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Thermalright Intros TA 120 EX Tower-type CPU Cooler

Thermalright is on a roll with its streak of recent CPU cooler launches, the latest of which, is the TA 120 EX. Positioned a notch above its TRUE Spirit 120 series, the TA 120 EX is characterized by a dense aluminium fin stack with 52 fins packed with a gap of 1.6 mm, compared to 48 fins on the TRUE Spirit 120. The cooler is slightly larger and heavier, too. Heat drawn through a mirror-finish copper base, is conveyed to the fin stack through five 6 mm-thick copper heat pipes.

A Thermalright TL-C12 PRO-G fan comes included with the cooler. This 120 mm spinner features a fluid-dynamic bearing, spins at speeds of up to 1,850 RPM, pushing up to 82 CFM of airflow, at 2.1 mm H₂O static pressure, and a maximum noise output of up to 29.6 dBA. With its fan in place, the TA 120 EX measures 124 mm x 70 mm x 154 mm (WxDxH), weighing 680 g. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

Thermalright Rolls Out the 47mm-Tall AXP90-X47 Low-profile CPU Cooler

Thermalright today rolled out the AXP90-X47, a low-profile CPU cooler meant for compact Mini-ITX builds where Z-height is at a premium. The top-flow cooler offers a height of just 47 mm with its fan in place, and is meant for Socket AM4, LGA1200, and LGA115x platforms. The cooler should do fine as a stock fan-heatsink replacement, for running 10th Gen or 11th Gen Core processors at stock speeds.

The AXP90-X47 design consists of an aluminium fin-stack that's arranged along the plane of the motherboard, with 54 fins. Four 6 mm-thick nickel-plated copper heat-pipes make indirect contact with the CPU over mirror-finish base made of the same material, conveying heat to this fin-stack. An included 92 mm Thermalright TL-9015 fan ventilates the cooler. This 15 mm-thick fan features a 4-pin PWM input, and hydraulic bearing. It turns at speeds of up to 2,700 RPM, pushing up to 42.58 CFM of air-flow at 1.33 mm H₂O static-pressure, and a noise output of 22.4 dBA at top speed. The cooler measures 92 mm x 92 mm x 47 mm (WxDxH, including fan); weighing 310 g. The company didn't reveal pricing.

Thermalright Frost Commander 140 is a Large Dual Fin-Stack Cooler Out to Snack on AIOs

Thermalright unveiled its new flagship air cooler, the Frost Commander 140. This massive "D-type" dual fin-stack cooler is designed for conventional tower-type builds. With a height of exactly 160 mm, the cooler might scrape the side-panel of most mid-tower cases. Two equal-sized stacks of 53 aluminium fins, each, are skewered by five 8 mm-thick nickel-plated copper heat pipes that make indirect contact with the CPU through a mirror-finished nickel-plated copper base. There are two fans included with the cooler, a smaller 120 mm fan pushes fresh air into the first fin-stack while a larger 140 mm fan between the two fin-stacks conveys this air through the second fin-stack. Mounting clips are included letting you mount up to three fans that are up to 140 mm in size.

The included 120 mm fan, TL-C12, turns at speeds of up to 1,850 RPM ±10%, pushing up to 82 CFM of air, at up to 2.10 mm H₂O static pressure, and up to 29.6 dBA noise output. The larger included 140 mm fan, a TL-D14X, does up to 1,800 RPM, up to 95.50 CFM airflow, 2.25 mm H₂O static pressure, and is as loud as 30.2 dBA at top speed. Both fans feature fluid-dynamic bearings. With its fans in place, the cooler measures 140 mm x 146 mm x 160 mm (WxDxH), weighing exactly 1.34 kg (1 kg heatsink + 340 g for the two fans). CPU sockets supported include AM4, LGA1200, LGA115x, and LGA2066. The company didn't put out thermal performance numbers, but could offer the Frost Commander 140 as an alternative to entry/mid all-in-one liquid CPU coolers. The company didn't reveal pricing.

Intel Readies Xeon W-1300 Socket LGA1200 Processors Based on "Rocket Lake"

Intel is reportedly giving final touches to the Xeon W-1300 line of enterprise processors targeting workstations, according to an ASRock CPU support list dug up by Komachi Ensaka. The processors are based on the same 14 nm "Rocket Lake" silicon as the company's 11th Gen Core desktop processors, and come in core counts of up to 8-core/16-thread. The lineup is expected to debut with five SKUs, three of which are 8-core/16-thread, and two 6-core/12-thread.

