Huawei has just unveiled its latest MateBook Pro laptop, featuring a homegrown processor, operating system, and a fully integrated experience. Priced at 9,999 RMB for the base model with 24 GB of RAM and a 512 GB SSD, this equates to about $1,480. The top-end configuration offers 32 GB of RAM and a 1 TB SSD for 13,999 RMB, approximately $2,072 at the current exchange rate.

Inside, the previous Kirin X90 has been replaced by the new Kirin X90 Plus, which is kept cool by a foam-copper vapor chamber, allowing the chip to maintain a 40 W performance envelope. Huawei seems to have retained the same core counts and GPU specs with a 10-core, 20-thread design, but the improved thermal management suggests they are extracting more performance from this generation. No official specifications have been released yet, so this remains speculative.

Huawei's next-generation Ascend 950 AI accelerator has been pictured for the first time, showcasing the company's custom silicon and HBM memory. The chip combines Huawei's first self-developed HBM memory with a new generation of AI acceleration. Huawei aims to compete through scale rather than focusing solely on single-chip performance. Although it currently trails NVIDIA in per-chip performance, Huawei's system-scale solutions can still be competitive. The company has announced the Ascend 950 family for early 2026, featuring two variants.

The 950PR model includes 128 GB of in-house HBM with around 1.6 TB/s of bandwidth, while the 950DT model increases memory to 144 GB and boosts bandwidth to nearly 4 TB/s. Both chips target one PetaFLOP of FP8, and two PetaFLOPS of FP4. Huawei's competitive strategy emphasizes dense packaging and aggressive networking, rather than relying solely on raw per-chip performance. We have no information on the node selection, but it will likely be SMIC's newest N+3 node with 5 nm-class features. Chinese SMIC has officially achieved volume production of its newest 5 nm node relying on the deep ultraviolet (DUV) to manufacture its silicon. Since the first customer for N+3 was Huawei with Kirin 9030 SoC, it is only logical that the more important Ascend AI accelerator family is manufactured using the same node.

Chinese company SMIC has officially achieved volume production of its newest 5 nm-class node called SMIC N+3. This is officially China's most advanced semiconductor node produced without any extreme ultraviolet (EUV) lithography tools, relying on the deep ultraviolet (DUV) to manufacture its silicon. In the latest analysis of the Huawei Kirin 9030 SoC, the TechInsights has confirmed that the chip has officially been manufactured using the new advanced node, bringing Chinese semiconductor independence one step closer to reality. This node is a full generation ahead of the older SMIC N+2, which is 7 nm-class node Huawei has been using to manufacture its Ascend series of AI accelerators and other infrastructure parts.

However, this is not without drawbacks. Since SMIC uses DUV to print silicon designs, the company faces significant challenges in realizing its silicon ambitions. For printing smaller nodes, EUV scanners offer more possibilities due to their much smaller wavelength of 13.5 nm, compared to the smallest DUV immersion scanner wavelength of 193 nm. TechInsights has confirmed that SMIC's N+3 node, despite achieving impressive DUV multi-patterning implementation, encounters significant yield challenges, particularly due to the aggressively scaled metal pitch. As a result, the Huawei Kirin 9030 SoC is likely produced at an operating loss, with a significant portion of dies being discarded or used for downgraded chips.

Earlier today, Huawei Technologies debuted a high-end family of Mate 80 smartphones—all powered by variants of the firm's proprietary Kirin 9030 chip. Industry insiders propose that these relatively advanced mobile processors were fabricated by SMIC, utilizing an N+3 process node. This milestone allegedly marks the Chinese semiconductor leader's first foray into 5 nm territories, at least for smartphone applications. Preceding Huawei's fancy product launch, the Geekbench browser database welcomed a mysterious SGT-AL10 device. Smartphone experts believe that this model code is related to the freshly-revealed Mate 80 Pro Max model. Yesterday's new entry depicts a test platform powered by a (presumably) in-house designed 9-core CPU cluster (1 + 4 + 4). In comparison, the older Kirin 9020 SoC featured an eight-core configuration.

The latest chip could sport a single prime "Taishan" CPU core (designated as cluster #3), clocked at 2.75 GHz. The Geekbench 6.2 (Android AArch64) leak points to cluster #1 featuring four cores clocked at 1.72 GHz, and cluster #2 utilizing four cores clocked at 2.27 GHz. Scores of 1131 (single) and 4277 (multi) were tallied, positioning the emergent Kirin 9030 well below Western rivals in terms of performance. Digital Chat Station provided comment upon discovery of these underwhelming data points—the tenured chipset soothsayer theorized that the processor was not running at its full potential. A fully unleashed Kirin 9030 is not expected to catch up with big name components; Qualcomm, MediaTek, and Apple's very best enjoy significant technological advantages.

Huawei is advancing its strategy for technology independence by introducing two new desktop computer models built entirely with Chinese components. The Qingyun line—featuring the W515y and W585y models—represents the company's latest effort to provide computing solutions free from foreign hardware. These systems integrate Huawei's Kirin 9000X chip with locally developed Linux software, instead of Microsoft Windows. Users can choose between UOS V20 from Tongxin or Galaxy Kylin V10. While details about the hardware are still emerging, the Kirin 9000X is an eight-core Arm-based chip with 16 threads, operating at 2.5 GHz. It could be a big.LITTLE deisgn, or a big-core only SoC. The desktops feature quad-channel LPDDR5x memory and support both flash storage and conventional hard drives.

