Lenovo unveiled its new Lenovo Chromebook Plus (14", 10), the world's first Chromebook powered by MediaTek Kompanio Ultra processor and exclusive Google AI features for hybrid AI functionality. Designed for professionals, students and creators, the Lenovo Chromebook Plus (14", 10) sets a new standard for Chromebooks in many categories, including 50 TOPS for supercharged performance, the capability to handle AI features both on device and via cloud and quad speakers and Dolby Atmos for a truly captivating multimedia experience.

"Our society has embraced the freedom of hybrid and remote work, but that freedom demands the workforce and their devices to be productive regardless of location and to do more in less time," said Benny Zhang, Executive Director and General Manager of Chromebooks in Lenovo's Intelligent Devices Group. "The Lenovo Chromebook Plus (14", 10) delivers the most powerful AI capabilities ever on a Chromebook. Whether you are an executive needing AI performance through the day, an artist wishing to create outside the studio, or an everyday user looking to browse, learn or play, this premium device is your perfect everyday companion."

TrendForce's latest investigations reveal that 1Q25 revenue for the global IC design industry reached US$77.4 billion, marking a 6% QoQ increase and setting a new record high. This growth was fueled by early stocking ahead of new U.S. tariffs on electronics and the ongoing construction of AI data centers around the world, which sustained strong chip demand despite the traditional off-season.

NVIDIA remained the top-ranking IC design company, with Q1 revenue surging to $42.3 billion—up 12% QoQ and 72% YoY—thanks to increasing shipments of its new Blackwell platform. Although its H20 chip is constrained by updated U.S. export controls and is expected to incur losses in Q2, the higher-margin Blackwell is poised to replace the Hopper platform gradually, cushioning the financial impact.

NVIDIA plans to introduce its first Arm-based "N1/N1x" gaming SoC in Dell's Alienware laptops later this year or early 2026, according to Taiwanese reports. The SoC is being developed with MediaTek, combining an Arm-derived CPU core and NVIDIA's Blackwell GPU architecture. Early rumors suggest that NVIDIA's new SoC will operate within an 80 W to 120 W power range, positioning it among existing high-performance laptop chips. When Qualcomm entered the Arm-based laptop design market with its Snapdragon X-series, it faced challenges because many titles required emulation through Microsoft's Prism framework, leading to compatibility issues and lower frame rates on Arm-based Windows devices. NVIDIA plans to work closely with Microsoft and game developers to ensure that Arm compatibility is present from day one, so every Arm SoC maker will benefit.

Rumors of an Arm-centric NVIDIA chip first appeared in 2023, and recent leaks suggest an engineering prototype already exists. During an earnings presentation earlier this year, NVIDIA CEO Jensen Huang announced that the company plans to integrate Arm CPU blocks into AI-oriented hardware, specifically mentioning the Digits compute system. Dell's CEO, Michael Dell, also hinted at a future AI-capable PC collaboration with NVIDIA, fueling speculation that Alienware will be the first to use the new chip. Beyond gaming, the partnership with MediaTek could lead to broader Arm solutions for both desktops and mobile devices. MediaTek is reportedly working on its own Arm-based PC processors, and AMD is exploring Arm architectures for future Surface devices. NVIDIA's entry into this space could turn Dell's Alienware laptops into a practical testbed for high-performance Arm technology in a market long dominated by x86 workforce.

Three weeks ago, Kurnal and Geekerwan dived deep into Nintendo's alleged Switch 2 chipset. The very brave Chinese leakers are notorious for their acquiring of pre-release and early silicon samples. Last week, their collective attention turned to a brand-new Xiaomi mobile chip: the XRING 01. After months of insider murmurs and official teasers, the smartphone giant recently unveiled its proprietary flagship SoC. According to industry moles, Xiaomi has invested a lot of manpower into a special chip design entity—leadership likely wants to avoid a repeat of prior first-party developed disappointments. Despite rumors of disappointing prototype performance figures, mid-May Geekbench results pointed to the emergent XRING 01 mobile chip being up there with Qualcomm's dominant Snapdragon 8 Elite platform. Die shot analysis has confirmed Xiaomi's selection of a TSMC 3 nm "N3E" node process; also utilized by the latest Apple, Qualcomm and MediaTek flagships. Overall die size is 114.48 mm² (10.8 x 10.6 mm), with 109.5 mm² of used area; comparable to Apple's A18 Pro SoC footprint (refer to Geekerwan's comparison shot, below).