The lineup is led by the W-1370, with base frequency of 2.90 GHz, 16 MB of shared L3 cache, and 80 W TDP. Next up, is the slightly slower W-1390, clocked at 2.80 GHz, and 80 W TDP. The third 8-core part is the W-1390T, which is clocked at just 1.50 GHz (base), and comes with aggressive power-management that gives it a TDP rating of 35 W. The 6-core/12-thread W-1350P has the highest clock speeds, with a base frequency of 4.00 GHz, 12 MB of shared L3 cache, and 125 W TDP. The W-1350 is its slower sibling, clocked at 3.30 GHz, and 80 W TDP. The processors will be compatible with Intel Z490, W480, and H470 chipsets, besides their 500-series successors.

Thermalright Intros Silver Arrow ITX-R Rev A CPU Cooler

Thermalright today introduced the Silver Arrow ITX-R Rev A, a compact dual aluminium fin-stack CPU cooler with a low footprint, designed for maximum clearance around the CPU socket area, making it ideal for Mini-ITX tower gaming PC builds. A revision of the original Silver Arrow ITX-R from 2017, the new Rev A comes with a slightly smaller aluminium fins toward the bottoms of the fin-stacks, which reduce the heatsink's weight by 30 g, but improve clearance around the CPU socket. Thermalright also took the opportunity to update the included fan, which is now a TY-129B. This 130 mm spinner tuns between 600 to 1,500 RPM, compared to the 300-1,300 RPM range of the original TY-129 that the original Silver Arrow ITX-R comes with. The heatsink measures 155 mm x 103 mm x 147 mm (LxWxH), weighing 630 g. Thermalright claims that the cooler can handle thermal loads of up to 240 W. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

Thermalright Intros Venomous Plus CPU Cooler

Thermalright today introduced the Venomous Plus, its latest tower-type CPU cooler and a re-take on the 10+ year old Venomous X. Designed to tackle thermal loads of up to 240 W, the Venomous Plus features a classic aluminium fin-stack design. Six 6 mm-thick nickel-plated copper heat pipes make indirect contact with the CPU at the mirror-finished base made of the same material; passing through the aluminium fin-stack that's ventilated by a TL-C12S 120 mm fan. The heatsink by itself measures 127 mm x 60 mm x 158 mm (WxDxH), weighing 660 g, and holding 51 fins. The fan adds about 25-27 mm in width.

The included TL-C12S fan is one of the key things setting this apart from the Venomous X. It's a modern unit that takes in 4-pin PWM for its main function, 3-pin ARGB for illumination, and features ARGB illumination through diodes studded in the impeller hub. The fan features fluid-dynamic bearing, turns up to 1,500 RPM (±10%), pushing up to 66.17 CFM of air-flow with static pressure of 1.53 mm H₂O; and has a maximum noise output of 25.6 dBA. Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066.

Thermaltake Intros UX210 ARGB Tower-Type CPU Cooler

Thermaltake today released to market the UX210 ARGB, a slim tower-type CPU cooler. Designed for thermal loads of up to 150 W, the cooler features a conventional-design aluminium fin-stack heatsink, ventilated by a 120 mm fan. Five 6 mm-thick nickel-plated copper heat pipes make contact with the CPU over a mirror-finish nickel-plated copper base; conveying heat through an aluminium fin-stack, which is ventilated by a fan.

The 120 mm fan included with the Thermaltake UX210 ARGB takes in 4-pin PWM for its main function, and 3-pin ARGB for its lighting. It features a 30,000-hour rated hydraulic bearing, spins between 600 to 2,000 RPM, pushing up to 72.3 CFM of air, with a static pressure of up to 2.31 mm H₂O, and a noise output of up to 34.3 dBA. With its fan in place, the cooler measures 136 mm x 74 mm x 153 mm (WxDxH). Among the CPU socket types supported are AM4, LGA1200, LGA115x, and LGA2066. The company didn't reveal pricing.

AeroCool Intros Cylon 3H Top-Flow CPU Cooler

AeroCool today introduced the Cylon 3H, a top-flow CPU cooler. The cooler features a "C-type" aluminium fin-stack design. Three 6 mm-thick copper heat pipes make direct contact with the CPU at the base, conveying heat through an aluminium fin-stack that's arranged along the plane of the motherboard, and ventilated by a 120 mm fan. This fan features an addressable RGB illumination through a silicone diffuser around the bore of the impeller. AeroCool claims that the cooler can handle thermal loads of up to 125 W.

