Imagine a world where you can whisper your digital wishes into your device, and poof, it happens. That world may be coming sooner than you think. But if you're worried about AI doing your thinking for you, you might be waiting for a while. In a fireside chat Wednesday (March 20) at NVIDIA GTC, the global AI conference, Kanjun Qiu, CEO of Imbue, and Bryan Catanzaro, VP of applied deep learning research at NVIDIA, challenged many of the clichés that have long dominated conversations about AI. Launched in October 2022, Imbue made headlines with its Series B fundraiser last year, raising over $200 million at a $1 billion valuation.

The Future of Personal Computing
Qiu and Catanzaro discussed the role that virtual worlds will play in this, and how they could serve as interfaces for human-technology interaction. "I think it's pretty clear that AI is going to help build virtual worlds," said Catanzaro. "I think the maybe more controversial part is virtual worlds are going to be necessary for humans to interact with AI." People have an almost primal fear of being displaced, Catanzaro said, but what's much more likely is that our capabilities will be amplified as the technology fades into the background. Catanzaro compared it to the adoption of electricity. A century ago, people talked a lot about electricity. Now that it's ubiquitous, it's no longer the focus of broader conversations, even as it makes our day-to-day lives better.

During the CES 2024 show, EK unveiled an exciting new addition to their premium all-in-one (AIO) CPU cooler lineup—the EK-Nucleus AIO CR360 Direct Die D-RGB. As the name suggests, this new 360 mm AIO water cooler is purpose-built for direct die cooling of delidded Intel LGA1700 CPUs. The EK-Nucleus Direct Die stands out with its custom cold plate and mounting mechanism, which are exclusively engineered for exposed CPU dies. The nickel-plated copper base ensures compatibility with liquid metal TIMs like the included Thermal Grizzly Conductonaut, which comes in the package. EK has worked with der8auer to provide delidding service kits and tools to facilitate easy DIY removal of the integrated heat spreader (IHS).

The package also contains a contact frame and protective foam for safe liquid metal application. At the heart of the cooler is a powerful AIO pump EK co-developed with the OEM manufacturer, meaning it is not an off-the-shelf pump found in other AIOs and is capable of up to 500 L/h flow rate. The reinforced, sleeved rubber tubing is fitted with aluminium covers for durability. Integrated omnilink connectors allow daisy chaining of the three included 120 mm D-RGB fans for cable management. The EK-Nucleus Direct Die offers extensive RGB lighting customization with illuminated circle accents on the removable pump top covers. The diamond-cut brushed aluminium side panels and radiator cowl add to the premium aesthetic. The new AIO will be available for the Intel LGA1700 platform, with hopefully more versions later. The EK-Nucleus AIO CR360 Direct Die D-RGB is now available for pre-order at €202.90 MSRP price tag.

Jon Peddie Research reports the growth of the global PC client-based CPU units market reached 53.6 million units in Q2'23, up 17%, and iGPU shipments increased by 14% to 49 million units. Year over year, iGPUs declined -29%.

Integrated GPUs will have a compound annual growth rate of 2.5% during 2022-2026 and reach an installed base of 4.8 billion units at the end of the forecast period. Over the next five years, the penetration of iGPUs in the PC will grow to reach a level of 98%.

Intel's software engineers are working on path-traced light simulation and conducting neural graphics research, as documented in a recent company news article, with an ambition to create a more efficient solution for integrated graphics cards. The company's Graphics Research Organization is set to present their path-traced optimizations at SIGGRAPH 2023. Their papers have been showcased at recent EGSR and HPG events. The team is aiming to get iGPUs running path-tracing in real time, by reducing the number of calculations required to simulate light bounces.

The article covers three different techniques, all designed to improve GPU performance: "Across the process of path tracing, the research presented in these papers demonstrates improvements in efficiency in path tracing's main building blocks, namely ray tracing, shading, and sampling. These are important components to make photorealistic rendering with path tracing available on more affordable GPUs, such as Intel Arc GPUs, and a step toward real-time performance on integrated GPUs." Although there is an emphasis on in-house products in the article, Intel's "open source-first mindset" hints that their R&D could be shared with others—NVIDIA and AMD are likely still struggling to make ray tracing practical on their modest graphics card models.

