In an interview with CNBC's TechCheck, Intel CEO Pat Gelsinger said he expected the chip shortage to continue to drag on, at least until 2024. Unfortunately he didn't go into too much detail as to why, beyond there being an equipment shortage, which in turn will slow down the speed at which new fabs can be put online. In other words, Intel is pointing fingers at ASML and other companies that manufacture the various types of equipment that is needed to manufacture semiconductors.

Intel is the first company to have publicly said that the semiconductor shortage will continue longer than initially expected, where most companies expected things to ease off towards the end of this year, or at least sometime in 2023. The shortage isn't likely to affect Intel when it comes to products the company manufactures in-house, but if the shortage continues into the foreseeable future, it might have a bigger knock-on effect when it comes to the wide ecosystem that Intel is reliant on, such as motherboards. The other concern is obviously Intel's products that are being manufactured by TSMC, where the company is likely to see increased competition when it comes to getting access to enough capacity at certain production nodes.

At the end of 2021, there was quite a lot of noise when it came to India's homegrown semiconductor fab initiative, where the nation was trying to win over Intel, as well as some other semiconductor manufacturers. It would appear that the Indian government has stepped up its efforts and is now actively pitching to Intel, GlobalFoundries and TSMC. The main person behind this is said to be Rajeev Chandrasekhar, the minister of state for technology and entrepreneurship and a former Intel engineer. So far it seems like Chandrasekhar hasn't gotten very far according to the article The Economic Times, where he states that "We're meeting the CEOs, talking to them, making presentations."

On the other hand, recent news has suggested that Foxconn is interested in setting up some kind of foundry in India, in a partnership with local Vedanta Group. It's unclear what kind of semiconductors this would be for though, especially as Vedanta is mostly in the mining industry. The various Indian states are said to be very keen on the other hand, both in terms of getting new industry, but also in getting new investments. Earlier this month, during his tour of several Asian countries, Intel's CEO, Pat Gelsinger had a meeting with the Indian Prime Minister, Narendra Modi, but what came of that meeting is unclear. India is hoping to be able to reproduce the success it has had when it comes to manufacturing smartphones locally, with Samsung, Nokia and Xiaomi producing locally, as well as Taiwanese Foxconn, Wistron and Pegatron, who contract manufacture Apple devices. However, semiconductors are far more complex to make than smartphones, so if India isn't willing to play the long game, it's unlikely much will come of its attempts to attract semiconductor foundries.

Industry reports and sources in the financial community have placed Apple and Intel as the two premier customers for TSMC's upcoming N2 node. N2, which is expected to enter volume production by the end of 2025, will be TSMC's first manufacturing process making use of GAAFET (Gate-All-Around Field-Effect Transistor) design. If there are no significant market upheavals or unexpected snags in technology transition, TSMC will be late to the GAAFET party, following Samsung's 3GAE node in 2023 and Intel's first Angstrom-era process, Intel 20A, in 2024.

While Apple's uptake on TSMC's latest manufacturing technology is practically a given at this point, the fact that Intel too is taking up TSMC's N2 node showcases the company's evolved business tactics after the introduction of its IDM 2.0 strategy (IDM standing for Integrated Device Manufacturer, meaning Intel too will fabricate chips according to clients' specs). While pre-Pat Gelsinger was seemingly scared of touching any other foundries' products - mostly from the fact that Intel does have its own significant manufacturing capabilities and R&D, after all - the new Intel is clearly more at peace with driving its competitor's revenues.

After months of rumors and speculations, it looks like we are finally going to receive official information from Intel regarding the exact country the company plans to do semiconductor R&D and manufacturing in within Europe. Today, the company published its media alert post, showing that we are finally going to receive exact information tomorrow. As we have previously reported, the current round of suggestions led to Intel building a fab inside Germany; however, it still remains to be confirmed. Once the information is out, we are going to report on it and finally see where team blue is headed next. You can find the announcement below.

As part of its IDM 2.0 strategy, Intel is committed to investing in research and development (R&D) capabilities and manufacturing capacity to meet the surging demand for advanced semiconductors and to build a more resilient, globally balanced supply chain.