Unlike nearby rivals, the XRING 01 seems to not sport an integrated 5G modem. Notebookcheck surmised: "it is rumored to use an external radio from MediaTek. It isn't located on the actual die itself, and likely a contributing factor to why its size is so small." Annotations indicate the presence of off-the-shelf/licensed Arm CPU cores (ten in total): two Cortex-X925 units, four Cortex-A725 units, two Cortex-A725 units, and two Cortex-A520 units. Additionally, an Arm Immortalis-G925 MP16 iGPU was identified. A 6-core NPU—with 16 MB of cache—was highlighted, but it is not clear whether this is a proprietary effort or something bought in. Observers have noted the absence of SLC cache. GSMArena posited: "the Geekerwan team speculates that (Xiaomi's) omission of the SLC has hurt GPU efficiency—it's pretty fast, but it uses more power than the Dimensity GPU at peak performance. The more efficient CPU combined with the fact that the GPU rarely runs at full tilt makes for pretty good overall efficiency in real-life gaming tests." The XRING department's debut product is impressive, but industry watchdogs are looking forward to refined variants or full-fledged successors.

As previously promised, Dr. Rick Tsai took to the Computex 2025 stage earlier today. The MediaTek CEO's keynote speech included a teaser for next-gen. Currently, the fabless chip design firm's best offerings are manufactured at TSMC foundries—utilizing 3 nm node processes. According to inside track knowledge, the forthcoming Dimensity 9500 mobile chipset will be based on "N3P." During today's important presentation, Tsai announced his company's next major leap—with "2 nm silicon innovation." According to a presentation slide, a tape-out phase is anticipated by this September. Industry experts reckon that a futuristic flagship—perhaps "Dimensity 9600"—SoC will benefit from this generational jump. Finalized products could arrive around late 2026; with MediaTek reportedly being on TSMC's 2 nm (N2) mass production order books. Officially, MediaTek's shift from 3 nm into 2 nm is expected to improve chip performance—with an estimated 15% uplift—while reducing power consumption (by ~25%).

Acer today announced a range of new products for users on the go, including two new tablets -- the Acer Iconia V12 and the Acer Iconia V11 -- and three new 5G network connectivity devices, including the Acer Connect X6E Plus 5G CPE, the Acer Connect M5 Mobile Wi-Fi, and the Acer Connect D5 Pro 5G dongle.

Acer Iconia V Series Tablets: Portable and Reliable for Entertainment and Multitasking
The Acer Iconia V12 and Iconia V11 are versatile tablets catering to a wide range of users, from students and family members to budget-conscious consumers, seeking a reliable mobile companion for everyday use. Their stunning displays offer a large viewing area with a wide 16:10 aspect ratio, up to 2K resolution, and 90 Hz refresh rate. The narrow bezel design maximizes screen real estate to see and do more, while their thin in-cell touch panels enhance touch sensitivity performance to deliver a more responsive and immersive experience.

Today, MediaTek unveiled its latest chipset in the flagship space, the MediaTek Dimensity 9400e. Featuring the company's advanced All Big Core architecture, the Dimensity 9400e is the latest addition to MediaTek's family of flagship-class processors, providing a wider variety of options and functionality for device makers, and delivering exceptional performance and energy efficiency for outstanding artificial intelligence, connectivity, imaging, and gaming for users.

"With the launch of the MediaTek Dimensity 9400e, we are expanding our family of leading mobile platforms to ensure both device makers and users can select from a larger range of flagship experiences than ever before," said Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business Unit. "We remain committed to exceeding expectations in top-tier performance, energy efficiency, and AI capabilities by combining powerful hardware with advanced MediaTek-driven technologies."

Recent benchmark leaks from Geekbench have revealed that NVIDIA's first Arm-based "superchip," the GB10 Grace Blackwell, is on the verge of its market launch as reported by Notebookcheck. This processor is expected to be showcased at Computex 2025 later this month, where NVIDIA may also roll out the N1 and N1X (MediaTek confirmed in April that their CEO—Dr. Rick Tsai—will be delivering a big keynote speech at Computex 2025 trade show) alternatives tailored for desktop and laptop use. ASUS and Dell have already put the GB10 in their upcoming products while NVIDIA has also used it in its Project DIGITS AI supercomputer. The company announced this machine at CES 2025 saying it would cost around $2,999 and be ready to buy this month.

