a desktop processor that implements Intel's new heterogenous x86 core design that's making its debut with "Lakefield." The chip features up to 8 larger "Willow Cove" or "Golden Cove" CPU cores, and up to 8 smaller "Tremont" or "Gracemont" cores. This 8-big/8-small combo lets the chip achieve TDP targets around 80 Watts. Next up is "Tiger Lake," Intel's next-generation mobile processor family succeeding "Ice Lake." This microarchitecture implements "Willow Cove" CPU cores in a homogeneous setup, alongside Xe architecture based integrated graphics. "Ice Lake-SP" is Intel's next enterprise architecture that places mature "Sunny Cove" CPU cores in extreme core-count dies. Lastly, there's "Snow Ridge," an SoC purpose built for 5G base-stations. Image quality notwithstanding, these slides don't appear particularly new, and it's likely that COVID-19 has destabilized the roadmap. For instance, "Alder Lake," and "Ice Lake-SP" are expected to be 10 nm++ chips, a node that doesn't go live before 2021.

Trio of Intel 10th Gen "Ice Lake" NG Processors Show Up on Intel Website

Three new 10th generation Core "Ice Lake-U" notebook processors surfaced on Intel website with a curious new nomenclature, possibly ahead of their "Q2-2020" launch. The three follow the processor model numbering convention of 10x0NGy, where x denotes the key model differentiator, and y the iGPU tier differentiator. Among the three parts are the Core i7-1060NG7, the Core i5-1030NG7, and the Core i3-1000NG4. The i5-1060NG7 and i5-1030NG7 are 10-Watt parts and feature 4-core/8-thread "Sunny Cove" CPUs, while the i3-1000NG4 packs a 2-core/4-thread "Sunny Cove" CPU, and is rated at 9 W TDP.

What sets the Core i5 apart from the Core i7, besides CPU clock speeds, are L3 cache sizes: 8 MB for the Core i7, and 6 MB for the i5. The Core i3 packs 4 MB. With an eye clearly on ultra-portable notebooks, these chips only feature dual-channel LPDDR4 memory interfaces, with memory clock speeds of up to 3733 MT/s. The i7-1060NG7 CPU ticks at 1.20 GHz and up to 3.80 GHz Turbo Boost; while the i5-1030NG7 runs between 1.10 GHz to 3.50 GHz. The i3-1000NG4 is clocked 1.10 GHz with 3.20 GHz Turbo Boost. The Core i7 and Core i5 parts pack an identical Gen11 iGPU: Iris Plus clocked between 300 MHz to 1.10 GHz for the i7 and up to 1.05 GHz for the i5. The Core i3 features 300-900 MHz iGPU clock speeds and fewer execution units.

Microsoft DirectX 12 Ultimate: Why it Helps Gamers Pick Future Proof Graphics Cards

Microsoft Thursday released the DirectX 12 Ultimate logo. This is not a new API with any new features, but rather a differentiator for graphics cards and game consoles that support four key modern features of DirectX 12. This helps consumers recognize the newer and upcoming GPUs, and tell them apart from some older DirectX 12 capable GPUs that were released in the mid-2010s. For a GPU to be eligible for the DirectX 12 Ultimate logo, it must feature hardware acceleration for ray-tracing with the DXR API; must support Mesh Shaders, Variable Rate Shading (VRS), and Sampler Feedback (all of the four). The upcoming Xbox Series X console features this logo by default. Microsoft made it absolutely clear that the DirectX 12 Ultimate logo isn't meant as a compatibility barrier, and that these games will work on older hardware, too.

As it stands, the "Navi"-based Radeon RX 5000 series are "obsolete", just like some Turing cards from the GeForce GTX 16-series. At this time, the only shipping product which features the logo is NVIDIA's GeForce RTX 20-series and the TITAN RTX, as they support all the above features.

Intel Core i5-L16G7 is the first "Lakefield" SKU Appearance, Possible Prelude to New Nomenclature?

Intel Core i5-L16G7 is the first commercial SKU that implements Intel's "Lakefield" heterogenous x86 processor architecture. This 5-core chip features one high-performance "Sunny Cove" CPU core, and four smaller "Tremont" low-power cores, with an intelligent scheduler balancing workloads between the two core types. This is essentially similar to ARM big.LITTLE. The idea being that the device idles most of the time, when lower-powered CPU cores can hold the fort; performance cores kick in only when really needed, until which time they remain power-gated. Thai PC enthusiast TUM_APISAK discovered the first public appearance of the i5-L16G7 in an unreleased Samsung device that has the Userbenchmark device ID string "SAMSUNG_NP_767XCL."

