G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is working closely with the ASUS ROG team to explore the overclock potential of the new DDR5 CAMM2 form factor and have successfully reached the early milestone of Memtest-stable at DDR5-10000 memory speed with a 64 GB capacity CAMM2 module on a modified custom ASUS ROG Maximus Z890 Hero CAMM2 motherboard with an Intel Core Ultra 7 265K desktop processor.

Overclocked CAMM2 Reaches DDR5-10000 Memtest-Stable Milestone
G.SKILL is always seeking out overclock memory performance wherever possible. With the in-development CAMM2 form factor and in cooperation with the ASUS ROG team, demonstrating stability is the first step toward enabling overclock memory specifications on future hardware platforms.

During the Intel AI Summit in Seoul, South Korea, Intel teased its upcoming product portfolio, featuring next-generation memory technologies. Being in Seoul, memory makers like SK Hynix are Intel's main partners for these products. Teased at the summit is Intel's upcoming AI accelerator, called "Jaguar Shores," which utilizes the next-generation HBM4 memory, offering 2.0 TB/s of bandwidth per module across 2,048 IO pins. SK Hynix plans to support this accelerator with its memory, ensuring that Intel's big data center-grade AI accelerator is equipped with the fastest memory on the market. Since the "Falcon Shores" accelerator is only intended for testing with external customers, we don't have an exact baseline to compare to, and Jaguar Shores specifications are scarce.

Next up, Intel confirmed that its upcoming seventh-generation "Diamond Rapids" Xeon processors will use the second generation of MRDIMMs (Multiplexer Rank Dual Inline Memory Modules), an upgrade from the first-generation MRDIMMs used in the Xeon 6 family. The upgrade to MRDIMMs Gen 2 will allow Intel to push transfer rates to 12,800 MT/s, up from 8,800 MT/s in Xeon 6 with MRDIMMs Gen 1. Alongside this 45% speed bump in raw transfer rates, the memory channels are jumping to 16, up from 12 in the current generation, yielding an additional bandwidth boost. Given that MRDIMMs operate by connecting more memory ranks using a multiplexer, and that these modules buffer data and commands, the increased data transfer rate comes without any additional signal degradation. As Intel is expected to pack more cores, this will be an essential piece in the toolbox to feed them and keep those cores busy on the Oak Stream platform, based on the LGA9324 socket.

V-Color brought an interesting innovation to Computex 2025—DDR5 memory modules with LCD matrix displays. The company showed off its upcoming XFinity Manta DDR5 modules that come with small integrated displays (around 1-inch diagonal), which put out real-time stats such as module voltage, temperature, clock speed, timings, module density, etc. Among the speed and density options we've seen are 24 GB DDR5-7800 CL38 @1.4 V, and 24 GB DDR5-8000 CL38 @ 1.35 V. There's also a 32 GB DDR5-6400 CL32 @ 1.4 V module, a 48 GB DDR5-6000 CL28 @ 1.4 V module, and a 48 GB DDR5-7200 CL36 @ 1.4 V. The 32 GB and 48 GB modules are likely dual-rank.

We also spotted a 64 GB (2x 32 GB) DDR5-8000 CL44 @ 1.4 V dual-channel kit. Given its high speed, it is either using high-density DRAM chips in a single-rank configuration, or a CKD. Another example of high density is an XPrism 32 GB DDR5-9600 CL48 1.4 V module, and an XSky ROG co-branded series 24 GB DDR5-8800 CL42 1.45 V module. Next up are things we weren't expecting—OC R-DIMMs with RGB!

Around mid-February, South Korean sources alleged that NVIDIA was in the process of developing an innovative new memory form factor. The System on Chip Advanced Memory Module (SOCAMM) design is reportedly a collaborative effort. Team Green's usual set of memory partners—SK Hynix, Samsung, and Micron—were mentioned in early 2025 news articles. Just over a month later, official press material revealed a key forthcoming deployment—Micron stated: "(our) SOCAMM (product), a modular LPDDR5X memory solution, was developed in collaboration with NVIDIA to support the NVIDIA GB300 Grace Blackwell Ultra Superchip. In a (rumored) blow to all involved parties, ZDNet Korea posits that Team Green has postponed the commercialization of their "next-generation low-power DRAM module" IP. According to industry moles, the SOCAMM standard will not debut with this generation of enterprise-focused "Grace-Blackwell" chips. Instead, fresher theories indicate a postponement into next-gen territories—possibly rescheduled to arrive alongside the firm's "Rubin" GPU architecture.