The benchmark listings show some inconsistencies, like identifying the chipset as Armv8 instead of Armv9. However, they point out that the GB10's Cortex-X925 cores can reach speeds up to 3.9 GHz. The performance results show that the GB10 can compete with high-end Arm and x86 processors in single-core metrics. Yet, Apple's M4 Max processors still leads in this area. The GB10 marks NVIDIA's move into the workstation-grade Arm processor market and could shake up the established players in the high-performance computing field.

Around late April, MediaTek confirmed that their CEO—Dr. Rick Tsai—will be delivering a big keynote speech—on May 20—at this month's Computex 2025 trade show. The company's preamble focuses on their "driving of AI innovation—from edge to cloud," but industry moles propose a surprise new product introduction during proceedings. MediaTek and NVIDIA have collaborated on a number of projects; the most visible being automative solutions. Late last year, intriguing Arm-based rumors emerged online—with Team Green allegedly working on a first time attempt at breaking into the high-end CPU consumer market segment; perhaps with the leveraging of "Blackwell" GPU architecture. MediaTek was reportedly placed in the equation, due to expertise accumulated from their devising of modern Dimensity "big core" mobile processor designs. At the start of 2025, data miners presented evidence of Lenovo seeking new engineering talent. Their job description mentioned a mysterious NVIDIA "N1x" SoC.

Further conjecture painted a fanciful picture of forthcoming "high-end N1x and mid-tier N1 (non-X)" models—with potential flagship devices launching later on this year. According to ComputerBase.de, an unannounced "GB10" PC chip could be the result of NVIDIA and MediaTek's rumored "AI PC" joint venture. Yesterday's news article divulged: "currently (this) product (can be) found in NVIDIA DGX Spark (platforms), and similarly equipped partner solutions. The systems, available starting at $3000, are aimed at AI developers who can test LLMs locally before moving them to the data center. The chip combines a 'Blackwell' GPU with a 'Grace' Arm CPU (in order) to create an SoC with 128 GB LPDDR5X, and a 1 TB or 4 TB SSD. The 'GB10' offers a GPU with one petaflop of FP4 performance (with sparsity)." ComputerBase reckons that the integrated graphics solution makes use of familiar properties—namely "5th-generation Tensor Cores and 4th-generation RT Cores"—from GeForce RTX 50-series graphics cards. When discussing the design's "Grace CPU" setup, the publication's report outlined a total provision of: "20 Arm cores, including 10 Cortex-X925 and 10 Cortex-A725. The whole thing sits on a board measuring around 150 × 150 mm—for comparison: the classic NUC board format is 104 × 101 mm."

MediaTek CEO Dr. Rick Tsai will deliver a keynote speech at COMPUTEX 2025. The presentation will highlight MediaTek's AI vision—from edge to cloud—and how the company is driving AI innovation. It will also explore the evolution of next-generation connectivity and reveal how cutting-edge, power-efficient, high-performance chips are shaping the future. The keynote will take place on opening day, May 20 at 11:00 AM (UTC+8), at the Taipei Nangang Exhibition Center, Hall 2, 7F. As a global leader in semiconductor technology and AI computing, MediaTek continues to drive innovation across devices, smart homes, automotive electronics, IoT, and data center technologies. At COMPUTEX 2025, MediaTek CEO Dr. Rick Tsai will outline MediaTek's vision for AI computing from edge to cloud, explore the evolution of next-generation connectivity, and discuss how high-performance, power-efficient chipsets are shaping our future.

Dr. Tsai brings extensive leadership experience in the semiconductor and technology industries. Under his leadership, MediaTek has further strengthened its position as a leading innovator of advanced chip solutions, maintaining a leading position in the global mobile chipset market and driving progress in the entire portfolio of technology platforms. Demonstrate how MediaTek's vision to empower a connected, intelligent world for everyone.

As a global leader in digital drawing devices and solutions, Huion today announces the Kamvas Slate 11 and Kamvas Slate 13, siblings of the Kamvas Slate 10 Android tablet. This announcement demonstrates Huion's commitment to exploring new fields and expanding its product lineup.

Highlights preview
Kamvas Slate 11 & 13 are aimed at artists and note-takers who demand standalone creative equipment with high clarity, entertainment, and portability. For larger canvas lovers, Kamvas Slate 13 features a 12.7-inch 4:3 QHD (2176 x 1600) screen, offering more room for drawing. For users who prefer great portability, Kamvas Slate 11 has a 10.95-inch FHD+ (1920 x 1200) screen, making it easy to carry around for on-the-go use.