Clock speeds of the processor are listed as "1.40 GHz base, with 1.75 GHz turbo," but it's possible that the two core types have different clock-speed bands, just like the cores on big.LITTLE SoCs. Other key components of "Lakefield" include an iGPU based on the Gen11 graphics architecture, and an LPDDR4X memory controller. "Lakefield" implements Foveros packaging, in which high-density component dies based on newer silicon fabrication nodes are integrated with silicon interposers based on older fabrication processes, which facilitate microscopic high-density wiring between the dies. In case of "Lakefield," the Foveros package features a 10 nm "compute field" die sitting atop a 22 nm "base field" interposer.

Intel Unveils Xe DG1-SDV Graphics Card, Demonstrates Intent to Seriously Compete in the Gaming Space

At a media event on Wednesday, Intel invited us to check out their first working modern discrete graphics card, the Xe DG1 Software Development Vehicle (developer-edition). Leading the event was our host Ari Rauch, Intel Vice President and General Manager for Graphics Technology Engineering and dGPU Business. Much like gruff developer-editions of game consoles released to developers several quarters ahead of market launch, the DG1-SDV allows software developers to discover and learn the Xe graphics architecture, and develop optimization processes for their current and future software within their organizations. We walked into the event expecting to see a big ugly PCB with a bare fan-heatsink and a contraption that sort-of looks like a graphics card; but were pleasantly surprised with what we saw: a rather professional product design.

What we didn't get at the event, through, was a juicy technical breakdown of the Xe graphics architecture, and its various components that add up to the GPU. We still left pleasantly surprised for what we were shown: it works! The DG1-SDV is able to play games at 1080p, even if they are technically lightweight titles like "Warframe," and aren't maxing out settings. The SDV is a 15.2 cm-long graphics card that relies on the PCI-Express slot for power entirely (and hence pulling less than 75 W).

Alienware Shows Off Concept UFO - a Portable, Tablet-like Mini PC

At CES 2020, Dell's gaming-inspired division, Alienware, had a handful of new products to showcase. Among these, we found a new product that is still in development called the Concept UFO. The UFO is a concept product that hints a new development strategy for gaming PCs, and that is a portability first approach. Inspired by Nintendo's Switch console, this computer puts gaming PCs on the go. Designed to be a handheld based solution, this PC is based on Windows 10 operating system so you can be sure that all of your existing game libraries are also playable on it as well.

Having an Intel processor as its base, the Concept UFO uses Intel's iGPU to power an 8-inch display of unknown resolution. While we don't know which architecture is powering the UFO, we speculate that Ice Lake is behind it. Our speculation is based on an assumption that, if the concept is capable of playing games, Alienware would put as high-performance iGPU as possible, and such performance is currently only found inside Intel's Ice Lake processors, in form of Intel Iris Plus integrated graphics. Frank Azor of AMD tweeted a question if anyone would like to see this product come with new AMD 4000 series of Ryzen mobile processors, so we could be in for a surprise, given that final specifications are not determined. Ryzen 4000 series would represent a perfect choice as it offers a lot of CPU and GPU power in a mere 15 W TDP package, however, we don't know what solution will be present in the end.

Intel CPU Based on New Architecture Leaks

Today Intel's CPU based on yet unannounced architecture got revealed in the SiSoft benchmark database. Featuring six cores and twelve threads running at 3 GHz, it appears like a regular 14 nm CPU that's already available, however, when digging through the details, many things are revealed. The newly submitted CPU has a different L2 cache configuration from previous CPU offerings, with this chip featuring 1.25 MB of L2 cache per core, it is unlike anything else Intel currently offers. Ice Lake mobile chips feature 512 KB, while the highest amount of L2 cache is currently present on i9-10980XE, which features 1 MB of L2.

It is unknown where this CPU fits in the whole 14/10 nm lineup, as we don't know if this is an iteration of 10 nm Tiger Lake or the rumored 14 nm Rocket Lake CPU. All we know is that this CPU features new architecture compared to Skylake iterations that are currently being used, judging by L2 cache bump, which usually happens on new architectures. The platform used for benchmarking this CPU was SuperMicro X12DAi-N SMC X12 dual-socket motherboard, which featured two of these new CPUs for a total of 12 cores and 24 threads.

LG Announces new Gram Laptop Lineup Powered by Intel Ice Lake CPUs

LG Electronics' newest gram laptop computer series - the LG gram 17 (model 17Z90N), LG gram 15 (model 15Z90N), LG gram 14 (model 14Z90N) and 14-inch LG gram 2-in-1 (model 14T90N) - is designed to set a new standard for portable computing and will satisfy the needs of the most demanding users. The 2020 lineup of LG gram laptops stick to the company's winning formula - lightweight, compact, long battery life - while adding even more performance.