The included 120 mm fan of the Cylon 3H features a 60,000-hour rated hydraulic bearing, takes in 4-pin PWM for its main function, and 3-pin ARGB for the illumination, turns between 600 to 1,800 RPM; pushing up to 60.8 CFM of air-flow at 1.48 mm H₂O static pressure, at up to 24.3 dBA noise output. With its fan in place, the cooler measures 126 mm x 138 mm x 98 mm (WxDxH). Among the CPU socket types supported are AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Intel 11th Gen Core "Rocket Lake-S" Processor Detailed Some More

Intel at a January 11, 2021 online media event (which we live-blogged here) revealed more information about its 11th Generation Core "Rocket Lake-S" desktop processor family. These chips succeed the 10th Gen Core "Comet Lake-S," and are built on the same Socket LGA1200 package, retaining backwards compatibility with Intel 400-series chipset motherboards with firmware updates; and native support with the upcoming Intel 500-series chipset motherboards. Intel in its media event confirmed that the top Core i9-11900K is an 8-core/16-thread processor, which will deliver the highest PC gaming performance possible when it comes out.

In its media event, Intel revealed a side-by-side comparison of the i9-11900K with a machine powered by the AMD Ryzen 9 5900X 12-core processor, where it's shown offering a mostly mid-single-digit-percentage performance lead over the AMD chip. In the "Metro Exodus" benchmark prominently highlighted in the Intel event, the i9-11900K is shown offering an average frame-rate of 156.54 FPS compared to 147.43 FPS of the 5900X (a 6.17% gain). VideoCardz tweeted a leaked Intel presentation slide with many more game test results where Intel compared the two chips. Intel's play with marketing "Rocket Lake-S" to gamers and PC enthusiasts will hence ride on the back of gaming performance leadership, and future-proofing against the new wave of productivity apps that leverage AI deep-learning, as "Rocket Lake-S" features DLBoost VNNI extensions that accelerate deep-learning neural-net building, training, and AI inference performance.

ASUS Z590 ROG Maximus XIII, TUF, & PRIME Motherboards Pictured

A number of upcoming Z590 ASUS motherboards have recently been pictured. The four upcoming motherboards include the ASUS ROG Maximus XIII Extreme Glacial, ASUS ROG Maximus XIII Hero, ASUS Prime Z590-A, and the ASUS TUF Z590-PLUS WIFI. These new motherboards feature an LGA1200 socket the same one found on existing Z490 boards and are targeted towards Intel's upcoming 11th generation processors. The new Rocket Lake-S processors will introduce support for PCIe 4.0 which should be fully supported on these new boards.

The Z590 MAXIMUS XIII EXTREME GLACIAL is a high-end premium motherboard with integrated monoblock from EK. The board is similar to the Z490 GUNDAM and comes in an E-ATX form factor. The 13th edition ASUS ROG Maximus XIII Hero includes dual EATX12V 8-pin power connectors an upgrade from the 8+4 pin configuration found on the Z490 series. These new motherboards are expected to be announced in the coming days during CES.

Dynatron Rolls Out L15 AIO Liquid CPU Cooler

Dynatron earlier this week rolled out the L15, an all-in-one, closed-loop, liquid CPU cooler. This cooler features a radiator-mounted pump, so the CPU water-block is considerably slimmer for a cooler that's capable of handling thermal loads of up to 250 W. The 240 mm x 120 mm radiator comes with a pair of 120 mm dual ball-bearing PWM fans that can turn at speeds ranging between 600 to 2,400 RPM, pushing 23 to 92 CFM of air-flow, with noise output ranging between 16 to 38 dBA. The cooler supports the latest Intel LGA1200 and LGA115x sockets, and AMD AM3+ (or older) sockets, although the company does not mention AM4 support in its data-sheet. The company didn't reveal pricing.

DeepCool Intros GAMMAXX L240 A-RGB and L360 A-RGB AIO Liquid CPU Coolers

DeepCool today updated its GAMMAXX line of all-in-one liquid closed-loop CPU coolers, with the new GAMMAXX L240 A-RGB and L360 A-RGB. These are functionally the same coolers as the GAMMAXX L-series, but with a handful updates, such as an ambient air pressure balancer, and new addressable-RGB LED lighting elements on the pump-block and the included 120 mm fans. Each of the included 120 mm A-RGB fans spins between 500 to 1,800 RPM, pushing up to 69.34 CFM of air-flow, at up to 2.42 mm H₂O static pressure, and up to 30 dBA noise output. The fans feature hydro-dynamic bearings. Among the CPU socket types supported include AM4, LGA1200, and LGA2066. The company didn't reveal pricing.