Join a webcast with CEO Pat Gelsinger where he will share details of Intel's latest plans for in semiconductor R&D and manufacturing in Europe.

When: 6 a.m. PDT (2 p.m. CET), Tuesday, March 15
Where: Watch live on the Intel Newsroom.
Event Replay: A video replay will be available on the Intel Newsroom following the webcast.

Intel Corporation today announced that Christoph Schell has been appointed executive vice president and chief commercial officer to lead the Sales, Marketing and Communications Group (SMG), starting March 14. Schell will succeed Michelle Johnston Holthaus, who will take on a new role as general manager of Intel's Client Computing Group (CCG).

"Christoph has an exceptional track record of driving innovative and disruptive go-to-market strategies around the globe. He brings expertise in understanding business segments, verticals and the solutions and services customers want," said Pat Gelsinger, Intel CEO. "We are harnessing our core strengths as an advantage to grow in our traditional markets and accelerate our entry into new ones. I'm confident Christoph is the right leader to take on this critical role and guide the talented SMG organization to achieve our growing ambitions."

Schell joins Intel from HP Inc., where he was most recently chief commercial officer. With his go-to-market team, he led customer and partner success, category management and customer support globally. During his 25 years with the company, Schell held various senior management roles across the globe, including president of 3D Printing & Digital Manufacturing. Prior to rejoining HP in 2014, Schell served as executive vice president of Growth Markets for Philips, where he led the lighting business across Asia Pacific, Japan, Africa, Russia, India, Central Asia and the Middle East. He started his career in his family's distribution and industrial solutions company and worked in brand management at Procter & Gamble.

Intel on Thursday (17/02/2022), hosted its 2022 Investor Meeting and outlined key elements of the company's strategy and path to long-term growth during an era of unprecedented demand for semiconductors. The event included a series of announcements at both a corporate and individual business unit level, including more details of the company's Smart Capital strategy, product roadmaps across its new reporting segments and key execution milestones.

"The continued proliferation of technology is driving sustained, long-term demand for semiconductors, creating a $1 trillion market opportunity by 2030," said Pat Gelsinger, Intel chief executive officer. "With that opportunity in mind, today we outlined our strategy and roadmap for accelerating to 10%-12% year-over-year revenue growth by 2026 by doubling down on innovation, driving even deeper collaboration with our customers and partners, and leveraging our core strengths to successfully grow traditional markets and disrupt new ones. Our goals are ambitious, but I'm confident we have the right strategy and right team to achieve them and to deliver long-term value for our shareholders."

At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Intel Corporation today reported fourth-quarter and full-year 2021 financial results. The company also announced that its board of directors approved a cash dividend increase of five percent to $1.46 per share on an annual basis. The board declared a quarterly dividend of $0.365 per share on the company's common stock, which will be payable on March 1 to shareholders of record as of February 7.

"Q4 represented a great finish to a great year. We exceeded top-line quarterly guidance by over $1 billion and delivered the best quarterly and full-year revenue in the company's history," said Pat Gelsinger, Intel CEO. "Our disciplined focus on execution across technology development, manufacturing, and our traditional and emerging businesses is reflected in our results. We remain committed to driving long-term, sustainable growth as we relentlessly execute our IDM 2.0 strategy."

Rather unusually, Intel announced its latest chip fab plans not via a press release, but via an exclusive article in TIME magazine. It seems like an unusual strategy, as these kinds of things are normally not announced in this kind of fashion, especially as TIME doesn't exactly have close ties with Intel, nor the semiconductor industry as a whole, but maybe this is Intel's new way of trying to change the image of the company. Either which way, Intel is apparently planning on building no less than two fabs on the 1,000 acre (~4 square kilometer) site in New Albany, Ohio, which should be the workplace of some 3,000 people once it stands ready in 2025.