NVIDIA has reportedly sent out notices to major memory partners—(alleged) May 14 updates were received by Samsung Electronics and SK Hynix (in South Korea) and Micron (USA). As a result, SOCAMM supply timelines are (apparently) adjusted. A newer "Cordelia" board design—acting as a substrate for GB300 chips, and compatible with SOCAMM—was in the picture. The latest whispers suggest a return to an existing "Bianca" board configuration, that supports current-gen LPDDR memory modules. ZDNet believes that company engineers have run into several obstacles: "Blackwell chips have been continuously experiencing difficulties in securing design and packaging yields. In fact, the 'Cordelia' board is known to have reliability issues, such as data loss, and SOCAMM has reliability issues, such as heat dissipation characteristics." NVIDIA briefly previewed its futuristic "Rubin Ultra" AI GPU design during GTC 2025—on-stage, a "second half of 2027" release window was teased.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs.

These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients.

SMART Modular Technologies, Inc. ("SMART"), a Penguin Solutions, Inc. brand and a global leader in integrated memory solutions, solid-state drives, and hybrid storage products, announced today it is now sampling its redefined Non-Volatile CXL Memory Module (NV-CMM) to tier 1 OEMs based on the CXL 2.0 standard. This innovative product combines non-volatile high-performance DRAM memory, persistent flash memory and an energy source in a single removable EDSFF form factor to deliver superior reliability and serviceability for data-intensive applications. The NV-CMM module further expands the SMART family of CXL products introduced in the last year.

"Our NV-CMM represents a paradigm shift in memory technology for data centers," said Torry Steed, senior product marketing manager at SMART Modular Technologies. "By combining the benefits of non-volatile memory with the CXL standard, we're making it significantly easier for system integrators to incorporate compact, non-volatile, high performance persistent memory into their products."

SK hynix Inc. announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled "Memory, Powering AI and Tomorrow". The company will present HBM and other memory products for AI data centers and on-device and memory solutions for automotive business essential for AI era.

Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM (Small Outline Compression Attached Memory Module), a new memory standard for AI servers.

NVIDIA and its memory partners, SK Hynix, Samsung, and Micron, are preparing a new memory form factor called System on Chip Advanced Memory Module—SOCAMM shortly. This technology, adapting to the now well-known CAMM memory module standard, aims to bring additional memory density to NVIDIA systems. Taking inspiration from NVIDIA's Project DIGITS, it has now been developed independently by NVIDIA outside of any official memory consortium like JEDEC. Utilizing a detachable module design, SOCAMM delivers superior specifications compared to existing solutions, featuring 694 I/O ports (versus LPCAMM's 644 and traditional DRAM's 260), direct LPDDR5X memory substrate integration, and a more compact form factor.

For reference, current-generation Project DIGITS is using NVIDIA GB10 Grace Blackwell Superchip capable of delivering one PetaFLOP of FP4 compute, paired with 128 GB of LPDDR5X memory. This configuration limits the size of AI models that run locally on the device, resulting in up to 200 billion parameter models running on a single Project DIGITS AI PC. Two stacked Project DIGITS PCs are needed for models like Llama 3.1 405B with 405 billion parameters. Most interestingly, memory capacity is the primary limiting factor; hence, NVIDIA devotes its time to developing a more memory-dense SOCAMM standard. Being a replacement compatible with LPDDR5, it can use the same controller silicon IP with only the SoC substrate being modified to fit the new memory. With NVIDIA rumored to enter the consumer PC market this year, we could also see an early implementation in consumer PC products, but the next-generation Project DIGITS is the primary target.

SK hynix Inc. announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time). A large number of C-level executives, including CEO Kwak No-jung, CMO (Chief Marketing Officer) Justin Kim and Chief Development Officer (CDO) Ahn Hyun, will attend the event. "We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES," said Justin Kim. "Through this, we will publicize our technological competitiveness to prepare for the future as a Full Stack AI Memory Provider."

SK hynix will also run a joint exhibition booth with SK Telecom, SKC and SK Enmove, under the theme "Innovative AI, Sustainable Tomorrow." The booth will showcase how SK Group's AI infrastructure and services are transforming the world, represented in waves of light. SK hynix, which is the world's first to produce 12-layer HBM products for 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance.

While Intel's primary product focus is on the processors, or brains, that make computers work, system memory (that's DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen). In heavy-duty computing jobs like weather modeling, computational fluid dynamics and certain types of AI, this mismatch could create a bottleneck—until now.

After several years of development with industry partners, Intel engineers have found a path to open that bottleneck, crafting a novel solution that has created the fastest system memory ever and is set to become a new open industry standard. The recently introduced Intel Xeon 6 data center processors are the first to benefit from this new memory, called MRDIMMs, for higher performance—in the most plug-and-play manner imaginable.

In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.

