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Intel Reports Third-Quarter 2021 Financial Results

Intel Corporation today reported third-quarter 2021 financial results. "Q3 shone an even greater spotlight on the global demand for semiconductors, where Intel has the unique breadth and scale to lead. Our focus on execution continued as we started delivering on our IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and unveiled our most dramatic architectural innovations in a decade. We also announced major customer wins across every part of our business," said Pat Gelsinger, Intel CEO. "We are still in the early stages of our journey, but I see the enormous opportunity ahead, and I couldn't be prouder of the progress we are making towards that opportunity."

In the third quarter, the company generated $9.9 billion in cash from operations and paid dividends of $1.4 billion. Intel CFO George Davis announced plans to retire from Intel in May 2022. He will continue to serve in his current role while Intel conducts a search for a new CFO and until his successor is appointed. Third-quarter revenue was led by strong recovery in the Enterprise portion of DCG and in IOTG, which saw higher demand amid recovery from the economic impacts of COVID-19. The Client Computing Group (CCG) was down due to lower notebook volumes due to industry-wide component shortages, and on lower adjacent revenue, partially offset by higher average selling prices (ASPs) and strength in desktop.

Intel's CEO Blames Predecessors for Current State of the Company, Wants Apple Business Back with Better Processors

It's funny how new company CEOs always seem to blame their predecessors for whatever went wrong and it seems like Pat Gelsinger is no different, as he's throwing shade at his predecessors for not having been engineers. At the same time, he's set his mind on winning Apple back as a customer, as all Intel apparently has to do "is create a better chip than they can do themselves", with they being Apple here.

It should be pointed out that Intel hasn't had an engineer at the helm of the company since 2005, so the question is how far back Pat Gelsinger wants to throw the blame, although a guesstimate would be back to at least 2012/2013 when Paul Otellini stepped down. That said, in an interview with Axios, it's stated that "while he acknowledges the need to prove himself, Gelsinger said he will rebuild the company's credibility with its customers so that if they say they need a million of some chip by Monday, the order will be there by Sunday night."

Intel CEO Cites Brexit as Reason for Chip Fab Plans in UK Not an Option

In an interview with the BBC, Intel CEO Pat Gelsinger said that the company is no longer considering the UK as a site for a chip fab, due to Brexit, something the company had apparently done prior to Brexit. Now the company is looking for a location in another EU country for a US$95 billion investment for a new semiconductor plant, as well as upgrades to its current plants in Ireland.

Although Intel had not made any firm decisions on a site location prior to Brexit, Gelsinger is quoted as saying "I have no idea whether we would have had a superior site from the UK, but we now have about 70 proposals for sites across Europe from maybe 10 different countries." He continues "We're hopeful that we'll get to agreement on a site, as well as support from the EU... before the end of this year."

Intel CEO Predicts Chips Will Cost 20% of Future Cars' Bill of Materials by 2030

Intel CEO Pat Gelsinger predicts that chips and semiconductors will make up as much of the car's bill-of-materials (BOM) as the engine (or main propulsion) itself. This change will happen as early as in 2030, said Gelsinger, speaking at a keynote address, at the IAA Mobility 2021 show in Munich. Gelsinger's prediction is backed by internal research conducted by Roland Berger, and McKinsey.

As of 2019, chips barely made 4% of a vehicle's BOM, confining mainly to the ECU and an optional infotainment system. By 2030, electronics will take over a more complex set of roles, including full automation, and AI that can drive anywhere. A fully automated vehicle, or AV, will be next big thing in personal transport. Gelsinger predicts a $115 billion TAM (total addressable market) size for automobile semiconductors by the end of the decade.

Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

Intel Oregon Fab Expansion Milestone: First Chipmaking Tool Rolls in

For most people, a tool is something you hold in your hand: pliers, hammer, screwdriver. Inside an Intel chip factory, a tool is a whole different deal. Fab tools are huge and hugely costly and take entire teams to muscle into place and install. As Intel aggressively ramps its worldwide manufacturing footprint, a construction milestone recently passed at Intel's Ronler Acres factory in Hillsboro, Oregon.

