AZZA, a leading brand of computer cases and accessories, introduces the futuristic high-end OPUS 809. The luxury tower has a minimal footprint of 32 cm² yet capable of supporting full-ATX tower hardware. Flanked by 4 darkly tinted tempered glass panels and built on a 4 mm thick CNC milled aluminium frame, the OPUS ensures a unique PC look standing vertical or horizontal, and with its semi-open design, ensures adequate airflow to high-end components up to 360 mm long triple slot GPU, 360 AIO, ATX motherboard and PSU, and dual storage drives.

Mixing precision and style, the anodized and sandblasted 4 mm CNC milled aluminium frame of the OPUS with sharp angles and "X" shape gives the case a futuristic design. Surrounded by 4 tinted tempered glass panels, the OPUS ensures the PC remains elegant no matter which side is exposed. The unique shape and sturdiness of the case allows it to be placed in two orientations, vertically for a minimal 32 x 32 cm footprint, or horizontally, changing the look of the PC entirely.

Delivering on the promise of SSDs that address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced production-ready availability of its 9.5 mm XD6 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S data center class SSDs. Introduced in late 2020, KIOXIA XD6 drives were the first EDSFF E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) NVMe Cloud SSD Specification. XD6 series also supports popular E1.S 15 mm and 25 mm form factor options, providing the flexibility to select the right balance of cooling through different E1.S heatsink options.

Representing the latest innovation in flash storage for servers in cloud and hyperscale data centers, KIOXIA EDSFF E1.S SSDs are designed to optimize system density, efficiency and management. As defined by the EDSFF consortium and leveraging the OCP NVMe Cloud SSD Specification, the small form factor E1.S replaces the M.2 form factor and delivers greater density, performance, reliability, and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.

Cooler Master today launches the NR200P MAX, the first iteration of its new MAX line of building platforms. The NR200P MAX's extraordinarily optimized ecosystem provides small form factor enthusiasts a fail-proof jump start on their builds through fine-tuned components and thoughtful design. MAX products serve as a physical culmination of Cooler Master's years of mechanical, thermal, and power delivery expertise, aiming to break industrial limits and perfect technological achievements. Case, thermal and power solutions come pre-customized with never seen before product features, calibrated to work together in exquisite harmony.

Editors Note: You can find our review for the Cooler Master NR200P MAX here.

[Editor's note: We have published the review of HYTE Revolt 3 Case here.]

HYTE, the new PC components and lifestyle brand of iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today released its premier product, the Revolt 3 Mini-ITX PC case. Previously announced during CES 2021 as the Revolt 3 MK3, the Revolt 3 was designed with careful consideration for DIY PC enthusiasts, gamers, and creators alike.

"iBUYPOWER is excited to introduce its new sub-brand, HYTE, to our community with its very first product, the Revolt 3" said Darren Su, Executive Vice President of iBUYPOWER. "With over 20 years of experience as a systems integrator we felt like we had a unique perspective to bring to the table when developing PC Components. We approached the Revolt 3 with the goal of designing a case with the freedom and flexibility that would allow the use of a wide range of components without imposing performance restrictions based on the size of the case."

Jonsbo has added to their PC case lineup with the introduction of the N1 Mini-ITX chassis. The N1 features a minimalist, industrial design thanks to its external brushed aluminium enclosure (3 mm) and steel innards (1 mm thick), and includes four feet so the tower can be put in vertical position, in addition to its apparently stock, horizontal one. The Jonsbo N1 features 5x 3.5" expansion bays, and 1x low-profile PCIe expansion port.

A single 140 mm fan on the front of the unit helps keep temperatures in check (particularly for the HDDs), and there's naturally support for a SFF power supply (up to 150 mm in length). The CPU cooler has clearance for up to 70 mm, and the graphics card support is limited to 185 mm. The front panel offers 1x USB 3.0, 1x USB Type-C, and 1x audio port. No word on pricing was available at time of writing.