ASUS today introduced the X870 MAX Gaming WiFi7 motherboard. This Socket AM5 motherboard comes in two color-based variants—its default black, and the white X870 MAX Gaming WiFi7 W, which features a white PCB, besides white/silver heatsinks. The X870 MAX Gaming is positioned below even the TUF Gaming X870 Plus, and separate from the company's Prime series. It is designed to lure gaming PC builders away from the likes of the GIGABYTE Gaming X and MSI Gaming Plus series. The board is built in the ATX form-factor and draws power from a combination of 24-pin ATX and two 8-pin EPS connectors. It features a 12+2+1 phase CPU VRM that uses 80 A-rated power stages.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and just the one M.2 Gen 5 x4 NVMe slot. The second CPU-attached NVMe interface is wired out as M.2 Gen 4 x4. The third M.2 slot is Gen 4 x4 and wired to the X870 FCH. The board also puts out four SATA 6 Gbps ports. Besides the main Gen 5 x16 PEG slot, the board has three other physical x16 slots, two of these are Gen 4 x1, and the last one Gen 3 x1. Display connectivity includes an HDMI, and a DisplayPort that's wired to the board's two 40 Gbps USB4 type-C ports. Other USB ports include a 10 Gbps USB 3.2 Gen 2; three 5 Gbps USB 3.1 Gen 1, and four USB 2.0, there is a 20 Gbps USB-C header, besides two additional 5 Gbps ports through a standard header.

MediaTek has introduced the Kompanio Ultra, the latest milestone in AI-powered, high-performance Chromebooks. Leveraging MediaTek's proven expertise in flagship innovation, this powerful new platform brings fantastic on-device AI capabilities, superior computing performance, and industry-leading power efficiency to the newest Chromebook Plus devices. "The Kompanio Ultra underscores our commitment to delivering groundbreaking computing performance and efficiency that MediaTek has shown as a leader in the mobile compute space for many years," said Adam King, Vice President & General Manager of Computing and Multimedia Business at MediaTek. "We worked closely with Google to ensure the newest Chromebook Plus devices enjoy next-generation on-device AI capabilities, superior performance per watt, and immersive multimedia."

The Kompanio Ultra is MediaTek's most powerful Chromebook processor to date, integrating 50 TOPS of AI processing power to enable on-device generative AI experiences. With MediaTek's 8th-generation NPU, users can expect real-time task automation, personalized computing, and seamless AI-enhanced workflows—with local processing for enhanced speed, security, efficiency, and support for AI workloads without an internet connection. Built on the cutting-edge (TSMC) 3 nm process, the Kompanio Ultra features an all-big-core CPU architecture with an Arm Cortex-X925 processor clocked at up to 3.62 GHz, delivering industry-leading single and multithreaded performance. Whether handling intensive applications like video editing, content creation, or high-resolution gaming, this processor ensures smooth, lag-free performance with unmatched multitasking capabilities.

According to Reuters, citing The Information, Google will collaborate with MediaTek to develop its seventh-generation Tensor Processing Unit (TPU), which is also known as TPU v7. Google maintains its existing partnership with Broadcom despite the new MediaTek collaboration. The AI accelerator is scheduled for production in 2026, and TSMC is handling manufacturing duties. Google will lead the core architecture design while MediaTek manages I/O and peripheral components, as Economic Daily News reports. This differs from Google's ongoing relationship with Broadcom, which co-develops core TPU architecture. The MediaTek partnership reportedly stems from the company's strong TSMC relationship and lower costs compared to Broadcom.

There is also a possibility that MediaTek could design inference-focused TPU v7 chips while Broadcom focuses on training architecture. Nonetheless, the development of TPU is a massive market as Google is using so many chips that it could use a third company, hypothetically. The development of TPU continues Google's vertical integration strategy for AI infrastructure. Google reduces dependency on NVIDIA hardware by designing proprietary AI chips for internal R&D and cloud operations. At the same time, competitors like OpenAI, Anthropic, and Meta rely heavily on NVIDIA's processors for AI training and inference. At Google's scale, serving billions of queries a day, designing custom chips makes sense from both financial and technological sides. As Google develops its own specific workloads, translating that into hardware acceleration is the game that Google has been playing for years now.

TrendForce reveals that the combined revenue of the world's top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase. The booming AI industry has fueled growth across the semiconductor sector, with NVIDIA leading the charge, posting an astonishing 125% revenue growth, widening its lead over competitors, and solidifying its dominance in the IC industry.