At the company's massive $3 billion Mod3 factory expansion, the first tool rolled in. The honor went to a thin film deposition tool. It arrived not in a leather tool belt, but aboard two semitractor-trailers. Once completed and hooked up, it will weigh 10 tons. And by the time the Mod3 project is done in about six months, the thin film deposition tool will be joined by more than a dozen like it. A typical Intel fab, once built out, is stuffed with about 1,200 chipmaking tools, many of them costing millions of dollars apiece.

Intel Accelerates Packaging and Process Innovations

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel Now Producing More 10 Nanometer Wafers Than 14 Nanometer Wafers

Intel has recently confirmed during a recent earnings call that it is now manufacturing more 10 nm wafers than 14 nm wafers as part of its IDM 2.0 plan. This news comes four years after Intel first started shipping 10 nm products to customers however the production capacity did not exist to launch any mainstream desktop processors. Intel launched a few low-power mobile Ice Lake processors in 2019 but their 2021 flagship 11th Generation Rocket lake processors remained on 14 nm. This looks set to change as Intel highlights reduced production costs and prepares to launch 10 nm 12th Generation Alder Lake processors in Q4 2021. Intel will offer more details on their future manufacturing plans during their upcoming Intel Accelerated event.
Intel CEOUnder IDM 2.0, our factory network continues to deliver and we are now manufacturing more 10-nanometer wafers than 14-nanometer. As 10-nanometer volumes ramp, economics are improving with 10-nanometer wafer cost 45% lower year-over-year with more to come.

Intel Reports Second-Quarter 2021 Financial Results

Intel Corporation today reported second-quarter 2021 financial results. "There's never been a more exciting time to be in the semiconductor industry. The digitization of everything continues to accelerate, creating a vast growth opportunity for us and our customers across core and emerging business areas. With our scale and renewed focus on both innovation and execution, we are uniquely positioned to capitalize on this opportunity, which I believe is merely the beginning of what will be a decade of sustained growth across the industry," said Pat Gelsinger, Intel CEO. "Our second-quarter results show that our momentum is building, our execution is improving, and customers continue to choose us for leadership products."

Intel In Talks To Purchase GlobalFoundries for $30 Billion

Intel is exploring a deal to purchase GlobalFoundries for roughly $30 billion according to people familiar with the matter, which would serve as Intel's largest acquisition to date. GlobalFoundries is owned by Mubadala Investment Co and it was widely reported that the company was planning an initial public offering later this year. This latest report comes as Intel continues talks with RISC-V chip designer SiFive for a $2 billion purchase as part of a major restructuring effort led by new CEO Pat Gelsinger. Intel is planning to boost its manufacturing capacity with the IDM 2.0 initiative where they have already committed to building two new fabs in Arizona and will offer manufacturing services to other countries. GlobalFoundries currently holds about 7% of the global foundry market by revenue and has several large customers including AMD, Qualcomm, and NVIDIA.

Intel Announces Accelerated Webcast with Process & Packaging Updates

Intel has recently announced that CEO Pat Gelsinger and Dr. Ann Kelleher (senior vice president and general manager of Technology Development) will be hosting a webcast on July 26th to provide a deeper look at Intel's process and packaging roadmaps. These updates will focus on the companies IDM 2.0 Strategy which seeks to increase the companies manufacturing capabilities through the creation of new fabs and the development of more advanced processes. Intel will also offer manufacturing capabilities to external companies using these foundries which it hopes will allow it to better compete with the likes of TSMC, Globalfoundries, and Samsung. You can watch the webcast on July 26th at 2 PM PDT, Intel will publish a link to it on their Newsroom website.

Intel Prospects Europe for a Massive €20 Billion New Fab

Intel is exploring a massive €20 billion ($23.7 billion) manufacturing investment in the European Union that aims to produce "20% of the world's logic chips" by 2030, reports the Financial Times. This is likely to be separate from the company's ongoing investments in Ireland. Intel CEO Pat Gelsinger recently met with the leaders of France and Italy in a bid to "rebalance the semiconductor manufacturing landscape to make supply chains more resilient." Reading between the lines it becomes clear that they are referring to the world's overdependence on Asia, particularly Taiwan, for cutting-edge semiconductor manufacturing.