AMD is late in releasing its Phoenix Zen 4 lineup of mobile APUs - the original April launch has been missed, and laptops bearing Ryzen 7000HS & H-series are expected to arrive at some point this month. Preview hardware has made its way into the hands of testers, and one particular outlet - Golden Pig Upgrade, a content creator on the Chinese Bilibili video site - has performed benchmark tests. He seems to be the first reviewer to get hands-on time with AMD Ryzen 7040 Phoenix APUs, and his findings point to class leading performance results in terms of graphical capabilities - the 7840HS (packing a Radeon 780M RDNA3 iGPU) is compared to the Rembrandt-based 7735H, as well as a pair of Intel Raptor Lake CPUs - the 13700H and 13500H models.

AMD's newest Phoenix APU is the group leader in GPU performance stakes, but the jump up from the last-gen Rembrandt (RDNA2 iGPU) chip is not all that significant. VideoCardz reckons that the Radeon 780M integrated GPU is roughly equivalent to an NVIDIA GeForce MX550 dGPU and not far off from a GeForce GTX 1650 Max-Q graphics card (in terms of benchmark performance). According to AMD's internal documentation the RDNA 3 core architecture utilized in Phoenix APUs is referred to as "2.5" so this perhaps explains why the 780M is not doing laps around its older silbing(s).

On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.

The first desktop processors to implement AMD's "Zen 4" microarchitecture will feature integrated graphics as standard across the lineup, according to a Chips and Cheese report citing leaked AMD design documents. Currently, most of the Socket AM4 desktop processor lineup lacks integrated graphics, and specialized "G" SKUs with integrated graphics dot it. These SKUs almost always come with compromises in CPU performance or PCIe I/O. With its 5 nm "Raphael" Socket AM5 desktop processor, AMD is planning to change this, in a bid to match up to Intel on the universality of integrated graphics.

Built in the 5 nm silicon fabrication process, the "Raphael" silicon combines "Zen 4" CPU cores along with an iGPU based on the RDNA2 graphics architecture. This would be the first time AMD updated the SIMD architecture of its Ryzen iGPUs since 2017. The RDNA2-based iGPU will come with a more advanced DCN (Display CoreNext) component than current RDNA2-based discrete GPUs, with some SKUs even featuring DisplayPort 2.0 support, besides HDMI 2.1. By the time "Raphael" is out (2022-23), it is expected that USB4 type-C would gain popularity, and mainstream motherboards as well as pre-built desktops could ship with USB4 with DisplayPort 2.0 passthrough. AMD relies on a discrete USB4 controller with PCI-Express 4.0 x4 wiring, for its first Socket AM5 platform.

The LattePanda Alpha, based on Intel Core m3-8100Y, is a Dual-Core 1.10 GHz CPU that bursts up to 3.40 GHz. Integrated Intel UHD Graphics 615 into the processor, the LattePanda Alpha delivers enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. All of this computing power dissipates only 8 W power, which is the perfect choice for users who need a small, portable, and light SBC for their powerful DIY handheld. And, given its incredibly small size, the LattePanda Alpha can be easily hidden, functioning as the secretly powerful brains behind users coolest project.

At an Intel Labs virtual event today, Intel unveiled Horse Ridge II, its second-generation cryogenic control chip, marking another milestone in the company's progress toward overcoming scalability, one of quantum computing's biggest hurdles. Building on innovations in the first-generation Horse Ridge controller introduced in 2019, Horse Ridge II supports enhanced capabilities and higher levels of integration for elegant control of the quantum system. New features include the ability to manipulate and read qubit states and control the potential of several gates required to entangle multiple qubits.

"With Horse Ridge II, Intel continues to lead innovation in the field of quantum cryogenic controls, drawing from our deep interdisciplinary expertise bench across the Integrated Circuit design, Labs and Technology Development teams. We believe that increasing the number of qubits without addressing the resulting wiring complexities is akin to owning a sports car, but constantly being stuck in traffic. Horse Ridge II further streamlines quantum circuit controls, and we expect this progress to deliver increased fidelity and decreased power output, bringing us one step closer toward the development of a 'traffic-free' integrated quantum circuit."-Jim Clarke, Intel director of Quantum Hardware, Components Research Group, Intel.

Today, at Intel Labs Day, Intel highlighted industry-leading technological advances toward the realization of the company's long-standing vision of integrating photonics with low-cost, high-volume silicon. The advancements represent critical progress in the field of optical interconnects, which address growing challenges around the performance scaling of electrical input/output (I/O) as compute-hungry data workloads increasingly overwhelm network traffic in data centers. Intel demonstrated advances in key technology building blocks, including miniaturization, paving the way for tighter integration of optical and silicon technologies.