Lenovo today announced the next generation of its family of entry-level desktop workstations - the ThinkStation P350 Tower, Small Form Factor (SFF) and Tiny. This trio of workstations hosts a technology upgrade - each one is equipped with support for PCIe Gen 4 for faster access to cutting-edge storage technologies, as well as enhanced professional graphics support. This latest generation of desktop workstations becomes Lenovo's most powerful entry-level offering and delivers a complete package of size options that can scale across a variety of industries and their respective workflows. From engineering and architecture, to finance, STEM/higher education and medical, these new desktop workstations offer versatile, flexible and ISV-certified performance at whatever size is best suited for users' needs and working environment.

Built with the latest high-performance Intel Core or Xeon processors with support up to 11th Gen Intel Core or Intel Xeon W processors, the ThinkStation P350 Tower and SFF are tailored for mission-critical tasks that require superior reliability and powerful performance. Both the Tower and SFF also offer NVIDIA RTX professional graphics, with the Tower now able to support up to the NVIDIA RTX A5000 graphics card. In addition to the 500 W power supply, the tower chassis now boasts a new 750 W PSU option - enabling high-end GPU users with the power needed to tackle sophisticated workflows. The ThinkStation P350 Tiny is the industry's smallest workstation at less than 1L and offers uncompromising performance within a form factor 96% smaller than a traditional desktop. Powered by 11th Gen Intel Core processors, it is uniquely qualified for enabling OEM solutions, and can be used as a host for like-local remote workstation power.

The Eisbaer LT 92 is the little sister of the classic Eisbaer LT. It is without quick release fasteners and is delivered with only 25 cm long hoses. This ensures it fits perfectly into SFF cases. SFF stands for "Small Form Factor" and describes extremely compact housings. Despite its small dimensions, the 92 mm copper radiator offers enough cooling power for powerful processors. Alphacool uses hoses and fittings from the Enterprise Solution series for the Eisbaer LT 92. The TPV hoses are particularly robust and do not kink as easily as the usual PVC hoses. Bend protection is therefore not necessary. The Eisbaer LT 92 is compatible to all mainstream sockets, the appropriate mounting material for various Intel and AMD sockets is included, also a set of fan screws for 25 mm fans. Fans are not included with this unit and must be purchased separately. The Eisbaer LT 92 costs €73.09 (inc. VAT) from the Alphacool web shop.

Noctua today introduced another addition to its chromax line of all-black CPU coolers: the new NH-L9a-AM4 chromax.black is a low-profile quiet CPU cooler for AMD's Ryzen-based HTPCs and Small Form Factor (SFF) builds. Thanks to the same proven heatsink design and NF-A9x14 PWM fan as the original NH-L9a-AM4, it stays true to the same successful formula of fusing a height of only 37 mm with strong performance and excellent quietness of operation, as well as 100% RAM and PCIe compatibility. At the same time, the chromax.black version, with its black fan and black coated heatsink, combines these assets with a sleek stealth look.

"AMD's Ryzen platform has become more and more popular over the last few months, not only for high-end builds but also for compact HTPCs and Small Form Factor systems", says Roland Mossig (Noctua CEO). "We've already introduced the black NH-L9i low-profile cooler for Intel in October, but now we also want to give design-conscious AMD users a new option with the black version of NH-L9a-AM4!"

Silverstone at CES 2020 took the opportunity to showcase selections of their portfolio for the media, ranging from PC cases in major form-factors, PSUs, and a range of "ease-of-life" and aesthetic-driven accessories. Accessory-wise, there's a range of SSD-related products, such as the MS09 stick, which allows conversion of an M.2 SSD to what basically amounts to a USB 3.1 pen drive; other products in this category include the MS09-Mini and the MS11, which improves support for the NVMe protocol. The ECM26 is a PCIe adapter for M.2 sticks, while the Silverstone TP02-M2 presents itself as a heatsink for installation on non-passive-cooled M.2 SSDs.