The location of Intel's new mega-fab remains undecided, as the company is still sitting down with the various EU member states to work out a favorable deal. Regardless of where it lands, the investment would align with the EU's grand-strategy to localize semiconductor manufacturing on a large scale, with the goal of making the EU a net-exporter of semiconductors.

Intel Makes Changes to Executive Team, Raja got Promoted

Intel CEO Pat Gelsinger announced the addition of two new technology leaders to its executive leadership team, as well as several changes to Intel business units. Current Intel executives Sandra Rivera and Raja Koduri will each take on new senior leadership roles, and technology industry veterans Nick McKeown and Greg Lavender will join the company.

"Since re-joining Intel, I have been impressed with the depth of talent and incredible innovation throughout the company, but we must move faster to fulfill our ambitions," said Gelsinger. "By putting Sandra, Raja, Nick and Greg - with their decades of technology expertise - at the forefront of some of our most essential work, we will sharpen our focus and execution, accelerate innovation, and unleash the deep well of talent across the company."

Intel CEO Predicts Chip Shortages Across the Ecosystem to Run Another Couple of Years

Intel CEO Pat Gelsinger, speaking at the company's 2021 Computex Opening Keynote address stated that the explosive demand for chips caused by recent inflections of technology, accelerated by the COVID-19 pandemic, has resulted in demand outstripping supply by such extent, that it could "still take a couple of years for the ecosystem to address the shortages."

Gelsinger detailed how the world of information technology is at its biggest crossroads ever, with the emergence of Cloud, 5G, AI, and smarter edge computing changing the way people work, learn, and interact. This has caused a huge growth in the demand for semiconductors straining technology supply chains around the world. Gelsinger stated that his company is working with partners across the technology ecosystem to increase output to meet demand. He detailed how Intel has nearly doubled its own chip wafer manufacturing capacity over the past four years. "But while the industry has taken steps to address near-term constraints, it could still take a couple of years for the ecosystem to address chip shortages of foundry capacity, substrate, and components.

Intel CEO Pat Gelsinger Outlines 2020-21 CSR Report, Goals for the Near-Future

The following is an opinion editorial by Intel CEO Pat Gelsinger. It introduces Intel's 2020-2021 Corporate Responsibility Report: I am honored to return to Intel as CEO, and both humbled by the challenges and excited by the limitless opportunities made possible by the magic of technology.

Digital technology is transforming the world at an accelerated pace, driven by what I call the four "superpowers": cloud, connectivity fueled by 5G, artificial intelligence (Al) and the intelligent edge. They are superpowers because each expands the impact of the others. And together, they are reshaping every aspect of our lives and work. This goes straight to Intel's purpose and my own passion: creating world-changing technology that touches and improves the lives of every person on the planet.

Intel CEO on NVIDIA CPUs: They Are Responding to Us

NVIDIA has recently announced the company's first standalone Grace CPU that will come out as a product in 2023. NVIDIA has designed Grace on Arm ISA, likely ARM v9, to represent a new way that data centers are built and deliver a whole new level of HPC and AI performance. However, the CPU competition in a data center space is considered one of the hardest markets to enter. Usually, the market is a duopoly between Intel and AMD, which supply x86 processors to server vendors. In the past few years, there have been few Arm CPUs that managed to enter the data canter space, however, NVIDIA is aiming to deliver much more performance and grab a bigger piece of the market.

As a self-proclaimed leader in AI, Intel is facing hard competition from NVIDIA in the coming years. In an interview with Fortune, Intel's new CEO Pat Gelsinger has talked about NVIDIA and how the company sees the competition between the two. Mr. Gelsinger is claiming that Intel is a leader in CPUs that feature AI acceleration built in the chip and that they are not playing defense, but rather offense against NVIDIA. You can check out the whole quote from the interview below.

Intel to Enter Third-Party Foundry Business, Set Up $20 Billion Fabs in Arizona

Intel will formally enter the third-party semiconductor foundry business under the Intel Foundry Services (IFS) brand, announced CEO Pat Gelsinger, on Tuesday. This entity would operate under a business model not unlike that of TSMC, with its latest foundry technologies available to third-party customers, besides Intel. The company hopes to become a major foundry service provider to U.S. and E.U. customers, particularly enterprise and government contractors that need secure semiconductor manufacturing on U.S. soil.

