HARMAN Professional Solutions, the global leader in audio, video, control and lighting systems, today announced the JBL Professional 3 Series MkIII powered studio monitor family. Representing the most extensive redesign of the 3 Series platform to date, the new lineup includes the JBL 305P MkIII, 306P MkIII and 308P MkIII powered studio monitors, along with the JBL 310S MkIII powered subwoofer.

Building on the legacy of the JBL Professional 3 Series, the MkIII family introduces redesigned acoustic systems, new Class D amplification, simplified room optimization and integrated mounting options to support workflows ranging from compact stereo production setups to 2.1, surround and immersive monitoring.

Intel is reportedly preparing two new processor SKUs focused on extremely low-power computing. The first, called "Moon Lake," is designed as a pure low-power efficiency (LPE) core SoC. The "Moon Lake" generation features no P-Cores and up to 4 "Darkmont" LPE-Cores on the Intel 18A die. Unlike "Wildcat Lake," which includes at least 2 P-Cores, "Moon Lake" is intended to be a much smaller design for embedded devices like NAS. The base power of "Moon Lake" is reportedly rated at 6 W, similar to an SoC typically used in smartphones. The number of Xe3 cores in this SKU is unknown, but since "Wildcat Lake" has up to 2 Xe3 cores, we expect "Moon Lake" to have half of that to maintain its 6 W TDP. Intel has manufactured "Moon Lake" on its 18A node and placed it on the BGA1516 package, the same platform used by "Wildcat Lake." The official moniker for "Moon Lake" is MNL, and it could be a successor to the N-Series, like the previous "Alder Lake-N" series of low-power processors.

Additionally, Intel is preparing an overhaul of "Wildcat Lake" with the new "Wildcat Lake Refresh." When Intel launched the Core 300 Series "Wildcat Lake" earlier this year, these processors came with up to 2 P-Cores, 4 E-Cores, and up to 2 Xe3 GPU cores, with a package reaching up to 35 W. However, the new "Wildcat Lake Refresh" is expected to increase the number of P-Cores to 4 while keeping the same base microarchitecture of "Cougar Cove" and maintaining 4 "Darkmont" LPE-Cores. The integrated graphics remain similar, with up to 2 Xe3 cores. Importantly, this refresh adds support for Intel's vPro technology, meaning that enterprise customers are in for a surprise with a new low-cost option for their PCs.

Konami Digital Entertainment president Hideki Hayakawa doesn't expect generative AI to shake up the games market much. In Konami Group's Integrated Report for the fiscal year ended March 2026, first spotted by Dengeki Online, Hayakawa responds to the popular view that AI will make game development far easier to break into. His argument is that general-purpose game engines and user-generated content have already lowered those barriers, so AI probably won't change much on that front. Hayakawa also made it clear where Konami's priorities lie.

Hideki Hayakawa (machine translated)I don't think the market environment will change drastically. Entry barriers have already been lowered by the advancements of generic game engines and the spread of user-generated content. Even if AI use does lead to improvements in production efficiency, I believe that the most important factors in producing entertaining and innovative video games are people and creators.

Back in January, we introduced the Raspberry Pi Smart Display Module, an adapter board for Raspberry Pi Compute Module 5 that is designed to deliver high-quality, low-power display experiences for digital signage and other visual applications. Today, we are delighted to announce that the Smart Display Module is available to buy now from our global network of Approved Resellers.

The Raspberry Pi Smart Display Module was developed in collaboration with Sharp Display Solutions Europe and works with any display or device that supports products conforming to the Intel Smart Display Module (SDM) specification. It provides cost-effective performance with 4K video playback and is fully compatible with numerous content management systems that already support Raspberry Pi 5 or Compute Module 5.

The KytyPlus PS5 emulator has reportedly rendered the Unreal Engine 5-powered Silent Hill 2 remake on an integrated GPU. Reddit user Legal_Help_31 shared a test on an AMD Radeon 840M with 512 MB of dedicated VRAM plus shared system memory, paired with a Ryzen AI 5 340 and around 15 GB of shared RAM. Performance is still not where we would want it, of course. The game's content warning screen runs at around 4 FPS, and it looks like the game only starts and sits there for several minutes without crashing. The test includes no gameplay at this time. The developer's own GitHub page calls the work experimental and says it is not a playability claim. FSR upscaling can apparently be used as well.

