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ADATA TRUSTA Showcases AI Scaler Extended Memory, TD7P51 ECO Gen 5 SSD and R-DIMM at AI Infra Summit 2026

TRUSTA, the enterprise storage and memory brand of memory leader ADATA, is showcasing its latest AI Scaler Extended Memory solution at AI Infra Summit 2026, one of North America's leading AI infrastructure events, bringing together approximately 8,000 professionals and 250 industry partners across the AI infrastructure ecosystem.

As increasingly complex AI models place greater demands on GPU memory and drive up infrastructure costs, TRUSTA is highlighting its award-winning AI Scaler Extended Memory Solution under the theme "Scale AI Beyond GPU Limits." The integrated hardware-software architecture enables enterprises to deploy on-premises AI with greater scalability and cost efficiency. TRUSTA is also presenting its TD7P51 ECO PCIe Gen 5 enterprise SSD and DDR5 R-DIMM, demonstrating a comprehensive portfolio built for next-generation AI infrastructure.

TRUSTA Showcases Its Full Enterprise Storage and Memory Solutions at CES 2026

TRUSTA, the enterprise storage brand launched by ADATA this year, showcased its full portfolio of products and solutions at CES 2026. Leading the line is the T7P5 PCIe Gen 5 x4 SSD series, in U.2, E3.5 and E1.5 form factors, offering storage capacities of 1.92 TB, 3.84 TB and 7.68 TB. The series uses 3D eTLC NAND memory and offers read speeds of up to 13,500 MB/s and write speeds of up to 10,400 MB/s, with 4K random IOPS of 3,200 K read / 470 K write.

TRUSTA also showcased solutions using SATA III and PCIe Gen 4 x4 interfaces. The TD5S30 series features 2.5" SATA III SSDs with maximum read/write speeds of 530 / 510 MB/s, 4 K random IOPS of 80 K / 50 K, and capacities of 400 GB, 960 GB, 1.92 TB, 3.84 TB, and 7.68 TB. The TB3S30 series also uses SATA III, this time in M.2 format, with storage capacities from 120 GB to 1.92 TB, read/write speeds of 560 / 490 MB/s, and 4 K random IOPS of 80 K / 70 K.

Intel "Granite Rapids-WS" Workstation Xeon SKUs Appear With Up to 336 MB of Cache

Intel is gearing up for a return to the high-end desktop (HEDT) workstation market with the launch of the "Granite Rapids-WS" Xeon processors. A well-known hardware leaker, @momomo_us, has provided a list of potential SKUs, detailing their L3 cache capacities and clock speeds. At the top of this preliminary list is a SKU labeled as the "698X," featuring 336 MB of L3 cache and a clock speed of 2.0 GHz across all cores. The lower clock speed combined with naming conventions suggesting it's a top end SKU tier suggests this should be a higher-core SKU, though this is yet to be confirmed. The Granite Rapids-WS design is based on Intel's XCC server compute dies, incorporating two compute tiles that deliver up to 86 cores with two I/O tiles for connectivity, such as PCIe and memory controllers. To exceed 86 cores, Intel would likely need to adopt the larger UCC die and a bigger package.

The specifics of memory support for the workstation SKU are still uncertain. However, the server XCC family supports DDR5-6400 and can achieve higher effective speeds with MR-DIMMs. For workstations, Intel is likely to opt for an eight-channel memory configuration to balance capacity and board complexity, although a 12-channel memory setup is also possible. The Granite Rapids-WS processors are derived from Intel's server XCC dies, allowing for a quicker path to higher core counts in workstations. These "Granite Rapids" server dies are modified with a new socket and package to suit the specific needs of workstations. Intel manufactures the I/O die for Granite Rapids on the Intel 7 node, while the compute tiles are produced using Intel 3.

ADATA INDUSTRIAL Debuts at Embedded World North America 2025

ADATA INDUSTRIAL, a global leader in industrial-grade embedded memory, will make its first appearance at Embedded World North America 2025 (Booth #7060), showcasing the theme "Driving the Infinity of AI." This strategic expansion into the U.S. market underscores ADATA INDUSTRIAL's commitment to empowering intelligent transformation across vertical markets with high-performance PCIe Gen 5 SSDs, DDR5 DRAM modules, intelligent software, and enterprise-grade storage solutions under ADATA's enterprise brand, TRUSTA. Together, these innovations form a complete edge-to-cloud storage ecosystem for AI, automation, and other high-demand industrial applications.