To this effect, Gelsinger announced that the company will invest $20 billion in the state of Arizona, to set up two semiconductor foundries. Intel could have an edge over other foundry companies as its foundry service portfolio includes Intel technologies as IP blocks. IFS will be led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Pat Gelsinger. The $20 billion investment in Arizona, according to Intel, will generate over 3,000 high-skilled jobs, over 3,000 construction jobs, and approximately 15,000 local long-term jobs.

Intel "Meteor Lake" a "Breakthrough Client Processor" Leveraging Foveros Packaging

Intel CEO Pat Gelsinger made the first official reference to the company's future-generation client processor, codenamed "Meteor Lake." Slated for market release in 2023, the processor's compute tile will be taped out in Q2-2021. Launching alongside the "Granite Rapids" enterprise processor, "Meteor Lake" will be a multi-chip module leveraging Intel's Foveros chip packaging technology.

Different components of the processor will be fabricated on different kinds of silicon fabrication nodes, and interconnected on the package using EMIB inter-die connections, or even silicon interposers. The compute tile is likely the tile containing the processor's CPU cores, and Intel confirmed a 7 nm-class foundry node for it. "Meteor Lake" will be a hybrid processor, much like the upcoming "Alder Lake," meaning that it will have two kinds of CPU cores, larger "high performance" cores that remain dormant when the machine is idling or dealing with lightweight workloads; and smaller "high efficiency" cores based on a low-power microarchitecture.

Intel to Launch 3rd Gen Intel Xeon Scalable Portfolio on April 6

Intel today revealed that it will launch its 3rd Generation Xeon Scalable processor series at an online event titled "How Wonderful Gets Done 2021," on April 6, 2021. This will be one of the first major media events headed by Intel's new CEO, Pat Gelsinger. Besides the processor launch, Intel is expected to detail many of its advances in the enterprise space, particularly in the areas of 5G infrastructure rollout, edge computing, and AI/HPC. The 3rd Gen Xeon Scalable processors are based on the new 10 nm "Ice Lake-SP" silicon, heralding the company's first CPU core IPC gain in the server space since 2015. The processors also introduce new I/O capabilities, such as PCI-Express 4.0.

Intel CEO Pat Gelsinger Announces "Intel Unleashed" Webcast on March 23rd

Recently appointed Intel CEO Pat Gelsinger has announced via Twitter that the company will be holding a webcast on March 23rd - likely in the toes of Rocket Lake's actual release, which is expected towards the end of the month. The webcast, titled "Intel Unleashed", seems to serve as the premier event with Pat Gelsinger firmly entrenched on Intel's reins, and should be a tour de force for Intel's strengths, planned execution on product development and release, and growth opportunities - and, if we're being honest, a frontal recognizance of Intel's current weaknesses. for now, the only information Pat Gelsinger put forwards is that this is a business update, and that "exciting things" are coming in 2021.

Pat Gelsinger Becomes CEO of Intel

Today marks Intel's official CEO transition as Pat Gelsinger becomes the company's eighth chief executive officer in its history. Gelsinger is an accomplished CEO and industry veteran with more than four decades of technology and leadership experience - including 30 years at Intel, where he began his career.

Gelsinger shared his thoughts on returning to lead the company, saying:
"As the incoming CEO, I am just really thrilled that we have the opportunity to take this great icon of a company, this company that has been crucial to every aspect of technology, and have it be that leader again into the future. Because I believe that Intel has a treasure trove of technologists, of technology, and ultimately its core DNA is being that technology leader for the future. I'm just thrilled as a technologist, as a geek at heart, to be able to be in that leadership role to help bring the passions, the history, the opportunity of this great company forward as never before. Our best days are in front of us."

Intel Appoints Sunil Shenoy as Senior Vice President of Design Engineering Group

Intel Corporation today announced the appointment of Sunil Shenoy as senior vice president and general manager of the Design Engineering Group, effective Feb. 1. Shenoy, a 33-year Intel veteran who departed in 2014, returns to the company to lead the critical work of design, development, validation and manufacturing of intellectual properties and system-on-chips (SOC) for client and data center applications. Shenoy will report to current CEO Bob Swan until Feb. 15, after which he will report to incoming CEO Pat Gelsinger.