Innodisk, a leading global AI solution provider, announces its DDR5 6400 DRAM series, featuring the industry's largest 64 GB single-module capacity. This 6400 series is purpose-built for data-intensive applications in AI, telehealth, and edge computing, where high performance at the edge is crucial. Available in versatile form factors, including CUDIMM, CSODIMM, and RDIMM, the series delivers unmatched speed, stability, and capacity to meet the rigorous demands of modern edge AI and industrial applications.

The DDR5 6400 series delivers a data transfer rate of 6400 MT/s, offering a 14% boost in speed over previous generations and doubling the maximum capacity to 64 GB. These enhancements make it an optimal choice for applications like Large Language Models (LLMs), generative AI, autonomous vehicles, and mixed reality, which require high-speed, reliable data processing in real time.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

Team Group Industrial has officially introduced the industry's first industrial-grade DDR5 6400 MHz CU-DIMM/CSO-DIMM memory modules. The innovative product addresses challenges posed by high-frequency operation on signal stability by incorporating a specialized component known as the Client Clock Driver (CKD), which effectively buffers and drives clock signals, ensuring the signals remain stable and complete even under high-frequency conditions. This advancement sets a new benchmark in industrial storage technology, enhancing reliability and performance for demanding applications.

Team Group utilizes DDR5 Clocked Unbuffered Dual Inline Memory Module technology, which enables frequency and voltage adjustments based on system load and operating conditions, facilitating exceptional data transmission speeds and optimized power consumption performance, fully supporting the dynamic load requirements prevalent in industrial applications, and delivering solutions with outstanding performance and reliability.

SK hynix is showcasing its leading AI and data center memory products at the 2024 Open Compute Project (OCP) Global Summit held October 15-17 in San Jose, California. The annual summit brings together industry leaders to discuss advancements in open source hardware and data center technologies. This year, the event's theme is "From Ideas to Impact," which aims to foster the realization of theoretical concepts into real-world technologies.

In addition to presenting its advanced memory products at the summit, SK hynix is also strengthening key industry partnerships and sharing its AI memory expertise through insightful presentations. This year, the company is holding eight sessions—up from five in 2023—on topics including HBM and CMS.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces its first-ever CU-DIMM & CSO-DIMM memory modules, which work seamlessly with the latest Intel Core Ultra (Series 2) "Arrow Lake-S" Processors/ Z890 platform to unleash the true DDR5 performance. KLEVV's next-generation DDR5 memory lineup receives a substantial performance boost with the integration of advanced Client Clock Driver (CKD) technology. Incorporated via a small integrated circuit (IC) directly on the DIMM, CKD IC enhances the module's speed and efficiency for both desktop and laptop applications. By regenerating the memory chips' clock signal, it improves stability, supports higher operating frequencies, and minimizes electrical interference and signal degradation—pushing the boundaries of memory performance.

Designed for both performance desktop and laptop systems, KLEVV's new Standard CU-DIMM and CSO-DIMM memory modules combine the brand's renowned quality with cutting-edge DDR5 technology, making them ideal for both casual and professional users. Leveraging the innovative CKD architecture, these modules deliver exceptional stability and reliability, even at high speeds, effectively mitigating electrical interference that could otherwise hinder performance. With this advanced design, users can count on smooth, efficient operation, even under heavy workloads.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced upcoming raw card designs currently in development in JEDEC's JC-45 Committee for DRAM Modules in collaboration with the JC-40 and JC-42 Committees. These raw card memory device standards are intended for use in client computing applications such as laptops and desktops and will be supported by related appendix specifications. The forthcoming raw cards will also complement two DDR5 Clock Driver standards published earlier this year: JESD323: DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common Specification and JESD324: DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common Specification.

Integrating a Clock Driver (CKD) into a DDR5 DIMM provides numerous advantages, particularly in memory stability and performance, and enhances signal integrity and reliability at high speeds. By regenerating the clock signal locally on the DIMM, a CKD ensures stable operation even at elevated clock speeds. With a DDR5 CKD, DIMM data rates can be increased from 6400 Mbps to 7200 Mbps in the initial version of the standard, and targeting up to 9200 Mbps in future versions.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today unveiled industry-first, complete memory interface chipsets for Gen 5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs). These innovative new products for RDIMMs and MRDIMMs will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center and AI workloads.

"The voracious memory demands of AI and HPC require the relentless pursuit of higher performance through continued innovation and technology leadership," said Sean Fan, chief operating officer at Rambus. "With our 30-plus years of renowned high-speed signal integrity and memory system expertise, the Rambus Gen5 RCD, and next-generation MRCD, MDB, and PMIC will be critical enabling chips in future-generation servers leveraging DDR5 RDIMM 8000 and MRDIMM 12800."