Looking ahead to 2025, advancements in semiconductor manufacturing will further enhance AI computing power, with LLMs continuing to emerge. Open-source models like DeepSeek could lower AI adoption costs, accelerating AI penetration from servers to personal devices. This shift positions edge AI devices as the next major growth driver for the semiconductor industry.

The Retroid Pocket Flip was launched with essentially the same specifications as the Pocket 3+. As the name suggests, the product's form factor allows it to fold in half, with the bottom panel functioning as the controller. The company has now announced its successor, the Pocket Flip 2. Although the pricing details are yet to be revealed, the Flip 2 does feature a bunch of notable upgrades which are likely to make the device command a slightly higher price tag than its ~$160 predecessor.

One of the biggest differences between the Flip and Flip 2 is certainly the substantially higher processing power that the Flip 2 has on tap, courtesy of its Snapdragon 865 or Dimensity 1100 SoC paired with 8 GB of memory. Both of these chips are undoubtedly far more capable than the Unisoc T618 SoC found in the original version, with the amount of memory being twice as much. That said, the Dimensity 1100 (Mali G77) variant will likely have the upper hand in GPU performance compared to the Snapdragon 865 variant (Adreno 650). The display has also witnessed a serious improvement, now boasting a 1080p OLED panel that is 5.5-inches in size, with a peak brightness of 500 nits.

Morse Micro, the world's leading provider of Wi-Fi HaLow chips, today announced the general availability of the world's first Wi-Fi 4 and Wi-Fi HaLow gateway - certified by Wi-Fi Alliance. Featuring FCC, IC, and RCM certification, this breakthrough device enables developers, system integrators, and manufacturers to harness the power of long-range, energy-efficient Wi-Fi HaLow combined with traditional Wi-Fi 4 (802.11n) connectivity in a single, compact gateway.

"The certification of the HaLowLink 1 reinforces the growing importance of reliable, interoperable Wi-Fi HaLow products in the connectivity ecosystem," said Maureen Gallagher, VP of Marketing at Wi-Fi Alliance. "With its extended range and low-power capabilities, Wi-Fi HaLow is a powerful solution for IoT applications, and Morse Micro is committed to accelerating adoption by delivering high-quality products through the Wi-Fi CERTIFIED program."

Report with market evolution powered by AI—The global artificial intelligence (AI) chips market size is estimated to grow by USD 902.6 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 81.2% during the forecast period. Increased focus on developing AI chips for smartphones is driving market growth, with a trend towards convergence of AI and IoT. However, dearth of technically skilled workers for ai chips development poses a challenge. Key market players include Advanced Micro Devices Inc., Baidu Inc., Broadcom Inc., Cerebras, Fujitsu Ltd., Google LLC, Graphcore Ltd., Huawei Technologies Co. Ltd., Intel Corp., International Business Machines Corp., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., SambaNova Systems Inc., Samsung Electronics Co. Ltd., SenseTime Group Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and Tesla Inc.

Cadence today announced that MediaTek has adopted the AI-driven Cadence Virtuoso Studio and Spectre X Simulator on the NVIDIA accelerated computing platform for its 2 nm development. As design size and complexity continue to escalate, advanced-node technology development has become increasingly challenging for SoC providers. To meet the aggressive performance and turnaround time (TAT) requirements for its 2 nm high-speed analog IP, MediaTek is leveraging Cadence's proven custom/analog design solutions, enhanced by AI, to achieve a 30% productivity gain.

"As MediaTek continues to push technology boundaries for 2 nm development, we need a trusted design solution with strong AI-powered tools to achieve our goals," said Ching San Wu, corporate vice president at MediaTek. "Closely collaborating with Cadence, we have adopted the Cadence Virtuoso Studio and Spectre X Simulator, which deliver the performance and accuracy necessary to achieve our tight design turnaround time requirements. Cadence's comprehensive automation features enhance our throughput and efficiency, enabling our designers to be 30% more productive."

Microsoft's Windows-on-Arm (WoA) project has been going through an expansion phase, with the recent range of Snapdragon X SoCs powering many laptops. However, as we are about to get bombed with WoA devices in 2025, Microsoft has prepared an official ISO image of the Windows 11 operating system, available for users to download on the official website. The download size is about 5 GB and requires an Arm-based system to work, as expected. The need for Windows 11 ISO image for WoA comes from the increased number of desktop builds shipped to developers worldwide based on Arm. There are many workstations like the ones offered by ODMs, with an Ampere Altra or Altra Max processor inside.

