Tuesday, May 20th 2025
MediaTek CEO Anticipates Q4 2025 Taping-out of First 2 nm Chip Design
As previously promised, Dr. Rick Tsai took to the Computex 2025 stage earlier today. The MediaTek CEO's keynote speech included a teaser for next-gen. Currently, the fabless chip design firm's best offerings are manufactured at TSMC foundries—utilizing 3 nm node processes. According to inside track knowledge, the forthcoming Dimensity 9500 mobile chipset will be based on "N3P." During today's important presentation, Tsai announced his company's next major leap—with "2 nm silicon innovation." According to a presentation slide, a tape-out phase is anticipated by this September. Industry experts reckon that a futuristic flagship—perhaps "Dimensity 9600"—SoC will benefit from this generational jump. Finalized products could arrive around late 2026; with MediaTek reportedly being on TSMC's 2 nm (N2) mass production order books. Officially, MediaTek's shift from 3 nm into 2 nm is expected to improve chip performance—with an estimated 15% uplift—while reducing power consumption (by ~25%).
Sources:
Reuters, Notebookcheck, Wccftech, Pocket-lint, Nikkei Asia
1 Comment on MediaTek CEO Anticipates Q4 2025 Taping-out of First 2 nm Chip Design
This fluff piece says nothing "important" per se, except as a bolster to stockholders and speculators, as it is basically the same thing that every other fabless mfgr is doing or hopes to do soon....they are "a day late & a dollar short" as the saying goes :D
Note however, that all this depends on TSMC being able to produce & supply chips in ever increasingly humongous quantities, many of which are already earmarked for Apple and a few other select companies that placed their orders years ago, and probably already paid up front for at least some of them....