The article quotes Pat Gelsinger saying "Our expectation is that this becomes the largest silicon manufacturing location on the planet," as Intel has the option to double the land for its new fab site and apparently has plans for as many as eight fabs at the location. Additional fabs obviously depends on demand and crucially if Intel manages to full off its contract foundry business, since without it, it seems unlikely that Intel is going to need the additional six fabs in the foreseeable future, especially as Intel is in the final stages of finishing its new fab in Ireland, while also planning to announce a location for yet another fab somewhere in Europe and let's not forget Arizona. The TIME article goes into a lot more details as to what the new fabs mean for Ohio, but doesn't go into much more detail about Intel's plans for its future fabs there.

Update: Official press release below.

Pat Gelsinger is planning a trip to Asia next week, where he'll stop over in Taiwan and Malaysia according to Bloomberg. There he's apparently planning to hold talks that show that manufacturing in Asia is a key part to his efforts of turning Intel's fortunes around. It's said that he'll also be meeting with TSMC.

This will be Gelsinger's first trip to Asia as Intel's CEO, largely due to the pandemic, although outside of meeting with TSMC, his schedule wasn't further mentioned, but it's likely he will be meeting with key partners and suppliers. Intel does some of its chip packaging in Malaysia, on the island of Penang to be more specific, where plants have been temporarily closed due to the pandemic, which in turn has hurt supply for the tech companies located there.

Not content with his speech at Fortune Brainstorm Tech conference—Intel's CEO—Pat Gelsinger has now written an opinion piece on CNN where he's telling the US congress that it must pass the CHIPS for America Act. It's quite bold for a CEO of any company to make such demands, least not for one that has been less than a year in the position.

The CHIPS Act involves US$52 billion earmarked for chip makers who are willing to produce chips on US soil, although as we already know, Gelsinger wants the bulk of that to go to US companies. To try and win over the House, his opinion piece on CNN is trying to win over the hearts and minds of the US senators by pitching all the positive things that will happen if Intel gets more money than its competitors.

With the full support of Intel's board of directors, Intel today announced its intention to take Mobileye public in the United States in mid-2022 via an initial public offering (IPO) of newly issued Mobileye stock. The move will unlock the value of Mobileye for Intel shareholders by creating a separate publicly traded company and will build on Mobileye's successful track record and serve its expanded market.

Intel will remain the majority owner of Mobileye, and the two companies will continue as strategic partners, collaborating on projects as they pursue the growth of computing in the automotive sector. The share of semiconductors is expected to be 20% of a premium vehicle's total bill-of-materials (BOM) by 20301. The Mobileye executive team will remain, with Prof. Amnon Shashua continuing as the company's CEO. Recently acquired Moovit as well as Intel teams working on lidar and radar development and other Mobileye projects will be aligned as part of Mobileye.

Intel is reportedly in talks with TSMC to secure foundry allocation to meet its product roadmap execution. The company is sending an executive delegation to meet with TSMC later this month, to secure foundry capacity for the N3 (3 nm) silicon fabrication node, and ensure that Intel's allocation isn't affected by other customers such as Apple. As part of its IDM 2.0 strategy, Intel has decided to build its products essentially as multi-chip modules with each block of IP built on a silicon fabrication node most optimal to it, so the company maximizes cutting-edge foundry nodes only on the technology that benefits from it the most. N3 will play a vital role with logic/compute tiles in products bound for 2023, as N3 hits critical volume in the first half of the year.

In related news, Intel CEO Pat Gelsinger speaking at the Fortune Brainstorm Tech conference, stressed on the importance for American chip designers to seek out semiconductor manufacturing in America, and cautioned against investing in Taiwan (without naming TSMC). This comes in the wake of geopolitical uncertainty in the region. In response to this statement issued to DigiTimes, TSMC CEO Mark Liu downplayed the matter, and said that Gelsinger's statement wasn't worth responding to, and that he doesn't slander industry colleagues. TSMC and Samsung have each announced multi-billion Dollar foundry investments in the US, in attempts to make the global semiconductor supply chains resilient to any security situation that may emerge in East Asia.

Since Intel CEO Pat Gelsinger joined the company earlier this year, the messaging language from Intel has changed radically, as it has become a no-nonsense message of Intel going back to its roots as a leading foundry and a leading chip maker. However, Gelsinger might've overstepped a little bit as of lately, as during a conference in California, he went on record saying that Intel deserves special treatment by the US government, in favor of some of its competitors.