The port selection is vast, offering a Type-C USB connector and three standard USB 3.2 ports on the front, with four additional USB connections, wired network capability, a legacy serial interface, and dual video options via VGA and HDMI on the back panel. Weighing approximately 3.6 kg and measuring just under 300 mm in width, the systems are compact. Huawei includes its own keyboard and mouse with each unit, though pricing and release dates have not been disclosed. Notably, Huawei has chosen to equip these computers with established Linux variants instead of its HarmonyOS.

A mysterious HiSilicon Kirin X90 processor was included in a Chinese state report; the official assessment document seems to cover the topics of native CPU reliability and security. Jukanlosreve—a keen watcher of semiconductor industry inside tracks—highlighted the unannounced technology on social media. They alerted TP Huang (aka tphuang) to this discovery, possibly in reaction to the latter's reporting of a wholly Huawei-designed AI laptop. Last week, we heard about a speculated portable enterprise PC series powered by Kunpeng-920 mobile processors. HiSilicon is a Chinese fabless semiconductor firm, operating under Huawei ownership—normally, their Kirin processors are designated as smartphone-based solutions. Industry watchdogs believe that company leadership is paving the way for a new generation of personal and server processors—their current Kunpeng-900 series debuted back in 2019, so natural successors are very likely in the development pipeline. Early last year, insiders proposed that Huawei had prioritized its Ascend 910B AI accelerator chip—despite these rumors, Kirin-related leaks continued to trickle out.

According to industry moles, HiSilicon tends to spread its custom Arm-based Taishan core design across modern Kirin and Kunpeng processor families. Based on Jukanlosreve's initial detective work, Tom's Hardware proposed a plausible outlook for the (leaked) chip's future. Their report theorized: "Huawei's server and PC divisions have been relatively quiet, as evidenced by the lack of new Kunpeng SoC designs. The new Kirin X90, despite its name, could be a possible successor, considering that Huawei is reportedly launching a new 'AI PC' with HarmonyOS next month. It's likely to be fabricated using SMIC's 7 nm process featuring Taishan V120 cores based on either the Armv8 or Armv9 architectures, which are not subject to the US trade ban." Instead of using an old hat Kunpeng-920 SoC, Huawei's forthcoming next-gen "Qingyun" AI laptop could be equipped with a Kirin X90 APU—Tom's Hardware foresees an Apple MacBook-esque "integration of custom hardware and software" with the Chinese tech firm's fully in-house developed model.

Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

Huawei's Ascend 910B AI GPU is reportedly in high demand in China—we last learned that NVIDIA's latest US sanction-busting H20 "Hopper" model is lined up as a main competitor, allegedly in terms of both pricing and performance. A recent Reuters report proposes that Huawei is reacting to native enterprise market trends by shifting its production priorities—in favor of Ascend product ranges, while demoting their Kirin smartphone chipset family. Generative AI industry experts believe that the likes of Alibaba and Tencent have rejected Team Green's latest batch of re-jigged AI chips (H20, L20 and L2)—tastes have gradually shifted to locally developed alternatives.

Huawei leadership is seemingly keen to seize these growth opportunities—their Ascend 910B is supposedly ideal for workloads "that require low-to-mind inferencing power." Reuters has spoken to three anonymous sources—all with insider knowledge of goings-on at a single facility that manufacturers Ascend AI chips and the Kirin smartphone SoCs. Two of the leakers claim that this unnamed fabrication location is facing many "production quality" challenges, namely output being "hamstrung by a low yield rate." The report claims that Huawei has pivoted by deprioritizing Kirin 9000S (7 nm) production, thus creating a knock-on effect for its premium Mate 60 smartphone range.

Semiconductor Manufacturing International Corp (SMIC) is preparing new semiconductor production lines at its Shanghai facilities according to a fresh Reuters report—China's largest contract chip maker is linked to next generation Huawei SoC designs, possibly 5 nm-based Kirin models. SMIC's newest Shanghai wafer fabrication site was an expensive endeavor—involving a $8.8 billion investment—but their flagship lines face a very challenging scenario with new phases of mass production. Huawei, a key customer, is expected to "upgrade" to a 5 nm process for new chip designs—their current flagship, Kirin 9000S, is based on a SMIC 7 nm node. Reuter's industry sources believe that the foundry's current stable of "U.S. and Dutch-made equipment" will be deployed to "produce 5-nanometer chips."

Revised trade rulings have prevented ASML shipping advanced DUV machinery to mainland China manufacturing sites—SMIC workers have reportedly already repurposed the existing inventory of lithography equipment for next-gen pursuits. Burn Lin (ex-TSMC), a renowned "chip guru," believes that it is possible to mass produce 5 nm product on slightly antiquated gear (previously used for 7 nm)—but the main caveats being increased expense and low yields. According to a DigiTimes Asia report, mass production of a 5 nm SoC on SMIC's existing DUV lithography would require four-fold patterning in a best case scenario.

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.