Continuing the SSD accessories galore, there are a number of other solutions, including a tool-less NMVe to PCIe adapter (ECM21-E), an ARGB powered one (ECM24-ARGB, which includes a heatsink), a simpler, non-ARGB one with a heatsink (ECM23), and my personal favorite, a docking station for a barebones M.2 drive you may have around, in the form of the TS16 station. The presence of a Power button very surely means this can't be hot-swapped - the risk of data-loss is real.

PowerColor is readying a small form-factor friendly custom-design Radeon RX 5700 graphics card, called simply the PowerColor RX 5700 ITX. With a length of 17.5 cm, standard 11 cm height, and strictly 2-slot thickness, the card uses a dense aluminium fin-stack heatsink with four 6 mm-thick nickel-plated copper heat pipes that make direct contact with the GPU at the base, ventilated by a single 80 mm fan. More interestingly, the card draws power from a single 8-pin PCIe power connector (225 W max power input for the connector + PCIe slot).

Unsurprisingly, the PowerColor RX 5700 ITX sticks to AMD-reference clock-speeds of 1465 MHz base, 1625 MHz gaming, and 1725 MHz boost, with the memory ticking at 14 Gbps (GDDR6-effective). Despite its compact cooling solution, the card does not skimp on idle-fan-off. Display outputs include two DisplayPort 1.4, and one HDMI 2.0. Based on the 7 nm "Navi 10" silicon, the RX 5700 features 2,304 stream processors across 36 RDNA compute units, 144 TMUs, 64 ROPs, and a 256-bit wide GDDR6 memory interface, holding 8 GB of memory. PowerColor didn't reveal pricing of the card, as it will formally launch it later this month.

COMINO is a hitherto unrepresented brand at TPU, so we'll try and change that in this post. COMINO is an European manufacturer based off Cyprus, which have specialized in datacenter and retail cooling solutions. They seem particularly geared towards digital currencies, building specialized enclosures for mining hardware to perform at their fullest potential.

At COMPUTEX, the company showcased their OTTO system, built upon their aptly named OTTO chassis, which looks like a full-blown radiator by itself. It's an SFF gaming PC in a ~13 L volume chassis that nonetheless packs in the most powerful components users can buy today: Intel's Core i9-9900K CPU, NVIDIA's RTX 2080 Ti graphics card, and all the other bangs and whistles expected from a top-tier gaming PC. The company has worked on developing everything as needed to make the most of the available space, including the incorporation of Black Ice radiators with Noctua fans, custom water blocks with fins from a different process than usual to allow higher heat exchange, and preparing a dual connection PCIe extension adapter based on the server market needs to allow an x16 connection as opposed to the usual x8. Look out for a more detailed look at the system here in due time!

The DC-ATX Direct Plug from HDPlex is an interesting new accessory that lets you power mini-ITX motherboards with conventional ATX/EPS inputs inside SFF cases that come with 2-pin external power bricks. The accessory plugs directly into the 24-pin ATX input of your motherboard, and takes input from a 2-pin DC. It also puts out 8-pin EPS for the CPU (over a 4-pin connector), one 6+2 pin PCIe power connector, and two SATA power connectors.

The accessory uses DC-to-DC switching to convert 12V to the various other voltage domains, such as +5V, 3.3V, and 5vsb. The accessory supports a power output only up to 200 Watts, which is still impressive for something its size. Available now, the DC-ATX Direct Plug from HDPlex is priced at USD $62.50. You can also buy a bundle that includes a 200-Watt power brick that's nano-ATX capable.

Here are some of the first clear renders of an NVIDIA GeForce GTX 1650 graphics card, this particular one from ZOTAC. The GTX 1650, slated for April 22, will be the most affordable GPU based on the "Turing" architecture, when launched. The box art confirms this card features 4 GB of GDDR5 memory. The ZOTAC card is compact and SFF-friendly, is no longer than the PCIe slot itself, and is 2 slots-thick. Its cooler is a simple fan-heatsink with an 80 mm fan ventilating an aluminium heatsink with radially-projecting fins. The card can make do with the 75W power drawn from the PCIe slot, and has no additional power connectors. Display outputs include one each of DisplayPort 1.4, HDMI 2.0b, and a dual-link DVI-D.