KytyPlus is a high-level emulation (HLE) fork of the KytyPS5 project. It reportedly runs without Sony's console firmware and uses Vulkan for rendering. The original KytyPS5 reportedly still crashes when launching Silent Hill 2 Remake, even on stronger hardware, so KytyPlus is a few steps ahead there. It is also impressive that this technically ran on an iGPU, but a boot screen at 4 FPS tells us very little about whether this ever becomes playable. The emulation scene has moved quickly in recent weeks, though, with KytyPS5 showing tremendous progress in Demon's Souls Remake and Astro Bot, among other games. KytyPlus developers are apparently now working to improve the performance in Silent Hill 2 Remake.

The Tiwaz is an open-source split keyboard product that started as a DIY project and morphed into something a little more concrete and comprehensive. Unlike traditional split ergonomic keyboards, like the MoErgo Go60 and ZSA Voyager, which generally eschew any thoughts of gaming prowess in favor of ergonomics, the Tiwaz was designed with gaming in mind. Specifically, its designer, Timo Strube, explains in the project's GitHub that "each half works standalone as a one-handed controller or macro pad," allowing it to be used by left-and right-handed users. The keyboard uses hot-swap sockets compatible with standard MX-style mechanical switches, giving it a wider degree of customization.

The Tiwaz uses a split ortholinear layout, meaning the keys are arranged in straight rows and columns, instead of the offsets present in both columnar stagger and row stagger layouts. Another interesting feature in the Tiwaz is that it features two thumb joysticks—one on the inner side of the keyboard itself. These can be configured to output cardinal directions, analog directions like a gamepad, or even mouse movements. The actual layout of the keyboard is also rather unorthodox, even for a split keyboard, with a total of 76 keys (38 per side), which is already a lot for a split keyboard, which usually hover around 50-60 keys at most. It also has a gasket-mounted case design, which also runs counter to many split ergonomic keyboards that forego features like gasket mounts in search of thinner cases for ergonomics purposes.

A developer going by Uzbekunknown on GitHub has gotten NVIDIA's DLSS 5 Neural Rendering running on the Arc 140V integrated graphics of an Intel Lunar Lake system, as Tom's Hardware reports. The project, called dlss-nr-on-intel, is an independent reimplementation of the 71-block network that runs on Intel's XMX units through Vulkan. It has apparently been shown working in Tekken 7, Dead or Alive 5 Last Round, and Mortal Kombat 1. For now it only runs on Linux, and users must supply their own copy of NVIDIA's DLL. As far as performance goes, the developer says Tekken 7 ran at around 10 FPS at 640x360 resolution, and the frametimes are absolutely abysmal too. The author calls it a research port, not a finished product, so photo mode use looks like the only realistic scenario right now.

Perhaps even more interesting is how this port came to be. Apparently, the code was written almost entirely by AI. The developer credits Claude Opus 5 and OpenAI's Astra, saying they themselves only supplied the hardware, the binary, and the direction. They also state they cannot defend the code line by line, and that a driver bug one of the agents hallucinated shaped three development phases. This mod effort follows DLSS 5 reaching RTX 30-series and AMD RDNA 4 cards within weeks of the leak, as well as the technology reaching web browsers. I think whether this is clever or a step too far depends on how much you trust code nobody fully reviewed. It's a fine technical demo, but I don't think we really needed DLSS 5 on Intel integrated graphics.

AMD is planning a significant return to establishing new manufacturing ties with its former silicon manufacturing venture, which it sold back in 2008. According to recent reports, AMD intends to collaborate with GlobalFoundries for new Co-Packaged Optics (CPO) for the next-generation Instinct MI500 series of AI accelerators. CPO technology will help AMD remain competitive in the AI data center space, where signal transfer is limited by traditional copper-based wiring. By harnessing the power and speed of light, CPO technology will enable data transfer between multiple nodes, and even multiple facilities, without the speed loss and increased latency associated with copper-based connections. Consequently, AMD is investing considerable effort to secure Photonics Integrated Circuit (PIC) manufacturing with its former partner, GlobalFoundries, which will handle PIC manufacturing, while the actual packaging will be managed by ASE to finalize the CPO design. This approach allows AMD to leverage the strengths of both companies, likely resulting in the best solution for its systems next year.