MSI Confirms Rocket Lake Arrives in Late-March, 400-series Chipset Compatibility

MSI in a customer service response that's been machine translated and tweeted by harukaze5719, revealed that Intel's 11th Gen Core "Rocket Lake-S" desktop processors arrive "by the end of March." This is the first confirmation from someone in the know that "Rocket Lake-S" won't arrive before the very end of Q1-2021, and that one should realistically expect availability only from Q2.

The same CS response also confirms backwards compatibility of the processors with existing Socket LGA1200 motherboards based on the Intel 400-series chipset. It mentions that MSI will release UEFI firmware updates that enable "Rocket Lake-S" compatibility starting with boards based on the top Intel Z490 chipset, followed by other 400-series models. Intel is expected to unveil its 11th Gen Core "Rocket Lake-S" desktop processor and compatible 500-series chipset platform in mid-January, as part of a virtual event on the sidelines of the 2021 International CES (a virtual show).

Intel 11th Gen Core "Rocket Lake" to See CES 2021 Unveil, Availability Later in Q1

Intel's 11th Generation Core "Rocket Lake-S" desktop processor family could be formally unveiled in just a few weeks from now, with HotHardware reporting a 2021 International CES unveiling (virtual event), for both the processors and their companion Intel 500-series chipset motherboards. This would put the unveiling around mid-January for the virtual launch event.

Availability is a different story, with the report predicting that while the Intel 500-series chipset motherboards will be available from mid-January, the processors won't arrive until March. Older reports predicted a market availability of these processors to almost miss Q1, and spill over into Q2 (April-June). Since "Rocket Lake-S" is based on the current LGA1200 package, the Intel 500-series chipset motherboards are expected to support existing 10th Gen Core "Comet Lake-S" processors, along with out-of-the-box support for the 11th Gen.

Intel "Avengers Edition" 10th Gen Core Desktop Processors Reach End of Life (EOL)

Intel today commenced the process of discontinuation of the "Avengers Edition" SKUs of its 10th Generation Core "Comet Lake-S" desktop processors, through a product change notification (PCN). The said PCN #117894-00 mentions December 16, 2020 as a common date for all four key discontinuation milestones in the product's lifecycle, namely Product Discontinuation Support commencement, Last Product Discontinuance Order (the last opportunity for distributors to place orders from Intel for), the date for these orders to become non-cancelable and non-returnable; and the date for the last order to ship. Normally, the latter two milestones are spaced 6 months and 12 months apart from the date of the product discontinuation PCN. To put this in simpler terms—and unless the PCN doesn't have a typo with its dates—Intel is expeditiously discontinuing its 10th Gen Core "Comet Lake-S" desktop processors, marking them EOL (end of life).

ID Cooling Reveals New Family of Mega Coolers for AMD, Intel CPUs

ID Cooling has announced their latest Mega Coolers, a new moniker and lineup that announces the coolers' compatibility with the latest, greatest, highest performance, and most power-hungry CPUs. The coolers are designed to accompany CPUs with TDPs up to 280 W. ID Cooling said these new mega coolers in the SE-207-series, which are basically tower coolers in design, will be hitting market just in time to address AMD's new-generation enthusiast grade Ryzen 5000-series 'Vermeer' and Intel's upcoming 11th Generation Core 'Rocket Lake' processors.

There are two separate coolers in the family; the SE-207-XT Black is aimed at AMD's Ryzen processors as well as Intel CPUs in LGA1200/115x/20xx form-factors; if you need some more cooling oomph, however, the SE-207-TRX Black is aimed at AMD's Ryzen Threadripper processor in TR4 packaging. Both coolers offer the same 280 W TDP dissipation capabilities, and are built in a twin-tower design with twin fans (700 RPM ~ 1800 RPM, up to 76.16 CFM air pressure, up to 35.2 dBA). In the case of the Threadripper-loving SE-207-TRX, a copper baseplate with direct-touch heatpipe technology removes heat from your CPU and passes it through the large, black, dual fin-stack arrays which are then cooled by two 120 mm fans. The E-207-XT Black, on the other hand, makes do with a solid copper baseplate absent of that same direct touch technology.