"We are approaching an I/O power wall and an I/O bandwidth gap that will dramatically hinder performance scaling. The rapid progress Intel is making in integrated photonics will enable the industry to fully re-imagine data center networks and architectures that are connected by light. We have now demonstrated all of the critical optical technology building blocks on one silicon platform, tightly integrated with CMOS silicon. Our research on tightly integrating photonics with CMOS silicon can systematically eliminate barriers across cost, power and size constraints to bring the transformative power of optical interconnects to server packages." -James Jaussi, senior principal engineer and director of PHY Lab, Intel Labs.

With update 2.6.6174, released today, 3DMark now includes a new benchmark dubbed Night Raid. This latest addition to the popular 3DMark suite offers DX12 performance testing for laptops, tablets and other devices with integrated graphics. It also offers full support for ARM based processors in the latest always-connected PCs running Microsoft's Windows 10 on ARM. Users running 3DMark Basic Edition which is free will have access to this latest addition upon installing the update.

The Night Raid benchmark continues the trend of offering two graphics tests and a CPU test. While not as visually stunning as previous entries this is to be expected considering it is targeted at integrated graphics processors and entry level systems. Even so, it makes use of numerous graphical features with graphics test 1 including; dynamic reflections, ambient occlusion, and deferred rendering. Graphics test 2 features; tessellation, complex particle systems and depth of field effects with forward-rendering. Finally, the CPU test will measures performance through a combination of physics simulation, occlusion culling, and procedural generation.

Chinese chipmaker Hygon began mass-producing its first x86 processors codenamed "Dhyana" based on AMD's "Zen" micro-architecture. The processor is the fruition of a deal AMD entered with a Chinese state-owned company back in mid-2016. As part of this deal, a company called Haiguang Microelectronics Company (HMC), in which AMD has a 51 percent stake, would license the "Zen" architecture to another company called Hygon (Chengdu Haiguang Integrated Circuit Design Co.), in which AMD owns a 30 percent stake. Hygon would then design "Dhyana," and a third entity (likely TSMC or some other Chinese foundry), would contract-manufacture the chip.

Such legal gymnastics is necessary to ensure AMD makes good on the $293 million it will take from the Chinese firms to license "Zen," while not breaching the x86 architecture cross-licensing agreement it signed with Intel, the core x86 IP owner. Chinese firms are going through all this trouble to build "Dhyana" instead of simply placing a large order of EPYC processors not just because they want more control over the supply and pricing of these chips, but probably also to ensure that China can keep an eye on all the on-die software that makes the processor tick, and weed out any backdoors to foreign governments (*cough*NSA*cough*).

What will water blocks look like in the future? This was the question that Aqua Computer has asked itself before they started developing VISION.
From this question emerged the idea for an OLED display integrated to water coolers.

During the development of the display integration, Aqua Computer realized that there are many other stand-alone use cases for this product - and as such, the VISION product line was born. In addition to the pure display functionality, VISION has been extended in variants with touch control, infrared receiver and RGB-LED. A menu-driven setup has been integrated and VISION also has a whole range of inputs and outputs: both a temperature sensor and a flow sensor can be directly connected to VISION. The solution can display various system information like temperatures, fan speed, CPU load or memory usage and also values from other Aqua Computer devices. The aquasuite 2017 software allows to choose from customizable layout templates.

Today Simple Audio announced the addition of two new hi-fidelity speaker solutions to their existing line of networked HD streaming players. The new speakers, dubbed Simple Audio Listen and Simple Audio Go bring audiophile sound, designer styling, and versatile connectivity to today's digital music lovers.

Simple Audio Listen - Stereo Speakers with Bluetooth
Simple Audio Listen is beautifully designed to deliver breathtaking audio from compact stereo speakers that look great on the desktop, bookshelf, and in any room. The speakers incorporate technology generally reserved for high-end audiophile systems, including a fully digital signal path, DSP, and bi-amplified design to deliver amazing audio quality. And because today's music fans listen to music from a variety of digital devices, Listen has a variety of inputs including USB, Bluetooth and line-in connections, allowing it to play music from nearly any device in the home. Listen features a unique, elegant touch interface, with no buttons, dials or knobs, and includes an infrared remote.