The Instinct MI500 series of AI accelerators is scheduled for release in 2027, as this year's lineup focuses on the Instinct MI400 series, which includes multiple SKUs for AI and HPC workloads. While these designs are already among the industry's leading AI accelerators, AMD aims to enhance performance further with the 2027 release using CPO technology. This will significantly contribute to delivering a solution that uses less power and offers much higher overall bandwidth compared to traditional copper data transfers. However, AMD is not alone in this CPO push. NVIDIA is also collaborating with semiconductor makers to develop a CPO system for "Vera Rubin," particularly the "Rubin Ultra" variant.

Razer, the leading global lifestyle brand for gamers, today unveils Dynamic Haptics, a new dual-source haptic system that unifies developer-authored Razer Sensa HD Haptics effects with Audio-to-Haptics (A2H). Dynamic Haptics delivers a richer and more consistent haptic landscape across both handcrafted gameplay moments and the ambient world.

A New Level of Haptic Detail
For decades, immersion in games has been defined by what players see and hear. Higher resolutions, faster refresh rates, and spatial audio have pushed realism forward, but often stop short of one critical element: physical sensation.

Yesterday, Apple announced its newest low-cost MacBook Neo, starting at $599 in the United States, or about $499 for education and students. Some online criticism emerged regarding Apple's decision to offer a laptop with only 8 GB of RAM in 2026, with no options for higher RAM capacity. However, this 8 GB of RAM is a design choice Apple made at TSMC's packaging facilities for the A18 Pro chip. Inside the MacBook Neo, Apple decided to reuse the iPhone 16 Pro's chip, which comes from TSMC with 8 GB of LPDDR5X memory. This memory is attached directly above the A18 Pro SoC using Integrated Fan-Out Package on Package (InFO-PoP), creating a 3D wafer-level fan-out package. This package is designed to hold memory directly above the SoC die, resulting in a smaller PCB design without the LPDDR5X module taking up over 100 mm² of PCB area.

Therefore, Apple's MacBook Neo configurations are limited to what the A18 Pro SoC is originally packaged with. These are 8 GB LPDDR5X modules that are shipped directly to TSMC for integration into the InFO-PoP package, which is later shipped back to Apple for integration into these new MacBook Neo laptops. While offering 8 GB laptops in modern times might seem controversial, the design choices behind the SoC and the goal of keeping unit costs low are what limit Apple from providing more memory capacity. Finally, these SoCs use Unix-based macOS, which is optimized for good memory management at this capacity, ensuring that users can still have a satisfactory experience.

Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XR9700 server, a first of its kind closed-loop liquid-cooled, fully-enclosed, ruggedized server engineered to run Cloud RAN and edge AI workloads in unprotected outdoor environments. Designed to mount on utility poles, rooftops and building exteriors, the PowerEdge XR9700 brings high performance computing into dense urban areas, remote locations and space-constrained facilities where traditional data center infrastructure cannot reach.

Why it matters
Telecommunications operators and those working at the edge often struggle to deploy compute due to lack of power and space. The PowerEdge XR9700 solves this, delivering high performance compute directly at the point of need in an ultra-compact, zero-footprint IP66-rated enclosure that's sealed from the elements. For telecommunications operators, it provides a flexible, software-defined alternative to traditional RAN solutions, supporting Cloud RAN and Open RAN processing at the cell site. At the same time, the platform can run edge and AI applications directly where data is created and consumed.

Since the introduction of Intel's brand-new "Panther Lake-H" mobile processor series, the flagship Arc B390 integrated graphics solution has received the lion's share of media attention. The impressive 12 Xe3-core iGPU is reserved for Core Ultra 300 series X9 and X7 models—likely a sore point for budget-conscious prospective buyers. When considering Team Blue's (roughly) "20% upcharge for a generational leap," customers seek current-gen solace elsewhere (AMD Radeon 890M). Fortunately, the step-down Arc B370 model seems to be relatively performant. The (presumably) much cheaper in-house alternative has been test driven by Notebookcheck. A preview report, published on February 13, provides an initial look at the 10 Xe3-core contender, that was onboard a Core Ultra 5 338H engineering sample. The German publication noted that the 12-core (4P + 8E) processor test subject ran with a "steady power limit of 35 watts." When comparing the Arc B370 to its more capable sibling, Notebookcheck outlined key points of interest: "the maximum GPU clock is also slightly lower at 2.4 vs. 2.5 GHz. Just like models (armed with) the Arc B390 GPU, the Core Ultra 5 338H is only available with soldered RAM (up to 8533 MHz)."