Cutting-Edge Hardware & Intelligent Management Platform
To meet the extreme demands for data processing speed and system stability in next-generation AI applications, ADATA INDUSTRIAL will showcase a range of advanced products:
  • Industrial-grade SSDs: Supporting the latest PCIe Gen 5 interface in U.2 form factors and leveraging advanced eTLC and BiCS8 3D NAND flash, these SSDs deliver outstanding bandwidth and endurance—ideal for high-speed data logging and real-time analytics.
  • Industrial-grade DDR5 Memory Modules: Featuring robust technologies such as Clock Drivers (CKD), Power Management ICs (PMIC), and On-Die ECC, these modules ensure signal integrity and data accuracy even in complex electromagnetic environments and prolonged operation, providing a stable computing backbone for edge servers and AI accelerators.

Intel "Granite Rapids-WS" Appears with 86 Cores and 172 Threads Built for HEDT

According to listing on OpenBenchmark.org, spotted by @momomo_us on X, appears to show a "Granite Rapids-WS" engineering sample running with 86 cores and 172 threads. The entry lists peak core speeds near 4.8 GHz, which likely reflects a turboboost on a few cores rather than a sustained all-core clock. Several important fields are empty in the submission, including power figures and other platform metrics, so the entry should be viewed as an early leak rather than a finished specification. The Granite Rapids-WS is a design built from Intel's XCC server compute dies, featuring two compute tiles that deliver 86 cores and two I/O tiles that handle connectivity, including PCIe and memory controllers. To go beyond 86, Intel would probably need to move to the larger UCC die and a bigger package.

Memory support for a workstation SKU remains unclear, although the server XCC family supports DDR5-6400 and can achieve higher effective speeds with MR-DIMMs. For a workstation, Intel is likely to choose an eight-channel memory configuration to balance capacity and board complexity. Thermal envelope and base clock frequencies are not reported, leaving questions about cooling and real-world expectations unanswered. If the entry is accurate, a Granite Rapids-WS part built from a server die could give Intel a quicker path to higher core counts for workstations. Intel has recently promoted Arrow Lake as a workstation option, while professional users have been left with a choice of an older workstation platform or AMD Threadripper, as Intel has recently scaled back its involvement in HEDT. For professionals and OEMs, the decisive factors will be validated core counts, power efficiency, memory and I/O capabilities, and how well software scales on the new hardware.

ADATA Trusta Highlights SSD Power Efficiency for AI Servers at OCP APAC 2025

TRUSTA, the enterprise storage brand of memory leader ADATA, announced its first-ever participation in the Open Compute Project APAC Summit, the annual technical conference for the open compute industry in Asia-Pacific region, debuts in Taiwan this year, gathering industry leaders to focus on innovations in data centers and AI infrastructure. In collaboration with FADU, a leading enterprise SSD controller brand, TRUSTA is showcasing their latest technological achievements, presenting a key solution for the sustainable development of data centers in the AI era.

TRUSTA Emphasizes SSD Power Efficiency Amid AI Boom and Corporate Sustainability Challenges
With the explosion of AI applications, data centers are facing unprecedented storage pressure. Since 2012, the computing power required for large language models has grown 4.7 times annually. Industry forecasts indicate that by 2030, the data volume for AI inference will surpass that of training data by 3.8 times, with energy consumption demand reaching 1.65 times that of 2023. At the same time, generative AI is accelerating the widespread adoption of synthetic data to surpass real-world data. The resulting data explosion—combined with the 24/7 operation of modern data centers—is intensifying the conflict between technological innovation, energy demand, and carbon emissions.

G.Skill Announces T5 Neo Series DDR5-6400 CL38 512GB (64GBx8) Overclocked R-DIMM Memory Kit

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the release of its latest high-performance T5 Neo series DDR5-6400 CL38 512 GB (64 GB x8) overclocked DDR5 R-DIMM memory solution. Specifically engineered for AMD Ryzen Threadripper PRO series processors and compatible AMD WRX90 chipset motherboards, this T5 Neo DDR5 R-DIMM memory kit leverages AMD EXPO memory overclocking technology and a high-quality 16-layer PCB design to deliver exceptional speed, high kit capacity, and reliability for professional workstations.