At the same time, it's not hard to see why Intel thinks the US government should favor it and other US companies like Micron and Texas Instruments, over Samsung and TSMC. However, Intel's selling argument here is that investing in non-US companies means that the R&D money and IP ends up abroad, which isn't entirely true when it comes to foundries. Gelsinger also complained about the fact that Samsung and TSMC was getting large government subsidies in their home countries and claimed that because of those subsidies, Intel was competing with Korea and Taiwan, rather than with Samsung and TSMC.

Today, Intel celebrates the 50th anniversary of the Intel 4004, the world's first commercially available microprocessor. With its launch in November 1971, the 4004 paved the path for modern microprocessor computing - the "brains" that make possible nearly every modern technology, from the cloud to the edge. Microprocessors enable the convergence of the technology superpowers - ubiquitous computing, pervasive connectivity, cloud-to-edge infrastructure and artificial intelligence - and create a pace of innovation that is moving faster today than ever.

This year marks the 50th anniversary of the 4004 chip. Think of how much we've accomplished in the past half-century. This is a sacred moment for technology. This is what made computing really take off!," said Pat Gelsinger, Intel CEO. The 4004 is the pioneer microprocessor, and its success proved that it was possible to build complex integrated circuits and fit them on a chip the size of a fingernail. Its invention also established a new random logic design methodology, one that subsequent generations of microprocessors would be built upon, before evolving to create the chips found in today's modern devices.

Intel's Aurora supercomputer is a $500 million contract with the US Department of Energy to deliver an exascale supercomputer for Argonne National Laboratory. The project aims to build a machine capable of cranking over one ExaFLOP of computing at sustained workloads. The supercomputer aims to reach two ExaFLOPs of computing power once the installation system is completed and powered. The contract bound Intel to create accelerators that are powerful enough to achieve this magical number. However, they left Intel with room to do a little bit extra. With Ponte Vecchio GPU behind the project, it seems like the GPU is performing better than expected.

According to Intel's CEO, Pat Gelsinger, the system will reach over 2 ExaFLOPs at peak and a bit below in sustained workloads. As per preliminary calculations done by The Next Platform, the system's estimations point towards 2.43 ExaFLOPs peak and around 1.7 ExaFLOPs in sustained workloads at Double-precision floating-point format math, aka FP64. The system will utilize Intel Xeon Sapphire Rapids processors with HBM memory and the powerful Ponte Vecchio GPU with 47 tiles and over 100 billion transistors.

Intel Corporation today reported third-quarter 2021 financial results. "Q3 shone an even greater spotlight on the global demand for semiconductors, where Intel has the unique breadth and scale to lead. Our focus on execution continued as we started delivering on our IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and unveiled our most dramatic architectural innovations in a decade. We also announced major customer wins across every part of our business," said Pat Gelsinger, Intel CEO. "We are still in the early stages of our journey, but I see the enormous opportunity ahead, and I couldn't be prouder of the progress we are making towards that opportunity."

In the third quarter, the company generated $9.9 billion in cash from operations and paid dividends of $1.4 billion. Intel CFO George Davis announced plans to retire from Intel in May 2022. He will continue to serve in his current role while Intel conducts a search for a new CFO and until his successor is appointed. Third-quarter revenue was led by strong recovery in the Enterprise portion of DCG and in IOTG, which saw higher demand amid recovery from the economic impacts of COVID-19. The Client Computing Group (CCG) was down due to lower notebook volumes due to industry-wide component shortages, and on lower adjacent revenue, partially offset by higher average selling prices (ASPs) and strength in desktop.

It's funny how new company CEOs always seem to blame their predecessors for whatever went wrong and it seems like Pat Gelsinger is no different, as he's throwing shade at his predecessors for not having been engineers. At the same time, he's set his mind on winning Apple back as a customer, as all Intel apparently has to do "is create a better chip than they can do themselves", with they being Apple here.