HABEY USA, a leading manufacturer of embedded computer and an Associate member of the Intel Intelligent Systems Alliance, introduces the PRO-6820. This is a fanless barebone system, with a chassis built tough for extended industrial processing indoors or outdoors. The system measures in at 9.45"x9.96"x4.53", not much bigger than our small form factor systems, running off Intel's 3rd Generation Ivy Bridge Quad Core i3/i5/i7 processor, and capable of up to 8GB of memory from 2x 204-Pin DDR3 SO-DIMM slots.

Rich with I/Os, the PRO-6820 offers 6x instal USB slots, 2x front accessible USB 3.0 slots and 4x rear USB 2.0 slots. The system also has 2x PS2 ports, 1x externally accessible 8-bit GPIO port, 4x COM ports, 6x LAN ports, 1x mic-in, 1x audio-out, 1x CF Card Socket & 1x externally accessible 2.5" SATA HDD. The Intel Integrated HD Graphics controller allows 1x VGA port with resolution up to 2048x1536 & 1x DVI-D ports with resolution up to 1920x1200.

Acer America today announced that it's delivering two elegant all-in-one (AIO) desktop models featuring Windows 8 to customers in the U.S. The Acer Aspire 7600U and 5600U Series were built to deliver all aspects of digital life into a stylish entertainment hub that can be enjoyed by every member of the family. Sporting an extremely slim profile of less than 1.4 inches and a clean design, these AIOs will enhance any room in the home.

With the U.S. Government increasingly using high- performance computing (HPC) to address current and future national challenges, Intel Corporation today announced it has been awarded two subcontracts totaling $19 million with the U.S. Department of Energy (DOE). As part of these two awards, Intel Federal LLC, a wholly owned subsidiary, will be a major participant in the Lawrence Livermore National Security, LLC (LLNS) managed Extreme-Scale Computing Research and Development "FastForward" program aimed at driving advancements in exascale computing.

The DOE has been a leading developer of supercomputing technology for a broad range of critical applications in the space of national security, economy, energy resources and consumption. The "FastForward" program will harness the talents of the national laboratories, academia and U.S. industry to develop the next generation of HPC technologies.

Today at an event in Hollywood, Microsoft unveiled Surface: PCs built to be the ultimate stage for Windows. Company executives showed two Windows tablets and accessories that feature significant advances in industrial design and attention to detail. Surface is designed to seamlessly transition between consumption and creation, without compromise. It delivers the power of amazing software with Windows and the feel of premium hardware in one exciting experience.

The Intel Xeon processor E5-2600 product family reached a new supercomputing milestone as the fastest adopted new processing technology to power 44 systems, including 3 Petascale-class supercomputers on the 39th edition of the Top500 list announced today.

The "SuperMUC" supercomputer at LRZ in Germany, which ranked fourth on the list, delivers 2.9 PetaFLOPs of performance, making it the most powerful in Europe, as well as the largest installation based on the new Intel Xeon processors E5 family.

Fusion-io today announced that it is enabling high performance database and virtualization solutions with seven new Fusion-powered HP IO Accelerator products for the industry-leading HP ProLiant and HP BladeSystem platforms. Integrated into HP ProLiant Generation 8 (Gen8) servers, the new HP IO Accelerators can boost application performance to address organizations' growing requirements to cost-effectively accelerate data-intensive applications.

To enable enterprises to cost-effectively enhance their data infrastructure, one or more HP IO Accelerators can be easily integrated within servers according to application and organizational needs. The HP IO Accelerators sit inside the server, directly on the PCIe bus with CPUs and Memory, rather than external to the server in a storage array being accessed over much slower links. The IO Accelerators boost applications by bypassing traditional storage controllers and unlocking trapped compute cycles.

It's proven: the thermal interface material (TIM) used by Intel, inside the integrated heatspreader (IHS) of its Core "Ivy Bridge" processors are behind its higher than expected load temperatures. This assertion was first made in late-April by an Overclockers.com report, and was recently put to test by Japanese tech portal PC Watch, in which an investigator carefully removed the IHS of a Core i7-3770K processor, removed the included TIM and binding grease, and replaced them with a pair of aftermarket performance TIMs, such as OCZ Freeze and Coolaboratory Liquid Pro.