With a total kit capacity of 512 GB across eight 64 GB modules, the T5 Neo series memory kit is built to meet the demands of intensive workloads. From AI model training, large-scale data analytics, memory-intensive simulations, professional applications, and high-resolution content creation, this high-capacity memory configuration enables professionals to work with significantly larger datasets, making it the ideal choice for next-generation workstations that require both exceptional bandwidth and expansive capacity to accelerate productivity. Please refer to the screenshots below for Memtest validation on the ASUS Pro WS WRX90E-SAGE SE motherboard with AMD Ryzen Threadripper PRO 9945WX processor.

G.SKILL Unveils Enhanced DDR5 R-DIMM with 16-Layer PCB and Voltage Protection

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the introduction of an enhanced revision of DDR5 R-DIMM memory to the market. Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage suppression (TVS) diodes and a fuse for voltage protection. Designed for enterprise servers and professional workstations, the new DDR5 R-DIMM memory brings cutting-edge advancements to performance and protection.

Improved Signal Integrity with 16-Layer PCB
These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs. The increase in the PCB layer count improves signal integrity for better reliability and stability in data transmission, even under high-performance or overclocked workloads - making it an ideal DDR5 R-DIMM memory choice for high-performance computing applications on servers or workstations.

ADATA Reveals a New Perspective on the AI Era at CES 2025

The world's leading memory module and flash memory brand, ADATA Technology, will be participating in CES 2025 with its gaming brand XPG and industrial-grade embedded storage brand ADATA Industrial. ADATA will be bringing its theme of "Innovate for a Better Tomorrow" to the Venetian in Las Vegas, located at booth Titian #2204 from January 7th to 10th. An online exhibition will be launched during this period for consumers around the world to experience a full range of innovative products in real time.

This year, ADATA will present three exhibition zones, each with an overarching theme. The "Artificial Intelligence Computing Solutions Zone" will showcase XPG AICORE DDR5 R-DIMM overclocked memory and XPG LANCER CUDIMM RGB DDR5 gaming memory. Additional products in this zone include the XPG DEFENDER SFF small form factor commercial chassis and XPG EDGECORE TFX power supply, which are designed to meet the needs of edge computing systems and demonstrate ADATA's comprehensive investment in the evolution of the AI era. The "Innovative Technology and Smart Mobile Lifestyle Zone" will see the launch of multiple Gen 5 SSD cooling solutions and highlight the world's first eco-friendly XPG LANCER NEON RGB DDR5 gaming memory with PCB heat dissipating coating, creating a new benchmark for cooling and efficient data transfer in the high-speed storage industry. The "Xtreme Performance Gear Zone" will showcase highly efficient gaming systems, top-notch power supplies, and cooling solutions, taking gaming applications to a new level. Each exhibit combines innovative technologies and high-performance products, and consumers around the world can join online for a one of a kind experience!

Fujitsu Previews Monaka: 144-Core Arm CPU Made with Chiplets

Fujitsu has previewed its next-generation Monaka processor, a 144-core powerhouse for data center. Satoshi Matsuoka of the RIKEN Center for Computational Science showcased the mechanical sample on social media platform X. The Monaka processor is developed in collaboration with Broadcom and employs an innovative 3.5D eXtreme Dimension System-in-Package architecture featuring four 36-core chiplets manufactured using TSMC's N2 process. These chiplets are stacked face-to-face with SRAM tiles through hybrid copper bonding, utilizing TSMC's N5 process for the cache layer. A distinguishing feature of the Monaka design is its approach to memory architecture. Rather than incorporating HBM, Fujitsu has opted for pure cache dies below compute logic in combination with DDR5 DRAM compatibility, potentially leveraging advanced modules like MR-DIMM and MCR-DIMM.

The processor's I/O die supports cutting-edge interfaces, including DDR5 memory, PCIe 6.0, and CXL 3.0 for seamless integration with modern data center infrastructure. Security in the design is taken care of with the implementation of Armv9-A's Confidential Computing Architecture for enhanced workload isolation. Fujitsu has set ambitious goals for the Monaka processor. The company aims to achieve twice the energy efficiency of current x86 processors by 2027 while maintaining air cooling capabilities. The processor aims to do AI and HPC with the Arm SVE 2 support, which enables vector lengths up to 2048 bits. Scheduled for release during Fujitsu's fiscal year 2027 (April 2026 to March 2027), the Monaka processor is shaping up as a competitor to AMD's EPYC and Intel's Xeon processors.

ADATA XPG Debuts First AICORE DDR5 Overclocked R-DIMM for High-end Workstations

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.
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