Asetek, the creator of the all-in-one liquid cooler and the global leader in liquid cooling solutions for gaming PCs and DIY enthusiasts, announced the 645LT, an all-in-one (AIO) CPU liquid cooler ideal for small form factor (SFF) cases. Applications for gaming and professional content generation produce excess heat that is difficult to manage in small form factor systems. The 645LT was purpose-built to fit in the tiniest of spaces, including the A4-SFX from DAN Cases, while maintaining lasting system performance.

In developing the 645LT, Asetek looked first to the community to understand what features and benefits were most sought out by enthusiasts and dedicated gamers who want to get the most out of their SFF PCs. The 645LT combines the high performance capabilities of Asetek's latest generation (Gen6) of pump technology -- the same pump used to cool some of the world's fastest supercomputers -- with other advances including unique 90° bends where our tubes meet the radiator for space savings and increased tube lengths for ease in mounting.

Western Digital Corp. today announced two new additions to its broad portfolio of NVMe-based systems, platforms, SSDs, and memory drives for data center and cloud customers. With a full portfolio covering applications from edge-to-core, these additions are the Western Digital Ultrastar DC SN630 NVMe SSD and the Western Digital CL SN720 NVMe SSD. Each leverages the power of Western Digital's vertical integration capabilities, including internally developed controller and firmware architectures, and 64-layer 3D NAND technology. As a replacement for lower-performing SATA SSDs, these new NVMe drives meet the insatiable need for performance, scalability, endurance and low total cost of ownership (TCO) for public and private cloud deployments, hyperscale cloud environments, and next-generation workloads at the edge.

IT managers face challenges such as managing multiple workload types, scaling at optimal TCO, and controlling server sprawl. Due to its inherent scalability and performance benefits, NVMe is quickly becoming the de facto standard for everything from traditional scale-up database applications to emerging edge computing architectures.

We might need more than the fingers on our hands to count the number of times upcoming products have been inadvertently been leaked by a reseller, and CORSAIR is the latest to have joined this list when not one, but two separate Reddit users shared details of the upcoming SF750 80 Plus Platinum SFX form factor power supply. For those who came in late, CORSAIR began their venture into the SFX form factor for PSUs with the 80 Plus rated SF600 and SF450, at 600 and 450 W respectively, and with a relatively large 92 mm fan that resulted in an efficient, quieter-than-average small form factor PSU. This was followed up by the SF600 and SF450 80 Plus Platinum rated PSUs, and now we have word of the third entry to this series.

CORSAIR, Silverstone, and a few others have been trying to one-up each other in the PSU power density metric, and the leaked SF750 will definitely be among the leaders there. The leak came up via an error in the publication of user manuals, as confirmed by Jon "Jonnyguru" Gerow himself, and the product appears to follow the trend of the series with a zero RPM mode at low loads, and plenty of cable outputs. Interestingly, there appear to be two 8-pin EPS connectors for those wanting to go with an SFF build with an Intel or AMD HEDT platform as well. The SFF market never really got the boom it was promising, so time will tell whether this will be a positive boost or not.

SilverStone today rolled out the Raven-Z RVZ03-ARGB small-form-factor gaming case. With a volume of just 14 liters, and measuring 382 mm x 105 mm x 350 mm (WxHxD), the case serves up enough room for dual-slot graphics cards that are up to 33 cm in length, and oriented sideways via an included PCIe riser cable. The case holds mini-ITX motherboards, with room for CPU coolers as tall as 83 mm. A standard ATX power supply up to 15 cm in length is supported, though a 3-pin AC receptacle and riser.

Storage options of the RVZ03-ARGB include three internal 2.5-inch mounts. Cooling includes three 120 mm vents, from which two are populated by 1,500 RPM, 18 dBA fans. Front panel connectivity includes USB 3.1 type-A ports, and HDA audio jacks. The star-attraction here of course is the addressable-RGB LED diffuser that dominates a somewhat X-shaped embellishment along the front panel. The light strip is either controlled by a small PCB cycling between presets, or can plug into your motherboard via a standard ARGB header, for software control. The case comes in two color options, matte black and white.