At the heart of the new series is the 10th Generation Intel Core processor with Iris Plus graphics and up to 24 GB of dual-channel DDR4 memory. With double the graphics processing power of last year's models, content creators will love having the speed and power to edit 4K video on-the-go and users will marvel at how smooth games can be with Iris Plus built-in.

UL Benchmarks Outs 3DMark Feature Test for Variable-Rate Shading Tier-2

UL Benchmarks today announced an update to 3DMark, with the expansion of the Variable-Rate Shading (VRS) feature-test with support for VRS Tier-2. A component of DirectX 12, VRS Tier 1 is supported by NVIDIA "Turing" and Intel Gen11 graphics architectures (Ice Lake's iGPU). VRS Tier-2 is currently supported only by NVIDIA "Turing" GPUs. VRS Tier-2 adds a few performance enhancements such as lower levels of shading for areas of the scene with low contrast to their surroundings (think areas under shadow), yielding performance gains. The 3DMark VRS test runs in two passes, pass-1 runs with VRS-off to provide a point of reference; and pass-2 with VRS-on, to test performance gained. The 3DMark update with VRS Tier-2 test will apply for the Advanced and Professional editions.

DOWNLOAD: 3DMark v2.11.6846

Intel "Rocket Lake-S" Desktop Processor Comes in Core Counts Up to 8, Gen12 iGPU Included

Intel's 11th generation Core "Rocket Lake-S" desktop processor will come in core-counts only up to 8, even as its predecessor, "Comet Lake-S," goes up to 10. Platform descriptors for Intel's next four microarchitectures surfaced on the web, detailing maximum values of their "S" (mainsteam desktop), "H" (mainstream notebook), "U" (ultrabook), and "Y" (low power portable) flavors. Both "Comet Lake-S" and "Rocket Lake-S" are 14 nm chips. "Comet Lake-S" comes with core counts of up to 10, a TDP of up to 125 Watts, Gen 9LP iGPU with 48 execution units, and native support for up to 128 GB of DDR4-2667.

The "Rocket Lake-S" silicon is interesting. Rumored to be yet another derivative of "Skylake," it features up to 8 CPU cores, the same 125 W maximum TDP, but swanky Gen12 iGPU with 32 execution units. The memory controller is also upgraded, which supports DDR4-2933 natively. There is no "Ice Lake-H" or "Ice Lake-S" in sight (no mainstream notebook or mainstream desktop implementations), ditto "Tiger Lake." For the foreseeable future, Intel will only make quad-core designs of the two 10 nm microarchitectures. "Rocket Lake-S" is slated for 2021 when, hopefully, we'll see Intel escape the 14 nm black hole.

Dell Calls Out Intel for CPU Shortages Affecting its 2019 Full Year Revenue Forecast

PC major Dell in its quarterly results call blamed Intel for cuts in its revenue forecast for 2019 (full year) sales. "Intel CPU shortages have worsened qtr-over-qtr, impacting our commercial PC and premium consumer PC Q4 forecasted shipments," said Dell COO Jeffrey Clarke. Intel's CPU shortages are caused due to demand in the PC and server markets significantly outpacing supply, and not because Intel is supplying below its capacity. The company increased its capex toward manufacturer by $1 billion YoY, retrofitting its manufacturing facilities to make 14 nm processors, all while juggling resources to execute its 10 nm rollout for high-volume mobile and high-margin server processors.

The company hasn't launched 10 nm desktop or HEDT processors, yet, and is reportedly preparing yet another 14 nm line of processors for these platforms, codenamed "Comet Lake." This microarchitecture has also seen a mobile rollout for mainstream mobile form-factors, while Intel focused 10 nm "Ice Lake" for ultraportables and ultra low-power form-factors. Intel executive VP for sales Michelle Johnston Holthaus recently wrote a letter to its customers (primarily companies like Dell,) informing them that despite their best efforts, demand continues to beat supply, and that they hadn't managed to solve their supply issues.

Intel "Tiger Lake" Microarchitecture Features HEDT-like Cache Rebalancing?

With its "Skylake" microarchitecture, Intel significantly re-balanced the cache hierarchy of its HEDT and enterprise multi-core processors to equip CPU cores with larger amounts of faster L2 caches, and lesser amounts on slower shared L3 cache. The company retained its traditional cache balance for its mobile and desktop processor derivatives. This could change with the company's "Tiger Lake" microarchitecture, particularly the "Willow Cove" CPU cores they use, according to a Geekbench online database listing for a prototype quad-core "Tiger Lake-Y" mobile processor.