This is also good news for enthusiasts waiting for the NVIDIA-MediaTek collaboration to drop its first goodies next year, and we expect to see some interesting solutions arise. With Microsoft investing its developer resources into producing Windows 11 Arm builds, it signals that the adoption of Arm-based devices is about to get much higher interest from the consumer standpoint.

According to DigiTimes, NVIDIA is reportedly targeting the high-end segment for its first consumer CPU attempt. Slated to arrive in 2025, NVIDIA is partnering with MediaTek to break into the AI PC market, currently being popularized by Qualcomm, Intel, and AMD. With Microsoft and Qualcomm laying the foundation for Windows-on-Arm (WoA) development, NVIDIA plans to join and leverage its massive ecosystem of partners to design and deliver regular applications and games for its Arm-based processors. At the same time, NVIDIA is also scheduled to launch "Blackwell" GPUs for consumers, which could end up in these AI PCs with an Arm CPU at its core.

NVIDIA's partner, MediaTek, has recently launched a big core SoC for mobile called Dimensity 9400. NVIDIA could use something like that as a base for its SoC and add its Blackwell IP to the mix. This would be similar to what Apple is doing with its Apple Silicon and the recent M4 Max chip, which is apparently the fastest CPU in single-threaded and multithreaded workloads, as per recent Geekbench recordings. For NVIDIA, the company already has a team of CPU designers that delivered its Grace CPU to enterprise/server customers. Using off-the-shelf Arm Neoverse IP, the company's customers are acquiring systems with Grace CPUs as fast as they are produced. This puts a lot of hope into NVIDIA's upcoming AI PC, which could offer a selling point no other WoA device currently provides, and that is tried and tested gaming-grade GPU with AI accelerators.

MediaTek today launched the Dimensity 9400, the company's new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek's flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm's v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek's second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek's previous generation flagship chipset, the Dimensity 9300. Built on TSMC's second-generation 3 nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

The OpenWrt One WiFi 6 router by Banana Pi has recently completed its journey from the first announcement in January 2024, through sampling in April, and is now available for retail to end-users. The OpenWrt One is the first board designed by Banana Pi in collaboration with the OpenWrt open-source community, with assistance from MediaTek. Banana Pi is also handling the manufacturing and distribution of the router board, with part of the generated income being used by OpenWrt to cover the costs of hosting and conferences, as well as donations to the Software Freedom Conservancy (SFC) organization.

The router uses MediaTek's MT7981B (Filogic 820) SoC and MediaTek MT7976C dual-band WiFi 6 chipset, offering 2x2 2.4 GHz and 3x3 5 GHz connectivity. It features a dual-core Cortex-A53 processor running at 1.3 GHz, 1 GB of DDR4 RAM, and 256 MB of SPI NAND flash storage. It also includes 16 MB of additional protected storage for system backup, and integrated M.2 2230/2242 NVMe PCIe 2x1 ports that can be used for adding external storage. The router comes with the board, including a heatsink, assembled in a metal case, three antennas, and an external power supply. In terms of connectivity, the OpenWrt One offers (aside from wireless connections) 1x Gigabit RJ45 and 1x 2.5GbE RJ45 ports, 1x USB 2.0 Type-A host port, and 1x USB Type-C port.

Lenovo elevates productivity and enjoyment on-the-go with Chromebook Duet (11", 9) and Chromebook Duet EDU G2, two 10.95-inch convertible laptops with 2K display that balance design and performance. Encased in a full metal chassis with Corning Gorilla Glass for ultimate durability and complemented by a soft protective folio, the Chromebook Duet (11", 9) is a portable companion that entertains, adapts, and encourages you to create. A learning resource for students and teachers, the Chromebook Duet EDU G2 takes durability to the next level with a rugged case and detachable keyboard.

"Modern society is constantly on the move, a challenge to traditional notions of productivity and leisure based on being stationary, while underscoring the necessity of having a portable and efficient laptop," said Benny Zhang, Executive Director and General Manager of Chromebooks in Lenovo's Intelligent Devices Group. "The Lenovo Chromebook Duet and Lenovo Chromebook Duet EDU G2 powered by MediaTek Kompanio 838 processor with AI-enabled NPU are versatile companions for work, play, learning and everything in between."

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.