"Sunil is a proven engineering leader who has deep experience in microprocessor and SoC design and R&D," said Swan. "His experience inside and outside of Intel will enable him to combine the best of Intel culture with an entrepreneurial spirit and fresh perspective as we work to strengthen the company's technical leadership team and to coach and develop a new generation of technical talent."

Intel Has Fixed its 7 nm Node, But Outsourcing is Still Going to Happen

Intel has today reported its Q4 2020 earnings disclosing full-year revenue with the current CEO Bob Swan, upcoming new CEO Pat Gelsinger, and Omar Ishrak, Chairman of Intel's board. During the call, company officials have talked about Intel's earnings and most importantly, addressing the current problems about the company's manufacturing part - semiconductor foundries. Incoming Intel CEO, Pat Gelsinger, has talked about the state of the 7 nm node, giving shareholders reassurance and a will to remain in such a position. He has made an argument that he has personally reviewed the progress of the "health and recovery of the 7 nm program."

The 7 nm node has been originally delayed by a full year amid the expectations, and as with the 10 nm node, we have believed that it is going to experience similar issues. However, the incoming CEO has reassured everyone that it is very much improving. The new 7 nm node is on track for 2023 delivery, when Intel is expected to compete with the 3 nm node of TSMC. Firstly, Intel will make a debut of the 7 nm node with client processors scheduled for 1H 2023 arrival, with data center models following that. The company leads have confirmed that Intel will stay true to its internal manufacturing, but have stressed that there will still be a need for some outsourcing to happen.

"Nehalem" Lead Architect Rejoins Intel to Work on New High-Performance Architecture

The original "Nehalem" CPU microarchitecture from 2008 was pivotal to Intel, as it laid the foundation for Intel's mainline server and client x86 processors for the following 12-odd years. Glenn Hinton, the lead architect behind "Nehalem," announced that he is rejoining Intel after 3 years of retirement, to work on a new high-performance CPU project. Hinton states that his decision to rejoin Intel out of his retirement was influenced by Pat Gelsinger joining the company as its new CEO. Jim Keller, a CPU architecture lead behind several commercially-successful architectures, recently left Intel after a brief stint leading an undisclosed CPU core project. Keller later took up the mantle of CEO at hardware start-up Tenstorrent.

Pat Gelsinger leading Intel is expected to have a big impact on its return to technological leadership in its core businesses, as highlighted in Gelsinger's recent comments on the need for Intel to be better than Apple (which he referred to as "that lifestyle company") at making CPUs, in reference to Apple's new M1 chip taking the ultraportable notebook industry by storm. The other front Intel faces stiff competition from, is AMD, which has achieved IPC parity with Intel, and is beating it on energy-efficiency, taking advantage of the 7 nm silicon fabrication process.

Pat Gelsinger: "Intel Has to be Better at Making CPUs Than That Lifestyle Company"

Intel's future CEO Pat Gelsinger, who supersedes current CEO Bob Swan come February 15th, has reportedly compared Intel with Apple's efforts, in wake of that company's decision to leave the Intel ecosystem in favor of in-house designed ARM CPUs. As Apple M1-powered devices hit reviewers' tables, the opinions mostly went one-sided in favor of Apple's decision, clamoring for that particular CPU design to be only lightly short of a computing miracle, considering the amount of computing power provided at that chip's TDP, and running circles around Apple's previous Intel implementations.

According to The Oregonian, a local newspaper from (you guessed it) Oregon where Intel has a strong branch presence, Intel held an all-hands meeting of its Oregon workforce, attended by future Intel CEO Pat Gelsinger, who is quoted as having remarked that "We [Intel] have to deliver better products to the PC ecosystem than any possible thing that a lifestyle company in Cupertino makes. We have to be that good, in the future." Considering how Apple's M1 has raised the world's attention to the ARM architecture as a competitor with strong enough arguments to face the x86 ecosystem (as if ARM powering the world's current fastest supercomputer wasn't a strong enough argument), that seems like a strong yet adequate statement. We'll see how Intel fares with its Alder lake CPUs, which essentially bring ARM's design philosophy of an heterogeneous CPU with both high-performance and high-efficiency cores to the x86 table.
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