PC Watch findings show that swapping the TIM, if done right, can shave stock clock (3.5 GHz, Auto voltage) temperatures by as much as 18% (lowest temperatures by the Coolaboratory TIM), and 4.00 GHz @ 1.2V temperatures by as much as 23% (again, lowest temperatures on the Coolaboratory TIM). The change in TIM was also change the overclockability of the chip, which was then able to sustain higher core voltages to facilitate higher core clock speeds. The report concluded that Intel's decision to use thermal paste inside the IHS of its Ivy Bridge chips, instead of fluxless solder, poses a very real impact on temperatures and overclockability.

To help customers address the inefficiencies and lost costs of managing multiple support vendors, Dell ProSupport for Multivendor has been globally expanded beyond x86 to include support for storage, networking and UNIX products. This expansion also includes support for additional vendors for servers, desktops and laptops. By consolidating support under one service provider, customers can ensure consistent processes and reduce the resources required to manage complex services contracts from multiple vendors, ultimately simplifying IT management and reducing their IT costs.

"Our customers rely on the expertise, global network and 24x7 availability of Dell ProSupport for their Dell systems and can now experience those same benefits across their entire environment," said Doug Schmitt, vice president, Dell Services. "With the latest expansion of Dell ProSupport for Multivendor, customers around the world can rely on Dell for all of their support needs. From end-user systems to complex data centers and everything in between, customers will save time and money and receive the same award-winning support they've come to expect from Dell ProSupport."

Welcome to the TechPowerUp 2011 PC technology Christmas special. We hope that you will enjoy reading it while tucking into your turkey, Christmas presents and a little too much wine... In this article, we go through the technology of 2011 that has had the most significance, the most impact and was generally the most talked about. It's not necessarily the best tech of 2011 which is the most significant though, since lemons can be just as significant as the ground-breakers in how they fail to deliver - and the backlash that goes with it.

January: Intel Sandy Bridge i5 & i7

Released on January 9th, the new Intel Core i5 & i7 processors were based on Intel's second generation Core architecture built on a 32 nm production process (HEXUS review). They included an IGP (Integrated Graphics Processor) physically on the same piece of silicon along with HyperThreading. These new dual and quad core processors soundly beat all previous generations of Intel processors in terms of processing performance, heat, power use, features and left AMD in the dust. Therefore, Intel badly needed some competition from AMD and unless you have been living under a rock, you will know how that turned out in October with the launch of Bulldozer. Sandy Bridge was a sound win and is generally considered to be the only architecture worth considering at this point. The i5-2500K is currently at the sweet spot of price/performance. It comes at a stock speed of 3.3 GHz, but typically overclocks to an amazing 4.5 - 5 GHz with a decent air cooler and without too much difficulty in getting there. Models in the budget i3 range were released at various times later. See this Wikipedia article for details.

StarTech.com, a leading manufacturer of hard-to-find connectivity parts has announced the release of the (SKU: SATDOCK4U3RE) USB 3.0/eSATA to SATA Standalone 1:3 Hard Drive Duplicator Dock, which enables users to perform 1:3 sector-by-sector duplication from a single SATA hard drive onto three others simultaneously, without having to connect the dock to a host computer. The Duplicator Dock also includes a SATA to IDE adapter, which provides the option of connecting an IDE hard drive in one of the SATA slots.

"IT professionals are always looking for ways to make their jobs more efficient and this new multi-drive duplicator allows them to accomplish just that," commented StarTech.com Senior Product Manager, Carey Cline. "The ability to perform a sector by sector duplication on up to three drives simultaneously, frees up the user's time to perform other functions while the back-ups are created in the background. The fact it acts as a standalone unit also means it doesn't use up resources on their computer system."

Intel started the trend of improving integrated graphics with their second generation LGA1155 socket Core i3, i5 & i7 line of processors. Depending on the model, these processors sport integrated HD2000 or HD3000 graphics right on the processor die, which nowadays give acceptable performance for low-end gaming and can play Full HD 1080p video perfectly. This trend is increasing with the upcoming Ivy Bridge processors, which will be able to support a massive 4096 x 4096 pixel display, as we reported here. AMD now also have equivalent products with their Llano-based A-series processors. So, where does this leave discrete graphics cards? Well, the low end market is certainly seeing reduced sales, as there really isn't enough of a performance difference nowadays to always warrant an upgrade from an IGP. As integrated graphics improve further, one can see how this will hurt sales of higher end graphics cards too. The problem is that the bulk of the profit comes not from the top-end powerhouse graphics cards, but from the low to mid-end cards which allow these companies to remain in business, so cannibalizing sales of these products to integrated graphics could make high-end graphics cards a much more niche product and crucially, much more expensive with to boot.