Advantech, a global leader in embedded computing, is excited to announce the release of the SQRAM CXL 2.0 Type 3 Memory Module. Compute Express Link (CXL) 2.0 is the next evolution in memory technology, providing memory expansion with a high-speed, low-latency interconnect designed to meet the demands of large AI Training and HPC clusters. CXL 2.0 builds on the foundation of the original CXL specification, introducing advanced features such as memory sharing, and expansion, enabling more efficient utilization of resources across heterogeneous computing environments.

Memory Expansion via E3.S 2T Form Factor
Traditional memory architectures are often limited by fixed allocations, which can result in underutilized resources and bottlenecks in data-intensive workloads. With the E3.S form factor, based on the EDSFF standard, the CXL 2.0 Memory Module overcomes these limitations, allowing for dynamic resource management. This not only improves performance but reduces costs by maximizing existing resources.

BIWIN unveils the DW100 RGB DDR5 OC CUDIMM, innovative CUDIMM technology that delivers the fastest speed of 9200 MT/s with an ultra-low CAS latency of CL42. Biwin DW100 RGB DDR5 OC CUDIMM brings high-end features including peak speeds, advanced thermal management, and customizable RGB lighting for a superior memory upgrade that gamers dream of.

Designed for high-speed computing, this module leverages the expertise of the Biwin OC Lab to deliver top-tier overclocking performance. At the core of the lab's innovation is the advanced manufacturing process that meticulously selects the finest semiconductor materials to meet extreme performance standards.

Innodisk, a leading global AI solution provider, continues to push the boundaries of innovation with the launch of its cutting-edge Compute Express Link (CXL) Memory Module, which is designed to meet the rapid growth demands of AI servers and cloud data centers. As one of the few module manufacturers offering this technology, Innodisk is at the forefront of AI and high-performance computing.

The demand for AI servers is rising quickly, with these systems expected to account for approximately 65% of the server market by 2024, according to Trendforce (2024). This growth has created an urgent need for greater memory bandwidth and capacity, as AI servers now require at least 1.2 TB of memory to operate effectively. Traditional DDR memory solutions are increasingly struggling to meet these demands, especially as the number of CPU cores continues to multiply, leading to challenges such as underutilized CPU resources and increasing latency between different protocols.

V-COLOR is set to revolutionize the future of memory technology with the launch of the world's first RGB DDR5 O CUDIMM (High Speed Overclocked CUDIMM). This groundbreaking innovation for the next-generation desktop platform, offering unmatched speeds and efficiency for desktop applications. This memory module has a new heatsink patent (Patent No. 113208127) to increase heat dissipation efficiency to a new level, and the introduction of the exclusive light guide rod patented coating technology (Patent No. M653290) allows the light guide rod to attract attention regardless of whether it has RGB effects or not.

The DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) technology dynamically adjusts clock frequency and voltage based on workload and system conditions. This cutting-edge capability results in faster data transmission, lower power consumption, and enhanced stability, making it a game-changer in the industry.

Samsung Electronics Co. is putting a lot of effort into securing its involvement in next-generation memory technology, CXL (Compute Express Link). In a media briefing on Thursday, Jangseok Choi, vice president of Samsung's new business planning team, announced plans to mass-produce 256 GB DRAM supporting CXL 2.0 by the end of this year. CXL technology promises to significantly enhance the efficiency of high-performance server systems by providing a unified interface for accelerators, DRAM, and storage devices used with CPUs and GPUs.

The company projects that CXL technology will increase memory capacity per server by eight to ten times, marking a significant leap in computing power. Samsung's long investment in CXL development is now in the final stages with the company currently testing products with partners for performance verification, Samsung recently established the industry's first CXL infrastructure certified by Red Hat. "We expect the CXL market to start blooming in the second half and explosively grow from 2028," Choi stated, highlighting the technology's potential to expand memory capacity and bandwidth far beyond current limitations.

SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4-7. As one of Asia's premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme "Connecting AI". Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

"Connecting AI" With the Industry's Finest AI Memory Solutions
Themed "Memory, The Power of AI," SK hynix's booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products. HBM3E, the fifth generation of HBM1, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications. Another technology which has become crucial for AI servers is CXL as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5 (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM and MCR DIMM. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme "Embracing the Era of High-Capacity SSDs." The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen 4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more. The company offers reliable industrial-grade, automotive-grade, and enterprise-grade storage products, providing high-capacity solutions for global users.

High-Capacity SSDs
For SSDs, Mnemonic Electronic presented products in various form factors and interfaces, including PCIe M.2, PCIe BGA, SATA M.2, and SATA 2.5-inch. The Mnemonic MS90 8 TB SATA SSD supports the SATA interface with a speed of up to 6 Gb/s (Gen 3) and is backward compatible with Gen 1 and Gen 2. It also supports various SATA low-power states (Partial/Sleep/Device Sleep) and can be used for nearline HDD replacement, surveillance, and high-speed rail systems.