Super Flower Also Announced the Neon 240 and Neon 360 AIO Liquid CPU Coolers

In addition to the Neon 122 tower-type air CPU cooler, Super Flower announced the Neon 240 and Neon 360 all-in-one, closed-loop, liquid CPU coolers. Unless we're mistaken, these CLCs appear to be DeepCool-sourced, looking at the design of their pump-blocks. As their names suggest, the two are differentited with radiator sizes, with the Neon 240 featuring a 240 mm x 120 mm radiator, and the Neon 360 featuring 360 mm x 120 mm.

The pump-block features a copper cold-plate, a latest-gen dual-chamber pump, Nylon sleeved tubing, and aluminium-fin radiators that, depending on the variant, are ventilated by two or three included 120 mm fans. Each of these hydraulic bearing fans spin between 800 to 1,800 RPM, pushing 46 CFM of air, with up to 29.7 dBA maximum noise output. The fans, along with the ornament on top of the pump-block, feature addressable RGB illumination. The Neon 240 supports AM4, LGA1200, LGA115x, and LGA2066 sockets, while the Neon 360 also includes support for TR4 and sTRX4 in addition to those. The coolers include an RGB controller with an RF remote control. The company didn't reveal pricing.

Intel Alder Lake-S Processor Pictured

Intel has just recently announced its next-generation Rocket Lake-S processor specifications designed to bring improved performance and newer platform technologies like PCIe 4.0. However, we are yet to see the first 10 nm CPU for desktop users. Today, thanks to the sources over at VideoCardz, we have the first look at Intel's next-next-generation processor called Alder Lake. The Alder Lake-S is a platform that brings many of the "firsts" for Intel. It will be the first architecture being built on the company's 10 nm SuperFin architecture. Alongside the new node, the platform will transition to the next-generation of technologies. Rumored are the transitions to PCIe 5.0 and perhaps, most importantly - DDR5.

Another new approach will be Intel's adaptation of Arm's big.LITTLE heterogeneous core structure. The processor will feature a few of the "little" cores for light tasks, and fire up the "big" cores for heavy computing. All of that will require a new socket to house the processor, which is the LGA1700. You can see the new processor below, compared to LGA1200 CPU from the previous generation.

Arctic Announces the Liquid Freezer II 420 AIO Liquid CPU Cooler

Arctic today expanded its Liquid Freezer II line of all-in-one, closed-loop, liquid CPU coolers, with its largest variant—Liquid Freezer II 420. This cooler uses a 38 mm-thick 420 mm x 140 mm radiator, which is ventilated by a trio of 140 mm fans, with the coolant pressure of the pump-block adjusted to match the large radiator. The pump-block features a tiny 40 mm fan that spins between 1,000-3,000 RPM, to maintain airflow near the CPU VRM area. The pump's impeller does 800 to 2,000 RPM. Among the CPU socket types supported are LGA1200, AM4, LGA115x, and LGA2066 (no sTR4/sTRX4 support). Arctic includes three Arctic P14 PWM fans, which feature fluid-dynamic bearings, spin between 200 to 1,700 RPM, pushing 72.8 CFM of air, each. Available now, the Liquid Freezer II 420 is priced at 120€ (including VAT).

Intel Alder Lake-S CPU Has Been Pictured

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.

ASUS ROG Maximus XII Extreme Gundam Motherboard Pictured

Here's the first picture of the ASUS ROG Maximus XII Extreme Gundam, a new Socket LGA1200 motherboard based on the Intel Z490 chipset, courtesy of VideoCardz. Based on the original Maximus XII Extreme, the Extreme Gundam is a step-up, and comes with a custom-design full-coverage water block, and styling resembling that of a Gundam mecha. Vast bits of silver covering the acrylic top of the FC block, fuse with bright bits of blue, red, and yellow. Supplied by EK Water Blocks, the full-coverage water block cools the processor, CPU VRM, and the Z490 PCH. It's also possible that the M.2 heatsinks on the board shed some of their heat onto the block. The board is otherwise identical to the original Maximus XII Extreme. We're also getting to learn that ASUS has a whole lineup of products planned, based on the Gundam theme.

Intel to Debut 500-series Chipset with Core "Rocket Lake-S," Which Launches Late-Q1 2021?