A disappointing Furmark score leaked out late last year, but it is reassuring to see the B370 performing admirably a few months later. Notebookcheck's tester observed this model being: "beaten by the Arc B390 in the synthetic benchmarks, but the power limits also play a role here...The results of the Arc B370 are very promising in general and there is a big advantage over previous iGPUs from Intel (Arc Graphics 140V/140T) as well as AMD (Radeon 890M)." Their 3DMark/Time Spy graphics chart shows the Core Ultra 5 338H engineering sample's Arc B370 iGPU scoring 5933 points. The B390 managed 6679 points, when evaluated on an ASUS ExpertBook Ultra B9406CAA test platform. When analyzing performance at lower TDP values, Notebookcheck noticed that the Arc B370's performance being "virtually identical to the Arc B390 at 20 Watts, while the deficit is just 6 % at 35 Watts." Further comprehensive tests are expected in the coming weeks, as Intel's Core Ultra 5 338H heads to retail in finalized form.

EnGenius Technologies Inc., a global leader in advanced connectivity and cloud-managed networking solutions, today announces the ECW515 Wi-Fi 7 dual-band 2x2:2 wall-plate access point, designed to deliver seamless in-room wireless and wired connectivity in multifamily units, student housing, senior living, hotels, and resorts.

Wi-Fi 7 In-Room Connectivity for MDU and Hospitality
The EnGenius ECW515 Wi-Fi 7 wall-plate access point delivers enterprise-grade wireless and wired connectivity directly inside the room, enabling fast, reliable in-room communication for streaming, voice, IoT, and productivity devices—while supporting VLAN-based per-user traffic segmentation to help maintain privacy and network control.

At Integrated Systems Europe (ISE) 2026 in Barcelona, Akasa showcased its latest solutions that embed LCD screens in passively-cooled cases. There are three versions, including "Kepler," "Maxwell Pro Plus," and "Euler CMX," all of which come with an LCD screen for monitoring or providing a visual interface that a user might need. First on the list is the new "Kepler" chassis, which is a 2U rack-mountable design with support for microATX and Mini-ITX boards, compatible with either Intel LGA1851 or LGA1700 sockets, capable of running anything from 12th to 14th Generation Intel Core processors, or Core Ultra in the latest 15th Generation "Arrow Lake." The system limits the CPU TDP to 35 W, which makes sense since it is a completely passively cooled enclosure. Kepler includes a 150 W AC-to-DC converter to power the system, and there is the possibility to install up to four single-slot low-profile PCIe cards or anything that fits within four slots of low-profile PCIe space.

OneOdio, a global audio brand known for delivering accessible and high-performance sound solutions, today announced the launch of the OneOdio solocaster, an all-in-one voice transformer and sound card designed for streaming, recording, gaming and content creation. Engineered for gamers and emerging creators alike, the solocaster combines professional-grade audio performance with creative sound tools and visual customization in a compact, easy-to-use format.

Positioned as a versatile audio hub for live content, the solocaster enables creators to manage microphones, system audio, background music and external sources from a single device. Universal compatibility with five independent audio channels and multi-port connectivity (USB-C, 3.5 mm, XLR, Bluetooth and AUX). The solocaster operates as a true plug-and-play device with no drivers required, supporting virtually all major streaming and recording apps across Windows, Mac and mobile.

It was previously revealed in leaks that the Apple M5 Pro and M5 Max-powered MacBook Pros are expected to launch sometime in the first half of 2026, but a new rumor from Fixed Focus Digital on Weibo has revealed that the M5 Max and Pro SoCs themselves may launch as early as March 2026. Apple generally announces new SoCs alongside at least one new product that will sport the new SoC, so either we will see new MacBooks launch alongside those chips or Apple will launch something like an M5 Max Mac Studio at the same time.