At the Flash Memory Summit (FMS) 2018, LITE-ON Storage previewed the first EDSFF 1U solid-state drive (SSD) to emerge from its work with CNEX Labs. The revolutionary drive gained great interest among storage advocates.

In collaboration with such partners, LITE-ON delivers an innovative and highly efficient storage solution for scalable computing that aligns to Open Compute Project (OCP) specifications. The resulting EDSFF (Enterprise and Datacenter SSD Form Factor) SSD will provide a more cost-effective solution for enterprise and hyperscale cloud environments.

"Standard SSD solutions are great at handling many typical business workloads, but the complexity of storing information in both cloud and data center infrastructure requires SSD firmware to be flexible and adaptable," said Charlie Tseng, CEO of LITE-ON Storage. "LITE-ON's expertise in SSD firmware is perfect for the varying needs of customers."

MonsterLabo had their 'The First' small form factor case on display at the Seasonic booth. Measuring in at 200 x 200 x 400 mm, The First only weighs around 10 kg. It can house a mini-ITX motherboard, a graphics card with a length up to 270 mm, an ATX or SFX power supply, one 3.5-inch drive, and three 2.5-inch drives. The case features a high-performance and fanless cooling solution capable of dissipating up to 200 W of heat. The radiator is shared between the processor and graphics card. There is also a single fan mount for a 120 mm or 140 mm fan to increase the cooling capacity to 300 W. For connectivity, The First has two USB 3.0 ports on the front panel. Consumers can fully customize the front panel with different painted and patterned skins and other surfaces like glass, wood, copper or leather.

After the AMD event, we got a chance to go hands on with the PowerColor Radeon RX Vega 56 Nano, the most compact desktop graphics card based on the "Vega10" silicon. This product is so special that it got an exclusive unveiling by AMD as a "one more thing." The card's PCB itself it slightly under 5 mm longer than that of the original R9 Nano, but the cooler adds another centimeter to its length. We can only imagine what SFF enthusiasts can do with this card under a specially-design full-coverage water-block.

It's also revealed that the card draws power from a combination of a 6-pin + 8-pin PCIe power connectors. The cooling solution consists of a dense aluminium fin-stack heatsink. A single 80 mm spinner ventilates this heatsink, and a plastic shroud covers it all up. Given that this card has specific "RX Vega 56" SKU marking and not an off-beat "RX Vega Nano" branding, we think this card will be as fast as a stock RX Vega 56, out of the box. Display outputs include three DisplayPort 1.4 and a HDMI 2.0. The MSRP for this card is set at USD $449.

ASUS rolled out the Prime H310T, one of the rare few thin mini-ITX motherboards based on Intel 300-series chipset, a boon for certain SFF cases such as the Akasa Euler series, or DIY all-in-one PC upgrades. Based on Intel H310 chipset, the board supports 8th generation Intel "Coffee Lake" processors (including 95W TDP chips). It draws power from 2-pin (12V DC in), and conditions it for the LGA1151 processor using a simple 3+1 phase VRM. The CPU socket is wired to two DDR4 SO-DIMM slots, which support up to 32 GB of dual-channel DDR4-2666 memory.

Storage connectivity includes a 32 Gbps M.2-2280 slot, and two SATA 6 Gbps ports. The only other expansion slot is an M.2 slot for WLAN modules. Display outputs include LVDS (useful in AIOs), DisplayPort, and HDMI. USB connectivity includes four 5 Gbps USB 3.1 gen 1 ports. 2-channel HD audio and gigabit Ethernet make for the rest of it.

Dell Technologies is unveiling the new Dell Wyse 5070 thin client, the company's most versatile and scalable thin client platform that enables organizations to select just the right configuration based on their employees' needs. In addition, Dell Technologies is expanding Dell EMC's VDI Complete Solutions, powered by VMware Horizon, to include support for 14th generation PowerEdge server infrastructure and virtualized graphics options for high-performance workloads. Both solutions lower the barrier to VDI adoption, making it easier than ever for organizations to plan, deploy, and run desktop and application virtualization within their IT environments.