It should be pointed out that Intel hasn't had an engineer at the helm of the company since 2005, so the question is how far back Pat Gelsinger wants to throw the blame, although a guesstimate would be back to at least 2012/2013 when Paul Otellini stepped down. That said, in an interview with Axios, it's stated that "while he acknowledges the need to prove himself, Gelsinger said he will rebuild the company's credibility with its customers so that if they say they need a million of some chip by Monday, the order will be there by Sunday night."

In an interview with the BBC, Intel CEO Pat Gelsinger said that the company is no longer considering the UK as a site for a chip fab, due to Brexit, something the company had apparently done prior to Brexit. Now the company is looking for a location in another EU country for a US$95 billion investment for a new semiconductor plant, as well as upgrades to its current plants in Ireland.

Although Intel had not made any firm decisions on a site location prior to Brexit, Gelsinger is quoted as saying "I have no idea whether we would have had a superior site from the UK, but we now have about 70 proposals for sites across Europe from maybe 10 different countries." He continues "We're hopeful that we'll get to agreement on a site, as well as support from the EU... before the end of this year."

Intel CEO Pat Gelsinger predicts that chips and semiconductors will make up as much of the car's bill-of-materials (BOM) as the engine (or main propulsion) itself. This change will happen as early as in 2030, said Gelsinger, speaking at a keynote address, at the IAA Mobility 2021 show in Munich. Gelsinger's prediction is backed by internal research conducted by Roland Berger, and McKinsey.

As of 2019, chips barely made 4% of a vehicle's BOM, confining mainly to the ECU and an optional infotainment system. By 2030, electronics will take over a more complex set of roles, including full automation, and AI that can drive anywhere. A fully automated vehicle, or AV, will be next big thing in personal transport. Gelsinger predicts a $115 billion TAM (total addressable market) size for automobile semiconductors by the end of the decade.

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

For most people, a tool is something you hold in your hand: pliers, hammer, screwdriver. Inside an Intel chip factory, a tool is a whole different deal. Fab tools are huge and hugely costly and take entire teams to muscle into place and install. As Intel aggressively ramps its worldwide manufacturing footprint, a construction milestone recently passed at Intel's Ronler Acres factory in Hillsboro, Oregon.

At the company's massive $3 billion Mod3 factory expansion, the first tool rolled in. The honor went to a thin film deposition tool. It arrived not in a leather tool belt, but aboard two semitractor-trailers. Once completed and hooked up, it will weigh 10 tons. And by the time the Mod3 project is done in about six months, the thin film deposition tool will be joined by more than a dozen like it. A typical Intel fab, once built out, is stuffed with about 1,200 chipmaking tools, many of them costing millions of dollars apiece.

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel has recently confirmed during a recent earnings call that it is now manufacturing more 10 nm wafers than 14 nm wafers as part of its IDM 2.0 plan. This news comes four years after Intel first started shipping 10 nm products to customers however the production capacity did not exist to launch any mainstream desktop processors. Intel launched a few low-power mobile Ice Lake processors in 2019 but their 2021 flagship 11th Generation Rocket lake processors remained on 14 nm. This looks set to change as Intel highlights reduced production costs and prepares to launch 10 nm 12th Generation Alder Lake processors in Q4 2021. Intel will offer more details on their future manufacturing plans during their upcoming Intel Accelerated event.

Intel CEOUnder IDM 2.0, our factory network continues to deliver and we are now manufacturing more 10-nanometer wafers than 14-nanometer. As 10-nanometer volumes ramp, economics are improving with 10-nanometer wafer cost 45% lower year-over-year with more to come.

Intel Corporation today reported second-quarter 2021 financial results. "There's never been a more exciting time to be in the semiconductor industry. The digitization of everything continues to accelerate, creating a vast growth opportunity for us and our customers across core and emerging business areas. With our scale and renewed focus on both innovation and execution, we are uniquely positioned to capitalize on this opportunity, which I believe is merely the beginning of what will be a decade of sustained growth across the industry," said Pat Gelsinger, Intel CEO. "Our second-quarter results show that our momentum is building, our execution is improving, and customers continue to choose us for leadership products."