The leaker also claims that Apple will be using TSMC's advanced SoIC (System on Integrated Chip) packaging to bring down production costs for the SoC slightly. Supposedly this is one way that Apple will fight the high DRAM costs after it allegedly slipped from TSMC's priority customer list. The slip from the priority list was supposedly accompanied by a significant production price increase for Apple, and it is thought that the AI boom is to blame for that price increase.

Cadence (Nasdaq: CDNS) today announced the Cadence Tensilica Hi-fi iQ DSP IP, the sixth generation of its highly successful Hi-fi DSP family, based on a new architecture purpose-built for next-generation voice AI and emerging immersive audio. As these applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the Hi-fi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands. Compared to the industry-leading Tensilica Hi-fi 5s DSP, the Hi-fi iQ DSP offers 2X greater compute performance, 8X higher AI performance and more than 25% energy savings for most workloads—delivering over 40% performance uplift on numerous audio codecs.

"With the increased growth of AI across virtually every facet of the industry, audio and language have become critical interfaces for users," said Anshel Sag, VP and principal analyst, Moor Insights and Strategy. "The AI performance and energy savings with Cadence's new flagship Tensilica Hi-fi iQ DSP position it to enable future AI-enhanced applications and offload processing from other IPs."

Chatsworth Products Inc. (CPI), a global leader in power, cooling and rack infrastructure for IT environments, today announced the launch of VersaEdge Wall-Mount Cabinet, a versatile new edge infrastructure product designed to dramatically simplify deployment and management of distributed computing environments. The new solution will make its public debut at BICSI Winter 2026, where attendees can experience its modular design, advanced thermal performance, and rapid-deployment capabilities firsthand. The VersaEdge Wall-Mount Cabinet combines modular scalability, streamlined installation, and robust reliability—delivering a turnkey solution that meets the growing performance, density and flexibility demands of today's edge-driven workloads.

"With increasing demand for distributed compute and edge deployments, customers need infrastructure that can adapt quickly—without sacrificing reliability or performance," said Michael Moore, Senior Product Manager, Open Architecture Systems, CPI. "The VersaEdge Wall-Mount Cabinet represents our commitment to delivering future-ready infrastructure that empowers organizations to deploy edge resources faster, scale with confidence, and optimize cost and efficiency."

Broadcom Inc., a global leader in semiconductor and infrastructure software solutions, today announced the launch of its next-generation BCM4918 accelerated processing unit (APU) and two new dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719, marking another milestone in its long legacy of Wi-Fi innovation. With the combination of higher throughput plus smart intelligence, Broadcom's unified Wi-Fi 8 platform allows operators to deliver new real-time agentic applications for residential consumers with built-in security and improved power efficiency.

Building on its first-to-market BCM6718 Wi-Fi 8 chipset, Broadcom continues to lead the industry in defining the next generation of wireless performance, intelligence, and efficiency. The new platform combines compute acceleration, advanced networking, and robust security, delivering the high throughput, low latency, and intelligent optimization needed for the emerging AI-driven connected ecosystem.

Lenovo today announced an expansive series of new data storage, virtualization solutions and data management services, designed to help customers modernize their IT and data infrastructure for powering enterprise applications and AI ready capabilities. Today's new offerings include new Lenovo ThinkSystem and ThinkAgile data storage and virtualization solutions, announced in tandem with data management services. Designed to provide a modern foundation for enterprises and mid-size businesses achieving AI innovations, this announcement combines complementary hardware, software and services offerings to help deploy, manage, and unleash the true potential of enterprise data.

"Sixty-three percent of organizations either do not have or are unsure if they have the right data management practices for AI, according to a survey by Gartner". Customer unique data is the differentiation that will drive their competitive advantage and most accurate results, however 80% of storage deployed in the last 5 years is on slower hard drive-based storage (according to IDC reporting) that is not optimized for AI. At the same time, customers are challenged with new virtualization and containerization requirements that demand open solutions. Businesses must mitigate this risk by ensuring their enterprise data systems and practices are modernized for advanced use cases.

Advantech is proud to announce the release of the DPX S460, the newest member of its S-series gaming platform family. Powered by AMD's Ryzen Embedded 8000 Series APUs, the DPX S460 combines cutting-edge Zen 4 architecture, RDNA 3 graphics, and integrated AI acceleration, making it a game-changer in regulated gaming markets.