Dell Wyse 5070 thin client provides unprecedented options and True 4K multi-display technology
Yesterday's thin clients had one configuration and little support for peripherals, browser-based solutions and unified communications. This meant that most organizations had to deploy a range of thin clients and PCs based on user profiles and workloads. Now, Dell has dramatically simplified standardization on a single thin client platform across the enterprise, making it easier for IT to deploy, and helping extend the security, cost and manageability benefits of thin clients for organizations.

After nearly a year from first announcing the Cu line of full copper coolers PC cooling innovator CRYORIG is now releasing the C7 Cu copper enhanced SFF ITX cooler. The C7 Cu is built from the award winning C7 architecture with one obvious upgrade, the extravagant use of copper for the whole heatsink body. By exchanging for a full copper build from aluminum has allowed the C7 Cu see improvements of up to 15% in thermal performance. The increased thermal performance without increased size is a key advantage of the C7 Cu especially in ultra compact SFF/ITX builds where space is limited.

Aimed at solving the space limits of Small Form Factor ITX systems, the C7 Cu was set with the task of further improving performance but without increasing size or fan speed. Utilizing higher thermal conductive materials was the only answer for the C7 Cu. Copper is nearly twice as thermal conductive as aluminum but nearly three times as expensive. That's why copper is normally only used on the most thermal critical components such as heatpipes and heatsink base plates. With the C7 Cu, CRYORIG has swapped out the aluminum elements of the C7 with pure copper. Thermal performance gains are close to 15% when compared to the original C7.

SteigerDynamics took the opportunity granted to them by taking part in a world-renowned tech show floor of CES 2018 to showcase an interesting lineup of SFF computer cases, with powerful systems integrated in a small footprint. These are usually considered the more impressive feats of engineering in the computer space, really; how much performance you can squeeze in a limited space, without compromising component reliability, cooling, and acoustics for the particular environments these will be used in.

SteigerDynamics has shown they do know how to engineer these systems, for sure. Their LEET Gaming Room/Living Room Gaming PC is a little on the bigger side, but it still carries a small footprint, in a pretty package, for the amount of high-quality hardware it's packing. A Maximus Hero X, a Core i7-8700K at 5 GHz, 16 GB of G.SKILL Trident Z DDR4 memory and EVGA GTX 1080 Ti SC, are almost as high-end a configuration one can have already. Add in the 2x 512 GB Samsung 960 PRO SSDs, and the 4x 1 TB HDDs in RAID 10, and there really isn't much to fault with this unit. Even power is taken care of by a Seasonic PRIME Titanium PSU. And to keep all of these high-performance components cool, the SteigerDynamics LEET carries a fully custom watercooling loop, that aids in silence and aesthetics. Just follow my lead here: don't look at the price-tag. It's really not for the faint of heart.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's fastest performance 64GB DDR4 SO-DIMM memory running at DDR4-3466MHz CL17-17-17-37 at 1.35V with a 4x16GB kit configuration. Constructed with rigorously hand-selected Samsung B-die DDR4 IC components, this new Ripjaws DDR4 SO-DIMM memory kit elevates the computing power of small-form-factor (SFF) PCs to a whole new realm of memory performance, allowing you to design a miniature powerhouse system for virtually any tasks ranging from content creation to gaming.

The Perfect Trio: High Capacity, High Frequency, Low Timings
The need of faster and larger capacity memory kits continue to rise as modern day workloads increases in both capacity and weight. To tackle this need, G.SKILL is expanding the delivery of maximum memory performance across all memory capacities; and by using 16GB SO-DIMM modules, high-end machines and workstation PCs can now be built in the size of a SFF system that can fit into a shoebox. Shown in the following screenshot is the high capacity 64GB SO-DIMM memory kit running at DDR4-3466MHz CL17-17-17-37 and being tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.