Intel will debut its 500-series desktop motherboard chipset series with its 11th Gen Core "Rocket Lake-S" desktop processors. A leaked alleged roadmap slide possibly from a presentation targeting an Intel ecosystem partner, reveals that the 500-series chipset will debut no sooner than March 2021, which could also mean "Rocket Lake-S" chips themselves could launch around that time, since Intel tends to launch new processor generations alongside new chipsets that are compatible out of the box. Even the 9th Generation "Coffee Lake Refresh" was accompanied by new Z390 and B365 chipsets. That said, Socket LGA1200 motherboards based on the existing 400-series chipset are expected to be compatible with "Rocket Lake-S," with BIOS updates. 500-series chipset motherboards might also support older 10th Gen Core "Comet Lake-S" processors.

The roadmap slide reveals that "Rocket Lake-S" could debut with strictly client-segment chipsets, such as the Z590 targeting overclockers, H570 targeting premium desktops, B560 targeting mid-range desktops, and H510 for entry-level desktops. Later in April, Intel could debut the Q570 chipset for commercial desktops, and W580 for workstations. What sets the 500-series chipset apart from the 400-series, appears to be a standardization of PCI-Express Gen 4, at least for the main PEG slot. Certain premium 400-series chipset motherboards already come with preparation for PCIe Gen 4 PEG. The "Rocket Lake-S" processor sees the first IPC increase by Intel on the desktop platform in five years, as the 14 nm chips are expected to feature new "Cypress Cove" CPU cores, which are a back-port of "Willow Cove" for the older 14 nm process. The chips could also feature a Gen12 Xe iGPU.

Bitspower Intros CPU+VRM Monoblock for MSI MEG Z490 Ace

Bitspower today introduced a CPU+VRM monoblock tailor-made for the MSI MEG Z490 Ace motherboard (model: BP-MBMZ490ACE). The monoblock provides liquid cooling to the Socket LGA1200 CPU and the adjoining CPU VRM solution, by making contact with its hottest components, the DrMOS, via thermal pads. The CPU contact area features a mirror finish, so you get to use your own TIM. The primary material of the monoblock is nickel-plated copper, coupled with a clear acrylic top that's studded with addressable RGB LEDs. The main coolant channel passes over the VRM area, and a micro-fin lattice over the CPU socket. Available now, the Bitspower BP-MBMZ490ACE is priced at USD $205.

AeroCool Intros the Mirage 5: Looks Like an AIO Block, But it's Not

At first glance, the new AeroCool Mirage 5 looks like an overgrown AIO CLC CPU block, with its puck shape, glass top, and an infinite-reflection RGB ornament, but it's not. It's a cylindrical, tower-type CPU air cooler. The CPU base features a tiny bit of aluminium finnage. From here, five 6 mm-thick copper heat pipes make direct contact with the CPU, conveying heat to a stack of ring-shaped anodized aluminium fins. The fin-stack is ventilated by a high-RPM 60 mm lateral flow fan with a somewhat cylindrical impeller, located underneath the top-plate.

This fan spins between 1,200 to 3,000 RPM, pushing between 39.7 to 74.3 CFM of air-flow, with 0.91 to 2.13 mm H₂O static pressure. AeroCool claims the noise output ranges between 18 to 30 dBA for this fan, since this isn't just another 60 mm fan, but a cylindrical impeller that happens to have a low diameter when viewed from the top. The fan features a hydraulic bearing, and is rated for 60,000 hours MTBF. The cooler measures 100 mm x 100 mm x 145 mm (WxDxH). AeroCool claims that the Mirage 5 can handle thermal loads of up to 150 W TDP. Among the CPU socket types supported are LGA2066, LGA1200, LGA115x, and AM4. The company didn't reveal pricing or availability.
A video presentation by AeroCool follows.

Bitspower Intros Monoblock for GIGABYTE Z490 AORUS Master

Bitspower today introduced a CPU+VRM monoblock for the GIGABYTE Z490 AORUS Master motherboard (mode: BP-MBGAZ490AM). Tailored for GIGABYTE's second most endowed product series based on the Intel Z490 chipset, the monoblock uses nickel-plated copper as its primary material, with a clear acrylic top that's studded with addressable-RGB LEDs. The block cools the Socket LGA1200 processor through its main micro-fin lattice, while the coolant channel flows over even the VRM MOSFETs. Bitspower includes thermal pads for contact between the monoblock and the MOSFETs, however, it leaves the choice of TIM over the CPU to the end-users. The block comes with a mirror finish at the CPU base. Bitspower says that the monoblock is also compatible with the GIGABYTE Z490 AORUS Ultra, however you should be mindful with your VRM thermal pad placement. The monoblock takes in standard G 1/4" fittings (not included). Available now, the Bitspower CPU+VRM monoblock for GIGABYTE Z490 AORUS Master is priced at USD $200.
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