"The DPX S460 exemplifies our dedication to leveraging advanced technologies to create powerful and flexible gaming solutions," said Craig Stapleton, Product Director for Advantech. "With AMD's 8000 Series chipset, we're delivering a platform that meets the most demanding requirements of the gaming industry."

Flex today announced the industry's first globally manufactured, fully integrated platform designed for gigawatt data centers supporting AI and HPC. By uniting power, cooling, compute, and Flex's global services into pre-engineered, modular reference designs for next-generation data centers, the new infrastructure platform enables operators to deploy infrastructure up to 30% faster, reduce execution risk, and scale reliably to meet the pace of AI demand. Flex will highlight the platform and new breakthrough products during the OCP Global Summit in booth B24.

"As AI adoption accelerates, data center operators must overcome rising power, heat, and scale challenges to deploy infrastructure at unprecedented speed," said Michael Hartung, president and chief commercial officer at Flex. "Flex delivers the industry's deepest hardware stack by integrating power, cooling, and compute with vertically integrated manufacturing at scale. Its open architecture provides the flexibility required for faster, more predictable deployments, enabling data center operators to keep up with AI demand."

Finalmouse, maker of popular lightweight gaming mice, today announced that, in 2026, the company will officially open its own gaming mouse production facility. Maxime Vincent, the company's VP of engineering, claims that the new factory will allow Finalmouse to further pursue its goal of vertical integration and pushing engineering boundaries to come up with original designs and hardware innovations. In the announcement video, posted to YouTube, Vincent explains how opening a dedicated production facility will allow the company to continue on its mission to target performance by developing tailored hardware, software, and firmware solutions instead of relying on OEM solutions that don't always align with the brand's goals.

Theoretically, in-housing the research and development, production, and quality control should remove some barriers and allow the company to be more flexible and potentially even allow Finalmouse to lower production costs. Along with the announcement of the manufacturing facility, Finalmouse has announced that, as of the announcement, all of the brand's flagship mice will be available for $175 with no pre-orders or lead times. Curiously, though, all of the Finalmouse ULX variants currently available for purchase on the Finalmouse website are still listed at $189. In our review of the Finalmouse ULX, value and limited availability were some of the notable cons at the same price, as was the build quality, so moving to an in-house manufacturing facility, where the brand has more control over processes and QA, might be what Finalmouse needs to step things up.

Cisco today unveiled a new network architecture to power the campus, branch, and industrial networks of the future. The new architecture delivers unmatched operational simplicity through unified management, next-generation networking devices purpose-built for AI workloads, and advanced security capabilities embedded into the network.

Cisco is setting a new standard for how organizations navigate the challenges of skyrocketing traffic, rising cyber threats, and critical uptime requirements created as enterprises rush to harness the potential of AI in the workplace. According to the Cisco IT Networking Leader Survey, 97% of businesses believe they need to upgrade their networks to make AI and IoT initiatives successful, and the stakes are high: a single severe outage can inflict nearly $160 billion in losses globally. Faced with these challenges, IT teams need a new approach to scale operations, reduce downtime, and unlock new levels of efficiency and innovation.

As robots increasingly make their way to the largest enterprises' manufacturing plants and warehouses, the need for access to critical business and operational data has never been more crucial. At its Sapphire conference, SAP announced it is collaborating with NEURA Robotics and NVIDIA to enable its SAP Joule agents to connect enterprise data and processes with NEURA's advanced cognitive robots. The integration will enable robots to support tasks including adaptive manufacturing, autonomous replenishment, compliance monitoring and predictive maintenance. Using the Mega NVIDIA Omniverse Blueprint, SAP customers will be able to simulate and validate large robotic fleets in digital twins before deploying them in real-world facilities.

Virtual Assistants Become Physical Helpers
AI agents are traditionally confined to the digital world, which means they're unable to take actionable steps for physical tasks and do real-world work in warehouses, factories and other industrial workplaces. SAP's collaboration with NVIDIA and NEURA Robotics shows how enterprises will be able to use Joule to plan and simulate complex and dynamic scenarios that include physical AI and autonomous humanoid robots to address critical planning, safety and project requirements, streamline operations and embody business intelligence in the physical world.