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Micron Announces Availability of Phase Change Memory for Mobile Devices

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

SK Hynix and IBM Sign Joint Development for PCRAM

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or ‘PCRAM’) technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM’s expertise in such disciplines with SK Hynix’s cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

Gigabyte Shows Off 3D Power Technology for Upcoming Motherboards

Last week we got a glimpse of Gigabyte's new 3D BIOS technology, a UEFI setup program with an innovative and functional user interface built into Gigabyte's upcoming X79 motherboards. Today Gigabyte released a new video detailing another such innovation, called 3D Power. This program gives you total and unrestricted control over the three main dimensions of your motherboard's power delivery: voltages, PWM frequency, and phase control. Gigabyte announced that all its upcoming X79 motherboards will feature PWM (pulse width modulation) CPU power design, backed by highly capable PWM controllers that give you a plethora of things you can tweak.

To begin with, the 3D Power application starts up with a cube that has the icons of the three main elements. Clicking on "voltage" gives you control over voltage-related settings in three main pages, turbo voltage response, load line calibration (active V-droop control), and active over-voltage protection. Load line calibration allows you to fine-tune the extant of V-droop correction over a variety of power domains, such as CPU, VTT, IMC, and DRAM.

Thermaltake Provides Phase Change Cooling for AMD Graphics Cards

Thermaltake today announced an initiative with AMD to redesign the revolutionary Xpressar micro refrigeration cooling system for use with ATI Radeon HD 4000 series graphics cards. First introduced in a specialized case designed to achieve CPU temperatures much lower than standard liquid cooling systems, the Xpressar technology will be modified for use as a graphics cooling solution. When commercially available, the Xpressar graphics solution could reduce graphics processor temperatures by as much as 20°C when compared to common liquid cooling products.

The Thermaltake Xpressar micro refrigeration cooling system utilizes a miniature version of the compressor cooling module commonly used in refrigerators and air conditioners. To streamline installation, the graphics cooling module will utilize a compact design, occupying only the drive bay area in the computer.

Asetek signs research agreement with Professor Massoud Kaviany

Broenderslev, Denmark, June 21 2007 – Asetek, the market leader of thermal management solutions for semiconductors, announced today that they have signed a research agreement with Professor, Ph.D. Massoud Kaviany from University of Michigan.

CPU and GPU capabilities improve by continuously growing the number of transistors in the core, by increasing the clock frequency, and by implementing more CPU cores into multicore processors. This results in higher power consumption which makes thermal management much more challenging. However, there is another factor which is becoming more critical than power consumption; hotspots. Hotspots can generate a very high heatflux and therefore impose tremendous demands on the effectiveness of the CPU and GPU cooler.

To meet this challenge Asetek will work in cooperation with Professor Massoud Kaviany to develop advanced single and two phase cooling solutions. These solutions will have the ability to handle the highly localized and extreme heatfluxes in the future CPU and GPU systems.

“It is an exciting time at Asetek, and we are really pleased to have partnered with Professor Massoud Kaviany on the development of these new cooling solutions,” says Christian Christiansen, VP of Engineering at Asetek. Christian Terp, Thermodynamics Specialist at Asetek, goes on to say, “Professor Kaviany’s knowledge and expertise in two phase cooling and porous media technologies is extremely impressive and we are looking forward to the product innovation that will come from his contributions.”
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