According to this listing, assuming Geekbench is reading the platform correctly; the "Tiger Lake-Y" processor features a 4-core/8-thread CPU, with a massive 1,280 KB (1.25 MB) of L2 cache per core, and 12 MB of L3 cache. Intel also enlarged the L1D (data) cache to be 48 KB in size, while the L1I (instruction) cache remains 32 KB. This amounts to a 400% increase in L2 cache size, and a 50% increase in L3 cache size. Unlike with "Skylake-X," the increase in L2 cache size doesn't come with a decrease in shared L3 cache size (per core). The "Tiger Lake-Y" processor is being tested on a "Corktown" prototyping platform (a specialized motherboard that has all possible I/O connectivity available with the platform, for testing. "Tiger Lake" is expected to make its debut some time in 2020-21 as a successor to "Ice Lake," and will be built on Intel's refined 10 nm++ silicon fabrication node. Find the Geekbench entry in the source link below.

Intel Ice Lake-SP and Cooper Lake-SP Details Leaked

Brainbox, a Korean media outlet, has gathered information on Intel's newest Ice Lake and Cooper Lake server processors from a presentation ASUS held for its server lineup. With Cooper Lake-SP paving the way for the first server CPU model to be released on the new "Whitley" platform, it is supposed to launch in Q2 of 2020. Cooper Lake-SP comes with TDP of 300 W and will be available with configurations of up to 48 cores, but there also should be a 56 core model like the Xeon Platinum 9282, that has a TDP of 400 W. Cooper Lake-SP supports up to 64 PCIe 3.0 lanes, 8 channel memory (16 DIMMs in total) that goes up to 3200 MHz and four Ultra Path Interconnect (UPI) links.

Ice Lake-SP, built on the new 10 nm+ manufacturing process, is coming in soon after Cooper Lake-SP release, with a launch window in Q3 of 2020. That is just few months apart from previous CPU launch, so it will be a bit hard to integrate the launches of two rather distinct products. As far as the specifications of Ice Lake-SP goes, it will have up to 38 core for the top end model, within 270 W TDP. It supports 64 PCIe 4.0 lanes with three UPI links. There is also 8 channel memory support, however this time there is an option to use 2nd generation Optane DC Persistent Memory. Both CPU uArches will run on the new LGA 4189 on the P+ socket.

Intel 10 nm Ice Lake is Alive: Server and Desktop Support Added to the Linux Kernel

There were many rumors about Intel's 10 nm CPUs, many of them indicating that Intel will not manufacture 10 nm CPUs for desktop users, due to the 10 nm manufacturing process being in a bad shape. Those rumors were later countered by Intel, claiming that 10 nm is doing very well on improving yields and that we will see desktop CPUs based on the new node very soon.

Thanks to the Linux kernel mailing list (LKML), we now know that support for Ice Lake desktop and server CPUs has been added. A Patch titled "Add more CPU model number for Ice Lake" has many details about variants of Ice Lake with names like Ice Lake X for server Xeon CPU, Ice Lake D for Xeon D CPUs, Ice Lake L for mobile, and regular Ice Lake for desktop series of CPUs. This confirms Intel's claims that Ice Lake is on its way to desktop and server users in the near future. Possible launch date on these CPUs would be sometime in 2020, when Xe graphics cards are launched in July/August, so Intel could bundle both processors on the same 10 nm node.

Intel Scraps 10nm for Desktop, Brazen it Out with 14nm Skylake Till 2022?

In a shocking piece of news, Intel has reportedly scrapped plans to launch its 10 nm "Ice Lake" microarchitecture on the client desktop platform. The company will confine its 10 nm microarchitectures, "Ice Lake" and "Tiger Lake" to only the mobile platform, while the desktop platform will see derivatives of "Skylake" hold Intel's fort under the year 2022! Intel gambles that with HyperThreading enabled across the board and increased clock-speeds, it can restore competitiveness with AMD's 7 nm "Zen 2" Ryzen processors with its "Comet Lake" silicon that offers core-counts of up to 10.

"Comet Lake" will be succeeded in 2021 by the 14 nm "Rocket Lake" silicon, which somehow combines a Gen12 iGPU with "Skylake" derived CPU cores, and possibly increased core-counts and clock speeds over "Comet Lake." It's only 2022 that Intel will ship out a truly new microarchitecture on the desktop platform, with "Meteor Lake." This chip will be built on Intel's swanky 7 nm EUV silicon fabrication node, and possibly integrate CPU cores more advanced than even "Willow Cove," possibly "Golden Cove."

Microsoft Unveils First Intel "Lakefield" Device and Surface Lineup with 10th Gen Core

Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel's unique processor, code-named "Lakefield," that features an industry-first architecture combining a hybrid CPU with Intel's Foveros 3D packaging technology. It offers device-makers more flexibility to innovate on design, form factor and experience.

"The innovation we've achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft's Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem," said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.
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